CN219457590U - Chip heat dissipation packaging structure - Google Patents

Abstract

The utility model discloses a chip heat dissipation packaging structure, and relates to the technical field of heat dissipation. The cooling mechanism is fixedly connected with the heat absorption mechanism at the top of the bottom plate, the cooling mechanism is fixedly connected with the cooling mechanism at the top of the heat absorption mechanism, the heat dissipation mechanism is fixedly connected with the heat exchange mechanism used for exchanging heat at the bottom of the heat dissipation mechanism, the heat exchange mechanism is arranged inside the cooling mechanism and the heat absorption mechanism and comprises a linear motor, the top of the linear motor is connected with the heat dissipation mechanism, the bottom of the linear motor is fixedly connected with a tympanic membrane, and the outer side of the tympanic membrane is fixedly connected with a sealing gasket. According to the utility model, through the arrangement of the heat absorption cavity and the cooling cavity, active heat dissipation can be realized through the cooperation of the heat absorption cavity and the cooling cavity, and the phenomenon that the chip operation speed is reduced due to poor heat dissipation effect in passive heat dissipation is avoided, so that the service life of the chip is prolonged, and meanwhile, the operation speed of the chip is ensured.

Description

Chip heat dissipation packaging structure

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a chip heat dissipation packaging structure.

Background

The chip is an integrated circuit mainly comprising semiconductor equipment, elements such as a transistor, a resistor, a capacitor, an inductor and the like required in a circuit and wiring are interconnected together, the integrated circuit is manufactured on a small semiconductor wafer or a medium substrate or a plurality of small semiconductor wafers or medium substrates and then packaged in a tube shell, along with the development of scientific technology, more and more components inside the chip generate higher and higher heat in the use process of the chip, the high temperature can cause internal short circuit and disconnection of the chip and simultaneously slow down the operation speed, so that the chip is damaged, the large multichip on the market currently adopts a passive heat dissipation mode, the heat dissipation effect is poor, the operation speed is poor, and the service life of the chip is reduced.

Disclosure of Invention

The utility model aims at: in order to solve the problem of poor passive heat dissipation effect, the utility model provides a chip heat dissipation packaging structure.

The utility model adopts the following technical scheme for realizing the purposes:

the utility model provides a chip heat dissipation packaging structure, includes the bottom plate, bottom plate top fixedly connected with heat absorption mechanism, heat absorption mechanism top fixedly connected with cooling body, the cooling body top is provided with heat dissipation mechanism, heat dissipation mechanism bottom fixedly connected with is used for exchanging heat's exchange mechanism, cooling body and heat absorption mechanism inside are provided with heat transfer mechanism.

Further, the exchange mechanism comprises a linear motor, the top of the linear motor is connected with the heat dissipation mechanism, the bottom of the linear motor is fixedly connected with a tympanic membrane, and the outer side of the tympanic membrane is fixedly connected with a sealing gasket.

Further, the heat absorption mechanism comprises a lower fixed block, the top of the lower fixed block is connected with the cooling mechanism, the lower fixed block is fixedly connected with a positioning pin, and a heat absorption cavity is formed in the lower fixed block.

Further, the cooling mechanism comprises an upper fixing block, the bottom of the upper fixing block is fixed with a lower fixing block, a heat dissipation cavity is formed in the upper fixing block, and a sealing gasket is fixed between the upper fixing block and the lower fixing block.

Further, the heat dissipation mechanism comprises a fixed plate, the bottom of the fixed plate is fixedly connected with an upper fixed block, the bottom of the fixed plate is fixedly connected with a step heat conduction column, the step heat conduction column is connected with a linear motor, and the top of the fixed plate is fixedly connected with heat dissipation fins.

Further, the heat exchange mechanism comprises a liquid outlet pipe and a liquid inlet pipe, the liquid outlet pipe, the liquid inlet pipe, the heat dissipation cavity and the heat absorption cavity are communicated, the liquid outlet pipe and the liquid inlet pipe are arranged inside the upper fixing block and the lower fixing block, and the liquid outlet pipe and the liquid inlet pipe are fixedly connected with one-way valves.

Further, the top of the bottom plate is fixedly connected with a leakage-proof pad.

Further, a through hole is formed in the sealing gasket, a groove is formed in the upper fixing block, and the locating pin, the groove and the through hole are matched.

The beneficial effects of the utility model are as follows:

according to the utility model, through the arrangement of the heat absorption cavity and the cooling cavity, active heat dissipation can be realized through the cooperation of the heat absorption cavity and the cooling cavity, and the phenomenon that the chip operation speed is reduced due to poor heat dissipation effect in passive heat dissipation is avoided, so that the service life of the chip is prolonged, and meanwhile, the operation speed of the chip is ensured.

Through the setting of tympanic membrane, drain pipe and feed liquor pipe, realized through the cooperation of tympanic membrane, drain pipe and feed liquor pipe for carry out circulative cooling heat dissipation to the fluoride liquid, improved the work efficiency of chip.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a front cross-sectional view of the present utility model;

FIG. 3 is an exploded view of the present utility model;

FIG. 4 is an enlarged partial view of portion A of FIG. 3 in accordance with the present utility model;

reference numerals: 1. a bottom plate; 101. a leak-proof pad; 2. a heat absorbing mechanism; 201. a lower fixing block; 202. a positioning pin; 203. a heat absorption chamber; 3. a cooling mechanism; 301. an upper fixing block; 302. a heat dissipation cavity; 4. a heat dissipation mechanism; 401. a fixing plate; 402. a step heat conduction column; 403. a heat radiation fin; 5. an exchange mechanism; 501. a sealing gasket; 502. a linear motor; 503. a tympanic membrane; 6. a heat exchange mechanism; 601. a liquid outlet pipe; 602. a liquid inlet pipe; 603. a one-way valve.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.

In describing embodiments of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "inner", "outer", "upper", etc. are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in place when the inventive product is used, are merely for convenience of description and simplification of description, and are not indicative or implying that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

As shown in fig. 1-4, a chip heat dissipation package structure comprises a bottom plate 1, a heat absorption mechanism 2 is fixedly connected to the top of the bottom plate 1, a cooling mechanism 3 is fixedly connected to the top of the heat absorption mechanism 2, a heat dissipation mechanism 4 is arranged at the top of the cooling mechanism 3, an exchange mechanism 5 for exchanging heat is fixedly connected to the bottom of the heat dissipation mechanism 4, a heat exchange mechanism 6 is arranged inside the cooling mechanism 3 and the heat absorption mechanism 2, and insulating heat absorption fluorinated liquid flows inside the heat absorption mechanism 2, the heat absorption mechanism 2 is arranged to take away heat generated by the chip through the heat absorption liquid inside the heat absorption mechanism 2, so that the temperature is reduced, the flowing power can be provided for the fluorinated liquid through the arrangement of the exchange mechanism 5, the heat absorption fluorinated liquid can be transferred into the cooling mechanism 3 for storage through the arrangement of the heat exchange mechanism 6, through the arrangement of the heat dissipation mechanism 4, the heat dissipation of the fluoridized liquid in the cooling mechanism 3 is realized, finally the fluoridized liquid after heat dissipation is conveyed into the heat absorption mechanism 2 through the heat exchange mechanism 6 to absorb heat, and the effect of circulating cooling is achieved, and the heat generated by the chip is absorbed firstly through the fluoridized liquid in the heat absorption mechanism 2 when the heat dissipation is needed, then the heat exchange mechanism 5 starts to work, the fluoridized liquid in the heat absorption mechanism 2 is transferred into the cooling mechanism 3 through the heat exchange mechanism 6, then the fluoridized liquid in the cooling mechanism 3 is subjected to heat dissipation through the heat dissipation mechanism 4, and then the fluoridized liquid after cooling in the cooling mechanism 3 is transferred into the heat absorption mechanism 2 through the heat exchange mechanism 6, so that the fluoridized liquid in the heat absorption mechanism 2 continues to absorb the generated heat, then, the heat is exchanged again by the exchanging mechanism 5, thereby performing the circulation heat dissipation.

As shown in fig. 2-4, the exchange mechanism 5 includes a linear motor 502, the top of the linear motor 502 is connected with the heat dissipation mechanism 4, the bottom of the linear motor 502 is fixedly connected with a tympanic membrane 503, the outside of the tympanic membrane 503 is fixedly connected with a sealing pad 501, in this embodiment, the tympanic membrane 503 and the sealing pad 501 are made of rubber, the linear motor 502 is a motor with a mover capable of reciprocating, by the arrangement of the linear motor 502, the tympanic membrane 503 can be driven to move, by the arrangement of the tympanic membrane 503, the effect of driving the fluorinated liquid to flow is achieved, by the arrangement of the sealing pad 501, the sealing is kept to prevent pressure relief when the tympanic membrane 503 is driven to move, and it is required to be explained that, by the reciprocating movement of the linear motor 502, the pressure at the upper end and the lower end of the tympanic membrane 503 is changed, and the fluorinated liquid is driven to flow.

As shown in fig. 3-4, the heat absorbing mechanism 2 includes a lower fixing block 201, the top of the lower fixing block 201 is connected with the cooling mechanism 3, the lower fixing block 201 is fixedly connected with a positioning pin 202, and a heat absorbing cavity 203 is formed inside the lower fixing block 201, in this embodiment, through the arrangement of the heat absorbing cavity 203, it is realized that the fluorinated liquid can be stored, so that the fluorinated liquid absorbs heat sufficiently.

As shown in fig. 2-4, the cooling mechanism 3 includes an upper fixing block 301, the bottom of the upper fixing block 301 is fixed with a lower fixing block 201, a heat dissipation cavity 302 is formed inside the upper fixing block 301, and a sealing pad 501 is fixed between the upper fixing block 301 and the lower fixing block 201, in this embodiment, by setting the heat dissipation cavity 302, the fluorinated liquid after heat absorption is stored, and by setting the sealing pad 501, the sealing effect on the heat dissipation cavity 302 and the heat absorption cavity 203 is achieved.

As shown in fig. 2-4, the heat dissipation mechanism 4 includes a fixing plate 401, the bottom of the fixing plate 401 is fixedly connected with an upper fixing block 301, the bottom of the fixing plate 401 is fixedly connected with a step heat conduction column 402, and the step heat conduction column 402 is connected with a linear motor 502, and the top of the fixing plate 401 is fixedly connected with a heat dissipation fin 403.

As shown in fig. 2 and fig. 4, the heat exchange mechanism 6 includes a liquid outlet pipe 601 and a liquid inlet pipe 602, the liquid outlet pipe 601, the liquid inlet pipe 602, the heat dissipation cavity 302 and the heat absorption cavity 203 are connected, the liquid outlet pipe 601 and the liquid inlet pipe 602 are opened inside the upper fixing block 301 and the lower fixing block 201, a check valve 603 is fixedly connected inside the liquid outlet pipe 601 and the liquid inlet pipe 602, in this embodiment, through the arrangement of the liquid inlet pipe 602 and the liquid outlet pipe 601, the effect that the fluorinated liquid flows in the heat dissipation cavity 302 and the heat absorption cavity 203 is achieved, through the arrangement of the check valve 603, the effect of controlling the flow direction of the fluorinated liquid is achieved, the effect that the fluorinated liquid flows back is avoided, the heat dissipation effect is poor, and it is required to be explained that when the tympanic membrane 503 is bulged downwards, the pressure in the heat absorption cavity 203 is reduced, the pressure in the heat dissipation cavity 302 is increased, then the check valve 603 is opened, so that the fluorinated liquid enters the liquid inlet pipe 602, the heat dissipation cavity 302 is cooled down through the liquid inlet pipe 602, when the liquid inlet pipe 503 is bulged downwards, the pressure in the heat dissipation cavity 302 is increased, so that the fluorinated liquid is contacted to the step heat conduction column 402 is cooled, when the pressure in the heat absorption cavity 203 is lowered, when the pressure in the heat absorption cavity is increased, the heat absorption cavity 203 is cooled, and when the pressure in the heat absorption cavity is opened, and the pressure is increased, and the pressure in the heat absorption cavity is opened, and the pressure is opened, and the inside the heat absorption cavity is opened.

As shown in fig. 2-4, the top of the bottom plate 1 is fixedly connected with a leakage preventing pad 101, and the top of the bottom plate 1 is fixedly provided with a chip, in this embodiment, by the arrangement of the leakage preventing pad 101, the leakage of the fluoridized liquid from the bottom during use is prevented

As shown in fig. 3, a through hole is formed in the sealing gasket 501, a groove is formed in the bottom of the upper fixing block 301, and the positions of the positioning pin 202, the groove and the through hole correspond to each other and are adapted to each other.

Claims (8)

1. The utility model provides a chip heat dissipation packaging structure, its characterized in that, includes bottom plate (1), bottom plate (1) top fixedly connected with heat absorption mechanism (2), heat absorption mechanism (2) top fixedly connected with cooling body (3), cooling body (3) top is provided with cooling body (4), cooling body (4) bottom fixedly connected with is used for exchanging heat exchange mechanism (5), cooling body (3) and inside heat exchange mechanism (6) that are provided with of heat absorption mechanism (2).

2. The chip heat dissipation package structure according to claim 1, wherein the exchange mechanism (5) comprises a linear motor (502), the top of the linear motor (502) is connected with the heat dissipation mechanism (4), the bottom of the linear motor (502) is fixedly connected with a tympanic membrane (503), and a sealing pad (501) is fixedly connected with the outer side of the tympanic membrane (503).

3. The chip heat dissipation packaging structure as set forth in claim 2, wherein the heat absorbing mechanism (2) includes a lower fixing block (201), the top of the lower fixing block (201) is connected with the cooling mechanism (3), the lower fixing block (201) is fixedly connected with a positioning pin (202), and a heat absorbing cavity (203) is formed inside the lower fixing block (201).

4. A chip heat dissipation package structure according to claim 3, wherein the cooling mechanism (3) comprises an upper fixing block (301), the bottom of the upper fixing block (301) is fixed with a lower fixing block (201), a heat dissipation cavity (302) is formed inside the upper fixing block (301), and a sealing gasket (501) is fixed between the upper fixing block (301) and the lower fixing block (201).

5. The chip heat dissipation package structure according to claim 4, wherein the heat dissipation mechanism (4) comprises a fixing plate (401), the bottom of the fixing plate (401) is fixedly connected with an upper fixing block (301), the bottom of the fixing plate (401) is fixedly connected with a step heat conduction column (402), the step heat conduction column (402) is connected with a linear motor (502), and the top of the fixing plate (401) is fixedly connected with a heat dissipation fin (403).

6. The chip heat dissipation packaging structure as set forth in claim 5, wherein the heat exchange mechanism (6) comprises a liquid outlet pipe (601) and a liquid inlet pipe (602), the liquid outlet pipe (601), the liquid inlet pipe (602), the heat dissipation cavity (302) and the heat absorption cavity (203) are communicated, the liquid outlet pipe (601) and the liquid inlet pipe (602) are arranged inside the upper fixing block (301) and the lower fixing block (201), and check valves (603) are fixedly connected inside the liquid outlet pipe (601) and the liquid inlet pipe (602).

7. The chip heat dissipation package structure according to claim 1, wherein the top of the bottom plate (1) is fixedly connected with a leakage preventing pad (101).

8. The heat dissipation packaging structure as recited in claim 4, wherein a through hole is formed in the sealing pad (501), a groove is formed in the bottom of the upper fixing block (301), and the positioning pin (202), the groove and the through hole are adapted.