CN219515186U - Radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses a radio frequency generating device, a radio frequency thawing device and a refrigerator, belongs to the technical field of household equipment, and aims to solve the technical problem that a heat dissipation structure of a conventional radio frequency generating device is complex. The radio frequency generating device comprises a mounting shell, a radiating piece, a power amplifier module, a power module and a fan, wherein the radiating piece is arranged in a mounting cavity of the mounting shell, the power amplifier module and the power module are in contact with the radiating piece, and the fan can exhaust air in the mounting cavity. The power amplifier module and the heat radiation module are contacted with the heat radiation piece at the same time, so that heat generated by the power amplifier module and the power module can be conducted to the heat radiation piece for discharge, thereby reducing the number of parts of the radio frequency generating device and simplifying the structure.

Description

Radio frequency generating device, radio frequency thawing device and refrigerator

Technical Field

The application belongs to the technical field of household appliances, and particularly relates to a radio frequency generating device, a radio frequency thawing device and a refrigerator.

Background

In the thawing radio frequency device, a power supply module is in communication connection with a power amplification module, the power amplification module can convert direct current output by the power supply module into radio frequency electric waves, load matching power transmission is realized through a matching circuit, and finally radio frequency energy can be transmitted through an antenna.

In the related art, a large amount of heat can be generated by the power module and the power amplification module in the operation process, and the heat dissipation mechanism for dissipating the heat of the power module and the power amplification module is complex in structure, so that the radio frequency thawing device is complex in structure and poor in reliability.

Disclosure of Invention

The utility model aims to at least solve the technical problem that the existing radiating structure with the radio frequency generating device is complex to a certain extent. Therefore, the utility model provides a radio frequency generating device, a radio frequency thawing device and a refrigerator.

In a first aspect, an embodiment of the present utility model provides a radio frequency generating device, including:

the installation shell is provided with an air inlet, an air outlet and an installation cavity, and the air inlet and the air outlet are communicated with the installation cavity;

the heat dissipation piece is arranged in the mounting cavity;

the fan is arranged on the installation shell and is communicated with the air inlet or the air outlet;

the power amplifier module and the power module are arranged in the installation shell, at least part of the power amplifier module and at least part of the power module are in contact with the radiating piece, and the power amplifier module is electrically connected with the power module.

In some embodiments, the power amplifier module includes a power amplifier board and a power amplifier device, the power amplifier device is disposed on the power amplifier board, and the power amplifier device is disposed on the heat sink.

In some embodiments, the power amplification board is disposed on the heat dissipation element, and the power amplification device is disposed through the power amplification board and contacts with the heat dissipation element.

In some embodiments, the power module includes a power strip and a power switching device, the power switching device is disposed on the power strip, and the power switching device is disposed on the heat sink.

In some embodiments, the mounting cavity includes an air duct subchamber portion through which the air flow passes, the air duct subchamber portion is in communication with the air inlet and the air outlet, the power module further includes a fine pitch device, the fine pitch device is disposed on the power panel, and the fine pitch device is disposed outside the air duct subchamber portion, and at least a portion of the heat sink is disposed in the air duct subchamber portion.

In some embodiments, the power panel divides the installation cavity into the air duct subchamber portion and the installation subchamber portion, the air duct subchamber portion is communicated with the installation subchamber portion, the direction of the opening of the installation subchamber portion is the same as the direction of the airflow in the air duct subchamber portion, and the fine-pitch device is arranged on one side of the power panel, which is opposite to the air duct subchamber portion.

In some embodiments, the power amplifier module and the power switching device are both located within the tunnel subchamber portion.

In some embodiments, the power board is connected to the power board, and the power board divide the installation cavity into the air duct subchamber portion and the installation subchamber portion, and the fine-pitch device is disposed on a side of the power board facing away from the air duct subchamber portion.

In some embodiments, the power switch device is disposed through the power panel and contacts the heat sink.

In some embodiments, the air inlet and the air outlet are disposed opposite.

In some embodiments, the heat sink has a heat dissipation channel with one end facing the air inlet and the other end facing the air outlet.

In some embodiments, the fan is disposed in the mounting cavity with an air inlet side of the fan facing the air inlet and an air outlet side of the fan facing the air outlet.

According to a second aspect, based on the above radio frequency generating device, an embodiment of the present application further provides a radio frequency thawing device, including a radio frequency thawing assembly and the above radio frequency generating device, where the radio frequency thawing assembly includes:

A shield cylinder having an open end;

the shielding door is arranged at the opening end and is used for closing the opening end;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

In some embodiments, a tuning cavity and a thawing cavity for containing food to be thawed are provided in the shielding cylinder, and the tuning plate and the polar plate are both provided in the tuning cavity.

In a third aspect, based on the radio frequency thawing device above, an embodiment of the present application further provides a refrigerator, including a refrigerator main body and the radio frequency thawing device above, where the radio frequency thawing device is disposed in the refrigerator main body.

In the radio frequency generating device provided by the embodiment of the application, the power amplifier module and the power module are arranged in the mounting shell, so that the radio frequency generating device has a compact structure, and the power amplifier module and the power module can be prevented from being damaged due to the fact that external dust enters the mounting shell to a certain extent. The power amplifier module and the power supply module are arranged on the radiating piece, so that heat of the power amplifier module and the power supply module can be conducted to the radiating piece, the fan can absorb the heat of the radiating piece and bring the heat out of the installation shell, and therefore the power amplifier module and the power supply module can share one radiating piece, the radio frequency generating device does not need to be provided with the radiating piece for radiating the power amplifier module and the power supply module independently, and finally the structure of the radio frequency generating device is further compact.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a schematic structural diagram of a radio frequency generating device according to an embodiment of the present application;

fig. 2 shows a schematic diagram of a power amplifier module and a power switching device of the radio frequency generating device in the air duct subchamber portion according to the embodiment of the application;

fig. 3 is a schematic diagram showing that a power board and a power board of a radio frequency generating device separate an installation cavity and the power board are integrated;

fig. 4 is a schematic diagram showing that a power amplification board and a power supply board of the radio frequency generating device separate an installation cavity and the power amplification board and the power supply are separated;

FIG. 5 is a schematic diagram of a heat sink of a radio frequency generating device according to an embodiment of the present application;

fig. 6 shows a schematic diagram of a radio frequency thawing device according to an embodiment of the present application;

Fig. 7 is a schematic diagram showing an exploded structure of a radio frequency thawing device according to an embodiment of the present utility model;

fig. 8 is a schematic diagram showing an internal structure of a radio frequency thawing device according to an embodiment of the present utility model;

fig. 9 illustrates a schematic structure of a refrigerator disclosed in an embodiment of the present utility model.

Reference numerals:

100-mounting shell, 110-air inlet, 120-air outlet, 130-mounting cavity, 131-air duct subchamber part, 132-mounting subchamber part,

200-heat dissipation elements, 210-heat dissipation bases, 220-heat dissipation fins, 230-heat dissipation channels,

300-power amplifier module, 310-power amplifier board, 320-power amplifier device,

400-power module, 410-power board, 420-power switching device, 430-fine pitch device,

500-a fan, wherein the fan is provided with a fan,

600-radio frequency thawing assembly, 610-shielding cylinder, 611-open end, 612-tuning chamber, 613-thawing chamber, 620-shielding door, 630-tuning plate, 640-pole plate, 650-bracket,

700-refrigerator body.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all the directional indicators in the embodiments of the present utility model are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

example 1

Referring to fig. 1, an embodiment of the application discloses a radio frequency generating device, which includes a mounting case 100, a heat dissipation member 200, a fan 500, a power amplifier module 300 and a power module 400.

The mounting case 100 is a basic component of the radio frequency generating device of the present application, and the mounting case 100 may provide a mounting base for and serve the purpose of protecting other at least partial components of the radio frequency generating device of the present application. The installation shell 100 can be made of metal materials, and corresponding insulation structures can be arranged in the installation shell 100, so that the installation shell 100 has better structural strength, and the reliability of the radio frequency generating device is better. The installation shell 100 is internally provided with an installation cavity 130, other at least partial components of the radio frequency generating device can be arranged in the installation shell 100, and of course, the radio frequency generating device can also be arranged outside the installation shell 100, the installation shell 100 is also provided with an air inlet 110 and an air outlet 120, and the air inlet 110 and the air outlet 120 of the installation shell 100 are communicated with the installation cavity 130 of the installation shell 100, so that gas outside the installation shell 100 can enter the installation cavity 130 through the air inlet 110 of the installation shell 100 and be discharged through the air outlet 120.

The power amplifier module 300 and the power module 400 are both arranged in the mounting cavity 130 of the mounting shell 100, the power module 400 is electrically connected with the power amplifier module 300, the power module 400 can provide electric energy for the power amplifier module 300, so that the power amplifier module 300 can convert the electric energy into amplified radio frequency signals, the radio frequency generating device can generate the radio frequency signals, specifically, the power amplifier module 300 is provided with a plurality of amplifying circuits, and the number of the amplifying circuits can be set to be multiple, and the amplifying circuits can amplify the radio frequency signals for multiple times. Specifically, the power amplifier module 300 and the power module 400 may be configured to have a circuit board and components disposed on the circuit board, so that the power amplifier module 300 and the power module 400 may have corresponding functions. The power module 400 and the power amplifier module 300 are both disposed in the mounting cavity 130 of the mounting housing 100, so that a power supply system and a generating system can be integrally disposed in the mounting housing 100 of the radio frequency generating device of the present application, thereby making the structure of the radio frequency generating device more compact. In addition, the connection circuit between the power module 400 and the power amplifier module 300 is also located in the installation housing 100, so that the circuit between the power amplifier module 300 and the power module 400 can be hidden in the installation housing 100, and the installation housing 100 can protect the connection circuit, so that the connection effect of the power module 400 and the power amplifier module 300 is more reliable.

It should be understood that, during the power-on operation of the power amplifier module 300 and the power module 400, the power amplifier module 300 and the power module 400 generate a large amount of heat due to the resistance factor in the circuit, and the heat is diffused in the mounting cavity 130 of the mounting case 100, which results in a higher temperature of the mounting cavity 130, so that the power amplifier module 300 and the power module 400 are in a high-temperature environment, and the performance of the power amplifier module 300 and the power module 400 is affected. Therefore, the fan 500 of the present application may be disposed in the installation case 100, the fan 500 may input air outside the installation case 100 into the installation cavity 130 through the air inlet 110 of the installation case 100 and exhaust the air through the air outlet 120, and the hot air in the installation cavity 130 of the installation case 100 may be brought out of the installation case 100 during the air flowing in the installation cavity 130 of the installation case 100, thereby achieving the purpose of reducing the temperature in the installation cavity 130 of the installation case 100, so as to reduce the temperature of the power amplifier module 300 and the power module 400, and prevent the power amplifier module 300 and the power module 400 from being damaged due to the excessively high temperature.

The heat sink 200 is disposed in the mounting cavity 130 of the mounting case 100, and the power amplifier module 300 and the power module 400 are disposed in contact with the heat sink 200, so that heat of the power amplifier module 300 and the power module 400 can be transferred to the heat sink 200 to prevent heat from concentrating on the power amplifier module 300 and the power module 400. The heat dissipation member 200 is disposed in the mounting cavity 130 of the mounting case 100, and the heat dissipation member 200 absorbs the heat of the power amplifier module 300 and the power amplifier module 400, so that the air outside the mounting case 100 can contact with the heat dissipation member 200 after entering the mounting cavity 130, so that the heat of the heat dissipation member 200 is brought out of the mounting case 100, thereby reducing the temperature of the heat dissipation member 200, and accordingly, the heat of the power amplifier module 400 and the power amplifier module 300 can be continuously conducted to the heat dissipation member 200, so that the temperature of the power amplifier module 400 and the power amplifier module 300 can be continuously dissipated, and the temperature of the power amplifier module 300 can be further reduced. The power module 400 and the power amplifier module 300 are both arranged on the heat dissipation piece 200, so that heat of the power module 400 and the power amplifier module 300 can be conducted to the heat dissipation piece 200 and dissipated through the heat dissipation piece 200, and therefore a heat dissipation device is not required to be arranged for the power amplifier module 300 and the power module 400 independently, and the structure of the radio frequency generation device is further compact.

It should be understood that the heat dissipation element 200 may be made of a material with strong heat conduction performance, and in particular may be made of a copper-aluminum composite material, a steel material, a cast iron material, an aluminum alloy material, or the like, and the surface of the heat dissipation element 200 has a heat dissipation surface with a larger area, so that the heat of the heat dissipation element 200 may be more efficiently dissipated in the mounting cavity 130 of the mounting shell 100, and the air flow of the fan 500 in the mounting cavity 130 of the mounting shell 100 may be more fully applied to the surface of the heat dissipation element 200, so that the temperature of the heat dissipation element 200 may be reduced.

The power module 400, the power amplifier module 300 and the heat sink 200 are all disposed in the mounting case 100 such that the mounting case 100 can protect the power module 400, the power amplifier module 300 and the heat sink 200 and can prevent dust and impurities outside the mounting case 100 from entering the mounting case 100 to some extent.

In the radio frequency generating device provided by the embodiment of the application, the power amplifier module 300 and the power module 400 are both arranged in the installation shell 100, so that the structure of the radio frequency generating device is compact, and external dust can be prevented from entering the installation shell 100 to a certain extent to damage the power amplifier module 300 and the power module 400. The power amplifier module 300 and the power module 400 are both arranged on the heat dissipation member 200, so that heat of the power amplifier module 300 and the power module 400 can be conducted to the heat dissipation member 200, and the fan 500 can bring heat absorbed by the heat dissipation member 200 out of the installation shell 100, so that the power amplifier module 300 and the power module 400 can share one heat dissipation member 200, and the power amplifier module 300 and the power module 400 do not need to be independently provided with the heat dissipation member 200 for dissipating heat of the power amplifier module 300 and the power module 400, and finally the structure of the radio frequency generation device is further compact.

Referring to fig. 1 and 2, in some embodiments, the power amplifier module 300 of the present application specifically includes a power amplifier board 310 and a power amplifier device 320, where the power amplifier board 310 may provide a mounting base for the power amplifier device 320, so that the power amplifier device 320 may be disposed on the power amplifier board 310 and electrically connected to a circuit board, it should be understood that a corresponding circuit structure may be disposed on the power amplifier board 310, and pins of the power amplifier device 320 may be fixed on the circuit structure on the power amplifier board 310, so that the power amplifier device 320 may be electrically connected to the circuit structure on the power amplifier board 310. It should be understood that the power amplifier device 320 is a main device for amplifying signals in the power amplifier module 300, and the power amplifier module 300 is a main heat source during operation, so that the power amplifier device 320 may be disposed on the heat sink 200 so that the power amplifier device 320 may contact with the heat sink 200, and thus, heat generated by the power amplifier device 320 may be directly transferred to the heat sink 200, so that heat of a main heat source of the power amplifier module 300 may be efficiently transferred to the heat sink 200.

Of course, it should be understood that, in other embodiments, the power amplification board 310 may be disposed in contact with the heat dissipation element 200, the power amplification device 320 is disposed on the power amplification board 310, and the heat generated by the power amplification device 320 may be transferred to the power amplification board 310 and further transferred to the heat dissipation element 200, so that the contact mounting manner of the power amplification module 300 and the heat dissipation element 200 may be relatively simple when the power amplification module 300 is disposed in contact with the heat dissipation element 200.

Referring to fig. 1 and 2, in some embodiments, in order to enable the power amplifier device 320 to be disposed in contact with the heat sink 200 when disposed on the power amplifier board 310, a side board surface of the power amplifier board 310 may be directly disposed on the heat sink 200, and the power amplifier board 310 may be sufficiently disposed in contact with the heat sink 200, so that both heat generated by the power amplifier board 310 and heat conducted to the power amplifier board 310 by the power amplifier device 320 may be conducted to the heat sink 200, and a side board surface of the power amplifier board 310 facing away from the heat sink 200 may be used for mounting various components of the power amplifier module 300, such as the power amplifier device 320. The power amplifier 320 is disposed in contact with the heat sink 200 after penetrating through the power amplifier board 310, so that the power amplifier 320 can be disposed in contact with the heat sink 200 directly, specifically, a through hole for the power amplifier 320 to penetrate through can be formed in the power amplifier board 310, and the pins of the power amplifier 320 are located at the side of the power amplifier 320, so that the pins of the power amplifier 320 can be led out from the side wall of the power amplifier 320 and electrically connected with a side plate surface of the power amplifier board 310 opposite to the heat sink 200.

The aperture size of the through hole of the power amplification board 310 may be set to match the shape of the power amplification device 320, specifically, the outer wall of the power amplification device 320 may be in contact with the inner wall of the through hole of the power amplification board 310, or may have a smaller gap with the inner wall of the through hole of the power amplification board 310, so that the through hole of the power amplification board 310 may serve the purpose of limiting the power amplification device 320, so that the power amplification device 320 may be more reliably fixed to the power amplification board 310. In addition, it should be understood that, when the sidewall of the power amplifier device 320 is disposed in contact with the inner wall of the through hole of the power amplifier board 310, the heat generated by the power amplifier device 320 can be further transferred to the power amplifier board 310, and the heat can be transferred to the heat sink 200 through the power amplifier board 310, so as to achieve the purpose of fully transferring the heat generated by the power amplifier device 320 to the heat sink 200.

In other embodiments, in order to enable the power amplifier device 320 to be disposed in contact with the heat sink 200 when disposed on the power amplifier board 310, the power amplifier device 320 may be disposed on a side wall of the power amplifier board 310 when a side surface of the power amplifier board 310 is disposed in contact with the heat sink 200. Specifically, the pins of the power amplifier 320 are located on the side wall of the power amplifier 320, the pins of the power amplifier 320 are led out from the side of the power amplifier 320 to be electrically connected with the side surface of the power amplifier board 310 opposite to the heat sink 200, and the power amplifier 320 is in direct contact with the heat sink 200, so that the heat generated by the power amplifier 320 can be directly transferred to the heat sink 200, and the side wall of the power amplifier 320 adjacent to the power amplifier board 310 can be in contact with the side wall of the power amplifier board 310, so that part of the heat generated by the power amplifier 320 can be transferred to the power amplifier board 310 and transferred to the heat sink 200 through the power amplifier board 310, and the heat of the power amplifier 320 can be more efficiently dissipated.

In other embodiments, in order to enable the power amplifying device 320 to be disposed in contact with the heat sink 200 when disposed on the power amplifying board 310, the power amplifying device 320 may be disposed in contact with the heat sink 200, and the power amplifying board 310 is in a non-contact state with the heat sink 200. Specifically, the side surface of the power amplification board 310 for installing each component may be disposed towards the heat dissipation element 200, and the power amplification device 320 is disposed on the side surface of the power amplification board 310 towards the heat dissipation element 200, so that the power amplification device 320 is located between the power amplification board 310 and the heat dissipation element 200, and thus the heat of the power amplification device 320 can be fully conducted to the heat dissipation element 200, and the heat of the power amplification device 320 conducted to the power amplification board 310 is reduced, and because the power amplification board 310 is located in the installation cavity 130 of the installation shell 100, the air flow generated by the fan 500 in the installation cavity 130 of the installation shell 100 may act on the power amplification board 310, so that the heat of the power amplification board 310 may be fully discharged out of the installation shell 100 along with the air flow.

Referring to fig. 1 and 2, in some embodiments, the power module 400 of the present application specifically includes a power board 410 and a power switching device 420, wherein the power board 410 may provide a mounting base for the power switching device 420, so that the power switching device 420 may be disposed on the power board 410 and electrically connected to the circuit board, and it should be understood that a corresponding circuit structure may be disposed on the power board 410, and pins of the power switching device 420 may be fixed on the circuit structure on the power board 410, so that the power switching device 420 may be electrically connected to the circuit structure on the power board 410. It should be understood that the power switching device 420 is a switching device in the power module 400, and the power switching device 420 is a main heat generating source during operation of the power module 400, and therefore, the power switching device 420 may be disposed on the heat sink 200 such that the power switching device 420 may contact the heat sink 200, and thus, heat generated by the power switching device 420 may be directly transferred to the heat sink 200, so that heat of the main heat source of the power module 400 may be efficiently transferred to the heat sink 200.

Of course, it should be understood that, in other embodiments, the power board 410 may be disposed in contact with the heat sink 200, the power switch device 420 is disposed on the power board 310, and the heat generated by the power switch device 420 may be transferred to the power board 410 and further transferred to the heat sink 200, so that the contact mounting manner of the power module 400 and the heat sink 200 may be relatively simple when the power module 400 is disposed in contact with the heat sink 200.

In some embodiments, the power module 400 of the present application is further provided with fine pitch devices 430, such as various capacitive devices, and the fine pitch devices 430 are provided to the power panel 410 and electrically connected to the power panel 410. It should be appreciated that fine pitch device 430 may include a wing pin device having a pitch of 0.65mm or less for pads, or a surface array device having a pitch of 1.0mm or less for pads, and specifically fine pitch device 430 may include an MCU and a portion of a patch device. When the blower 500 sucks and discharges the air outside the mounting case 100 through the mounting chamber 130 of the mounting case 100, the blower 500 inevitably sucks the dust in the external air into the mounting case 100, and if the dust blows to the fine pitch device 430, the dust is accumulated on the fine pitch device 430, and long time, the more the dust is accumulated at the fine pitch device 430, the greater the risk of damaging the fine pitch device 430. Accordingly, in order to prevent the fine pitch device 430 from being damaged due to dust accumulation, an air flow passing through the mounting cavity 130 of the mounting case 100 may be provided not to blow the fine pitch device 430 straight for the purpose of preventing dust accumulation at the fine pitch device 430.

Referring to fig. 2, specifically, the installation cavity 130 of the installation housing 100 may include an air duct sub-cavity portion 131, the fan 500 sucks air outside the installation housing 100 through the air inlet 110, and then the air may pass through the air duct sub-cavity portion 131 and be discharged through the air outlet 120 of the installation housing 100, so that dust in the air may also flow along with air flow in the air duct sub-cavity portion 131, and the fine pitch device 430 may be disposed outside the air duct sub-cavity portion 131, so that the air flowing in the air duct sub-cavity portion 131 may not directly act on the fine pitch device 430, and accordingly, dust carried in the air flow may not directly adhere to the fine pitch device 430, thereby preventing dust from accumulating on the fine pitch device 430 to some extent, so as to achieve the purpose of protecting the fine pitch device 430.

The power amplifier module 300, the power switching device 420 and the heat sink 200 may be disposed in the air duct subchamber portion 131, the fine pitch device 430 is not disposed on the power amplifier module 300, the power switching device 420 and the heat sink 200 may be directly blown by the air flow passing through the air duct subchamber portion 131, so that the air flow may directly contact the power amplifier module 300, the power switching device 420 and the heat sink 200, and thus the heat generated by the power amplifier module 300 and the power switching device 420 may be efficiently discharged to the outside of the installation case 100.

Referring to fig. 1 and 2, in some embodiments, in order that the fine pitch device 430 of the power module 400 may be disposed outside the air duct subchamber portion 131 and may be electrically connected with the power panel 410, the power panel 410 of the present application may divide the mounting chamber 130 of the mounting case 100 to include the mounting subchamber portion 132 and the air duct subchamber portion 131 described above in a case where the power panel 410 is disposed inside the mounting chamber 130 of the mounting case 100, wherein the mounting subchamber portion 132 and the air duct subchamber portion 131 are disposed on opposite side surfaces of the power panel 410, and the fine pitch device 430 may be disposed on a side of the power panel 410 facing away from the air duct subchamber portion 131, i.e., within the mounting subchamber portion 132, so that the fine pitch device 430 may avoid the air duct subchamber portion 131. Specifically, a side wall of one side of the power panel 410 may be provided to be connected with an inner wall of the installation cavity 130 so that the power panel 410 may be fixedly provided within the installation case 100.

It should be understood that the fine pitch device 430 and other components disposed on the side of the power board 410 facing away from the air duct subchamber portion 131 may generate heat during operation, so the mounting subchamber portion 132 and the air duct subchamber portion 131 may be disposed in communication, so that heat generated by the fine pitch heat in the mounting subchamber portion 132 and heat generated by other components disposed on the side of the power board 410 facing away from the air duct subchamber portion 131 may be diffused into the air duct subchamber portion 131, and further such heat may be carried out of the mounting case 100 by air flow in the air duct subchamber portion 131, so that heat generated by the power module 400 may be sufficiently discharged out of the mounting case 100. Specifically, one side wall of the power panel 410 is connected to the inner wall of the installation cavity 130 of the installation housing 100, and the other side wall of the power panel 410 is spaced from the inner wall of the installation cavity 130 of the installation housing 100 such that the other side wall of the power panel 410 and the inner wall of the installation housing 100 constitute an opening of the installation sub-cavity portion 132, and the opening communicates with the air duct sub-cavity portion 131.

In order to prevent dust carried in by the air flow in the air duct subchamber portion 131 from entering the installation subchamber portion 132 to a certain extent, the direction of the opening of the installation subchamber portion 132 may be set to be the same as the direction of the air flow passing through the air duct subchamber portion 131, so that the direction of the air flow and the direction from the opening of the installation subchamber portion 132 to the inner wall of the installation subchamber portion 132 are opposite to each other, so that the air flow cannot directly blow into the installation subchamber portion 132, and dust carried in by the air flow can be prevented from entering the installation subchamber portion 132 to a certain extent, and dust is prevented from accumulating on the fine-pitch device 430.

In some embodiments, in order to enable the heat of the power amplifier module 300 and the power switching device 420 of the present application to be sufficiently discharged outside the installation case 100 when the power amplifier module 300 and the power switching device 420 are located in the duct subchamber portion 131, the power amplifier module 300, the power switching device 420, and the heat sink 200 may be disposed opposite to at least one of the air inlet 110 and the air outlet 120 of the installation case 100. When the power amplifier module 300, the power switching device 420 and the heat sink 200 are opposite to the air inlet 110 of the installation case 100, the air flow inputted through the air inlet 110 of the installation case 100 can be directly blown to the power amplifier module 300, the power switching device 420 and the heat sink 200, so that the air flow still has a fast flow rate when acting on the power amplifier module 300, the power switching device 420 and the heat sink 200, and the air flow can sufficiently exchange heat with the power amplifier module 300, the power switching device 420 and the heat sink 200, so that the heat of the power amplifier module 300, the power switching device 420 and the heat sink 200 can be sufficiently taken out of the installation case 100 by the air flow.

When the power amplifier module 300, the power switching device 420, and the heat sink 200 are opposite to the air outlet 120 of the mounting case 100, the air flow outputted through the air outlet 120 of the mounting case 100 may be directly blown to the power amplifier module 300, the power switching device 420, and the heat sink 200 before passing through the air outlet 120 of the mounting case 100. When the power amplifier module 300, the power switching device 420, and the heat sink 200 are opposite to the air inlet 110 and the air outlet 120 of the mounting case 100, the air flow passing through the air duct subchamber portion 131 may more sufficiently act on the power amplifier module 300, the power switching device 420, and the heat sink 200.

Referring to fig. 3, in some embodiments, in order to enable the fine pitch device 430 to be located outside the air duct subchamber portion 131, a power board 310 may be further provided to be connected to the power board 410, and the power board 310 and the power board 410 may jointly partition the installation chamber 130 of the installation case 100 to form the air duct subchamber portion 131 and the installation subchamber portion 132, so that the air flow passing through the air duct subchamber portion 131 does not flow into the installation subchamber portion 132, independently of each other. The fine pitch device 430 is disposed in the mounting sub-chamber portion 132 such that dust entrained by the air flow of the duct sub-chamber portion 131 does not flow toward the mounting sub-chamber portion 132 to prevent dust from accumulating on the fine pitch device 430.

Specifically, a portion of the side walls of the power board 310 and a portion of the power board 410 may be connected, and another portion of the side walls of the power board 310 and the power board 410 may be connected to an inner wall of the installation cavity 130 of the installation case 100, so that the installation sub-cavity portion 132 and the air duct sub-cavity portion 131 may be completely separated by the power board 310 and the power board 410, one side plate surface of the power board 310 and one side plate surface of the power board 410 are located in the air duct sub-cavity portion 131, and the other side plate surface of the power board 310 and the other side plate surface of the power board 410 are located in the installation sub-cavity portion 132. The fine pitch device 430 is disposed on the board surface of the power board 410 opposite to the air duct subchamber portion 131, so that the fine pitch device 430 can be disposed in the mounting subchamber portion 132. Of course, it should be understood that the power amplifier board 310 and the power board 410 may be integrally constructed so that they are connectable.

In some embodiments, when the power amplification board 310 is connected to the power board 410 and the installation cavity 130 of the installation case 100 is divided into the installation sub-cavity portion 132 and the duct sub-cavity portion 131, in order that the power amplification device 320 and the power switching device 420 may be disposed in contact with the heat sink 200, the power amplification device 320 may be disposed in contact with the heat sink 200 through the power amplification board 310, and the power switching device 420 may be disposed in contact with the heat sink 200 through the power board 410. Specifically, at least a portion of the power amplifier board 310 and at least a portion of the power board 410 are disposed in contact with the heat sink 200, so that the heat sink 200 can be supported by the power amplifier board 310 and the power board 410, the power board 410 is provided with a through hole for the power switch device 420 to pass through, and the pins of the power switch device 420 are located at the side of the power switch device 420, so that the pins of the power switch device 420 can be led out from the side wall of the power switch device 420 and electrically connected with a side plate surface of the power board 410 opposite to the heat sink 200.

The aperture size of the through hole of the power panel 410 may be set to match the external shape of the power switching device 420, specifically, the outer wall of the power switching device 420 may be in contact with the inner wall of the through hole of the power panel 410, or may have a smaller gap with the inner wall of the through hole of the power panel 410, so that the through hole of the power panel 410 may serve the purpose of limiting the power switching device 420, so that the power switching device 420 may be more reliably fixed to the power panel 410. In addition, it should be understood that, when the sidewall of the power switching device 420 is disposed in contact with the inner wall of the through hole of the power board 410, the heat generated by the power switching device 420 may be further transferred to the power board 410, and this portion of the heat may be transferred to the heat sink 200 through the power board 410, so as to achieve the purpose of sufficiently transferring the heat generated by the power switching device 420 to the heat sink 200.

When the heat dissipation element 200 is disposed in the air duct subchamber 131, one side of the air dissipation element may be disposed in contact with the power amplification board 310 and the power panel 410, so that the power amplification device 320 penetrating the power amplification board 310 and the power switching device 420 penetrating the power panel 410 may be disposed in contact with the heat dissipation element 200 directly. Accordingly, a side of the heat sink 200 facing away from the power amplifier board 310 and the power panel 410 may be connected to an inner wall of the air duct subchamber portion 131 of the installation case 100, so that the inner wall of the installation case 100 is supported on the heat sink 200, and further the heat sink 200 may be supported on the power amplifier board 310 and the power panel 410. Corresponding fixing holes can be formed in the heat dissipation part 200, the power amplification board 310 and the power panel 410, and the fixing parts can be arranged in the fixing holes of the heat dissipation part 200, the power amplification board 310 and the power panel 410 so that the power amplification board 310 and the power panel 410 can be mutually fixed with the heat dissipation part 200, and therefore the installation effect of the power amplification board 310 and the power panel 410 can be stable and reliable.

Of course, the side walls of the power amplification board 310 and the power supply board 410 may be fixedly connected with the inner wall of the installation shell 100, so that the installation effect of the power amplification board 310 and the power supply board 410 is more stable and reliable, correspondingly, the heat dissipation element 200 may also be arranged to have a gap with the power amplification board 310 and the power supply board 410, and the power amplification device 320 and the power supply switching device 420 may be arranged to penetrate through the power amplification board 310 and the power supply board 410 and extend into the air duct subchamber portion 131 to be in contact with the heat dissipation element 200, so that part of the power amplification device 320 and part of the power supply switching device 420 are located in the air duct subchamber portion 131, and thus the air flow in the air duct subchamber portion 131 may also directly act on the power amplification device 320 and the power supply switching device 420, so that the power amplification device 320 and the power supply switching device 420 may more fully dissipate heat.

In some embodiments, in order that the power switching device 420 and the power amplifying device 320 may be disposed in contact with the heat sink 200, the heat sink 200 may be penetrated through the power amplifying board 310 and the power board 410 such that at least a portion of the heat sink 200 is located in the installation sub-cavity portion 132, the power amplifying device 320 and the power switching device 420 may be disposed in contact with a portion of the heat sink 200 located in the installation sub-cavity portion 132, and heat generated by the power amplifying device 320 and the power switching device 420 may be transferred to the heat sink 200.

It should be noted that, if the power module 400 is not provided with the fine pitch device 430, that is, the power module 400 is not affected by dust accumulation, the power module 400 may be arranged in a manner that refers to the arrangement of the power amplifier module 300, so that heat generated by the power module 400 may be sufficiently conducted to the heat sink 200.

In some embodiments, in order to allow the air flow to pass through the duct subchamber portion 131 of the mounting case 100 more efficiently, the air inlet 110 and the air outlet 120 of the mounting case 100 may be disposed opposite to each other, so that the air flow in the duct subchamber portion 131 of the mounting case 100 may generate convection, and the air flow entering from the air inlet 110 of the mounting case 100 may be discharged through the air outlet 120 of the mounting case 100 without changing the direction of flow, so that the flow rate of the air flow is faster.

Referring to fig. 4, in some embodiments, when the power amplifier board 310 and the power panel 410 of the present application are both disposed on the heat sink 200, the power amplifier board 310 and the power panel 410 may also be disposed at intervals, so that the heat sink 200, the power amplifier board 310 and the power panel 410 cooperate to divide the installation cavity 130 of the installation housing 100 into the air duct subchamber portion 131 and the installation subchamber portion 132.

Referring to fig. 5, in order to provide the heat sink 200 of the present application with a higher heat dissipation efficiency, the heat sink 200 may be specifically configured to include the heat dissipation base 210 and the heat dissipation fins 220, wherein the heat dissipation base 210 may provide a mounting base for the power amplifier module 300 and the power module 400, the heat dissipation base 210 has a heat dissipation surface, the power amplifier module 300 and the power module 400 are both in contact connection with the heat dissipation surface of the heat dissipation base 210, the number of the heat dissipation fins 220 may be plural, and the plurality of the heat dissipation fins 220 may be disposed at a side of the heat dissipation base 210 facing away from the heat dissipation surface at intervals along a preset direction, so that a heat dissipation channel 230 through which an air flow passes may be formed between adjacent heat dissipation fins 220, and both ends of the heat dissipation channel 230 of the heat sink 200 may face the air inlet 110 and the air outlet 120 of the mounting case 100, respectively, so that the air flow passing through the air duct subcavity portion 131 may smoothly pass through the heat dissipation channel 230 of the heat dissipation fin 220, so that the air flow may be in contact with the heat dissipation fins 220.

In some embodiments, the blower 500 of the present application may be disposed in the installation cavity 130 of the installation housing 100, and particularly at the air inlet 110 or the air outlet 120 of the installation housing 100, such that the blower 500 may sufficiently suck air outside the installation housing 100 and input into the duct subchamber portion 131. Of course, the fan 500 may also be disposed outside the installation cavity 130 of the installation shell 100 and located at the air inlet 110 or the air outlet 120, and the specific location of the fan 500 is not limited in the present application.

Example two

Referring to fig. 6-8, based on the above radio frequency generating device, the embodiment of the application further provides a radio frequency thawing device, which comprises the above radio frequency generating device.

The radio frequency thawing device further comprises a radio frequency thawing assembly 600, wherein a tuning plate 630 and a polar plate 640 are arranged in the radio frequency thawing assembly 600, the tuning plate 630 is electrically connected with a tuning inductor, and the tuning inductor can be selectively arranged on the tuning plate 630 or independent from the tuning plate 630. The tuning plate 630 is electrically connected with the radio frequency generating device, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate 640 is electrically connected with the tuning plate 630 and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 300 is a power amplification signal corresponding to a standard load, and the tuning module is used for adjusting the impedance of a load end. The different thawed materials have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the thawing process, impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform impedance matching, the tuning module outputs a signal to the polar plate 640, and the polar plate 640 sends out a radio frequency signal, so that the thawing purpose of the food materials is realized.

The rf thawing assembly 600 further comprises a shield cylinder 610 having an open end 611 with an opening and a shield door 620 disposed at the open end 611 of the shield cylinder 610 for closing the opening to form a closed shield cavity with the shield cylinder 610. The tuning plate 630 and the polar plate 640 are both arranged in the shielding cylinder 610, the shielding cylinder 610 can provide a mounting foundation for the tuning plate 630 and the polar plate 640, and can also play a role in protecting the tuning plate 630 and the polar plate 640, in addition, the shielding cylinder 610 can also shield radio frequency signals emitted by the polar plate 640, and radio frequency signal leakage is avoided.

In some embodiments, a tuning chamber 612 and a thawing chamber 613 are disposed within the shield cylinder 610, the tuning plate 630 and the plate 640 are both disposed within the tuning chamber 612, the thawing chamber 613 is configured to receive food to be thawed, and the plate 640 radiates rf energy into the thawing chamber 613 to thaw the food in the thawing chamber 613. The tuning plate 630 and the polar plate 640 are placed separately from the food materials, so that the food materials are prevented from being polluted on one hand, and on the other hand, melted water after the food materials are thawed is prevented from contacting the tuning plate 630 and the polar plate 640 to damage components. In addition, in order to facilitate the placement of the tuning plate 630 and the pole plate 640 within the shield can 610, the rf thawing assembly 600 further includes a bracket 650, and the tuning plate 630 and the pole plate 640 may be placed on the bracket 650 such that the bracket 650 is supported by the tuning plate 630 and the pole plate 640.

Example III

Referring to fig. 9, based on the above radio frequency thawing device, the embodiment of the present utility model further provides a refrigerator, which includes a refrigerator main body 700 and the above radio frequency thawing device, wherein the radio frequency thawing assembly 600 may be disposed in the refrigerator main body 700, and the radio frequency generating device may be disposed at the top of the refrigerator main body 700.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

Claims (15)

1. A radio frequency generating device, comprising:

the installation shell (100) is provided with an air inlet (110), an air outlet (120) and an installation cavity (130), and the air inlet (110) and the air outlet (120) are communicated with the installation cavity (130);

A heat sink (200) provided in the installation cavity (130);

the fan (500) is arranged on the mounting shell (100) and is communicated with the air inlet (110) or the air outlet (120);

the power amplifier module (300) and the power module (400) are arranged in the mounting shell (100), at least part of the power amplifier module (300) and at least part of the power module (400) are in contact with the heat dissipation piece (200), and the power amplifier module (300) is electrically connected with the power module (400).

2. The radio frequency generating device according to claim 1, wherein the power amplification module (300) comprises a power amplification board (310) and a power amplification device (320), the power amplification device (320) is disposed on the power amplification board (310), and the power amplification device (320) is in contact with the heat sink (200).

3. The radio frequency generating device according to claim 2, wherein the power amplification board (310) is disposed on the heat dissipation member (200), and the power amplification device (320) is disposed through the power amplification board (310) and contacts the heat dissipation member (200).

4. A radio frequency generating device according to claim 3, characterized in that the power supply module (400) comprises a power supply board (410) and a power switching device (420), the power switching device (420) being arranged to the power supply board (410), and the power switching device (420) being arranged to be in contact with the heat sink (200).

5. The radio frequency generating device according to claim 4, wherein the mounting cavity (130) comprises an air duct subchamber portion (131) through which an air flow passes, the air duct subchamber portion (131) is in communication with the air inlet (110) and the air outlet (120), the power module (400) further comprises a fine pitch device (430), the fine pitch device (430) is disposed on the power panel (410), and the fine pitch device (430) is disposed outside the air duct subchamber portion (131), and at least a portion of the heat sink (200) is disposed in the air duct subchamber portion (131).

6. The radio frequency generating device according to claim 5, wherein the power panel (410) divides the installation cavity (130) into the air duct subchamber portion (131) and the installation subchamber portion (132), the air duct subchamber portion (131) is communicated with the installation subchamber portion (132), the opening of the installation subchamber portion (132) is oriented in the same direction as the airflow in the air duct subchamber portion (131), and the fine-pitch device (430) is arranged on one side of the power panel (410) facing away from the air duct subchamber portion (131).

7. The radio frequency generating device according to claim 6, wherein the power amplifier module (300) and the power switching device (420) are both located within the tunnel subchamber portion (131).

8. The radio frequency generating device according to claim 5, wherein the power board (310) is connected to the power board (410), the power board (310) and the power board (410) divide the installation cavity (130) into the air duct subchamber portion (131) and the installation subchamber portion (132), and the fine pitch device (430) is disposed on a side of the power board (410) facing away from the air duct subchamber portion (131).

9. The radio frequency generating device according to claim 8, wherein the power switching device (420) is disposed through the power panel (410) in contact with the heat sink (200).

10. The radio frequency generating device according to any of claims 1-9, wherein the air inlet (110) and the air outlet (120) are arranged opposite.

11. The radio frequency generating device according to claim 10, wherein the heat dissipating member (200) comprises a heat dissipating base (210) and a plurality of heat dissipating fins (220), the heat dissipating base (210) has a heat dissipating surface, the power amplifier module (300) and the power module (400) are in contact with the heat dissipating surface, the plurality of heat dissipating fins (220) are connected to a side of the heat dissipating base (210) facing away from the heat dissipating surface at intervals along a preset direction, a heat dissipating channel (230) is arranged between adjacent heat dissipating fins (220), one end of the heat dissipating channel (230) faces the air inlet (110), and the other end of the heat dissipating channel (230) faces the air outlet (120).

12. The radio frequency generating device according to claim 11, wherein the blower (500) is disposed in the mounting cavity (130), an air inlet side of the blower (500) is directed towards the air inlet (110), and an air outlet side of the blower (500) is directed towards the air outlet (120).

13. A radio frequency thawing device, characterized by comprising a radio frequency thawing assembly (600) and a radio frequency generating device as claimed in any of claims 1-12, said radio frequency thawing assembly (600) comprising:

a shield cylinder (610) having an open end (611);

a shielding door (620) provided at the opening end (611) for closing the opening end (611);

a tuning plate (630) disposed within the shield cylinder (610) and electrically connected to the radio frequency generating device;

and the polar plate (640) is arranged in the shielding cylinder body (610), is electrically connected with the tuning plate (630) and is used for transmitting radio frequency signals.

14. The radio frequency thawing device according to claim 13, characterized in that a tuning cavity (612) and a thawing cavity (613) for containing food to be thawed are provided in the shielding cylinder (610), the tuning plate (630) and the pole plate (640) being both provided in the tuning cavity (612).

15. A refrigerator, characterized by comprising a refrigerator body (700) and a radio frequency thawing device as claimed in claim 13 or 14, which is arranged inside the refrigerator body (700).