CN218603864U - Temperature display device - Google Patents
Temperature display device Download PDFInfo
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- CN218603864U CN218603864U CN202320016657.1U CN202320016657U CN218603864U CN 218603864 U CN218603864 U CN 218603864U CN 202320016657 U CN202320016657 U CN 202320016657U CN 218603864 U CN218603864 U CN 218603864U
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- heat
- heat dissipation
- wireless data
- water
- data receiver
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model relates to the technical field of temperature measurement data transmission display, in particular to a temperature display device; the wireless data receiver circuit board comprises a shell, a display screen, a wireless data receiver circuit board and a water-cooling heat dissipation mechanism, wherein the water-cooling heat dissipation mechanism comprises a heat insulation board, heat conduction pipes, a heat absorption plate, heat dissipation fins, a water pump, a water tank and a heat exchange pipeline, heat generated during the operation of the wireless data receiver circuit board is transmitted to the heat absorption plate through the heat conduction pipes, then the heat is transmitted to the heat dissipation fins, a semiconductor refrigeration piece is started to refrigerate water in the water tank, the water pump is started to convey cold water in the water tank into the heat exchange pipeline, the heat exchange pipeline is partially embedded between the intermittences of the heat dissipation fins, so that the cold water in the heat exchange pipeline and the heat dissipation fins can fully exchange heat, heat on the heat dissipation fins is taken away, the heat dissipation fins can keep good heat dissipation performance, and the wireless data receiver circuit board is more stable during the actual operation by adopting the structure.
Description
Technical Field
The utility model relates to a temperature measurement data transmission of ferrous metallurgy high temperature scene shows technical field, especially relates to a temperature display device.
Background
In the metal smelting process, after the temperature of the furnace is required to be collected through the temperature measuring device, the temperature measuring data of the furnace is transmitted to the wireless data receiver in the temperature display device of the front-line console for receiving through the wireless data transmitter, and then the temperature measuring data of the display screen on the temperature display device is transmitted to the front-line console, so that the process operation is better assisted by a front-line operation user.
As the device uses wireless technology in the metallurgical field, the shielding and interference factors are considered, and a high-power wireless transceiving unit circuit is required to be used. According to the wireless working principle, when the wireless power supply works, large heat is generated in a corresponding circuit. Because general service environment temperature is higher, and does not set up corresponding heat dissipation mechanism on the current temperature display device, can not dispel the heat to the wireless data receiver circuit board in the temperature display device voluntarily for in the practical application, the too high condition of self temperature often can appear in the wireless data receiver circuit board in the temperature display device, and too high temperature can reduce the stability of wireless data receiver actual work, leads to transmission interrupt or irreversible damage even.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature display device does not set up heat dissipation mechanism on solving the temperature display device among the prior art, can not dispel the heat to the wireless data receiver circuit board in the temperature display device for in the practical application, the too high condition of self temperature often can appear in the wireless data receiver circuit board in the temperature display device, and reduces the problem of the stability of wireless data receiver actual work.
In order to achieve the above object, the present invention provides a temperature display device, which includes a housing, a display screen, a wireless data receiver circuit board and a water-cooling heat dissipation mechanism, wherein the display screen is disposed on the surface of the housing, the wireless data receiver circuit board is disposed inside the housing, the output end of the wireless data receiver circuit board is electrically connected to the display screen, the water-cooling heat dissipation mechanism is further disposed inside the housing, and the water-cooling heat dissipation mechanism is located at the bottom of the wireless data receiver circuit board;
the water-cooling heat dissipation mechanism comprises a heat insulation plate, a heat conduction pipe, a heat absorption plate, heat dissipation fins, a water pump, a water tank and a heat exchange pipeline, wherein the heat insulation plate is arranged inside the shell, the heat insulation plate is located at the bottom of the wireless data receiver circuit board, a plurality of heat conduction pipes are arranged at the heating position of the bottom of the wireless data receiver circuit board, each heat conduction pipe penetrates through the heat insulation plate and the heat conduction pipes are arranged, the heat conduction pipes are far away from one end of the wireless data receiver circuit board and are connected with the heat absorption plate, the heat dissipation fins are arranged on the heat absorption plate, the heat insulation plate is far away from one side of the wireless data receiver circuit board, the water tank and the water pump are installed, the input end of the water pump is connected with the water outlet of the water tank, the output end of the water pump is provided with the heat exchange pipeline, the heat exchange pipeline is partially embedded between the gaps of the heat dissipation fins, semiconductor refrigeration fins are arranged on the water tank, and heat dissipation grooves are further arranged on the shell and correspond to the heat dissipation fins.
Wherein, heat exchange tube includes first connecting pipe, serpentine coil and second connecting pipe, serpentine coil inlays to be established between heat radiation fins's the clearance, serpentine coil's one end is provided with first connecting pipe, serpentine coil's the other end is provided with the second connecting pipe, first connecting pipe is kept away from serpentine coil's one end with the output of water pump links to each other, the second connecting pipe is kept away from serpentine coil's one end with the return water mouth of water tank links to each other.
The heat absorption plate comprises a plate body and two support legs, a plurality of heat conduction pipes are arranged between the plate body and the bottom of the wireless data receiver circuit board, the support legs are arranged at two ends of the plate body, and one ends, far away from the plate body, of the support legs are detachably connected with the heat insulation plate.
The side of the shell is provided with a heat dissipation plate, the heat dissipation groove is formed in the heat dissipation plate, a placing groove is further formed in the heat dissipation plate and penetrates through the heat dissipation groove, and a filter screen is arranged in the placing groove.
The temperature display device further comprises a heat insulation frame, the heat insulation frame is detachably connected with the water tank and covers the outer portion of the hot end of the semiconductor refrigerating sheet, and one end, far away from the water tank, of the heat insulation frame penetrates through the shell and is located on the outer portion of the shell.
The heat insulation frame comprises a frame body and two installation wing plates, the frame body covers the outside of the semiconductor refrigeration sheet, the installation wing plates are arranged on two sides of the frame body, and the installation wing plates are detachably connected with the water tank.
The utility model discloses a temperature display device, including shell, display screen, wireless data receiver circuit board and water-cooling heat dissipation mechanism, water-cooling heat dissipation mechanism includes heat insulating board, heat pipe, absorber plate, heat radiation fins, water pump, water tank and heat transfer pipeline, through the heat insulating board will wireless data receiver circuit board with the absorber plate is separated, makes the absorber plate is located the heat dissipation region, and is a plurality of the heat pipe will heat transmission that wireless data receiver circuit board during operation produced extremely absorber plate department, and then transmit to on the heat radiation fins, start the semiconductor refrigeration piece, it is right water in the water tank refrigerates, starts the water pump, will cold water in the water tank carry extremely in the heat transfer pipeline, because heat transfer pipeline part inlays to be established between heat radiation fins's the intermittent type, make cold water in the heat transfer pipeline with the abundant heat transfer of heat radiation fins, thereby heat on the heat radiation fins, and pass through the heat dissipation groove makes the outside air with the air of heat radiation fins department keeps circulating, and then takes away through the heat that heat radiation fins absorbed, makes heat radiation fins keep good heat dispersion, adopt above-mentioned structure wireless data receiver is in the real time more stable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a temperature display device provided by the present invention.
Fig. 2 is a schematic diagram of an internal structure of the temperature display device provided by the present invention.
Fig. 3 is a schematic view of the bottom structure of the heat insulation board provided by the present invention.
Fig. 4 is a partial enlarged view of a structure of fig. 3 according to the present invention.
101-shell, 102-display screen, 103-wireless data receiver circuit board, 104-heat insulation board, 105-heat conduction pipe, 106-heat absorption board, 107-heat dissipation fin, 108-water pump, 109-water tank, 110-heat exchange pipe, 111-semiconductor refrigeration sheet, 112-heat dissipation groove, 113-first connecting pipe, 114-serpentine coil, 115-second connecting pipe, 116-plate body, 117-support leg, 118-heat dissipation plate, 119-placing groove, 120-filter screen, 121-heat insulation frame, 122-frame body and 123-installation wing plate.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
Referring to fig. 1 to 4, the utility model provides a temperature display device, the temperature display device includes a housing 101, a display screen 102, a wireless data receiver circuit board 103 and a water-cooling heat dissipation mechanism, the surface of the housing 101 is provided with the display screen 102, the inside of the housing 101 is provided with the wireless data receiver circuit board 103, the output end of the wireless data receiver circuit board 103 is electrically connected with the display screen 102, the inside of the housing 101 is also provided with the water-cooling heat dissipation mechanism, and the water-cooling heat dissipation mechanism is located at the bottom of the wireless data receiver circuit board 103;
the water-cooling heat dissipation mechanism comprises a heat insulation plate 104, a heat conduction pipe 105, a heat absorption plate 106, heat dissipation fins 107, a water pump 108, a water tank 109 and a heat dissipation pipe 110, wherein the heat insulation plate 104 is arranged inside the shell 101, the heat insulation plate 104 is positioned at the bottom of the wireless data receiver circuit board 103, a plurality of heat conduction pipes 105 are arranged at the heating part at the bottom of the wireless data receiver circuit board 103, each heat conduction pipe 105 penetrates through the heat insulation plate 104 and a plurality of heat conduction pipes 105 are far away from one end of the wireless data receiver circuit board 103, the heat absorption plate 106 is connected with the heat dissipation plate 106, the heat dissipation fins 107 are arranged on the heat absorption plate 106, the heat insulation plate 104 is far away from one side of the wireless data receiver circuit board 103, the water tank 109 and the water pump 108 are installed, the input end of the water pump 108 is connected with the water outlet of the water tank 109, the output end of the water pump 108 is provided with the heat dissipation pipes 110, the heat dissipation pipes 110 are partially embedded between the gaps of the heat dissipation fins 107, semiconductor cooling fins 111 are arranged on the water tank 109, a heat dissipation groove 112 is further arranged on the shell 101, and the heat dissipation groove 112 is corresponding to the heat dissipation fins 107.
In this embodiment, the wireless data receiver circuit board 103 is in communication connection with the wireless data transmitter, and collects temperature data of a site in real time by using the wireless data transmitter, and sends the data to the wireless data receiver circuit board 103 in a wireless manner after packaging the data, and the received temperature measurement data is uploaded to the display screen 102 by the wireless data receiver circuit board 103 and displayed by the display screen 102, so as to better assist a user in performing process operations;
the wireless data receiver circuit board 103 and the heat absorbing plate 106 are separated by the heat insulating plate 104, so that the heat absorbing plate 106 is located in a heat dissipation area, heat generated when the wireless data receiver circuit board 103 works is transmitted to the heat absorbing plate 106 through the plurality of heat conduction pipes 105, and then transmitted to the heat dissipation fins 107, the semiconductor refrigeration sheet 111 is started to refrigerate water in the water tank 109, the water pump 108 is started to convey cold water in the water tank 109 to the heat exchange pipeline 110, and the heat exchange pipeline 110 is partially embedded between the intervals of the heat dissipation fins 107, so that the cold water in the heat exchange pipeline 110 and the heat dissipation fins 107 fully exchange heat, and thus heat on the heat dissipation fins 107 is taken away, and external air and air at the heat dissipation fins 107 keep circulation through the heat dissipation grooves 112, and further heat absorbed by the heat dissipation fins 107 is taken away through flowing air, so that the heat dissipation fins 107 keep good heat dissipation performance.
Further, heat exchange line 110 includes first connecting pipe 113, serpentine coil 114 and second connecting pipe 115, serpentine coil 114 inlays and establishes between heat radiation fins 107's the clearance, serpentine coil 114's one end is provided with first connecting pipe 113, serpentine coil 114's the other end is provided with second connecting pipe 115, first connecting pipe 113 is kept away from serpentine coil 114's one end with the output of water pump 108 links to each other, second connecting pipe 115 is kept away from serpentine coil 114's one end with water tank 109's return water mouth links to each other.
In this embodiment, the first connection pipe 113 is used to transport the cold water in the water tank 109 to the inside of the serpentine coil 114, and the serpentine coil 114 is embedded between the gaps of the heat dissipation fins 107, so that after heat exchange is performed between the serpentine coil 114 and the heat dissipation fins 107, the water after heat exchange is transported to the inside of the water tank 109 through the second connection pipe 115, thereby completing the circulating refrigeration.
Further, the heat absorbing plate 106 includes a plate body 116 and two support legs 117, a plurality of heat conducting pipes 105 are disposed between the plate body 116 and the bottom of the wireless data receiver circuit board 103, the support legs 117 are disposed at two ends of the plate body 116, and one end of each support leg 117, which is far away from the plate body 116, is detachably connected to the heat insulating plate 104.
In this embodiment, the support legs 117 are fixed to the heat insulation plate 104 by screws, so as to complete the installation of the heat absorption plate 106, and both the support legs 117 are fixedly connected to the plate body 116, and are manufactured by an integral molding technique, so that the structure is firmer.
Further, a heat dissipation plate 118 is disposed on a side surface of the housing 101, the heat dissipation groove 112 is disposed on the heat dissipation plate 118, a placement groove 119 is further disposed on the heat dissipation plate 118, the placement groove 119 penetrates through the heat dissipation plate 112, and a filter screen 120 is disposed in the placement groove 119.
In this embodiment, the heat dissipation grooves 112 are disposed on the heat dissipation plate 118, the filter screen 120 is disposed on the heat dissipation plate 118, and the filter screen 120 filters flowing air, so that dust in the air is prevented from adhering to the heat dissipation fins 107, and the heat dissipation performance of the heat dissipation fins 107 is reduced.
Further, the temperature display device further comprises a heat insulation frame 121, the heat insulation frame 121 is detachably connected with the water tank 109 and covers the outside of the hot end of the semiconductor chilling plate 111, and one end of the heat insulation frame 121, which is far away from the water tank 109, penetrates through the casing 101 and is located outside the casing 101.
In this embodiment, the heat insulation frame 121 is disposed outside the hot end of the semiconductor chilling plate 111, and the heat insulation frame 121 penetrates through the housing 101, so that heat dissipated by the hot end of the semiconductor chilling plate 111 is transmitted to the outside of the housing 101, and the heat dissipated by the hot end of the semiconductor chilling plate 111 is prevented from affecting the heat dissipation fins 107.
Further, the heat insulation frame 121 includes a frame 122 and two installation wing plates 123, the frame 122 covers the outside of the semiconductor cooling plate 111, the installation wing plates 123 are disposed on two sides of the frame 122, and the installation wing plates 123 are detachably connected to the water tank 109.
In the present embodiment, the installation wing plates 123 are fixed to the water tank 109 by screws, so that the heat insulation frame 121 is installed, and since both the installation wing plates 123 are fixedly connected to the frame 122, the heat insulation frame 121 is manufactured by using an integral molding technique, so that the structure is more stable.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (6)
1. A temperature display device is characterized in that,
the wireless data receiver comprises a shell, a display screen, a wireless data receiver circuit board and a water-cooling heat dissipation mechanism, wherein the display screen is arranged on the surface of the shell, the wireless data receiver circuit board is arranged in the shell, the output end of the wireless data receiver circuit board is electrically connected with the display screen, the water-cooling heat dissipation mechanism is also arranged in the shell, and the water-cooling heat dissipation mechanism is positioned at the bottom of the wireless data receiver circuit board;
the water-cooling heat dissipation mechanism comprises a heat insulation plate, a heat conduction pipe, a heat absorption plate, heat dissipation fins, a water pump, a water tank and a heat exchange pipeline, wherein the heat insulation plate is arranged inside the shell, the heat insulation plate is located at the bottom of the wireless data receiver circuit board, a plurality of heat conduction pipes are arranged at the heating position of the bottom of the wireless data receiver circuit board, each heat conduction pipe penetrates through the heat insulation plate and the heat conduction pipes are arranged, the heat conduction pipes are far away from one end of the wireless data receiver circuit board and are connected with the heat absorption plate, the heat dissipation fins are arranged on the heat absorption plate, the heat insulation plate is far away from one side of the wireless data receiver circuit board, the water tank and the water pump are installed, the input end of the water pump is connected with the water outlet of the water tank, the output end of the water pump is provided with the heat exchange pipeline, the heat exchange pipeline is partially embedded between the gaps of the heat dissipation fins, semiconductor refrigeration fins are arranged on the water tank, and heat dissipation grooves are further arranged on the shell and correspond to the heat dissipation fins.
2. Temperature display device according to claim 1,
the heat exchange pipeline includes first connecting pipe, serpentine coil and second connecting pipe, serpentine coil inlays to be established between heat radiation fins's the clearance, serpentine coil's one end is provided with first connecting pipe, serpentine coil's the other end is provided with the second connecting pipe, first connecting pipe is kept away from serpentine coil's one end with the output of water pump links to each other, the second connecting pipe is kept away from serpentine coil's one end with the return water mouth of water tank links to each other.
3. Temperature display device according to claim 1,
the heat absorbing plate comprises a plate body and two support legs, a plurality of heat conducting pipes are arranged between the plate body and the bottom of the wireless data receiver circuit board, the support legs are arranged at two ends of the plate body, and one ends, far away from the plate body, of the support legs are detachably connected with the heat insulating plate.
4. Temperature display device according to claim 1,
the side of shell is provided with the heating panel, the radiating groove sets up on the heating panel, still be provided with the standing groove on the heating panel, the standing groove runs through the radiating groove, be provided with the filter screen in the standing groove.
5. Temperature display device according to claim 1,
the temperature display device further comprises a heat insulation frame, the heat insulation frame is detachably connected with the water tank and covers the outer portion of the hot end of the semiconductor refrigerating sheet, and one end, far away from the water tank, of the heat insulation frame penetrates through the shell and is located on the outer portion of the shell.
6. Temperature display device according to claim 5,
the heat insulation frame comprises a frame body and two installation wing plates, the frame body covers the outside of the semiconductor refrigeration sheet, the installation wing plates are arranged on two sides of the frame body, and the installation wing plates are detachably connected with the water tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320016657.1U CN218603864U (en) | 2023-01-05 | 2023-01-05 | Temperature display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320016657.1U CN218603864U (en) | 2023-01-05 | 2023-01-05 | Temperature display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218603864U true CN218603864U (en) | 2023-03-10 |
Family
ID=85409825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320016657.1U Active CN218603864U (en) | 2023-01-05 | 2023-01-05 | Temperature display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218603864U (en) |
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2023
- 2023-01-05 CN CN202320016657.1U patent/CN218603864U/en active Active
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