CN212648815U - Power distribution cabinet with rapid heat dissipation function - Google Patents
Power distribution cabinet with rapid heat dissipation function Download PDFInfo
- Publication number
- CN212648815U CN212648815U CN202021531289.7U CN202021531289U CN212648815U CN 212648815 U CN212648815 U CN 212648815U CN 202021531289 U CN202021531289 U CN 202021531289U CN 212648815 U CN212648815 U CN 212648815U
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- Prior art keywords
- power distribution
- distribution cabinet
- heat dissipation
- plate
- controller
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- 230000017525 heat dissipation Effects 0.000 title claims description 18
- 239000004065 semiconductor Substances 0.000 claims abstract description 39
- 238000001816 cooling Methods 0.000 claims abstract description 38
- 239000011229 interlayer Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 229920000742 Cotton Polymers 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a switch board that can dispel heat function fast, including switch board body and the cabinet door of setting on the switch board body, the backplate of switch board body sets up to double-deck board, double-deck board includes inner panel and planking, be provided with the intermediate layer between planking and the inner panel, be provided with cooling system in the intermediate layer, cooling system includes the controller and the temperature sensor and the semiconductor refrigeration piece of being connected with the controller, the cold junction of semiconductor refrigeration piece passes through fin and inner panel connection, and the hot junction passes through the fin and is connected with the planking, the planking is provided with the thermovent that has corresponding hot junction, install radiator fan on the thermovent. The utility model discloses not only can carry out rapid cooling for the inside of the cabinet body through fin and radiator fan on the semiconductor refrigeration piece cold junction, can carry out rapid cooling through fin and radiator fan on the semiconductor refrigeration piece hot junction moreover.
Description
Technical Field
The utility model relates to a switch board field especially relates to switch board that can dispel the heat function fast.
Background
The distribution cabinet is a final-stage device of a distribution system. The power distribution cabinet is a general name of a motor control center. The power distribution cabinet is used in the occasions with dispersed loads and less loops; the motor control center is used for occasions with concentrated loads and more loops. They distribute the power of a certain circuit of the upper-level distribution equipment to the nearby loads. This level of equipment should provide protection, monitoring and control of the load.
At present, with the rapid development of data centers, the power of a power distribution system is increased, and the heat generation power is also increased greatly. The problem of equipment overheating of the power distribution cabinet can be caused, and certain risks are brought to stable and reliable operation of the data center. For example, the high temperature, the switch board will unable operation, and whole circuit system will be absorbed in paralysedly, consequently must carry out cooling process simultaneously in the switch board operation, and current cooling process only uses the fan to blow the heat dissipation simply, and not only inefficiency, the air of rapid flow moreover can take a lot of dusts to the switch board in, influences the electrical apparatus use in the switch board, reduces the life of equipment easily. Therefore, there is a need for a cabinet that facilitates cooling of the cabinet.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the problems in the prior art and provide a power distribution cabinet with a rapid heat dissipation function, and compared with the prior art, the utility model has the advantages of novel design, simple structure and convenient use, and not only can rapidly cool the interior of the cabinet body through the radiating fins and the radiating fans on the cold ends of the semiconductor refrigeration sheets, but also can rapidly dissipate heat through the radiating fins and the radiating fans on the hot ends of the semiconductor refrigeration sheets; the arranged mesh enclosure and the rain shield can not only protect the cooling fan, but also prevent rainwater from entering the cabinet body; can effectively prolong the service life of the cabinet body and the internal electric appliance of the cabinet.
For realizing above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes:
the power distribution cabinet with the rapid heat dissipation function comprises a power distribution cabinet body and a cabinet door arranged on the power distribution cabinet body, wherein a back plate of the power distribution cabinet body is a double-layer plate, the double-layer plate comprises an inner plate and an outer plate, an interlayer is arranged between the outer plate and the inner plate, a cooling system is arranged in the interlayer, the cooling system comprises a controller, a temperature sensor and a semiconductor refrigerating sheet, the temperature sensor and the semiconductor refrigerating sheet are connected with the controller, the cold end of the semiconductor refrigerating sheet is connected with the inner plate through a heat dissipation sheet, the hot end of the semiconductor refrigerating sheet is connected with the outer plate through a heat dissipation sheet, the outer plate is provided; the inner panel sets up the cooling opening that corresponds the cold junction, install radiator fan on the cooling opening. By adopting the technical scheme, the outer plate and the cabinet body are integrally formed through sheet metal; the inner plate is welded on the cabinet body; the interlayer is used for installing a cooling system; the semiconductor refrigerating sheet is used for cooling the interior of the cabinet body; the temperature sensor is used for detecting the temperature in the cabinet body; the controller is used for controlling the semiconductor refrigerating sheet to refrigerate; specifically, the controller passes through the internal temperature of temperature sensor detection cabinet, when the temperature that detects surpassed the temperature that inside procedure set for, starts the semiconductor refrigeration piece, passes through the fin by the semiconductor refrigeration piece and cooling fan cools down for the cabinet body.
Preferably, the semiconductor refrigeration piece is positioned in the middle of the backboard interlayer. By adopting the technical scheme, the interior of the cabinet body is convenient to cool.
Preferably, the controller and the temperature sensor are located at the top of the interlayer, and the temperature sensor is connected with the inner part of the power distribution cabinet body through a mounting hole formed in the inner plate. By adopting the technical scheme, the device is used for keeping away from the semiconductor refrigeration sheet; wherein, temperature sensor is convenient for detect the inside temperature of the cabinet body.
Preferably, a mesh enclosure is arranged on the heat dissipation opening, and a rain shield connected with the outer plate is arranged above the mesh enclosure. By adopting the technical scheme, the mesh enclosure is used for shielding and protecting the radiating fan; the rain shield reduces the rainwater from falling into the cabinet body.
Preferably, the bottom of the interlayer is provided with a water leakage hole which penetrates through the bottom of the power distribution cabinet body. By adopting the technical scheme, the water generated at the cold end can be conveniently discharged.
Preferably, heat insulation cotton is arranged between the controller and the semiconductor refrigeration sheet. By adopting the technical scheme, the heating of the controller is reduced.
Preferably, the inner plate is provided with a door plate corresponding to the semiconductor refrigerating sheet, the temperature sensor and the controller. By adopting the technical scheme, the cooling system is convenient to overhaul.
The utility model has the advantages that: compared with the prior art, the cooling device has the advantages that the cooling device is novel in design, simple in structure and convenient to use, and can be used for rapidly cooling the inside of the cabinet body through the cooling fins and the cooling fans on the cold ends of the semiconductor refrigeration pieces and rapidly dissipating heat through the cooling fins and the cooling fans on the hot ends of the semiconductor refrigeration pieces; the arranged mesh enclosure and the rain shield can not only protect the cooling fan, but also prevent rainwater from entering the cabinet body; can effectively prolong the service life of the cabinet body and the internal electric appliance of the cabinet.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood and to be implemented according to the content of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:
fig. 1 is a schematic structural diagram related to the present invention;
fig. 2 is a schematic view of a partial cross-sectional structure according to the present invention.
The reference numbers in the figures illustrate: switch board body 1, cabinet door 2, backplate 3, controller 4, temperature sensor 5, semiconductor refrigeration piece 6, radiator fan 7, screen panel 8, rain cover 9, the hole 10 that leaks, thermal-insulated cotton 11, fin 12, door plant 13, inner panel 301, planking 302, intermediate layer 303.
Detailed Description
The invention is further described with reference to the accompanying drawings:
referring to fig. 1 to 2, the power distribution cabinet with a rapid heat dissipation function includes a power distribution cabinet body 1 and a cabinet door 2 arranged on the power distribution cabinet body 1, a back plate 3 of the power distribution cabinet body 1 is a double-layer plate, the double-layer plate includes an inner plate 301 and an outer plate 302, an interlayer 303 is arranged between the outer plate 302 and the inner plate 301, a cooling system is arranged in the interlayer 303, the cooling system includes a controller 4, a temperature sensor 5 and a semiconductor chilling plate 6 connected with the controller 4, a cold end of the semiconductor chilling plate 6 is connected with the inner plate 301 through a heat sink 12, a hot end is connected with the outer plate 302 through the heat sink 12, the outer plate 302 is provided with a heat dissipation port corresponding to the hot end, and a heat dissipation fan 7 is installed; the inner plate 301 is provided with a cooling hole corresponding to the cold end, and the cooling hole is provided with a cooling fan 7. By adopting the technical scheme, the outer plate 302 and the cabinet body are integrally formed by sheet metal; the inner plate 301 is welded on the cabinet body; the interlayer 303 is used for installation of a cooling system; the semiconductor refrigerating sheet 6 is used for cooling the inside of the cabinet body; the temperature sensor 5 is used for detecting the temperature in the cabinet body; the controller 4 is used for controlling the semiconductor refrigerating sheet 6 to refrigerate; specifically, the controller 4 detects the temperature in the cabinet body through the temperature sensor 5, and when the detected temperature exceeds the temperature set by an internal program, the semiconductor refrigeration piece 6 is started, and the cabinet body is cooled through the heat radiation fin 12 and the heat radiation fan 7 by the semiconductor refrigeration piece 6. Wherein, the both sides of switch board body 1 are provided with vent 14.
Preferably, the semiconductor refrigeration sheet 6 is positioned in the middle of the interlayer 303 of the back plate 3. By adopting the technical scheme, the interior of the cabinet body is convenient to cool.
Preferably, the controller 4 and the temperature sensor 5 are located on the top of the interlayer 303, and the temperature sensor 5 is connected with the inside of the power distribution cabinet body 1 through a mounting hole formed on the inner plate 301. By adopting the technical scheme, the refrigerator is used for keeping away from the semiconductor refrigerating sheet 6; wherein, temperature sensor 5 is convenient for detect the inside temperature of the cabinet body.
Preferably, a mesh enclosure 8 is disposed on the heat dissipation opening, and a rain shield 9 connected to the outer plate 302 is disposed above the mesh enclosure 8. By adopting the technical scheme, the mesh enclosure 8 is used for shielding and protecting the cooling fan 7; the rain shield 9 reduces the rain water from falling into the cabinet body. Wherein, the rain shield 9 is a rain shield 9 with three closed sides and an opening at the bottom.
Preferably, the bottom of the interlayer 303 is provided with a water leakage hole 10, and the water leakage hole 10 penetrates through the bottom of the power distribution cabinet body 1. By adopting the technical scheme, the water generated at the cold end can be conveniently discharged.
Preferably, a heat insulation cotton 11 is arranged between the controller 4 and the semiconductor refrigeration sheet 6. By adopting the technical scheme, the heating of the controller 4 is reduced.
Preferably, the inner plate 301 is provided with a door panel 13 corresponding to the semiconductor chilling plate 6, the temperature sensor 5 and the controller 4. By adopting the technical scheme, the cooling system is convenient to overhaul.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In practical use, when the controller senses that the temperature in the cabinet body exceeds the temperature set by a program (for example, 50 ℃) through the temperature sensor, the semiconductor refrigerating sheet is started, the cold end of the semiconductor refrigerating sheet is cooled rapidly, the low temperature is transmitted to the radiating fin, and the radiating fan on the radiating fin radiates the low temperature into the cabinet body, so that the interior of the cabinet body is cooled.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. Switch board that can dispel heat function fast, including switch board body (1) and cabinet door (2) of setting on switch board body (1), its characterized in that: the back plate (3) of the power distribution cabinet body (1) is a double-layer plate, the double-layer plate comprises an inner plate (301) and an outer plate (302), an interlayer (303) is arranged between the outer plate (302) and the inner plate (301), a cooling system is arranged in the interlayer (303), the cooling system comprises a controller (4), a temperature sensor (5) and a semiconductor refrigerating sheet (6), the temperature sensor (5) and the semiconductor refrigerating sheet (6) are connected with the controller (4), the cold end of the semiconductor refrigerating sheet (6) is connected with the inner plate (301) through a radiating fin (12), the hot end of the semiconductor refrigerating sheet is connected with the outer plate (302) through the radiating fin (12), the outer plate (302) is provided with a radiating port corresponding to the hot end, and a radiating fan (; the inner plate (301) is provided with a cooling hole corresponding to the cold end, and a cooling fan (7) is installed on the cooling hole.
2. The power distribution cabinet with the rapid heat dissipation function according to claim 1, wherein: the semiconductor refrigerating sheet (6) is positioned in the middle of the interlayer (303) of the back plate (3).
3. The power distribution cabinet with the rapid heat dissipation function according to claim 1, wherein: the controller (4) and the temperature sensor (5) are located at the top of the interlayer (303), and the temperature sensor (5) is connected with the inner portion of the power distribution cabinet body (1) through a mounting hole formed in the inner plate (301).
4. The power distribution cabinet with the rapid heat dissipation function according to claim 1, wherein: a mesh enclosure (8) is arranged on the heat dissipation opening, and a rain shield (9) connected with the outer plate (302) is arranged above the mesh enclosure (8).
5. The power distribution cabinet with the rapid heat dissipation function according to claim 1, wherein: the bottom of intermediate layer (303) is provided with water leakage hole (10), water leakage hole (10) link up in the bottom of switch board body (1).
6. The power distribution cabinet with the rapid heat dissipation function according to claim 1, wherein: and heat insulation cotton (11) is arranged between the controller (4) and the semiconductor refrigerating sheet (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021531289.7U CN212648815U (en) | 2020-07-29 | 2020-07-29 | Power distribution cabinet with rapid heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021531289.7U CN212648815U (en) | 2020-07-29 | 2020-07-29 | Power distribution cabinet with rapid heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212648815U true CN212648815U (en) | 2021-03-02 |
Family
ID=74763878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021531289.7U Expired - Fee Related CN212648815U (en) | 2020-07-29 | 2020-07-29 | Power distribution cabinet with rapid heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212648815U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692203A (en) * | 2021-09-07 | 2021-11-23 | 广东电网有限责任公司 | Heat dissipation device for FTU on column |
-
2020
- 2020-07-29 CN CN202021531289.7U patent/CN212648815U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692203A (en) * | 2021-09-07 | 2021-11-23 | 广东电网有限责任公司 | Heat dissipation device for FTU on column |
| CN113692203B (en) * | 2021-09-07 | 2023-11-24 | 广东电网有限责任公司 | Heat abstractor for post FTU |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210302 |