CN211529947U

CN211529947U - LED screen and display device

Info

Publication number: CN211529947U
Application number: CN201921659786.2U
Authority: CN
Inventors: 刘国旭; 申崇渝
Original assignee: Beijing Yimei New Technology Co ltd
Current assignee: Beijing Yimei New Technology Co ltd
Priority date: 2019-10-02
Filing date: 2019-10-02
Publication date: 2020-09-18
Anticipated expiration: 2029-10-02

Abstract

The utility model relates to a LED technical field provides a LED screen and display device, wherein, the LED screen includes: a plurality of rows of chips, wherein at least one of the plurality of rows of chips is a simultaneously transferred chip. The utility model discloses a LED screen can greatly improve the efficiency of shifting the chip to possible cost-effective purpose.

Description

LED screen and display device

Technical Field

The utility model relates to a LED technical field, more specifically say, relate to a LED screen and display device.

Background

The characteristics of the micro LED result in a particularly large number of chips, and 6220800 LED chips are on a 1K screen, so the method of transferring LED chips is also called bulk transfer. In the known transfer method of the micro led chip, the transfer is performed through one pixel, and thus, the efficiency of the transfer method is too low, and the cost is increased.

In order to overcome the above-mentioned drawbacks of the prior art, it is necessary to provide a new LED screen and display device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED screen and display device, it can overcome prior art's above-mentioned defect and can realize greatly improving the efficiency of shifting the chip to possible cost-effective purpose.

In order to achieve the above object, the utility model discloses a first aspect provides a LED screen, wherein, include: a plurality of rows of chips, wherein at least one of the plurality of rows of chips is a simultaneously transferred chip.

The LED screen as described above, wherein the pixel pitch of the LED screen is an integer multiple of the crystal pitch of the silicon wafer.

The LED screen as described above, wherein the pixel pitch of the LED screen is 1 times the crystal pitch of the silicon wafer.

The LED screen as described above, wherein the pixel pitch of the LED screen is 2 times the crystal pitch of the silicon wafer.

The LED screen as described above, wherein the pixel pitch of the LED screen is 3 times the crystal pitch of the silicon wafer.

A second aspect of the present invention provides a display device, wherein the display device includes the LED screen as described above.

The LED screen and the display device with the structure can greatly improve the efficiency of transferring the chip and achieve the purpose of saving cost.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an LED screen provided in an embodiment of the present invention;

fig. 2 is a schematic flow chart of a method for setting a chip of an LED screen according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

10-an LED screen;

1-chip;

2-substrate.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1, the present invention provides an LED screen 10, wherein the LED screen 10 includes: a plurality of rows of chips 1, wherein at least one of the plurality of rows of chips 1 is a chip that is transferred at the same time.

The transfer efficiency of the chip 1 can be improved by simultaneously transferring the chips 1 in a row, that is, the transfer efficiency can be greatly improved, and the purpose of cost saving can be achieved.

Specifically, the chips 1 are transferred in batches in an interlaced manner, and the peeled LED chips are placed in the substrate 2 in batches, so that the transfer efficiency can be greatly improved.

Specifically, after the silicon wafers (wafers) are manufactured into chips, the chips are closely arranged, the pixel pitch in a screen is exactly integral multiple of the Wafer crystal pitch, and the chips are removed in an interlaced mode.

In one embodiment, the pixel pitch of the LED screen 10 is 1 times the wafer crystal pitch. For example, assuming that the wafer pitch is 1, the pixel pitch in the screen is 1, and the number of rows taken from the wafer is 1, 3, 5.

In another embodiment, the pixel pitch of the LED screen 10 is 2 times the wafer crystal pitch. For example, assuming that the wafer pitch is 1, the pixel pitch in the screen is 2, and the number of rows taken from the wafer is 1, 4, 7.

In another embodiment, the pixel pitch of the LED screen 10 is 3 times the wafer crystal pitch. For example, assuming that the wafer pitch is 1, the pixel pitch in the screen is 3, and the number of rows taken from the wafer is 1, 5, 9.

The second aspect of the utility model provides a display device, wherein, this display device includes as above the LED screen, this LED screen is the same with the LED screen in above-mentioned specific embodiment, no longer gives unnecessary details here.

Further, the utility model also provides a method for set up the chip of LED screen, wherein, as shown in fig. 2, this method includes: s1: transferring the chips in batch in an interlaced manner; s2: and placing the transferred chip at the pixel point position of the substrate.

Specifically, in step S1), the chips on the silicon wafer are peeled off in an interlaced manner using the laser peeling technique to more accurately and efficiently perform the peeling off of the chips.

Further, in step S2), the peeled chip is sucked up by the stamp to take out the chip, and the taken out chip is placed at the pixel point position of the substrate and baked to fix the chip. In one embodiment, the stamp is provided with protrusions corresponding to the pixel positions of the substrate.

The method will now be described in detail with reference to a specific embodiment to make the method clearer.

The method comprises the following steps:

(1) the wafer was fixed and the chips on the wafer were peeled off using LLO laser lift-off technology.

(2) The chips are sucked up by means of the stamp and are removed one by one in the manner known in the art, wherein this removal is known to the person skilled in the art and is not described in detail again.

(3) And placing the taken chip at the pixel point position of the substrate.

(4) And (4) repeating the steps (1), (2) and (3) until the chip of the LED screen is set.

Furthermore, the stamp is provided with bulges, and the bulges are exactly corresponding to the pixel point positions of the substrate. In the step (3), the LED chip needs to be baked and fixed to complete the stable arrangement of the LED chip.

The LED screen and the display device with the structure and the method can greatly improve the efficiency of transferring the chip and achieve the aim of saving cost.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An LED screen, comprising: the chip transfer method comprises the steps of a plurality of lines of chips, wherein at least one line of the plurality of lines of chips is a chip transferred at the same time, the chips on a silicon wafer are peeled off in an interlaced mode through a laser peeling technology, the peeled chips are sucked up by a seal to be taken out, the taken-out chips are placed at pixel point positions of a substrate and are baked to fix the chips, and therefore the chips are transferred at the same time.

2. The LED screen of claim 1 wherein the pixel pitch of the LED screen is an integer multiple of the crystal pitch of the silicon wafer.

3. The LED screen of claim 2 wherein the pixel pitch of the LED screen is 1 times the crystal pitch of the silicon wafer.

4. The LED screen of claim 2 wherein the pixel pitch of the LED screen is 2 times the crystal pitch of the silicon wafer.

5. The LED screen of claim 2 wherein the pixel pitch of the LED screen is 3 times the crystal pitch of the silicon wafer.

6. A display device, characterized in that it comprises a LED screen according to any one of claims 1 to 5.