CN219350926U

CN219350926U - Laser device

Info

Publication number: CN219350926U
Application number: CN202223426963.7U
Authority: CN
Inventors: 王铁柱; 兰明文; 莫华莲; 邝贤峰; 吴晓婷; 梁丽芳
Original assignee: Foshan NationStar Optoelectronics Co Ltd
Current assignee: Foshan NationStar Optoelectronics Co Ltd
Priority date: 2022-12-20
Filing date: 2022-12-20
Publication date: 2023-07-14
Anticipated expiration: 2032-12-20

Abstract

The utility model discloses a laser, which comprises a chassis, a lead wire and a cover plate, wherein more than two grooves are formed in the chassis, and more than two ribs are formed in the cover plate; the number of the grooves on the chassis is the same as the number of the ribs on the cover plate, and the cover plate is matched with the grooves on the chassis based on the ribs; the side wall of the chassis is provided with a connecting hole; the lead is connected into the chassis based on the connecting hole. The laser sets up a plurality of recesses and bead on the cooperation position of chassis and apron, improves through the cooperation of bead and recess the cooperation area of chassis and apron, thereby improve the connection convenience of apron and chassis improves apron and chassis welded tightness, effectively improves the preparation efficiency of laser and reduces apron and chassis welded gas leakage probability.

Description

Laser device

Technical Field

The utility model mainly relates to the technical field of lasers, in particular to a laser.

Background

The chassis and the cover plate of the existing laser are generally fixed in a welding mode, and the welding mode is mainly parallel seam welding or laser welding, so that the face-to-face bonding of the cover plate and the chassis is realized, but the welding mode has high welding requirements on the matching surfaces of the cover plate and the chassis, such as the parallel seam welding requires high flatness of the matching surfaces of the chassis and the cover plate, and the laser welding has high reflection requirements on the welding surfaces, so that the welding operation of the chassis and the cover plate is complicated, and the overall preparation efficiency and the welding yield of the laser are influenced.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art, and provides a laser, wherein a plurality of grooves and ribs are arranged at the matching positions of a chassis and a cover plate, and the matching area of the chassis and the cover plate is increased through the matching of the ribs and the grooves, so that the connection convenience of the cover plate and the chassis is improved, the welding tightness of the chassis and the cover plate is improved, and the preparation efficiency of the laser is effectively improved.

The utility model provides a laser which comprises a chassis, a lead wire and a cover plate, wherein more than two grooves are formed in the chassis, and more than two ribs are formed in the cover plate;

the number of the grooves on the chassis is the same as the number of the ribs on the cover plate, and the cover plate is matched with the grooves on the chassis based on the ribs;

the side wall of the chassis is provided with a connecting hole;

the lead is connected into the chassis based on the connecting hole.

Further, the convex rib is of an arc angle structure

Furthermore, the chassis and the cover plate are both made of metal materials.

Further, an insulating layer is filled between the hole wall of the connecting hole and the lead.

Further, the depth of the groove is h1, the height of the convex rib is h2, and the constraint relation between h1 and h2 is as follows: h1-h2 is less than or equal to 0.1 h1.

Further, the width of the groove is n1, the width of the convex rib is n2, and the constraint relation between n1 and n2 is: n1-n2 is less than or equal to 0.1 n1.

Further, a welding layer is arranged between the groove and the convex rib, or an adhesive layer is arranged between the groove and the convex rib.

Further, solder is arranged in the groove, the solder forms the welding layer, or a soldering lug is arranged in the groove, and the soldering lug forms the welding layer.

Further, the filling height of the solder is h3, and the constraint relation between h3 and h1 is: h1 is more than or equal to 0.5 and h3 is more than or equal to h1.

Further, the welding tabs are arranged in the grooves in a V shape.

Further, high-strength adhesive is arranged in the groove, and the adhesive layer is formed by the high-strength adhesive.

Further, the filling height of the high-strength adhesive is h4, and the constraint relation between h4 and h1 is: h1 is more than or equal to 0.5 and h4 is more than or equal to h1.

The utility model provides a laser, which is characterized in that a plurality of grooves and ribs are arranged at the matching positions of a chassis and a cover plate, and the matching area of the chassis and the cover plate is increased through the matching of the ribs and the grooves, so that the connection convenience of the cover plate and the chassis is improved, the welding tightness of the cover plate and the chassis is improved, the preparation efficiency of the laser is effectively improved, and the air leakage probability of the welding of the cover plate and the chassis is reduced. .

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings which are required in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a laser structure in an embodiment of the utility model;

FIG. 2 is a schematic view of a cover plate structure according to an embodiment of the present utility model;

FIG. 3 is a schematic view of the chassis structure in an embodiment of the present utility model;

FIG. 4 is a cross-sectional view of a laser structure in an embodiment of the utility model;

fig. 5 is an enlarged schematic view of the structure at a in fig. 4 according to an embodiment of the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Fig. 1 shows a schematic view of a laser structure in an embodiment of the present utility model, fig. 2 shows a schematic view of a cover plate structure in an embodiment of the present utility model, fig. 3 shows a schematic view of a chassis structure in an embodiment of the present utility model, the laser includes a chassis 2 and a cover plate 1, two or more grooves 21 are provided on the chassis 2, two or more ribs 11 are provided on the cover plate 1, the number of grooves 21 on the chassis 2 and the number of ribs 11 on the cover plate 1 are the same, the cover plate 1 is matched with the grooves 21 on the chassis 2 based on the ribs 11, and the matching area of the cover plate 1 and the chassis 2 can be increased by the ribs 11 being embedded with the grooves 21, so as to improve the connection stability of the cover plate 1 and the chassis 2.

Further, the shape and size of the convex rib 11 on the cover plate 1 are matched with those of the groove 21 on the chassis 2, so that the cover plate 1 and the chassis 2 can be matched in a scarf joint mode.

Specifically, the cover plate 1 covers the top of the chassis 2, and is used for protecting the laser element, avoiding the laser element from being directly exposed to the external environment, and reducing the risk of damaging the laser element. The cover plate 1 is provided with an opening, the opening is used for the laser element to emit laser beams, the opening is provided with a transparent plate 12, the transparent plate 12 can separate the laser element in the chassis 2, and the laser beams emitted by the laser element can be emitted in an external environment.

Further, the transparent plate 12 may be a glass plate, which has good light transmittance and low manufacturing cost.

Further, one end of any one of the ribs 11 inserted into the groove 21 is an arc angle structure, and the arc angle structure can improve the convenience of matching the rib 11 with the groove 21.

Specifically, chassis 2 is notch ascending rectangular cell body structure, the inside cavity of cell body structure forms and holds the chamber, hold the chamber and be used for the installation laser component, the notch of chassis 2 upper end is convenient for carry out the installation of laser component, the light-emitting direction orientation of laser component the notch, apron 1 covers notch department.

Further, a plurality of recess 21 is located the upper surface of chassis 2 lateral wall, arbitrary recess 21 centers on hold the chamber and form ring channel structure, a plurality of recess 21 is by interior to outside interval arrangement, through be provided with a plurality of recess 21 on the chassis 2 to and set up the bead 11 of same quantity on the apron 1, improve through the cooperation of recess 21 and bead 11 the cooperation area between apron 1 and the chassis 2 can improve connect the convenience between apron 1 and the chassis 2, thereby improve the preparation efficiency of laser instrument. Furthermore, the chassis 2 and the cover plate 1 are both made of metal, so that the installation and use requirements of the laser can be met, and the chassis 2 and the cover plate 1 are conveniently connected and fixed.

Specifically, the laser further includes a plurality of leads 3, one end of any one of the leads 3 is connected to the inside of the chassis 2 and connected to a laser element inside the chassis 2, and the other end of the lead 3 is used for connecting to an external device, that is, the laser is connected to the external device based on the plurality of leads 3.

Specifically, fig. 4 shows a cross-sectional view of a laser structure in an embodiment of the present utility model, a plurality of connection holes are formed on a side wall of the chassis 2, and the plurality of connection holes are in one-to-one correspondence with the plurality of leads 3, that is, the leads 3 can extend outside the chassis 2 through the connection holes.

Specifically, an insulating layer 22 is disposed at any position of the connection hole, the insulating layer 22 is located between the lead 3 and the hole wall of the connection hole, the insulating layer 22 is used for separating the lead 3 from the chassis 2, so that direct contact between the lead 3 and the chassis 2 is avoided, and risk of electric leakage or short circuit between the chassis 2 and the lead 3 is reduced.

Further, the insulating layer 22 may be made of glass, and has good high temperature resistance.

Specifically, fig. 5 shows an enlarged schematic view of the structure a in fig. 4 according to an embodiment of the present utility model, the cover 1 is embedded in the groove 21 of the chassis 2 based on the rib 11, the depth of the groove 21 is h1, the height of the rib 11 is h2, and the constraint relationship between h1 and h2 is: h1-h2 is less than or equal to 0.1 x h1, i.e. the depth of the groove 21 is greater than the height of the rib 11.

Further, the width of the groove 21 is n1, the width of the rib 11 is n2, and the constraint relationship between n1 and n2 is: n1-n2 is less than or equal to 0.1×n1, that is, the width of the groove 21 is greater than the width of the rib 11, and the overall size of the groove 21 is slightly greater than the overall size of the rib 11, so that the convenience in matching between the rib 11 and the groove 21 can be improved, and meanwhile, a gap is formed between the groove 21 and the rib 11, so that solder or other connecting substances can be conveniently filled in the gap, and the connection stability between the cover plate 1 and the chassis 2 is improved.

Specifically, referring to fig. 5, a welding layer 4 is disposed between the groove 21 and the rib 11, and the cover plate 1 and the chassis 2 may be fixed based on welding connection, so as to improve the connection stability between the cover plate 1 and the chassis 2.

Specifically, the groove 21 may be filled with solder, the solder layer 4 may be formed between the groove 21 and the rib 11 based on the solder, the filling height of the solder is h3, and the constraint relationship between h3 and h1 is: h1 is 0.5 h3 h1, i.e. the filling amount of the solder is greater than half the capacity of the groove 21, so as to ensure the welding stability between the convex rib 11 and the groove 21, and achieve good welding effect.

Furthermore, the cover plate 1 and the chassis 2 can be subjected to welding operation based on a pulse welding machine, a working interface of the pulse welding machine is arranged at a position where the front surface of the cover plate 1 is attached to the chassis 2, the cover plate 1 and the chassis 2 are pressed by the pulse welding machine, so that the welding flux in the groove 21 is melted, gaps between the groove 21 and the convex edges 11 are completely filled, and the connection stability between the groove 21 and the convex edges 11 is improved.

Further, the filling amount of the solder is larger than the size of the gap space between the groove 21 and the convex rib 11, and during the welding process, the solder is partially overflowed outside the groove 21 after being melted, so that the welding layer 4 is formed on other matching positions of the base plate 2 and the cover plate 1, the welding effect between the cover plate 1 and the base plate 2 can be further improved, and the welding tightness between the cover plate 1 and the base plate 2 is improved.

Specifically, the soldering lug can be placed in the groove 21, the welding layer 4 is formed between the groove 21 and the rib 11 based on the soldering lug, the soldering lug can be arranged in the groove 21 in a V shape, the contact surface between the soldering lug and the groove 21 and between the soldering lug and the rib 11 can be increased, and the soldering lug is melted and fully contacted with the groove 21 and the rib 11 during welding, so that the welding effect and the welding stability are improved.

Further, a plurality of soldering lugs can be placed in the groove 21, so that when the soldering lugs are melted, the soldering lugs can overflow out of the groove 21, thereby improving the coverage area of the soldering layer 4 and improving the connection stability of the cover plate 1 and the chassis 2.

Furthermore, by adding the solder or the soldering lug in the groove 21, the welding effect of the connecting position of the cover plate 1 and the chassis 2 can be improved, and the requirement of the welding mode on the matching surface of the cover plate 1 and the chassis 2 is low, so that the convenience of welding operation can be effectively improved, and the assembly efficiency of the laser is improved.

Specifically, the cover plate 1 and the chassis 2 may be fixed based on adhesive connection, that is, an adhesive layer may be disposed between the groove 21 and the rib 11, and the adhesive layer is a high-strength adhesive, so that connection stability between the cover plate 1 and the chassis 2 may be ensured.

Further, the filling height of the high-strength adhesive is h4, and the constraint relation between h4 and h1 is: h1 is more than or equal to 0.5 and h4 is less than or equal to h1, namely the filling amount of the high-strength adhesive in the groove 21 is more than half of the capacity of the groove 21, so that the high-strength adhesive can partially overflow out of the groove 21 in the pressing process of the cover plate 1, and therefore the adhesive is filled in other positions of the matching surfaces of the cover plate 1 and the cover plate 2, the connection area of the adhesive layer is increased, and the bonding effect and the connection tightness between the cover plate 1 and the cover plate 2 are further improved.

The embodiment of the utility model provides a laser, which is characterized in that a plurality of grooves 21 and ribs 11 are arranged on the matching surfaces of a cover plate 1 and a chassis 2, the matching area between the cover plate 1 and the chassis 2 is improved through the matching of the grooves 21 and the ribs 11, and welding flux or viscose is added in the grooves 21 for connection, so that the connection stability of the cover plate 1 and the chassis 2 is ensured, the connection convenience of the cover plate 1 and the chassis 2 is improved, the welding tightness of the cover plate and the chassis is improved, the preparation efficiency of the laser is effectively improved, and the air leakage probability of the cover plate and the chassis is reduced.

In addition, the foregoing describes in detail a laser provided by the embodiments of the present utility model, and specific examples should be adopted herein to illustrate the principles and embodiments of the present utility model, and the foregoing examples are only for aiding in understanding the method and core idea of the present utility model; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present utility model, the present description should not be construed as limiting the present utility model in view of the above.

Claims

1. The laser is characterized by comprising a chassis, a lead and a cover plate, wherein more than two grooves are formed in the chassis, and more than two ribs are formed in the cover plate;

the side wall of the chassis is provided with a connecting hole;

the lead is connected into the chassis based on the connecting hole.

2. The laser of claim 1, wherein the fins are of arcuate configuration.

3. The laser of claim 1, wherein the chassis is a metal material and the cover plate is a metal material.

4. The laser of claim 1, wherein an insulating layer is filled between the walls of the connection holes and the leads.

5. The laser of claim 1, wherein the depth of the groove is h1, the height of the rib is h2, and the constraint relationship between h1 and h2 is: h1-h2 is less than or equal to 0.1 h1.

6. The laser of claim 1, wherein the groove has a width n1 and the rib has a width n2, and the constraint relationship between n1 and n2 is: n1-n2 is less than or equal to 0.1 n1.

7. The laser of claim 5, wherein a weld layer is disposed between the groove and the rib or an adhesive layer is disposed between the groove and the rib.

8. The laser of claim 7, wherein a solder is disposed within the recess, the solder forming the solder layer, or a tab is disposed within the recess, the tab forming the solder layer.

9. The laser of claim 8, wherein the fill height of the solder is h3, and the constraint relationship between h3 and h1 is: h1 is more than or equal to 0.5 and h3 is more than or equal to h1.

10. The laser of claim 8, wherein the bonding pads are arranged in a V-shape within the recess.

11. The laser of claim 7, wherein a high strength adhesive is disposed within the recess, the high strength adhesive forming the adhesive layer.

12. The laser of claim 11, wherein the high-strength adhesive has a fill height h4, and the constraint relationship between h4 and h1 is: h1 is more than or equal to 0.5 and h4 is more than or equal to h1.