CN219512601U - Embedded industrial computer convenient for heat dissipation - Google Patents
Embedded industrial computer convenient for heat dissipation Download PDFInfo
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- CN219512601U CN219512601U CN202223510392.5U CN202223510392U CN219512601U CN 219512601 U CN219512601 U CN 219512601U CN 202223510392 U CN202223510392 U CN 202223510392U CN 219512601 U CN219512601 U CN 219512601U
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- industrial computer
- radiator
- water tank
- shell
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses an embedded industrial computer convenient for heat dissipation, which belongs to the field of industrial computers and comprises an embedded industrial computer body, wherein a heat dissipation mechanism is arranged at the rear end of the embedded industrial computer body and comprises a first radiator, a first shell, a heat conducting coil, a water tank, a fixed box, a water pump, a semiconductor refrigerating sheet, a second radiator, a second shell and a heat dissipation fan, the first radiator is fixedly connected at the rear end of the embedded industrial computer body, the first shell is fixedly connected outside the first radiator, and the heat dissipation mechanism arranged at the rear end of the embedded industrial computer body is used for dissipating heat of the embedded industrial computer body in a circulating water cooling mode after cooling water, so that the purpose of conveniently dissipating heat of the embedded industrial computer body is achieved, the heat dissipation effect and the heat dissipation efficiency of the embedded industrial computer body in use are greatly improved, and the service life of the embedded industrial computer body is further prolonged.
Description
Technical Field
The utility model relates to the field of industrial computers, in particular to an embedded industrial computer convenient for heat dissipation.
Background
The embedded industrial computer is a reinforced enhanced industrial computer which can be used as an industrial controller to reliably operate in an industrial environment. The embedded industrial personal computer is a computer which is specially designed for industrial sites and has compact mechanism.
In the prior art, the existing embedded industrial computer generally adopts the radiating fins to radiate heat, but when the embedded industrial computer is radiated, the radiating of heat generated by the embedded industrial computer is slower, and the radiating of the heat is inconvenient, so that the heat cannot be radiated timely in the long-time use process and accumulated in the embedded industrial computer, the temperature in the industrial computer is increased, the operation of electronic components in the embedded industrial computer is influenced, and the service life of the embedded industrial computer is shortened.
Disclosure of Invention
The utility model mainly aims to provide an embedded industrial computer convenient for heat dissipation, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a convenient radiating embedded industrial computer, includes embedded industrial computer body, the rear end of embedded industrial computer body is equipped with heat dissipation mechanism, and heat dissipation mechanism includes first radiator, first casing, heat conduction coil pipe, water tank, fixed box, water pump, semiconductor refrigeration piece, second radiator, second casing and radiator fan, first radiator fixed connection is at the rear end of embedded industrial computer body, and first casing fixed connection is in the outside of first radiator, heat conduction coil pipe fixed connection is between the fin of first radiator, water tank fixed connection is at the rear end of first casing, and fixed box fixed connection is in one side of first casing, water pump fixed connection is in the inside of fixed box, and the outlet pipe fixed connection of water pump's input and water tank left side, the output of water pump passes through conveyer pipe fixed connection with the inlet tube of heat conduction coil pipe, semiconductor refrigeration piece fixed connection is in the bottom surface of water tank, and second radiator fixed connection is in the bottom surface of water tank, second casing fixed connection is also at the bottom surface of second radiator fan fixed connection at the bottom surface of water tank fixed connection.
Preferably, the first radiator is fixedly arranged on the rear end wall of the embedded industrial computer body, the first shell is fixedly arranged outside the first radiator, and the heat conducting coil is fixedly arranged between the fins of the first radiator.
Preferably, the water tank is fixedly installed on the rear end wall of the first shell, the water inlet pipe is fixedly installed on the right side of the water tank, the water outlet pipe is fixedly installed on the left side of the water tank, and the fixing box is fixedly installed on the left side wall of the water tank.
Preferably, the water pump is fixedly arranged in the fixed box, the input end of the water pump is fixedly arranged with the water outlet pipe, the output end of the water pump is fixedly arranged with the input end of the heat conduction coil pipe through the conveying pipe, and the output end of the heat conduction coil pipe is fixedly arranged with the water inlet pipe through the connecting pipe.
Preferably, three grooves are formed in the bottom surface of the water tank, the refrigerating surface of the semiconductor refrigerating sheet is fixedly arranged on the top surface in the groove, and a second radiator is fixedly arranged on the bottom surface of the water tank.
Preferably, the second shell is fixedly installed on the bottom surface of the water tank and covers the second radiator, a radiating opening is formed in the bottom surface of the second shell, and a radiating fan is fixedly installed on the bottom surface of the second shell and located below the radiating opening.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the cooling water of the water tank is refrigerated by the semiconductor refrigeration technology through the heat dissipation mechanism arranged at the rear end of the embedded industrial computer body, the refrigerated cooling water is conveyed into the heat conduction coil arranged between the fins of the first radiator through the water pump, when the first radiator guides out the heat generated by the embedded industrial computer body and releases the heat, the heat which flows in the heat conduction coil and is guided out by the refrigerated cooling water absorbs the heat released by the first radiator and realizes heat exchange, so that the embedded industrial computer body is cooled by the circulating water cooling mode after the cooling water is refrigerated, the purpose of conveniently radiating the embedded industrial computer body is achieved, the radiating effect and radiating efficiency of the embedded industrial computer body in use are greatly improved, and the service life of the embedded industrial computer body is further prolonged.
Drawings
FIG. 1 is a front view of the overall structure of the present utility model;
FIG. 2 is a rear view of the overall structure of the present utility model;
fig. 3 is a schematic diagram illustrating a structural separation of the heat dissipation mechanism of the present utility model.
In the figure: 1. an embedded industrial computer body; 2. a heat dissipation mechanism; 3. a first heat sink; 4. a first housing; 5. a thermally conductive coil; 6. a water tank; 7. a water inlet pipe; 8. a water outlet pipe; 9. a fixed box; 10. a water pump; 11. a delivery tube; 12. a connecting pipe; 13. a groove; 14. a semiconductor refrigeration sheet; 15. a second heat sink; 16. a second housing; 17. a heat radiation port; 18. a heat radiation fan.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in fig. 1-3, an embedded industrial computer with convenient heat dissipation comprises an embedded industrial computer body 1, wherein a heat dissipation mechanism 2 is arranged at the rear end of the embedded industrial computer body 1, the heat dissipation mechanism 2 comprises a first radiator 3, a first shell 4, a heat conducting coil 5, a water tank 6, a fixed box 9, a water pump 10, a semiconductor refrigerating sheet 14, a second radiator 15, a second shell 16 and a heat dissipation fan 18, the first radiator 3 is fixedly connected at the rear end of the embedded industrial computer body 1, the first shell 4 is fixedly connected at the outside of the first radiator 3, the heat conducting coil 5 is fixedly connected between fins of the first radiator 3, the water tank 6 is fixedly connected at the rear end of the first shell 4, the fixed box 9 is fixedly connected at one side of the first shell 4, the water pump 10 is fixedly connected inside the fixed box 9, the input end of the water pump 10 is fixedly connected with a water outlet pipe 8 at the left side of the water tank 6, the output end of the water pump 10 is fixedly connected with the input end of the heat conducting coil 5 through a conveying pipe 11, the output end of the coil 5 is fixedly connected with a water inlet pipe 7 at the right side of the water tank 6 and the bottom surface 7 of the bottom surface of the water tank 6 is fixedly connected with the second radiator 16 through a connecting pipe 12, the heat conducting sheet is fixedly connected with the bottom surface of the second radiator 16 is fixedly connected with the bottom surface of the second shell 16, and the heat dissipation fan is fixedly connected with the bottom surface of the second shell 6 is fixedly connected with the bottom surface 16.
As shown in fig. 1-3, in this embodiment, in order to facilitate heat dissipation of the embedded industrial computer body 1 during use by the heat dissipation mechanism 2, the first radiator 3 is fixedly installed on the rear end wall of the embedded industrial computer body 1, the first casing 4 is fixedly installed outside the first radiator 3, the heat conducting coil 5 is fixedly installed between fins of the first radiator 3, the water tank 6 is fixedly installed on the rear end wall of the first casing 4, the water inlet pipe 7 is fixedly installed on the right side of the water tank 6, the water outlet pipe 8 is fixedly installed on the left side wall of the water tank 6, the fixed box 9 is also fixedly installed on the left side wall of the water tank 6, the water pump 10 is fixedly installed inside the fixed box 9, the input end of the water pump 10 and the water outlet pipe 8 are fixedly installed together, the output end of the water pump 10 and the input end of the heat conducting coil 5 are fixedly installed together through the conveying pipe 11, the output end of the heat conducting coil 5 and the water inlet pipe 7 are fixedly installed together through the connecting pipe 12, the bottom surface of the water tank 6 is provided with three grooves 13, the refrigerating surface of the semiconductor fin 14 is fixedly installed on the bottom surface of the groove 13, the bottom surface of the groove 13 is fixedly installed on the bottom surface of the second casing 16, the bottom surface of the second radiator 16 is fixedly installed on the bottom surface of the second casing 16, the second radiator 17 is fixedly installed on the bottom surface of the second casing 16, and the second radiator 17 is fixedly installed on the bottom surface of the second casing 16 is fixedly installed on the bottom surface of the second casing 17;
the specific operation of the heat dissipation mechanism 2 is as follows: when the embedded industrial computer body 1 is used, the semiconductor refrigerating sheet 14 installed in the groove 13 formed on the bottom surface of the water tank 6 is electrified, the refrigerating surface of the semiconductor refrigerating sheet 14, which is tightly attached to the top surface in the groove 13 after the electrification, starts to refrigerate cooling water in the water tank 6, and the heating surface of the semiconductor refrigerating sheet 14 is tightly attached to the second radiator 15 installed on the bottom surface of the water tank 6, so that the second radiator 15 can quickly guide out and release heat generated when the semiconductor refrigerating sheet 14 refrigerates to the inside of the second shell 16 installed on the bottom surface of the water tank 6, at the moment, the heat dissipation fan 18 installed on the bottom surface of the second shell 16 discharges the heat of the second shell 16 through the heat dissipation opening 17 formed on the bottom surface of the second shell 16, thereby avoiding the influence of the heat generated by the semiconductor refrigerating sheet 14 in the continuous refrigeration process of the cooling water in the water tank 6 on the semiconductor refrigerating sheet itself, when the semiconductor refrigerating sheet 14 continuously refrigerates the cooling water of the water tank 6, the water pump 10 of the fixed box 9 arranged at the left side of the water tank 6 pumps the refrigerated cooling water out of the water tank 6 through the water outlet pipe 8 at the left side of the water tank 6, the refrigerated cooling water is conveyed to the heat conducting coil 5 arranged between the fins of the first radiator 3 on the rear end wall of the embedded industrial computer body 1 through the conveying pipe 11 by the output end, the first radiator 3 absorbs and takes away the cooling water refrigerated in the heat conducting coil 5 according to the heat exchange principle by leading out and releasing the heat when the embedded industrial computer body 1 is used in the process of the refrigerated cooling water flowing in the first radiator 3, finally, the cooling water flows back into the water tank 6 from the water inlet pipe 7 through the connecting pipe 12 and is refrigerated again by the semiconductor refrigerating sheet 14, therefore, after cooling water is cooled, the embedded industrial computer body 1 is cooled by circulating water, the purpose of conveniently cooling the embedded industrial computer body 1 is achieved, the cooling effect and the cooling efficiency of the embedded industrial computer body 1 in use are greatly improved, and the service life of the embedded industrial computer body 1 is further prolonged.
The foregoing is only illustrative of the preferred embodiments of the present utility model and, although the present utility model has been described in detail with reference to the foregoing embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model, and equivalents of the features may be substituted for elements thereof without departing from the true spirit and scope of the utility model.
Claims (6)
1. The utility model provides a convenient radiating embedded industrial computer, includes embedded industrial computer body (1), its characterized in that: the rear end of the embedded industrial computer body (1) is provided with a heat dissipation mechanism (2), the heat dissipation mechanism (2) comprises a first radiator (3), a first shell (4), a heat conduction coil (5), a water tank (6), a fixing box (9), a water pump (10), a semiconductor refrigerating sheet (14), a second radiator (15), a second shell (16) and a heat dissipation fan (18), the first radiator (3) is fixedly connected to the rear end of the embedded industrial computer body (1), the first shell (4) is fixedly connected to the outside of the first radiator (3), the heat conduction coil (5) is fixedly connected between fins of the first radiator (3), the water tank (6) is fixedly connected to the rear end of the first shell (4), the fixing box (9) is fixedly connected to one side of the first shell (4), the water pump (10) is fixedly connected to the inside of the fixing box (9), the input end of the water pump (10) is fixedly connected to a water outlet pipe (8) on the left side of the water tank (6), the output end of the water pump (10) is fixedly connected to a water inlet pipe (12) through a heat conduction pipe (7) on the right side of the heat conduction coil (5) and is fixedly connected to a water inlet pipe (7) on the right side of the water tank (6), the semiconductor refrigerating sheet (14) is fixedly connected in the bottom surface of the water tank (6), the second radiator (15) is fixedly connected to the bottom surface of the water tank (6), the second shell (16) is also fixedly connected to the bottom surface of the water tank (6), and the cooling fan (18) is fixedly connected to the bottom surface of the second shell (16).
2. The heat dissipation facilitating built-in industrial computer of claim 1, wherein: the first radiator (3) is fixedly arranged on the rear end wall of the embedded industrial computer body (1), the first shell (4) is fixedly arranged outside the first radiator (3), and the heat conducting coil pipes (5) are fixedly arranged between the fins of the first radiator (3).
3. The heat dissipation facilitating built-in industrial computer of claim 2, wherein: the water tank (6) is fixedly mounted on the rear end wall of the first shell (4), the water inlet pipe (7) is fixedly mounted on the right side of the water tank (6), the water outlet pipe (8) is fixedly mounted on the left side of the water tank (6), and the fixing box (9) is fixedly mounted on the left side wall of the water tank (6).
4. A heat sink-facilitating embedded industrial computer according to claim 3, wherein: the water pump (10) is fixedly arranged in the fixed box (9), the input end of the water pump (10) is fixedly arranged with the water outlet pipe (8), the output end of the water pump (10) is fixedly arranged with the input end of the heat conducting coil pipe (5) through the conveying pipe (11), and the output end of the heat conducting coil pipe (5) is fixedly arranged with the water inlet pipe (7) through the connecting pipe (12).
5. The heat dissipation facilitating built-in industrial computer of claim 4, wherein: three grooves (13) are formed in the bottom surface of the water tank (6), the refrigerating surface of the semiconductor refrigerating piece (14) is fixedly arranged on the top surface in the groove of the grooves (13), and a second radiator (15) is fixedly arranged on the bottom surface of the water tank (6).
6. The heat dissipation facilitating built-in industrial computer of claim 5, wherein: the second shell (16) is fixedly arranged on the bottom surface of the water tank (6) and covers the second radiator (15), a radiating opening (17) is formed in the bottom surface of the second shell (16), and a radiating fan (18) is fixedly arranged on the bottom surface of the second shell (16) and located below the radiating opening (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223510392.5U CN219512601U (en) | 2022-12-28 | 2022-12-28 | Embedded industrial computer convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223510392.5U CN219512601U (en) | 2022-12-28 | 2022-12-28 | Embedded industrial computer convenient for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219512601U true CN219512601U (en) | 2023-08-11 |
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ID=87528774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223510392.5U Active CN219512601U (en) | 2022-12-28 | 2022-12-28 | Embedded industrial computer convenient for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219512601U (en) |
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2022
- 2022-12-28 CN CN202223510392.5U patent/CN219512601U/en active Active
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