CN219321312U

CN219321312U - Cleaning flower basket convenient for wafer etching

Info

Publication number: CN219321312U
Application number: CN202223606407.8U
Authority: CN
Inventors: 袁黔云
Original assignee: Guangdong Maijie Micro New Materials Co ltd
Current assignee: Guangdong Maijie Micro New Materials Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-07-07
Anticipated expiration: 2032-12-30

Abstract

The utility model discloses a cleaning basket convenient for etching a wafer, which comprises a cleaning basket, wherein the middle part of the cleaning basket is hollowed out, a plurality of symmetrical wafer placing grooves are formed in the front side and the rear side of the cleaning basket, the wafer placing grooves are distributed from left to right at equal intervals, the wafer placing grooves contain wafers, and the wafers can freely rotate in the wafer placing grooves. According to the utility model, the outer shape size of the cleaning basket can perfectly fit a 2 inch production line, a 1 inch wafer is accommodated by the wafer accommodating groove arranged on the cleaning basket, the existing equipment can be utilized to process a 1 inch line by 2 inch lines, the yellow light of the 1 inch line can be perfectly fit with the 2 inch line to be produced, and the etching station requirement is met, the hollow structure on the cleaning basket enables the wafer to be fully contacted with etching liquid, the reaction rate is increased, the production efficiency is further improved, and the reaction rates of all parts of each wafer tend to be consistent by the plurality of wafer accommodating grooves distributed at equal intervals, so that the purpose of the etching uniformity of the wafer grooves is achieved, the production period is shortened, and the cleaning basket is suitable for batch production.

Description

Cleaning flower basket convenient for wafer etching

Technical Field

The utility model belongs to the technical field of semiconductors, and particularly relates to a cleaning basket facilitating wafer etching.

Background

A wafer is a silicon chip used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. Semiconductor processing gradually progresses to larger-size and finer-grained circuits, but there is still a need for processing a part of wafers with larger and smaller sizes, but the 1 inch production line has been basically eliminated, so that it is necessary to provide a tool compatible with the 1 inch production line from the large-size production line, and in the process of manufacturing semiconductor devices by using wafers, in order to meet the requirements of dividing wafer grains and electrical characteristics of the semiconductor devices, the requirements of people on the etching uniformity of wafer grooves are higher and higher.

In order to make the depth and width of the etched wafer groove meet ideal requirements, in the prior art, a mode of reducing the number of wafers in one etching is generally adopted to increase the contact area between each wafer and etching solution and ensure the uniformity of etching the wafer groove, however, the etching mode often leads to longer production period and lower production efficiency.

Disclosure of Invention

The utility model aims to provide a cleaning flower basket convenient for wafer etching, and aims to solve the problems in the background technology. In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a wash basket of flowers convenient to wafer etching, includes washs the basket of flowers, wash basket of flowers middle part fretwork, both sides limit is equipped with a plurality of symmetrical wafer standing grooves around, the wafer standing groove from left to right equidistance distributes, wafer is contained in the wafer standing groove, the wafer can freely rotate in the wafer standing groove.

Preferably, the top of the wafer placement groove is provided with a V-shaped opening, and the V-shaped opening facilitates the wafer to slide into the wafer placement groove.

Preferably, the front part of the V-shaped opening is provided with a guiding inclined plane.

Preferably, a hollow groove is formed in the middle of the wafer placing groove.

Preferably, the lower part of the wafer placement groove is inclined inwards to form a clamping surface, and the clamping surface is used for preventing the wafer from falling out from the lower part of the wafer placement groove.

Preferably, a number mark is provided in front of the wafer placement groove, and the number mark is convenient for counting the number of the wafers.

The utility model has the beneficial effects that:

according to the utility model, the outer shape size of the cleaning basket can perfectly fit a 2 inch production line, a 1 inch wafer is accommodated by the wafer accommodating groove arranged on the cleaning basket, the existing equipment can be utilized to process a 1 inch line by 2 inch lines, the yellow light of the 1 inch line can be perfectly fit with the 2 inch line to be produced, and the etching station requirement is met, the hollow structure on the cleaning basket enables the wafer to be fully contacted with etching liquid, the reaction rate is increased, the production efficiency is further improved, and the reaction rates of all parts of each wafer tend to be consistent by the plurality of wafer accommodating grooves distributed at equal intervals, so that the purpose of the etching uniformity of the wafer grooves is achieved, the production period is shortened, and the cleaning basket is suitable for batch production.

Drawings

FIG. 1 is a schematic diagram of a cleaning basket for facilitating wafer etching according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a cleaning basket according to an embodiment of the present utility model;

fig. 3 is a schematic cross-sectional view of a cleaning basket according to an embodiment of the present utility model.

Wherein, each reference sign in the figure:

1-cleaning basket, 11-wafer placing groove, 111-guiding inclined plane, 112-clamping surface, 12-hollowed-out groove, 13-number mark and 2-wafer.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiments, and the terms "upper," "lower," "left," "right," "front," "back," and the like are used herein with reference to the positional relationship of the drawings.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The technical scheme of the patent is further described in detail below with reference to the specific embodiments.

As shown in fig. 1 to 3, the embodiment of the utility model provides a cleaning basket convenient for etching a wafer, which comprises a cleaning basket 1, wherein the cleaning basket 1 is made of teflon, is acid-alkali resistant and not easy to be corroded by etching solution, the middle part of the cleaning basket 1 is hollowed out, a plurality of symmetrical wafer placing grooves 11 are arranged on the front side and the rear side, the wafer placing grooves 11 are distributed from left to right at equal intervals, the wafer 2 is accommodated in the wafer placing grooves 11, and the wafer 2 can freely rotate in the wafer placing grooves 11.

In this embodiment, the top of the wafer placement groove 11 is a V-shaped opening, the V-shaped opening facilitates the wafer to smoothly enter the wafer placement groove 11, the front portion of the V-shaped opening is provided with a guiding inclined plane 111, the middle portion of the wafer placement groove 11 is provided with a hollowed-out groove 12, the lower portion of the wafer placement groove 11 is inclined inwards to form a clamping surface 112, the clamping surface 112 is used for preventing the wafer from falling out from the lower portion of the wafer placement groove 11, the front portion of the wafer placement groove 11 is provided with a digital label 13, and the digital label 13 is convenient for counting the number of wafers.

According to the utility model, through the cleaning basket 1, the external dimension of the cleaning basket can perfectly fit a 2 inch production line, a 1 inch wafer is accommodated by the wafer accommodating groove 11 arranged on the cleaning basket, the existing equipment 2 inch line can be utilized to process the 1 inch line, the yellow light of the 1 inch line can be perfectly fit with the 2 inch line to be produced, and the etching station requirement is met, the hollow structure on the cleaning basket 1 enables the wafer to be fully contacted with etching liquid, the reaction rate is increased, the production efficiency is further improved, and the reaction speeds of all parts of each wafer tend to be consistent by the plurality of wafer accommodating grooves 11 which are distributed at equal intervals, so that the purpose of the etching uniformity of the wafer grooves is achieved, the production period is shortened, and the cleaning basket is suitable for batch production.

The above embodiments are only for illustrating the present utility model, not for limiting the present utility model, and various changes and modifications may be made by one of ordinary skill in the relevant art without departing from the spirit and scope of the present utility model, and therefore, all equivalent technical solutions are also within the scope of the present utility model, and the scope of the present utility model is defined by the claims.

Claims

1. The utility model provides a wash basket of flowers convenient to wafer etching which characterized in that: including wasing the basket of flowers, wash the fretwork of basket of flowers middle part, both sides limit is equipped with a plurality of symmetrical wafer standing grooves around, the wafer standing groove from left to right equidistance distributes, wafer is contained to the wafer standing groove, the wafer can freely rotate in the wafer standing groove.

2. A cleaning basket for facilitating wafer etching as defined in claim 1, wherein: the top of the wafer placing groove is provided with a V-shaped opening, and the V-shaped opening facilitates the wafer to slide into the wafer placing groove.

3. A cleaning basket for facilitating wafer etching as defined in claim 2, wherein: the front part of the V-shaped opening is provided with a guide inclined plane.

4. A cleaning basket for facilitating wafer etching as defined in claim 2, wherein: the middle part of the wafer placing groove is provided with a hollow groove.

5. A cleaning basket for facilitating wafer etching as defined in claim 4, wherein: the lower part of the wafer placing groove is inclined inwards to form a clamping surface, and the clamping surface is used for preventing the wafer from falling out of the lower part of the wafer placing groove.