CN219372931U

CN219372931U - Mobile terminal heat dissipation shell

Info

Publication number: CN219372931U
Application number: CN202223215347.7U
Authority: CN
Inventors: 谈勇; 朱永刚; 朱彦元; 梁嘉林; 林洪鑫
Original assignee: Shenzhen Shunentropy Technology Co ltd
Current assignee: Shenzhen Shunentropy Technology Co ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-07-18
Anticipated expiration: 2032-12-02

Abstract

The utility model relates to the technical field of mobile terminal accessories, in particular to a mobile terminal radiating shell which comprises a frame body, a heat conducting structure, a heat conducting layer and a radiating layer, wherein the peripheral edge of the frame body is at least partially bent to form a frame for fixing a mobile terminal body, the heat conducting layer is arranged on one side of the frame body, which corresponds to the main extension surface of the back of the mobile terminal body, of the frame body, the heat conducting layer is attached to the main extension surface of the back of the mobile terminal body through the heat conducting structure, and the radiating layer is attached to one side of the mobile terminal body on the back of the heat conducting layer. This heat dissipation shell can spread the inside heat of mobile terminal to the shell rapidly and spread through the cooperation of heat conduction structure, heat conduction layer and heat dissipation layer, and the treater can not be because of the too high frequency reduction of temperature, can exert mobile terminal optimal performance. The heat generated by the mobile terminal is conducted to the heat conducting layer through the heat conducting structure, then the heat of the heat conducting piece is conducted to the heat radiating layer, and finally the heat of the heat radiating layer is radiated through air, a refrigerating sheet or a fan, so that the heat radiation of the mobile terminal is realized.

Description

Mobile terminal heat dissipation shell

Technical Field

The utility model relates to the technical field of mobile terminal accessories, in particular to a mobile terminal heat dissipation shell.

Background

With the advent of the intelligent age, the demands for mobile terminals are increasing, the hardware configuration of mobile terminals is also increasing, and the performance of mobile terminal processors is improving every year, which inevitably brings about a heating problem. The computing power of the 5G mobile terminal chip is at least 5 times higher than that of the 4G chip, the peak power consumption of the 5G chip is 2.5 times that of the 4G chip, the average power consumption of the 5G mobile terminal is expected to be improved by about 30% compared with that of the 4G, and therefore the power and the power supply of the 5G mobile terminal are higher than those of the 4G mobile terminal. Meanwhile, as the number of antenna modules of the 5G mobile terminal increases, continuously searching for a 5G signal that has not yet covered the full signal also causes an increase in power consumption, thereby generating more heat energy.

Particularly, the 5G mobile terminal using the plug-in baseband chip has more compact internal space, and the heat dissipation space is further compressed. Because the too high temperature of components in the mobile terminal can affect the performance and reliability of the electronic product, how to control the temperature of the components is an indispensable means for guaranteeing the reliability of the components.

Many people can cover a shell on the mobile terminal for anti-falling, anti-scraping, anti-skidding and attractive, and the most common mobile terminal shell on the market is mainly made of plastics at present, and the heat conductivity coefficient of the mobile terminal shell is lower than 1 w/m.k. The heat of the mobile terminal is mainly conducted outwards through the machine body for heat dissipation, and if a common plastic shell is used, a large amount of heat of the mobile terminal can be gathered on the back surface and cannot be dissipated through the shell, so that the heat dissipation of the mobile terminal is not facilitated. Therefore, under the condition that the mobile terminal uses the shell, how to quickly lead out the internal heat of the mobile terminal to the shell is a key for improving the overall heat dissipation effect of the mobile terminal.

Disclosure of Invention

In order to solve the problems, the utility model provides the mobile terminal radiating shell, which can quickly transfer the heat in the mobile terminal to the shell to be radiated, the processor cannot reduce the frequency due to overhigh temperature, the optimal performance of the mobile terminal can be exerted, the temperature consistency in the mobile terminal can be improved, and the service life of components is protected from being attenuated due to high temperature.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a mobile terminal heat dissipation shell, includes framework, heat conduction structure, heat conduction layer and heat dissipation layer, and wherein the frame of fixed mobile terminal body is formed to the edge at least part bending type all around of framework, the framework has the heat conduction layer corresponding mobile terminal body back main extension face one side, the heat conduction layer with laminate through heat conduction structure between the main extension face in mobile terminal body back, heat conduction layer back mobile terminal body one side is attached or from forming the heat dissipation layer.

Preferably, the heat conducting layer and the frame body are integrally processed into an extension surface structure.

Preferably, the frame body and the heat conducting layer are integrated into an ultrathin temperature equalizing plate, a stainless steel plate or an aluminum plate; the outer surface of the heat conducting layer serves as a heat dissipation layer.

Preferably, the middle part of the frame body is a hollow area, the shape of the heat conducting layer is consistent with that of the hollow area, and the periphery of the heat conducting layer is embedded into the hollow area.

Preferably, the heat conducting layer is an ultrathin temperature equalizing plate; the outer surface of the heat conducting layer is used as a heat dissipation layer.

Preferably, the periphery of the back surface of the frame body is provided with a convex frame structure, and the heat dissipation layer is embedded into the convex frame structure.

Preferably, the heat conducting layer is an ultrathin temperature equalizing plate or a graphite sheet; the heat dissipation layer is an aluminum sheet or a copper sheet.

As the preference, ultra-thin samming board includes casing, last casing and wick down, the main part shape of casing and last casing is unanimous down, and the equal homonymy in the periphery of casing and last casing extends down and forms and encloses the frame, it closes the frame to go up casing and lower casing lock and seal through enclosing, forms the cavity that is used for holding liquid between casing and the lower casing down, the casing is equipped with the support column that a plurality of array was arranged down towards cavity one side, the wick is arranged in the cavity and is supported the attached in last casing medial surface through the support column.

The beneficial effects of using the utility model are as follows:

this heat dissipation shell can spread the inside heat of mobile terminal to the shell rapidly and spread through the cooperation of heat conduction structure, heat conduction layer and heat dissipation layer, and the treater can not be because of the too high frequency reduction of temperature, can exert mobile terminal optimal performance. The heat generated by the mobile terminal is conducted to the heat conducting layer through the heat conducting structure, then the heat of the heat conducting piece is conducted to the heat radiating layer, and finally the heat of the heat radiating layer is radiated through air, a refrigerating sheet or a fan, so that the heat radiation of the mobile terminal is realized.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation case of a mobile terminal according to embodiment 1 of the present utility model.

Fig. 2 is a cross-sectional view taken along A-A in fig. 1.

Fig. 3 is a schematic structural diagram of a heat dissipation case of a mobile terminal according to embodiment 2 of the present utility model.

Fig. 4 is a cross-sectional view taken along the direction B-B in fig. 3.

Fig. 5 is a schematic structural diagram of a heat dissipation case of a mobile terminal according to embodiment 3 of the present utility model.

Fig. 6 is a cross-sectional view taken along the direction C-C in fig. 3.

Fig. 7 is a schematic cross-sectional view of an ultrathin temperature-equalizing plate in a heat-dissipating casing of a mobile terminal according to the utility model.

The reference numerals include:

10-frame, 20-heat conduction structure, 30-heat conduction layer, 40-heat dissipation layer, 41-lower shell, 411-support column, 42-upper shell, 43-liquid absorption core and 50-mobile terminal body.

Detailed Description

In order to make the objects, technical solutions and advantages of the present technical solution more apparent, the present technical solution is further described in detail below in conjunction with the specific embodiments. It should be understood that the description is only illustrative and is not intended to limit the scope of the present technical solution.

Example 1

As shown in fig. 1 and 2, the present embodiment provides a heat dissipation housing of a mobile terminal, which includes a frame 10, a heat conducting structure 20, a heat conducting layer 30 and a heat dissipation layer 40, wherein the peripheral edge of the frame 10 is at least partially bent to form a frame for fixing the mobile terminal body 50, the heat conducting layer 30 is disposed on one side of the frame 10 corresponding to the back main extension surface of the mobile terminal body 50, the heat conducting layer 30 is attached to the back main extension surface of the mobile terminal body 50 through the heat conducting structure 20, and the heat dissipation layer 40 is attached to one side of the back mobile terminal body 50 of the heat conducting layer 30.

The heat conductive layer 30 and the frame 10 are integrally formed. The frame body 10 and the heat conducting layer 30 are integrated into an ultrathin temperature equalizing plate; the outer surface of the thermally conductive layer 30 acts as a heat sink layer 40.

The heat dissipation shell mainly comprises four parts of a frame body 10, a heat conduction structure 20, a heat conduction layer 30 and a heat dissipation layer 40. The outer frame is customized according to the shapes of different mobile terminal bodies 50, and plays a role in wrapping and supporting the mobile terminal bodies 50; one surface of the heat conducting structure 20 is attached to the back surface of the mobile terminal body 50, and the other surface of the heat conducting structure is attached to the heat conducting layer 30, so that an air gap between the mobile terminal body 50 and the heat conducting layer 30 is filled, the contact between the mobile terminal body and the heat conducting layer is better, and the thermal resistance is reduced; the heat conductive layer 30 plays a role of rapidly conducting heat; the heat sink layer 40 functions to dissipate heat. The thermally conductive structure 20 may be a thermally conductive silicone or a graphite thermally conductive sheet.

Example 2

The present embodiment is generally the same as embodiment 1 described above, except for the arrangement of the heat conductive layer 30 and the heat dissipation layer 40, and the structure of the frame body 10 is adjusted correspondingly.

As shown in fig. 3 and 4, in the present embodiment, the middle portion of the frame 10 is a hollow area, the shape of the heat conducting layer 30 is consistent with the shape of the hollow area, and the periphery of the heat conducting layer 30 is embedded into the hollow area. The heat conducting layer 30 is an ultrathin temperature equalizing plate; the outer surface of the thermally conductive layer 30 acts as a heat sink layer 40.

Example 3

As shown in fig. 5 and 6, the periphery of the back surface of the frame 10 has a convex frame structure, and the heat dissipation layer 40 is embedded in the convex frame structure. The heat conducting layer 30 is an ultrathin temperature equalizing plate; the heat dissipation layer 40 is an aluminum sheet or a copper sheet.

As shown in fig. 7, in the above three embodiments, the heat conduction layer 30 is preferably an ultra-thin temperature equalization plate. The ultrathin temperature equalizing plate is a closed hollow cavity and consists of an upper shell 42, a lower shell 41, a liquid suction core 43 and working media. The upper shell 42 is provided with a groove, support columns 411 are distributed in the groove, and the upper shell and the lower shell mainly play a role in supporting the upper cavity and the lower cavity and prevent collapse; the lower housing 41 is fluted for placement of the wick 43.

The specific structure of ultra-thin samming board is ultra-thin samming board including lower casing 41, go up casing 42 and wick 43, lower casing 41 is unanimous with the main part shape of last casing 42, lower casing 41 and go up the equal homonymy all around of casing 42 and extend and form and enclose and close the frame, go up casing 42 and lower casing 41 lock and seal through enclosing and closing the frame, go up the cavity that forms between casing 42 and the lower casing 41 and be used for holding liquid, lower casing 41 is equipped with the support column 411 that a plurality of array was arranged towards cavity one side, wick 43 is arranged in the cavity and is supported the subsides through support column 411 and is at last casing 42 medial surface.

The side of the ultrathin temperature equalization plate contacted with the heat conducting structure 20 is an evaporation surface, and the other side is a condensation surface. The heat of the mobile terminal body 50 is transferred to the evaporation surface, the working medium in the evaporation surface is quickly vaporized into steam, the steam flows to the condensation surface, the condensation releases heat, and the liquid is changed back again. The liquid flows back to the evaporation surface by capillary action of the wick 43. Heat is transferred to the outside via the condensing surface for dissipation.

The ultra-thin temperature equalizing plate shell can be made of metal materials such as copper alloy, stainless steel, titanium alloy and the like. Wick 43 may be a combination of one or more of sintered copper powder, copper mesh, foam copper, nanocoating, micro-grooves, micro-cylinders, and the like. The working medium is usually deionized water, and can also adopt liquid such as methanol, acetone, ethanol and the like.

The following embodiments 4-7 are different embodiments of the forming manner of the frame body 10, and the frame body 10 may be formed by bending the peripheral edges of the heat conducting layer 30 and/or the heat dissipating layer 40, or may be formed independently, which is described in detail in the following embodiments 4-6.

Example 4

As shown in fig. 7, in this embodiment, the heat conducting layer 30 and the heat dissipating layer 40 are integrated, that is, heat dissipation is also conducted, at this time, the heat conducting layer 30 and the heat dissipating layer 40 are both ultrathin temperature equalizing plates, and the peripheral edges of the ultrathin temperature equalizing plates can be bent to form the frame 10. The edge welded portions of the upper case 42 and the lower case 41 may be extended to form the frame body 10.

Example 5

The heat conductive layer 30 and the heat sink layer 40 are two separate layers, which may be of different materials. The peripheral edges of the heat dissipation layer 40 are bent to form the frame body 10, and the structural strength (playing a role in preventing falling) mainly depends on the heat dissipation layer 40. At this time, the heat conductive layer 30 is formed in a simple planar shape, and is not limited to the shape of the mobile terminal body 50, and is bonded to the inner surface of the heat dissipation layer 40 (i.e., the side close to the mobile terminal body 50).

The peripheral edges of the heat conducting layer 30 may be bent to form the frame 10.

The frame 10 may be formed by bending both, and the problem of bending the heat conductive layer 30 may be referred to in embodiment 4.

Example 6

In this embodiment, neither the heat conducting layer 30 nor the heat dissipating layer 40 is bent, and the frame 10 is made of other materials, such as a silicone shell commonly used in mobile terminals. The back of the mobile terminal body 50 is hollowed out at a corresponding position, the shape of the heat conducting layer 30 is consistent with that of the hollowed-out area, and the periphery of the heat conducting layer 30 is embedded into the hollowed-out area.

The foregoing is merely exemplary of the present utility model, and those skilled in the art can make many variations in the specific embodiments and application scope according to the spirit of the present utility model, as long as the variations do not depart from the spirit of the utility model.

Claims

1. The utility model provides a mobile terminal heat dissipation shell which characterized in that: the mobile terminal comprises a frame body, a heat conducting structure, a heat conducting layer and a heat dissipation layer, wherein at least part of the periphery edge of the frame body is bent to form a frame for fixing the mobile terminal body, the heat conducting layer is arranged on one side of the back main extension surface of the corresponding mobile terminal body of the frame body, the heat conducting layer is attached to the back main extension surface of the mobile terminal body through the heat conducting structure, and one side of the back mobile terminal body of the heat conducting layer is attached to or self-formed with the heat dissipation layer.

2. The mobile terminal heat dissipation case as recited in claim 1, wherein: the heat conduction layer and the frame body are of an integrally processed extension surface structure.

3. The mobile terminal heat dissipation case as recited in claim 2, wherein: the frame body and the heat conducting layer are an integrated ultrathin temperature equalizing plate, a stainless steel plate or an aluminum plate; the outer surface of the heat conducting layer serves as a heat dissipation layer.

4. The mobile terminal heat dissipation case as recited in claim 1, wherein: the middle part of the frame body is a hollowed-out area, the shape of the heat conducting layer is consistent with that of the hollowed-out area, and the periphery of the heat conducting layer is embedded into the hollowed-out area.

5. The mobile terminal heat dissipation case as recited in claim 1, wherein: the heat conducting layer is an ultrathin temperature equalizing plate, a copper sheet, an aluminum sheet or a graphite sheet; the outer surface of the heat conducting layer is used as a heat dissipation layer.

6. The mobile terminal heat dissipation case as recited in claim 1, wherein: the periphery of the back of the frame body is provided with a convex frame structure, and the heat dissipation layer is embedded into the convex frame structure.

7. The mobile terminal heat dissipation case as recited in claim 6, wherein: the heat conducting layer is an ultrathin temperature equalizing plate or a graphite sheet; the heat dissipation layer is an aluminum sheet or a copper sheet.

8. The mobile terminal heat dissipation case as recited in claim 3, 5 or 7, wherein: the ultra-thin samming board includes casing, last casing and wick down, the main part shape of casing and last casing is unanimous down, and the equal homonymy extends all around of casing and last casing down and forms and enclose and close the frame, it is sealed just through enclosing closing the frame to go up casing and lower casing lock, forms the cavity that is used for holding liquid between casing and the lower casing down, the casing is equipped with the support column that a plurality of array was arranged down towards cavity one side, the wick is arranged in the cavity and is supported the subsides through the support column and is attached at last casing medial surface.