CN217741719U

CN217741719U - 5G digital repeater

Info

Publication number: CN217741719U
Application number: CN202221741857.5U
Authority: CN
Inventors: 刘平堂; 陈庆
Original assignee: Huaxing Communication Technology Co ltd
Current assignee: Huaxing Communication Technology Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2022-11-04
Anticipated expiration: 2032-07-05

Abstract

The utility model relates to a 5G digital repeater, the equipment box of which comprises a box main body, a fixing plate which is arranged inside the box main body and used for fixing a power supply and a mainboard, and a closed heat conduction mechanism and an active cooling mechanism which are arranged on the two side surfaces of the box main body; the closed heat conduction mechanism is arranged on one side of the mainboard installation module and comprises an isolation metal plate and heat conduction fins integrally formed on two sides of the isolation metal plate; the active cooling mechanism comprises a semiconductor refrigeration plate and a controller; rectangular grooves are formed in two side faces of the box main body, and a plurality of heat conduction holes are formed in the fixing plate; the isolation metal plate and the semiconductor refrigeration plate are respectively fixed in the rectangular groove, and the semiconductor refrigeration plate is connected with a power supply through a controller. This 5G digital repeater adopts totally enclosed machine case design, and the cooperation is to quick heat conduction and the initiative cooling of quick-witted case internal environment, makes it under the inside radiating prerequisite of guaranteeing to dispel the heat, carries out comprehensive isolation protection to inside mainboard and power.

Description

5G digital repeater

Technical Field

The utility model relates to the field of communication technology, concretely relates to 5G digital repeater.

Background

The 5G repeater is a relay communication device used for transferring and processing and extending 5G signal range, and the existing 5G repeater consists of a receiving antenna, a near-end machine, a far-end machine and a transmitting antenna: the receiving antenna is connected with the near-end machine, fixed in a 5G signal coverage area and used for receiving 5G radio frequency signals and processing the signals into digital signals; the transmitting antenna is connected with the remote terminal, fixed in a signal-free area and used for amplifying and converting the digital signal into a radio frequency signal and covering the area with the signal; the near-end machine and the far-end machine are in wired connection through optical fibers. In order to ensure the heat dissipation of an internal main board and a power supply, an open design of opening heat dissipation holes or heat dissipation gratings at the bottom of a shell or a chassis is generally adopted in the existing near-end and far-end machines, so that the performance of the existing near-end and far-end machines is often reduced or internal elements are damaged due to the damp environment or the deposition of dust (such as an underground shield construction environment).

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is: the 5G digital repeater adopts a totally enclosed case design, and is matched with rapid heat conduction and active cooling of the internal environment of the case, so that the comprehensive isolation protection is carried out on an internal mainboard and a power supply on the premise of ensuring the heat dissipation of the internal heat dissipation.

The 5G digital repeater comprises a receiving antenna, a near-end machine, a far-end machine and a transmitting antenna, wherein the near-end machine is connected with the far-end machine through optical fibers, the receiving antenna and the transmitting antenna are respectively connected to the near-end machine and the far-end machine, and the near-end machine and the far-end machine are both arranged in an equipment box, wherein the equipment box comprises a box main body, a fixing plate, a closed heat conduction mechanism and an active cooling mechanism, the fixing plate is arranged in the box main body and used for fixing a power supply and a main board, and the closed heat conduction mechanism and the active cooling mechanism are arranged on two side faces of the box main body; the closed heat conduction mechanism is arranged on one side of the mainboard installation module and comprises an isolation metal plate and heat conduction fins which are integrally formed on two sides of the isolation metal plate; the active cooling mechanism comprises a semiconductor refrigeration plate and a controller; rectangular grooves are formed in two side faces of the box main body, and a plurality of heat conduction holes are formed in the fixing plate; the isolation metal plate and the semiconductor refrigeration plate are respectively fixed in the rectangular groove, and the semiconductor refrigeration plate is connected with a power supply through a controller.

Specifically, for passive cooling, because the module mounting surface on the main board is a main heat-generating region, the closed heat-conducting mechanism is mounted on the side of the fixed plate where the module is mounted on the main board; the active cooling mechanism is arranged on one side of the fixing plate where welding spots are arranged on the main board.

The semiconductor refrigeration plate is characterized in that the active cooling is achieved, the controller is installed on the fixing plate and comprises an MCU (microprogrammed control unit) processor, a temperature sensor, a power conversion module and a relay switch module, the temperature sensor is connected with the input end of the MCU processor, the relay switch module is connected with the output end of the MCU processor, the input end of the power conversion module is connected with the power, and the output end of the power conversion module is connected with the semiconductor refrigeration plate through the relay switch module.

In order to ensure that the fins in the box body can quickly collect heat and conduct heat to the external fins uniformly, silicon heat-conducting glue is filled between the heat-conducting fins of the isolation metal plate positioned in the box body.

In order to ensure the totally-enclosed waterproof and dustproof performance of the equipment, a circle of sealing rubber strip is arranged between the inner edge of the rectangular groove and the edges of the isolation metal plate and the semiconductor refrigeration plate.

The utility model relates to a 5G digital repeater has overcome performance degradation, the component that current nearly, the open heat dissipation design of distal end machine lead to and has impaired, defect such as life weak point, and it adopts totally enclosed machine case design, and the cooperation makes it under the inside radiating prerequisite of guaranteeing to dispel the heat, carry out comprehensive isolation protection to inside mainboard and power to quick heat conduction and the active cooling of quick-witted incasement portion environment.

Drawings

The following will further explain the 5G digital repeater of the present invention with reference to the accompanying drawings:

FIG. 1 is a schematic structural diagram of a main plane of the 5G digital repeater (with the box body opened);

FIG. 2 is a schematic diagram of a rear view plane structure of the 5G digital repeater (with the box body closed);

FIG. 3 is a schematic bottom plan view of the 5G digital repeater;

FIG. 4 is a logic connection block diagram of the active cooling mechanism of the 5G digital repeater.

In the figure:

1-a box main body; 11-rectangular groove, 12-sealing rubber strip;

2-the fixing plate; 21-heat conduction holes;

3-sealing the heat conducting mechanism; 31-isolation metal plate, 32-heat conduction fin and 33-silicon heat conduction glue;

4-an active cooling mechanism; 41-semiconductor refrigerating plate, 42-controller.

Detailed Description

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, it is to be understood that the terms "left", "right", "front", "back", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, and are used merely for convenience of description and simplification of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

The technical solution of the present invention is further described with the following embodiments, but the scope of the present invention is not limited to the following embodiments.

Embodiment 1: as shown in fig. 1 to 3, the 5G digital repeater includes a receiving antenna, a near-end machine, a far-end machine, and a transmitting antenna, where the near-end machine is connected to the far-end machine through an optical fiber, the receiving antenna and the transmitting antenna are connected to the near-end machine and the far-end machine respectively, and the near-end machine and the far-end machine are both arranged in an equipment box, where the equipment box includes a box main body 1, a fixing plate 2 arranged inside the box main body 1 and used for fixing a power supply and a main board, and a closed heat conduction mechanism 3 and an active cooling mechanism 4 arranged on two side faces of the box main body 1; the closed heat conducting mechanism 3 is installed on one side of the mainboard installation module and comprises an isolation metal plate 31 and heat conducting fins 32 which are integrally formed on two sides of the isolation metal plate 31; the active cooling mechanism 4 comprises a semiconductor refrigeration plate 41 and a controller 42; two side surfaces of the box main body 1 are provided with rectangular grooves 11, and the fixed plate 2 is provided with a plurality of heat conduction holes 21; the isolation metal plate 31 and the semiconductor refrigeration plate 41 are respectively fixed in the rectangular groove 11, and the semiconductor refrigeration plate 31 is connected with a power supply through a controller 42. The closed heat conducting mechanism 3 is arranged on one side of the fixing plate 2, which is provided with the module, of the main board; the active cooling mechanism 4 is arranged on one side of the fixing plate 2 where welding spots are arranged on the main board.

Embodiment 2: as shown in FIG. 4, the 5G digital repeater has the controller 42 installed on the fixing plate 2, the controller 42 comprises an MCU processor, a temperature sensor, a power supply conversion module and a relay switch module, the temperature sensor is connected with the input end of the MCU processor, the relay switch module is connected with the output end of the MCU processor, the input end of the power supply conversion module is connected with the power supply, and the output end of the power supply conversion module is connected with the semiconductor refrigerating plate 41 through the relay switch module. The remaining structure and components are as described in embodiment 1, and the description will not be repeated.

Embodiment 3: in the 5G digital repeater, silicon heat-conducting glue 33 is filled between the heat-conducting fins 32 of the isolation metal plate 31 positioned in the box main body. The remaining structure and components are as described in embodiment 1, and the description will not be repeated.

Embodiment 4: a circle of sealing rubber strips 12 are arranged between the inner edge of the rectangular groove 11 and the edges of the isolation metal plate 31 and the semiconductor refrigeration plate 41 of the 5G digital repeater. The remaining structure and components are as described in embodiment mode 1, and the description is not repeated.

And (3) running: the box main body is combined with an isolation metal plate and a semiconductor refrigerating plate to completely seal a mainboard and a power supply in an internal interface of the equipment box and is arranged on the lower edge of the box main body, a wiring is arranged in a box body and is connected with the mainboard, a fin on the inner side of a sealed heat conduction mechanism on one side where a mainboard module is arranged and mainly used for generating heat guides the mainboard and the power supply to a fin outside the box and radiates the heat to the outside, a temperature sensor on a controller collects temperature data near a fixed plate in the box, when the internal heat generation quantity is increased due to continuous data transmission, the output end of an MCU processor controls a relay switch to be closed, the power supply supplies power to the semiconductor refrigerating plate through a power supply conversion module, and the interior of the box is actively cooled; the controller and the temperature sensor are powered by the MCU processor in series, and the MCU processor and the relay module adopt a DC5V semiconductor refrigeration board from a main board and convert the DC5V semiconductor refrigeration board into DC12V from a case power supply.

The digital repeater overcomes the defects of performance reduction, element damage, short service life and the like caused by the open heat dissipation design of the existing near-end machine and far-end machine, adopts the design of a totally-enclosed case, and is matched with rapid heat conduction and active cooling of the internal environment of the case, so that the digital repeater can carry out comprehensive isolation protection on an internal mainboard and a power supply on the premise of ensuring the heat dissipation and internal heat dissipation.

The foregoing description illustrates the principal features, basic principles, and advantages of the invention. It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments or examples, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The foregoing embodiments or examples are therefore to be considered in all respects illustrative and not restrictive. The scope of the invention is indicated by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.

Claims

1. A5G digital repeater is characterized in that: comprises a receiving antenna, a near-end machine, a far-end machine and a transmitting antenna, wherein the near-end machine is connected with the far-end machine through optical fibers, the receiving antenna and the transmitting antenna are respectively connected with the near-end machine and the far-end machine, the near-end machine and the far-end machine are both arranged in an equipment box, the equipment box comprises a box main body (1), a fixing plate (2) which is arranged in the box main body (1) and used for fixing a power supply and a main board, a closed heat conduction mechanism (3) and an active cooling mechanism (4) which are arranged on two side faces of the box main body (1),

the closed heat conducting mechanism (3) is arranged on one side of the mainboard mounting module and comprises an isolation metal plate (31) and heat conducting fins (32) integrally formed on two sides of the isolation metal plate (31); the active cooling mechanism (4) comprises a semiconductor refrigeration plate (41) and a controller (42); rectangular grooves (11) are formed in two side faces of the box main body (1), and a plurality of heat conduction holes (21) are formed in the fixing plate (2); the isolation metal plate (31) and the semiconductor refrigeration plate (41) are respectively fixed in the rectangular groove (11), and the semiconductor refrigeration plate (41) is connected with a power supply through a controller (42).

2. The 5G digital repeater according to claim 1, wherein: the closed heat conduction mechanism (3) is arranged on one side, carrying the module, of the main board on the fixing plate (2); the active cooling mechanism (4) is arranged on one side of the fixing plate (2) where welding spots are arranged on the main board.

3. The 5G digital repeater according to claim 2, wherein: controller (42) are installed on fixed plate (2), and controller (42) include MCU treater, temperature sensor, power conversion module and relay switch module, temperature sensor is connected with the input of MCU treater, and relay switch module is connected with the output of MCU treater, and power conversion module input is connected the power, power conversion module output are connected through relay switch module semiconductor refrigeration board (41).

4. The 5G digital repeater according to claim 3, wherein: the isolation metal plate (31) is positioned between the heat conduction fins (32) inside the box body and filled with silicon heat conduction glue (33).

5. The 5G digital repeater according to claim 4, wherein: and a circle of sealing rubber strips (12) are arranged between the inner edge of the rectangular groove (11) and the edges of the isolation metal plate (31) and the semiconductor refrigerating plate (41).