CN219363791U - Vacuum automatic conveying device and coating equipment - Google Patents
Vacuum automatic conveying device and coating equipment Download PDFInfo
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- CN219363791U CN219363791U CN202320746845.XU CN202320746845U CN219363791U CN 219363791 U CN219363791 U CN 219363791U CN 202320746845 U CN202320746845 U CN 202320746845U CN 219363791 U CN219363791 U CN 219363791U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a vacuum automatic conveying device and coating equipment, and belongs to the technical field of coating equipment. The utility model comprises a vacuum automatic conveying device and a film plating device with the device, wherein the vacuum automatic conveying device comprises a loading and unloading station, a film inlet and outlet chamber, a conveying chamber, a vacuum manipulator and valves, the number of the loading and unloading station and the number of the film inlet and outlet chambers are two, the valves are arranged between the loading and unloading station and the film inlet and outlet chamber, the film inlet and outlet chamber and the conveying chamber, the film inlet and outlet chamber is connected with the conveying chamber, the vacuum manipulator is arranged in the conveying chamber and used for transferring a substrate frame in the conveying chamber and a processing chamber, and a monitoring system, a conveying system and a vacuum system are arranged in the film inlet and outlet chamber and the conveying chamber. The utility model adopts left-right rotation mode, abandons the defects of the prior mode and combines the advantages of the two modes, thereby improving the production efficiency, occupying small volume, solving the problem of large vacuum breaking volume, having good production continuity, improving the productivity of the machine and having high cost performance.
Description
Technical Field
The utility model belongs to the technical field of coating equipment, and particularly relates to a vacuum automatic conveying device and coating equipment.
Background
At present, the existing vacuum coating equipment in the field of optical coating has the following defects:
1. the production efficiency is too low by adopting a single Load cavity one-furnace substrate integral loading mode;
2. the related vacuum breaking volume is relatively large, generally exceeds 1.5 cubic meters, and the vacuum impact is large;
3. the advanced single-chip circulation type vacuum loading and unloading mode solves the problem of large vacuum breaking volume in theory, but occupies large space of a factory building and has high cost.
Therefore, a vacuum automatic conveying device and a coating device are provided, and the problems are solved.
Disclosure of Invention
The utility model aims to provide a vacuum automatic conveying device and coating equipment, and aims to solve the problems that in the prior art, the existing vacuum coating equipment is low in production efficiency, relatively large in vacuum breaking volume, large in occupied factory space, high in cost and the like. In order to achieve the purpose, the utility model adopts the following technical scheme: the vacuum automatic conveying device comprises a loading and unloading station, a wafer inlet and outlet chamber, a conveying chamber, a vacuum manipulator and valves, wherein the number of the loading and unloading station and the number of the wafer inlet and outlet chamber are two, the valves are arranged between the loading and unloading station and the wafer inlet and outlet chamber, the wafer inlet and outlet chamber and the conveying chamber, the wafer inlet and outlet chamber is connected with the conveying chamber, and the vacuum manipulator is arranged in the conveying chamber and used for transferring substrate frames in the conveying chamber and the processing chamber; the wafer inlet and outlet chamber and the conveying chamber are respectively provided with a monitoring system, a conveying system and a vacuum system. The scheme is different from a single Load cavity one-furnace substrate integral loading mode and a single-chip circulating type loading and unloading mode, adopts a single-chip left-right rotation type design, abandons the defects of the existing mode, combines the advantages of the two modes, improves the production efficiency, occupies small volume, and solves the problem of large vacuum breaking volume.
Further describing the foregoing aspects, a handling system is provided at the loading and unloading station for handling the substrate holders. Wherein the monitoring system comprises a vacuum gauge for monitoring vacuum level and a photoelectric sensor for monitoring the substrate holder.
The vacuum system comprises a molecular pump, a rough pump group and a front-stage pump group, and is used for pumping air into and out of the wafer chamber and the conveying chamber, so that each chamber forms vacuum so as to achieve processing conditions.
Further, the monitoring system, the carrying system, the vacuum mechanical arm and the valve are electrically connected with the central processing unit and controlled by the central computer, so that high automation is realized.
The application also provides vacuum coating equipment, which comprises the vacuum automatic conveying device, and further comprises a processing chamber connected with the conveying chamber in a vacuum manner, wherein a vacuum system, a heater, a gas system, a cathode system and a coating drum are arranged in the processing chamber, the coating drum is rotatably arranged in the center of the processing chamber, and the vacuum system, the gas system, the heater and the cathode system are arranged on the inner wall of the processing chamber. The coating drum is used for loading products in a coating chamber, and when coating, the coating drum rotates at high speed in a barrel type processing chamber, and the carried substrate is subjected to film deposition before passing through a coating cathode.
The production steps of the equipment are as follows:
s1, respectively fixing a cleaned substrate to be coated on a substrate jig at two loading and unloading stations, wherein the substrate jig is arranged on a substrate frame;
s2, after the substrate frame carrying the substrate to be coated is conveyed to the substrate inlet and outlet chambers by the conveying system, the valve is closed, and the vacuum system is started to exhaust;
s3, when the monitoring system monitors that the air pressure of the left wafer inlet and outlet chamber is the same as that of the conveying chamber and accords with a preset value, a valve between the left wafer inlet and outlet chamber and the conveying chamber is opened, the conveying system conveys a left substrate frame of the left wafer inlet and outlet chamber to the conveying chamber, and a right substrate frame of the right wafer inlet and outlet chamber and a substrate to be coated stay in the right wafer inlet and outlet chamber;
s4, transferring the substrate jig and the substrate to be coated on the left substrate frame to a coating drum by the mechanical arm for coating;
s5, after film coating is completed, a valve between the right film feeding and discharging chamber and the conveying chamber is opened, a conveying system conveys a right substrate frame of the right film feeding and discharging chamber to the conveying chamber, a mechanical arm conveys a film coated substrate and a substrate jig to a left substrate frame, then conveys a substrate to be coated on the right substrate frame and the substrate jig to a film coating drum, at the moment, the left substrate frame sequentially conveys the substrate to the left film feeding and discharging chamber and the left loading and unloading station through the conveying system, the substrate to be coated is arranged on the left substrate frame through the substrate jig, and the conveying system conveys the left substrate frame to the left film feeding and discharging chamber;
s5, after film coating is completed, a valve between the left film inlet and outlet chamber and the conveying chamber is opened, the conveying system conveys the left substrate frame of the left film inlet and outlet chamber to the conveying chamber, and the mechanical arm conveys the film coated substrate and the substrate jig to the right substrate frame, so that the film coating is sequentially circulated, and the other substrate is ensured to be coated when one substrate is assembled, disassembled and conveyed.
The production process of the equipment adopts a single-chip left-right conversion type, ensures that a substrate after film coating is completed is moved out to a loading and unloading station to be unloaded and a new substrate to be coated is installed in the film coating process, simultaneously carries the substrate to be coated to a film inlet and outlet chamber, can be seamlessly connected after waiting for the completion of film coating of the substrate, reduces the film changing time of a process chamber and improves the production efficiency.
Compared with the prior art, the utility model has the following beneficial effects:
1. the utility model adopts a single-chip left-right rotation mode, ensures that the substrate to be coated and the already coated substrate are quickly exchanged in the process chamber, has good production continuity, improves the productivity of the machine and has high cost performance;
2. the utility model has reasonable design, compact structure, greatly reduced machine height and small occupation of factory building space; the existing product machine in the market is about 3.5 meters high, and the equipment is reduced to 2.5 meters high.
3. The single-chip left-right rotation type design is adopted, the defect of the existing mode is abandoned, the problem of large vacuum breaking volume is effectively solved, and the production efficiency is improved. The Load cavity is reduced from 1.5 cubic meters of the existing product on the market to 20-100 liters, and the Load cavity is reduced by more than 90%. The influence of vacuum breaking fluctuation of the coating chamber is reduced from the magnitude of 1E-1Pa to the magnitude of 5E-3 Pa.
4. The single-chip left-right rotation type design is adopted, the defect of a circulation mode is abandoned, the problem of large occupation between hundred stages is effectively solved, and the production efficiency is improved. The prior product of the hundred-level factory building space field is about 14 square meters, and the product of the patent is reduced to about 6.5 square meters. The occupation of hundred-level factory building space is reduced by more than 50 percent.
Drawings
FIG. 1 is a schematic view of an embodiment of the present utility model;
FIG. 2 is a schematic view of another embodiment of the present utility model;
fig. 3 is a schematic flow chart provided in an embodiment of the present utility model.
Wherein, each reference sign in the figure:
1. a left loading and unloading station; 11. a right loading and unloading station; 2. left in and out of the film chamber; 21. right in and out of the wafer chamber; 3. a conveying chamber; 4. a left substrate holder; 41. a right substrate holder; 5. a vacuum manipulator; 6. a coating drum; 7. a substrate jig; 8. a process chamber; 81. a molecular pump; 82. a heater; 83. a cathode system; 9. a valve; 101. a rough pump group; 102. a pre-pump group.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The technical scheme of the patent is further described in detail below with reference to the specific embodiments.
As shown in fig. 1 and 2, the present application provides a vacuum automated handling device, which comprises a loading and unloading station, a wafer inlet and outlet chamber, a handling chamber 3, a vacuum manipulator 5 and a valve 9, wherein the number of the loading and unloading station and the wafer inlet and outlet chamber is two, specifically, a left loading and unloading station 1, a right loading and unloading station 11, a left wafer inlet and outlet chamber 2 and a right wafer inlet and outlet chamber 21, the valve 9 is installed between the loading and unloading station and the wafer inlet and outlet chamber, the wafer inlet and outlet chamber and the handling chamber 3, the wafer inlet and outlet chamber is connected with the handling chamber 3, and the vacuum manipulator 5 is installed in the handling chamber 3 and used for transferring substrate frames in the handling chamber 3 and the processing chamber 8. The wafer inlet and outlet chamber and the conveying chamber 3 are respectively provided with a monitoring system, a conveying system and a vacuum system, and the loading and unloading station is provided with a conveying system for conveying the substrate rack. Wherein the monitoring system comprises a vacuum gauge for monitoring vacuum level and a photoelectric sensor for monitoring the substrate holder. The vacuum system comprises a molecular pump 81, a rough pump group 101 and a front pump group 102, and is used for pumping air into and out of the wafer chamber and the conveying chamber 3 so as to form vacuum in each chamber, so that the processing condition is achieved. The monitoring system, the carrying system, the vacuum manipulator 5 and the valve 9 are electrically connected with the central processing unit and controlled by the central computer, so that high automation is realized.
The application also provides vacuum coating equipment, including the aforesaid vacuum automation conveying device, still include with the processing chamber 8 of carrying room 3 vacuum connection, be equipped with vacuum system, heater 82, gas system, cathode system 83 and coating drum 6 in the processing chamber 8, the center of processing chamber 8 is installed in the rotation of coating drum 6, vacuum system, gas system, heater 82 and cathode system 83 are installed on the processing chamber 8 inner wall. The coating drum 6 is used for loading products in a coating chamber, and when coating, the coating drum 6 rotates at high speed in a barrel-type process chamber 8, and the carried substrate is subjected to film deposition before passing through a coating cathode.
In practical use, referring to fig. 1 to 3, the production adopts a single-chip left-right rotation mode, and the specific steps are as follows: the cleaned substrate to be coated is fixed on a substrate jig 7 at two loading and unloading stations respectively, and the substrate jig 7 is arranged on a substrate frame; after the substrate frame carrying the substrate to be coated is conveyed to the substrate inlet and outlet chambers by the conveying system, the valve 9 is closed, and the vacuum system is started to exhaust; when the monitoring system monitors that the air pressure of the left in-out film chamber 2 is the same as that of the conveying chamber 3 and accords with a preset value, a valve 9 between the left in-out film chamber 2 and the conveying chamber 3 is opened, the conveying system conveys a left substrate frame 4 of the left in-out film chamber 2 to the conveying chamber 3, and a right substrate frame 41 of the right in-out film chamber 21 and a substrate to be coated stay in the right in-out film chamber 21; the vacuum mechanical arm 5 transfers the substrate jig 7 and the substrate to be coated on the left substrate frame 4 to the coating drum 6 for coating; after coating is completed, a valve 9 between the right in-out wafer chamber 21 and the conveying chamber 3 is opened, a conveying system conveys a right substrate frame 41 of the right in-out wafer chamber 21 to the conveying chamber 3, a vacuum manipulator 5 conveys a coated substrate together with a substrate jig 7 to a left substrate frame 4, then conveys a substrate to be coated on the right substrate frame 41 together with the substrate jig 7 to a coating drum 6, at the moment, the left substrate frame 4 is sequentially conveyed to the left in-out wafer chamber 2 and the left loading and unloading station 1 through the conveying system, the substrate to be coated is installed on the left substrate frame 4 through the substrate jig 7, and the conveying system conveys the left substrate frame 4 to the left in-out wafer chamber 2; after the film plating is finished, a valve 9 between the left film feeding and discharging chamber 2 and the conveying chamber 3 is opened, the conveying system conveys the left substrate frame 4 of the left film feeding and discharging chamber 2 to the conveying chamber 3, and the vacuum mechanical arm 5 conveys the film plated substrate together with the substrate jig 7 to the right substrate frame 41 for circulation in sequence, so that one substrate is ensured to be coated when being assembled, disassembled and conveyed. The single-chip left-right conversion mode is adopted, so that a substrate is ensured to be carried out to a loading and unloading station to be unloaded and a new substrate to be coated is installed in the coating process, the substrate to be coated is carried to a wafer inlet and outlet chamber, seamless connection can be realized after the substrate coating is waited to be completed, the wafer changing time of the process chamber 8 is shortened, the production efficiency is improved, and the problem of large vacuum breaking volume is solved.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The above embodiments are only for illustrating the present utility model, not for limiting the present utility model, and various changes and modifications may be made by one of ordinary skill in the relevant art without departing from the spirit and scope of the present utility model, and therefore, all equivalent technical solutions are also within the scope of the present utility model, and the scope of the present utility model is defined by the claims.
Claims (7)
1. The utility model provides a vacuum automation carrying device, includes loading and unloading station, business turn over piece room, carries room (3), vacuum manipulator (5) and valve (9), its characterized in that: the number of the loading and unloading stations and the number of the wafer inlet and outlet chambers are two, the valves (9) are arranged between the loading and unloading stations and the wafer inlet and outlet chambers, and between the wafer inlet and outlet chambers and the conveying chamber (3), the wafer inlet and outlet chambers are connected with the conveying chamber (3), and the vacuum mechanical arm (5) is arranged in the conveying chamber (3) and used for transferring the substrate frames in the conveying chamber (3) and the processing chamber (8); and a monitoring system, a conveying system and a vacuum system are arranged in the wafer inlet and outlet chamber and the conveying chamber (3).
2. The vacuum automated conveyance device according to claim 1, wherein: the loading and unloading station is provided with a conveying system for conveying the substrate frame.
3. The vacuum automated conveyance device according to claim 1, wherein: the monitoring system comprises a vacuum gauge for monitoring the vacuum degree and a photoelectric sensor for monitoring the substrate frame.
4. The vacuum automated conveyance device according to claim 1, wherein: the vacuum system comprises a molecular pump (81), a rough pump group (101) and a pre-pump group (102).
5. A vacuum automated conveyance device according to any one of claims 1 to 4, wherein: the monitoring system, the carrying system, the vacuum manipulator (5) and the valve (9) are electrically connected with the central processing unit.
6. A vacuum coating apparatus, characterized in that: the vacuum automatic conveying device comprises the vacuum automatic conveying device, and further comprises a process chamber (8) in vacuum connection with the conveying chamber (3), wherein a vacuum system, a heater (82), a gas system, a cathode system (83) and a coating drum (6) are arranged in the process chamber (8), the coating drum (6) is rotatably arranged in the center of the process chamber (8), and the vacuum system, the gas system, the heater (82) and the cathode system (83) are arranged on the inner wall of the process chamber (8).
7. The vacuum coating apparatus according to claim 6, wherein: the process chamber (8) is of barrel design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320746845.XU CN219363791U (en) | 2023-04-07 | 2023-04-07 | Vacuum automatic conveying device and coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320746845.XU CN219363791U (en) | 2023-04-07 | 2023-04-07 | Vacuum automatic conveying device and coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219363791U true CN219363791U (en) | 2023-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320746845.XU Active CN219363791U (en) | 2023-04-07 | 2023-04-07 | Vacuum automatic conveying device and coating equipment |
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| Country | Link |
|---|---|
| CN (1) | CN219363791U (en) |
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2023
- 2023-04-07 CN CN202320746845.XU patent/CN219363791U/en active Active
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