CN219459427U

CN219459427U - High-power module power supply for current output

Info

Publication number: CN219459427U
Application number: CN202223036215.8U
Authority: CN
Inventors: 尧军; 唐奂; 罗良
Original assignee: Enargy Power Shenzhen Co ltd
Current assignee: Enargy Power Shenzhen Co ltd
Priority date: 2022-11-15
Filing date: 2022-11-15
Publication date: 2023-08-01
Anticipated expiration: 2032-11-15

Abstract

The utility model discloses a high-power module power supply for current output, and relates to the technical field of module power supplies. The utility model provides the following technical scheme: the utility model provides a high-power module power for current output, includes the shell, the front fixed mounting of shell has wiring panel, the side fixed mounting of shell has the work pilot lamp, the top of shell is provided with crashproof framework, the inside of shell is provided with heat radiation structure and power body. Through setting up heat radiation structure, utilize the produced air conditioning of cold junction of semiconductor refrigeration piece to cool down the processing to the power body, the heat that carries on the hot end of semiconductor refrigeration piece is outwards derived through radiator fan to the cooperation radiator fin again for this module power can be carried out the shell fast by the produced heat of during operation, thereby has guaranteed to possess good temperature environment in the shell, has guaranteed the normal work of power body.

Description

High-power module power supply for current output

Technical Field

The utility model relates to the technical field of module power supplies, in particular to a module power supply for outputting high-power current.

Background

The module power supply is a power supply functional component which is formed by making power supply functional components into parts, can be directly attached to or installed on a printed circuit board through a connector, is used for supplying power to various loads in various electronic equipment, and can greatly simplify the power supply design of an electronic application system. The module power supply has the advantages of high efficiency, small volume, convenient and flexible use, stable and reliable performance and the like, and becomes an indispensable power supply scheme for various industries, especially high-end electronic products, so that the module power supply is widely applied to the communication fields of switching equipment, access equipment, mobile communication, microwave communication, optical transmission, routers and the like, automobile electronics, aerospace and the like.

The module power supply for outputting high-power current is a module power supply with a relatively complex structure, and generally refers to a module power supply with output power of more than 1000W and output current of more than 300A.

In the prior art, a large amount of heat is generated in the power supply of the module for outputting the current with high power after the power supply is used for a long time, and the existing heat dissipation mode adopts a built-in heat dissipation fan to carry out heat dissipation treatment on the power supply per se, but the heat dissipation mode has poor effect and causes the problem of overhigh internal temperature of the power supply of the module for outputting the current with high power;

and the high-power module power supply for current output is easy to collide when in use, thereby causing the damage of the high-power module power supply for current output and increasing the working cost.

Disclosure of Invention

The utility model provides a module power supply for outputting high-power current, which aims to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high-power module power for current output, includes the shell, the front fixed mounting of shell has the wiring panel, the side fixed mounting of shell has the work pilot lamp, the top of shell is provided with crashproof framework, the inside of shell is provided with heat radiation structure and power body;

the anti-collision framework comprises an anti-collision plate, wherein a damping spring rod is fixedly arranged at the bottom end of the anti-collision plate, and the anti-collision plate is movably connected with the top of the shell through the damping spring rod;

the heat radiation structure comprises a semiconductor refrigerating sheet, the cold end of the semiconductor refrigerating sheet is overlapped with the power supply body, a heat radiation fan is fixedly arranged on the side face of the shell, and the heat radiation fan is positioned on the side face of the hot end of the semiconductor refrigerating sheet.

Further, the inner wall of the shell is provided with an insulating layer, the thickness of the insulating layer is 0.1-1 mm, the insulating strength of the insulating layer meets voltage withstand voltage of 500-1000V, the insulating layer is made of an alumina ceramic substrate, and the alumina ceramic substrate is a 95 alumina ceramic substrate with the thickness of 0.1 mm.

Further, the top fixedly connected with spring loop bar of shell, the surface sliding connection of spring loop bar has two deflection poles, and two deflection poles set up relatively, the top of deflection pole is articulated with the bottom of anticollision board.

Further, a heat radiation fin is welded at the hot end of the semiconductor refrigerating sheet, and the heat radiation fin is positioned between the semiconductor refrigerating sheet and the heat radiation fan.

Further, a dustproof cover shell is hinged to the side face of the shell, and the size of the dustproof cover shell is matched with the specification of the cooling fan.

Compared with the prior art, the utility model provides a module power supply for outputting high-power current, which has the following beneficial effects:

1. this high-power module power supply for current output utilizes damping spring pole to suspend the crashproof board in the top of shell through setting up crashproof framework, and the external impact force can be absorbed to the spring loop bar again in the cooperation, makes deflection pole on the spring loop bar rotate and makes the crashproof board carry out vertical shake under the effect of impact force, and then reaches the effect to the shock attenuation buffering, has avoided the power body to receive the damage of taking place after the vibrations easily, guarantees the integrality of power body.

2. This module power is used in high-power electric current output utilizes the cold air that the cold junction of semiconductor refrigeration piece produced to cool down the processing to the power body through setting up heat radiation structure, and the heat that carries on the hot end of semiconductor refrigeration piece is outwards derived through radiator fan to the heat that cooperates radiator fin again for this module power produced when the during operation can be taken out the shell fast, thereby has guaranteed to possess good temperature environment in the shell, has guaranteed the normal work of power body.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of an anti-collision architecture according to the present utility model;

fig. 3 is a cross-sectional view of the housing structure of the present utility model.

In the figure: 1. a housing; 2. a wiring panel; 3. a work indicator light; 4. an anti-collision framework; 5. a heat dissipation structure; 6. a power supply body; 7. an insulating layer; 8. a spring sleeve rod; 9. a deflection lever; 10. an anti-collision plate; 11. damping spring rod; 12. a semiconductor refrigeration sheet; 13. a heat radiation fin; 14. a heat radiation fan; 15. a dust-proof cover.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the utility model discloses a high-power module power supply for outputting current, which comprises a shell 1, wherein a wiring panel 2 is fixedly arranged on the front surface of the shell 1, a working indicator lamp 3 is fixedly arranged on the side surface of the shell 1, an anti-collision framework 4 is arranged at the top of the shell 1, and a heat dissipation structure 5 and a power supply body 6 are arranged in the shell 1;

the anti-collision framework 4 comprises an anti-collision plate 10, a damping spring rod 11 is fixedly arranged at the bottom end of the anti-collision plate 10, the anti-collision plate 10 is movably connected with the top of the shell 1 through the damping spring rod 11, a spring sleeve rod 8 is fixedly connected with the top of the shell 1, two deflection rods 9 are slidably connected with the surface of the spring sleeve rod 8, the two deflection rods 9 are oppositely arranged, and the top end of the deflection rod 9 is hinged to the bottom of the anti-collision plate 10.

Through setting up crashproof framework 4, utilize damping spring pole 11 to suspend crashproof board 10 in the top of shell 1, the external impact force of cooperation spring loop bar 8 again can be absorbed, makes deflection pole 9 on the spring loop bar 8 rotate and makes crashproof board 10 carry out vertical shake under the effect of impact force, and then reaches the effect to shell 1 shock attenuation buffering, has avoided power body 6 to receive the damage of taking place after the vibrations easily, guarantees the integrality of power body 6.

The heat radiation structure 5 comprises a semiconductor refrigerating sheet 12, the cold end of the semiconductor refrigerating sheet 12 is lapped with the power supply body 6, a heat radiation fan 14 is fixedly arranged on the side face of the shell 1, the heat radiation fan 14 is positioned on the side face of the hot end of the semiconductor refrigerating sheet 12, heat radiation fins 13 are welded on the hot end of the semiconductor refrigerating sheet 12, and the heat radiation fins 13 are positioned between the semiconductor refrigerating sheet 12 and the heat radiation fan 14.

Through setting up heat radiation structure 5, utilize the produced air conditioning of cold junction of semiconductor refrigeration piece 12 to carry out the cooling treatment to power body 6, cooperate radiator fin 13 again with the heat that carries on the hot end of semiconductor refrigeration piece 12 outwards derive through radiator fan 14 for the produced heat of this module power when the during operation can be taken out shell 1 fast, thereby has guaranteed to possess good temperature environment in the shell 1, has guaranteed the normal work of power body 6.

Specifically, the inner wall of the shell 1 is provided with an insulating layer 7, the thickness of the insulating layer 7 is 0.1-1 mm, the insulating strength of the insulating layer meets the voltage withstand voltage of 500-1000 v, the insulating layer 7 is made of an alumina ceramic substrate, and the alumina ceramic substrate is a 95 alumina ceramic substrate with the thickness of 0.1 mm.

In this embodiment, the insulating layer 7 can insulate the inner wall of the housing 1, so as to avoid short circuit of other devices caused by current leakage.

Specifically, a dustproof cover 15 is hinged to the side face of the housing 1, and the size of the dustproof cover 15 is matched with the specification of the cooling fan 14.

In the present embodiment, the rotatable dust cover 15 is used to cover the radiator fan 14 when the radiator fan 14 stops operating, thereby preventing dust from entering the radiator fan 14.

When the semiconductor refrigerating sheet 12 is in use, when the heat dissipation is needed to be carried out inside the shell 1, the semiconductor refrigerating sheet 12 is started to enable the semiconductor refrigerating sheet 12 to be electrified to work, the semiconductor refrigerating sheet 12 is composed of an N-type semiconductor material and a P-type semiconductor material, when the N-type semiconductor material and the P-type semiconductor material are connected into a couple, after direct current is connected in the circuit, energy transfer can be generated, the current absorbs heat from a joint of the N-type element to the P-type element, a cold end is formed by releasing heat from the joint of the P-type element to the N-type element, and the cold end is formed by absorbing heat generated by the module power supply body 6 through the semiconductor refrigerating sheet 12, and then the heat carried by the hot end of the semiconductor refrigerating sheet 12 is led out through the heat dissipation fan 14 in a matched mode, so that the heat generated by the module power supply during working can be quickly taken out of the shell 1.

In summary, according to the module power supply for outputting high-power current, the anti-collision framework 4 is arranged, the anti-collision plate 10 is suspended above the shell 1 by the damping spring rod 11, and then the external impact force can be absorbed by the spring sleeve rod 8, so that the deflection rod 9 on the spring sleeve rod 8 is driven to rotate, the anti-collision plate 10 vertically shakes under the action of the impact force, the effect of damping and buffering the shell 1 is achieved, the power supply body 6 is prevented from being damaged after being easily vibrated, and the integrity of the power supply body 6 is ensured; through setting up heat radiation structure 5, utilize the produced air conditioning of cold junction of semiconductor refrigeration piece 12 to carry out the cooling treatment to power body 6, cooperate radiator fin 13 again with the heat that carries on the hot end of semiconductor refrigeration piece 12 outwards derive through radiator fan 14 for the produced heat of this module power when the during operation can be taken out shell 1 fast, thereby has guaranteed to possess good temperature environment in the shell 1, has guaranteed the normal work of power body 6.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-power current output is with module power, includes shell (1), its characterized in that: the front of the shell (1) is fixedly provided with a wiring panel (2), the side surface of the shell (1) is fixedly provided with a working indicator lamp (3), the top of the shell (1) is provided with an anti-collision framework (4), and the interior of the shell (1) is provided with a heat dissipation structure (5) and a power supply body (6);

the anti-collision framework (4) comprises an anti-collision plate (10), a damping spring rod (11) is fixedly arranged at the bottom end of the anti-collision plate (10), and the anti-collision plate (10) is movably connected with the top of the shell (1) through the damping spring rod (11);

the heat dissipation structure (5) comprises a semiconductor refrigerating sheet (12), the cold end of the semiconductor refrigerating sheet (12) is overlapped with the power supply body (6), a heat dissipation fan (14) is fixedly arranged on the side face of the shell (1), and the heat dissipation fan (14) is located on the side face of the hot end of the semiconductor refrigerating sheet (12).

2. A high-power module power supply for outputting electric current as claimed in claim 1, wherein: the inner wall of the shell (1) is provided with an insulating layer (7), the thickness of the insulating layer (7) is 0.1-1 mm, the insulating strength of the insulating layer (7) meets voltage withstand voltage of 500-1000V, the insulating layer (7) is made of an alumina ceramic substrate, and the alumina ceramic substrate is a 95 alumina ceramic substrate with the thickness of 0.1 mm.

3. A high-power module power supply for outputting electric current as claimed in claim 1, wherein: the top fixedly connected with spring loop bar (8) of shell (1), the surface sliding connection of spring loop bar (8) has two deflection poles (9), and two deflection poles (9) set up relatively, the top of deflection pole (9) is articulated with the bottom of anticollision board (10).

4. A high-power module power supply for outputting electric current as claimed in claim 1, wherein: and the heat end of the semiconductor refrigerating sheet (12) is welded with radiating fins (13), and the radiating fins (13) are positioned between the semiconductor refrigerating sheet (12) and the radiating fan (14).

5. A high-power module power supply for outputting electric current as claimed in claim 1, wherein: the side of the shell (1) is hinged with a dustproof cover shell (15), and the size of the dustproof cover shell (15) is matched with the specification of the cooling fan (14).