CN219418977U

CN219418977U - Wafer back cleaning device

Info

Publication number: CN219418977U
Application number: CN202320883916.0U
Authority: CN
Inventors: 程盼盼
Original assignee: Chengdu Hiwafer Technology Co Ltd
Current assignee: Chengdu Hiwafer Technology Co Ltd
Priority date: 2023-04-19
Filing date: 2023-04-19
Publication date: 2023-07-25
Anticipated expiration: 2033-04-19

Abstract

The utility model discloses a wafer back surface cleaning device, which comprises a carrying platform, wherein the top of the carrying platform is provided with a bearing assembly, the bearing assembly comprises a plurality of concentric bearing platforms with different sizes, the bearing platform is provided with a sealing assembly for fixing the front surface of a wafer, an adsorption assembly for adsorbing the back surface of the wafer is arranged above the bearing platform, and the periphery of the carrying platform is provided with a height adjusting mechanism for adjusting the height of the adsorption assembly; the device also comprises a sliding component for driving the adsorption component to move along the center of the bearing component in the radial direction. The utility model can automatically fix the wafer through the sealing component without manual clamping, can not cause pollution, scratch, drop and fracture of the wafer, can effectively clean the whole area of the back of the wafer, and can be compatible with wafers with various sizes at the same time.

Description

Wafer back cleaning device

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a wafer back surface cleaning device.

Background

In the integrated circuit manufacturing process, the surface of the wafer must be kept clean before entering each step of the process, and cleaning of the back surface of the wafer is sometimes involved, including removing the residual glue, particles, organic matters and other foreign matters on the back surface of the wafer. After the wafer is developed or photoresist removed, the back of the wafer is easy to have residual photoresist or other particle foreign matters, the wafer needs to be cleaned, and the existing cleaning mode is mostly to clean the wafer by wiping the wafer by hand, so that the wafer is difficult to clean and is easy to pollute, scratch, drop or crack. Currently, in the integrated circuit manufacturing industry, the main wafer size is 4 inches, 6 inches, 8 inches, 12 inches, in the manufacturing process of 6 inches gallium arsenide and gallium nitride integrated circuits, sapphire needs to be bonded, the wafer size is enlarged, or 8 inches or wafers with other sizes need to be manufactured in a compatible way due to industrial upgrading, the wafer cleaning is more difficult, the handheld operation is more inconvenient, and the risks are also existed, or other cleaning platforms or devices with other sizes need to be replaced.

Therefore, a device for cleaning the back of the wafer needs to be designed, which is convenient for cleaning the back of the wafer, does not cause pollution, scratch, drop and fracture of the wafer, and can be compatible with wafers of various sizes.

Disclosure of Invention

The utility model aims to solve the problems that the back of a wafer is difficult to clean and the wafer is easy to pollute, scratch, drop and crack in the prior art, and provides a wafer back cleaning device.

The aim of the utility model is realized by the following technical scheme:

the utility model provides a wafer back belt cleaning device mainly, including the microscope carrier, the top of microscope carrier is provided with the carrier assembly, the carrier assembly includes a plurality of concentric not unidimensional plummet, be equipped with the sealed subassembly on the plummet that fixes the wafer front, the absorption subassembly on absorption wafer back is erect to the plummet top, be equipped with around the microscope carrier the high adjustment mechanism of absorption subassembly height; the device also comprises a sliding component for driving the adsorption component to move along the center of the bearing component in the radial direction.

As an alternative embodiment, the bearing component is stepped, and comprises a central concave platform and a plurality of bearing platforms which are combined in a stepped manner.

As an alternative embodiment, a groove for draining liquid and a liquid draining port are arranged at the step connection part of the bearing assembly.

As an alternative embodiment, the sealing assembly comprises an annular vacuum adsorption hole and a sealing ring, wherein the sealing ring is arranged at the periphery of the annular vacuum adsorption hole.

As an optional implementation manner, a vacuum switch assembly is connected to the side surface of the carrier, and the vacuum switch assembly is correspondingly connected to the annular vacuum adsorption hole.

As an alternative embodiment, the sliding assembly comprises a slider and a slide rail, the slider being mounted on the slide rail.

As an alternative implementation mode, the adsorption component comprises a vacuum tube, a first vacuum switch and a sucker, one end of the vacuum tube is connected with the sliding block and connected with a vacuum pipeline, and the other end of the vacuum tube is connected with the sucker; the first vacuum switch is mounted on the vacuum tube.

As an alternative embodiment, the sliding rail is cross-shaped.

As an alternative embodiment, the cleaning device further comprises a cleaning assembly, wherein the cleaning assembly is arranged on the side surface of the carrying platform.

As an alternative embodiment, the cleaning assembly includes a chemical gun, a water gun, and an air gun.

It should be further noted that the technical features corresponding to the above options may be combined with each other or replaced to form a new technical scheme without collision.

Compared with the prior art, the utility model has the beneficial effects that:

(1) According to the utility model, the wafer is automatically fixed through the sealing assembly, manual clamping is not needed, the wafer is not polluted, scratched, dropped and broken, all the areas on the back of the wafer can be effectively cleaned, and the cleaning of wafers with various sizes is compatible through the bearing platforms with different sizes.

(2) In one example, the adsorption component can be slidably adjusted to a proper position on the sliding rail to adsorb the wafer, and the height adjusting mechanism is adjusted to enable the adsorption component to be at a proper height so as to ensure that the wafer is stressed uniformly in the process of wiping and cleaning the back of the wafer, and the wafer is prevented from being crushed due to overlarge pressure.

(3) In one example, the bearing component is in a ladder shape, and comprises a central concave platform and a plurality of bearing platforms which are combined in a ladder shape, wherein the central area of the bearing component is concave, so that the bearing component can be prevented from being contacted with an effective area of a wafer and only contacted with an ineffective area of the edge of the wafer, the influence on the effective area and the yield of the front surface of the wafer can be avoided, and different bearing platforms can be used according to different wafer sizes.

(4) In one example, the step connection of the bearing assembly is provided with a groove and a liquid outlet for discharging liquid, so that liquid generated in the cleaning process can be effectively discharged.

(5) In one example, the seal assembly includes an annular vacuum suction port and a seal ring that function to secure the wafer and prevent contamination of the wafer front surface with the liquid.

(6) In one example, the slide rail is cross-shaped, and adsorption points covered on the wafer are increased, so that the wafer is uniformly adsorbed.

(7) In one example, the cleaning assembly includes a chemical gun, a water gun, and an air gun, and the wafer may be cleaned with chemicals first, then with the water gun, and finally with the air gun to dry the wafer to ensure cleanliness of the wafer.

Drawings

Fig. 1 is a schematic structural view of a wafer backside cleaning device according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a partially cross-sectional structure of a stage of a wafer backside cleaning apparatus according to an embodiment of the present utility model;

FIG. 3 is a schematic top view of a carrier assembly of a wafer backside cleaning apparatus according to an embodiment of the present utility model;

fig. 4 is a schematic top view illustrating a position to which an adsorption component of the wafer backside cleaning apparatus may slide during use according to an embodiment of the present utility model.

Reference numerals in the drawings: 10-stage, 20-bearing assembly, 21-concave platform, 22-first bearing platform, 23-second bearing platform, 30-adsorption assembly, 31-vacuum tube, 32-first vacuum switch, 33-sucker, 40-height adjustment mechanism, 50-sliding assembly, 51-slide rail, 52-slide block, 60-vacuum system, 61-adsorption assembly vacuum interface, 62-bearing platform vacuum interface, 70-sealing assembly, 71-first vacuum adsorption hole, 72-second vacuum adsorption hole, 73-sealing ring, 80-cleaning assembly, 81-chemical gun, 82-water gun, 83-air gun, 90-vacuum switch assembly, 91-second vacuum switch, 92-third vacuum switch, 100-groove, 110-liquid discharge port.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully understood from the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that directions or positional relationships indicated as being "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are directions or positional relationships described based on the drawings are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

Referring to fig. 1, in an exemplary embodiment, a wafer backside cleaning apparatus is provided, including a carrier 10, a carrier 20 is disposed on top of the carrier 10, the carrier 20 includes a plurality of concentric carrier platforms (such as a first carrier platform 22 and a second carrier platform 23) with different sizes, the carrier platforms are provided with wafer positioning scales (not shown), a sealing assembly 70 for fixing the front side of the wafer is disposed on the carrier platforms, an adsorption assembly 30 for adsorbing the backside of the wafer is disposed above the carrier platforms, a height adjusting mechanism 40 for adjusting the height of the adsorption assembly 30 is disposed around the carrier 10, the height adjusting mechanism 40 may be implemented by a stud, one end of the stud is threaded, and the other end of the stud is unthreaded and provided with a hexagonal hole; a slide assembly 50 is also included for driving the suction assembly 30 radially along the center of the carrier assembly 20.

Specifically, the apparatus is used with the wafer back side up on the carrier assembly 20, wherein wafers of different sizes are placed on corresponding carrier platforms. The wafer is adsorbed on the carrying platform by using the sealing assembly 70, the adsorbing assembly 30 can be driven by the sliding assembly 50 to slide to a proper position to adsorb the back surface of the wafer, and the height adjusting mechanism 40 is adjusted to enable the adsorbing assembly 30 to be at a proper height. The adsorption component 30 is adjusted to a proper height, then the upward pulling force of the wafer is used for supporting the wafer, the stress of the wafer is balanced in the process of wiping and cleaning the back of the wafer under the combined action of the sealing component 70 and the adsorption component 30, the wafer is prevented from being crushed due to overlarge stress, and the adsorption component 30 can replace adsorption points according to different cleaning positions. The wafer is automatically fixed through the sealing assembly 70 without manual clamping, so that the wafer cannot be polluted, scratched, dropped and broken, all the areas on the back of the wafer can be effectively cleaned, and the cleaning of wafers with various sizes is compatible through the bearing platforms with different sizes.

In one example, referring to fig. 2, the carrying assembly 20 is stepped, and includes a central concave platform 21 and a plurality of carrying platforms combined in a stepped manner. The central area is concave, so that the contact with the effective area of the wafer can be avoided, the contact with the ineffective area of the edge of the wafer can be avoided, the influence on the effective area and the yield of the front surface of the wafer can be avoided, and the wafer with various sizes can be compatible. In this example, since the central concave surface is not in contact with the wafer, the central area of the wafer is subjected to a larger cleaning pressure during the cleaning process, and the adsorption assembly 30 should be moved to the central area of the wafer for adsorption, so as to ensure that the stress of the wafer is balanced.

Further, the step connection of the carrying assembly 20 is provided with the groove 100 and the liquid outlet 110 for discharging liquid, so that the liquid generated in the cleaning process can be effectively discharged.

In one example, referring to fig. 3, the sealing assembly 70 includes an annular vacuum adsorption hole and a sealing ring 73, the sealing ring 73 is installed at the periphery of the annular vacuum adsorption hole, and the diameter of the sealing ring 73 is slightly smaller than that of the wafer, wherein the annular vacuum adsorption hole is correspondingly disposed on the carrying platform, the first vacuum adsorption hole 71 is disposed on the first carrying platform 22, the second vacuum adsorption hole 72 is disposed on the second carrying platform 23, and the sealing assembly 70 has the function of fixing the wafer, and can avoid the contamination of the front surface of the wafer by the chemical liquid.

Further, a vacuum switch assembly 90 is connected to the side of the carrier 10, the vacuum switch assembly 90 is correspondingly connected to the annular vacuum suction holes, each group of the annular vacuum suction holes can be independently controlled by a switch to open vacuum suction of the corresponding carrier platform according to the wafer size, as shown in fig. 2, the second vacuum switch 91 controls suction of the second vacuum suction holes 72, and the third vacuum switch 92 controls suction of the first vacuum suction holes 71.

In one example, the slide assembly 50 includes a slide block 52 and a slide rail 51, the slide block 52 being mounted on the slide rail 51. The adsorption component 30 can slide on the slide rail 51 to adjust to a proper position for adsorbing the wafer, in practice, the adsorption position of the adsorption component 30 can be adjusted according to the cleaning position, and a proper amount of adsorption component can be installed according to the size of the wafer, so as to ensure that the stress of the wafer is balanced, and the position to which the adsorption component 30 may slide when in use is shown in fig. 4.

In one example, the adsorption assembly 30 includes a vacuum tube 31, a first vacuum switch 32 and a suction cup 33, one end of the vacuum tube 31 is connected with the slider 52 and connected to a vacuum pipeline, and the other end of the vacuum tube 31 is connected with the suction cup 33; the first vacuum switch 32 is mounted on the vacuum tube 31. In practice, the vacuum system 60 is connected to the outside of the device, the adsorption assembly 30 is connected to the vacuum system 60 through the adsorption assembly vacuum interface 61, and the vacuum switch assembly 90 is connected to the vacuum system 60 through the load-bearing platform vacuum interface 62.

In one example, the sliding rail 51 is in a cross shape, and adsorption points covered on the wafer are increased to realize uniform adsorption on the wafer, which is only illustrated as an embodiment and is not to be construed as limiting the shape of the sliding rail 51, and those skilled in the art can select different sliding rail shapes according to practical situations.

In one example, a cleaning assembly 80 is also included, the cleaning assembly 80 being disposed on a side of the carrier 10. The cleaning assembly 80 includes a chemical gun 81, a water gun 82, and an air gun 83. When the wafer is cleaned, the chemical gun 81 is used for cleaning, the water gun 82 is used for cleaning the chemical, and the air gun 83 is used for drying the wafer so as to ensure the cleanliness of the wafer.

In an exemplary embodiment, the first carrying platform 22 is taken as an example, and the process of cleaning the back surface of the wafer by using the above device is described. The method comprises the following steps:

if there is residual glue on the back surface of the wafer matched with the size of the first carrying platform 22 after the photoresist removing process, placing the back surface of the wafer at the center position of the first carrying platform 22, opening the third vacuum switch 92 to adsorb the wafer on the first carrying platform 22 by using the annular first vacuum adsorption hole 71, opening the first vacuum switch 32 to adsorb the wafer after the adsorption assembly 30 slides on the sliding rail 51 to be adjusted to a proper position, and adjusting the height adjusting mechanism 40 to enable the adsorption assembly 30 to be at a proper height so as to ensure that the stress of the wafer is balanced in the process of cleaning the back surface of the wafer, thereby avoiding the wafer from being cracked due to overlarge compression. The residual glue can be cleaned by an isopropyl alcohol (IPA) chemical gun 81, dust-free cloth can be used for wiping in the cleaning process, so that the cleaning effect is ensured, and if the cleaning points are more, the residual glue can be adsorbed by the adsorption component 30 respectively near the cleaning points, so that the wafer stress is balanced when the cleaning points are cleaned. After the IPA is cleaned, the water gun 82 can be used for cleaning the IPA, and then the air gun 83 is used for drying the IPA and deionized water, so that the cleanliness of the wafer is ensured. The sealing ring 73 and the annular first vacuum adsorption hole 71 on the first carrying platform 22 can ensure that the liquid medicine does not pollute the front surface of the wafer, and IPA and deionized water in the cleaning process can be discharged through the groove 100 and the liquid outlet 110.

After cleaning, the first vacuum switch 32 on the adsorption assembly 30 is turned off to separate the adsorption assembly 30 from the wafer, and then the adsorption assembly 30 is slid to the edge of the slide rail 51 so as not to affect the subsequent operation. The third vacuum switch 92 is turned off to separate the wafer from the suction of the annular first vacuum suction hole 71, and the wafer is removed from the first carrying platform 22 by the suction pen and returned to its original position, thereby completing the cleaning process.

Furthermore, the carrier can be scaled up and down according to the size of a specific wafer to be compatible with a plurality of wafers with different sizes, and different materials can be selected according to different processes.

The foregoing detailed description of the utility model is provided for illustration, and it is not to be construed that the detailed description of the utility model is limited to only those illustration, but that several simple deductions and substitutions can be made by those skilled in the art without departing from the spirit of the utility model, and are to be considered as falling within the scope of the utility model.

Claims

1. The wafer back cleaning device is characterized by comprising a carrying platform, wherein the top of the carrying platform is provided with a bearing assembly, the bearing assembly comprises a plurality of concentric bearing platforms with different sizes, the bearing platform is provided with a sealing assembly for fixing the front surface of a wafer, an adsorption assembly for adsorbing the back surface of the wafer is arranged above the bearing platform, and the periphery of the carrying platform is provided with a height adjusting mechanism for adjusting the height of the adsorption assembly;

the device also comprises a sliding component for driving the adsorption component to move along the center radial direction of the bearing component.

2. The wafer backside cleaning apparatus of claim 1, wherein the carrier assembly is stepped and comprises a central concave platform and a plurality of support platforms combined in a stepped manner.

3. The wafer back surface cleaning apparatus of claim 2, wherein a groove and a drain port for draining are provided at the step connection of the carrier assembly.

4. The wafer backside cleaning apparatus of claim 1, wherein the sealing assembly comprises an annular vacuum suction hole and a sealing ring, the sealing ring being mounted on a periphery of the annular vacuum suction hole.

5. The wafer back surface cleaning apparatus of claim 4, wherein a vacuum switch assembly is connected to a side surface of the carrier, and the vacuum switch assembly is correspondingly connected to the annular vacuum suction hole.

6. The wafer backside cleaning apparatus of claim 1, wherein the slide assembly comprises a slider and a slide rail, the slider being mounted on the slide rail.

7. The wafer back surface cleaning apparatus of claim 6, wherein the suction assembly comprises a vacuum tube, a first vacuum switch and a suction cup, one end of the vacuum tube is connected with the slide block and connected to a vacuum pipeline, and the other end of the vacuum tube is connected with the suction cup; the first vacuum switch is mounted on the vacuum tube.

8. The wafer back side cleaning apparatus of claim 6, wherein said slide rail is cross-shaped.

9. The wafer backside cleaning apparatus of claim 1, further comprising a cleaning assembly disposed on a side of the stage.

10. The wafer backside cleaning apparatus of claim 9, wherein the cleaning assembly comprises a chemical gun, a water gun, and an air gun.