CN218587531U

CN218587531U - Module for mobile communication equipment

Info

Publication number: CN218587531U
Application number: CN202222322524.5U
Authority: CN
Inventors: 于海潮
Original assignee: Xi'an Longhui Science And Trade Co ltd
Current assignee: Xi'an Longhui Science And Trade Co ltd
Priority date: 2022-09-01
Filing date: 2022-09-01
Publication date: 2023-03-07
Anticipated expiration: 2032-09-01

Abstract

The utility model discloses a module for mobile communication equipment, which comprises an outer shell, a shell side wall mounting has two antennas, be provided with the port on another lateral wall of shell, the bottom is installed to the shell bottom, the symmetry is provided with two fixed orificess on the bottom. Has the advantages that: the utility model discloses a bottom, shell, semiconductor refrigeration piece, VC soaking pit and the conducting strip that sets up adopt totally enclosed structure, can be at utmost avoid in the dust gets into the module, have stronger leakproofness, use the semiconductor refrigeration piece to carry out the high efficiency cooling, avoid its condition that high temperature trouble appears under the high load function to sealed effect and radiating effect when having improved the module use, make the module still stable operation under the high pressure scene.

Description

Module for mobile communication equipment

Technical Field

The utility model relates to a communication equipment technical field, concretely relates to module for mobile communication equipment.

Background

Communication equipment is divided into limited communication equipment and wireless communication equipment, and the communication equipment comprises a module used for communication operation so as to realize processing, conversion, transmission and the like of communication signals, and belongs to important parts in the communication equipment.

However, the existing module for mobile communication equipment mostly adopts a semi-closed structure, and the module dissipates heat through a simple metal plate, so that the sealing effect is poor, dust is easily accumulated, and high-temperature fault is easily caused under the high-load operation, thereby reducing the sealing effect and the heat dissipation effect when the module is used, and therefore, a novel module for mobile communication equipment is urgently needed to solve the problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model aims to solve the technical problem that to prior art's current situation, provide a sealed effectual, the heat-sinking capability is strong and use stable module for mobile communication equipment.

(II) technical scheme

The utility model discloses a following technical scheme realizes: the utility model provides a module for mobile communication equipment, which comprises an outer shell, shell a side wall mounting has two antennas, be provided with the port on the other lateral wall of shell, the bottom is installed to the shell bottom, the symmetry is provided with two fixed orificess on the bottom, the bottom upper end is provided with sealed the pad, shell upper end mid-mounting has the heat dissipation fan, heat dissipation fan upper end is provided with the dust screen, heat dissipation fan bottom is provided with the semiconductor refrigeration piece, semiconductor refrigeration piece bottom is provided with the heat-conducting plate, the heat-conducting plate bottom is provided with the VC soaking board, the communication module has been arranged to VC soaking board one end, communication module one side is provided with microprocessor.

Further, the antenna is connected with the shell through bolts, and the port is connected with the shell through screws.

By adopting the technical scheme, the antenna is convenient for communication signal propagation and use, and the port is convenient for connection and installation of external wires.

Furthermore, the bottom cover is connected with the shell through bolts, the fixing holes are formed in the bottom cover, and the sealing gasket is bonded with the bottom cover.

By adopting the technical scheme, the bottom cover is matched with the sealing gasket for use, so that the shell has better sealing property, and the fixing hole is convenient to install, fix and use.

Further, the heat dissipation fan is connected with the shell through bolts, and the dust screen is connected with the heat dissipation fan clamping groove.

By adopting the technical scheme, the dust screen can prevent external dust or impurities from entering the heat dissipation fan, the heat dissipation fan has a good silencing effect, and meanwhile, stepless speed regulation can be carried out.

Furthermore, the semiconductor refrigeration piece is connected with the cooling fan clamping groove, and the heat conducting plate is in lap joint with the semiconductor refrigeration piece.

By adopting the technical scheme, the semiconductor refrigeration piece is provided with the refrigeration end and the heating end, the refrigeration end is tightly attached to the heat conduction plate, and the heat of the heat conduction plate can be effectively eliminated.

Furthermore, the VC soaking plate is welded with the shell, the communication module is connected with the shell through bolts, and the microprocessor is electrically connected with the communication module.

By adopting the technical scheme, the VC soaking plate can rapidly derive the heat generated by the communication module, the microprocessor can control the opening and closing of each component, and the microprocessor is provided with the thermistor and can automatically detect the temperature value.

(III) advantageous effects

Compared with the prior art, the utility model, following beneficial effect has:

for solving current module for mobile communication equipment and adopting semi-enclosed structure more, dispel the heat through simple metal sheet, sealed effect is relatively poor and collect up the dust easily, the high temperature trouble's condition appears easily under the high load function simultaneously, thereby the sealed effect and the radiating effect's when having reduced the module and using problem, the utility model discloses a bottom, shell, semiconductor refrigeration piece, VC soaking board and the conducting strip that set up adopt totally enclosed structure, can be at utmost avoid in the dust gets into the module, have stronger leakproofness, use the semiconductor refrigeration piece to carry out the high efficiency cooling, avoid its high temperature trouble's condition to appear under the high load function, thereby sealed effect and radiating effect when having improved the module and using for the module still stably functions under the high pressure scene.

Drawings

Fig. 1 is a front view of a module for mobile communication equipment according to the present invention;

fig. 2 is a main sectional view of the housing of the module for mobile communication device according to the present invention.

The reference numerals are explained below:

1. a housing; 2. a semiconductor refrigeration sheet; 3. a VC soaking plate; 4. an antenna; 5. a port; 6. a bottom cover; 7. a fixing hole; 8. a heat dissipation fan; 9. a dust screen; 10. a gasket; 11. a microprocessor; 12. a communication module; 13. a heat conducting plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in fig. 1-2, the module for mobile communication device in this embodiment includes a housing 1, two antennas 4 are installed on one side wall of the housing 1, a port 5 is installed on the other side wall of the housing 1, a bottom cover 6 is installed at the bottom end of the housing 1, two fixing holes 7 are symmetrically installed on the bottom cover 6, a sealing gasket 10 is installed at the upper end of the bottom cover 6, a heat dissipation fan 8 is installed at the middle portion of the upper end of the housing 1, a dust screen 9 is installed at the upper end of the heat dissipation fan 8, a semiconductor refrigeration sheet 2 is installed at the bottom end of the heat dissipation fan 8, a heat conduction plate 13 is installed at the bottom end of the semiconductor refrigeration sheet 2, a VC soaking plate 3 is installed at the bottom end of the heat conduction plate 13, a communication module 12 is arranged at one end of the VC soaking plate 3, and a microprocessor 11 is installed at one side of the communication module 12.

As shown in fig. 1-2, in this embodiment, the antenna 4 is bolted to the housing 1, the port 5 is screwed to the housing 1, the antenna 4 facilitates communication signal propagation, the port 5 facilitates connection and installation of external wires, the bottom cover 6 is bolted to the housing 1, the fixing hole 7 is formed in the bottom cover 6, the gasket 10 is bonded to the bottom cover 6, the bottom cover 6 is used in cooperation with the gasket 10, so that the housing 1 has better sealing performance, the fixing hole 7 facilitates installation and fixation, the cooling fan 8 is bolted to the housing 1, the dust screen 9 is connected to the clamping slot of the cooling fan 8, the dust screen 9 can prevent external dust or impurities from entering the cooling fan 8, the cooling fan 8 has better silencing effect and can perform stepless speed regulation, the semiconductor cooling fin 2 is connected to the cooling fan 8, the heat conducting plate 13 is lapped with the semiconductor cooling fin 2, the semiconductor cooling fin 2 has a cooling end and a heating end, the cooling end is closely attached to 13, heat conducting plate can effectively eliminate heat of the heat conducting plate 13, the soaking plate 3 is welded to the housing 1, the communication module 12 is bolted to the housing 1, the heat conducting plate 11 is electrically connected to the soaking plate 11, and the microprocessor can control the rapid temperature detection device, and the microprocessor can detect the temperature value of the microprocessor.

The specific implementation process of this embodiment is as follows: when using, at first stabilize the installation with bottom 6, then be connected outside wire rod and port 5, switch on simultaneously, if microprocessor 11 detects the temperature when higher during the use, VC soaking pit 3 is on heat transfer to heat-conducting plate 13 with the heat transfer that communication module 12 gived off, the heat on heat-conducting plate 13 is eliminated fast to the refrigeration end behind the operation of semiconductor refrigeration piece 2, 8 heat dissipation fans heat of the heating end of semiconductor refrigeration piece 2 is discharged, guarantee its stable use, when possessing better sealed effect, efficient radiating effect has simultaneously, make the inside operation under suitable temperature of module, the safe and stable operation of module has been guaranteed.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a module for mobile communication equipment which characterized in that: including shell (1), shell (1) a side wall mounting has two antennas (4), be provided with port (5) on shell (1) another lateral wall, bottom (6) are installed to shell (1) bottom, the symmetry is provided with two fixed orificess (7) on bottom (6), bottom (6) upper end is provided with sealed pad (10), shell (1) upper end mid-mounting has heat dissipation fan (8), heat dissipation fan (8) upper end is provided with dust screen (9), heat dissipation fan (8) bottom is provided with semiconductor refrigeration piece (2), semiconductor refrigeration piece (2) bottom is provided with heat-conducting plate (13), heat-conducting plate (13) bottom is provided with VC soaking board (3), VC soaking board (3) one end is arranged and is had communication module (12), communication module (12) one side is provided with microprocessor (11).

2. The module of claim 1, wherein: the antenna (4) is connected with the shell (1) through bolts, and the port (5) is connected with the shell (1) through screws.

3. The module of claim 1, wherein: the bottom cover (6) is connected with the shell (1) through bolts, the fixing hole (7) is formed in the bottom cover (6), and the sealing gasket (10) is bonded with the bottom cover (6).

4. A module for a mobile communication device according to claim 1, wherein: the heat dissipation fan (8) is connected with the shell (1) through bolts, and the dustproof net (9) is connected with a clamping groove of the heat dissipation fan (8).

5. A module for a mobile communication device according to claim 1, wherein: the semiconductor refrigeration piece (2) is connected with the clamping groove of the heat dissipation fan (8), and the heat conduction plate (13) is in lap joint with the semiconductor refrigeration piece (2).

6. The module of claim 1, wherein: the VC soaking plate (3) is welded with the shell (1), the communication module (12) is connected with the shell (1) through bolts, and the microprocessor (11) is electrically connected with the communication module (12).