CN106526922A - Substrate repair method and device, pressing mechanism, substrate repair equipment - Google Patents
Substrate repair method and device, pressing mechanism, substrate repair equipment Download PDFInfo
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- CN106526922A CN106526922A CN201710005817.1A CN201710005817A CN106526922A CN 106526922 A CN106526922 A CN 106526922A CN 201710005817 A CN201710005817 A CN 201710005817A CN 106526922 A CN106526922 A CN 106526922A
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- 239000000758 substrate Substances 0.000 title claims abstract description 236
- 230000007246 mechanism Effects 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 69
- 230000008439 repair process Effects 0.000 title abstract description 14
- 238000012545 processing Methods 0.000 claims description 20
- 238000012546 transfer Methods 0.000 claims description 20
- 230000009471 action Effects 0.000 claims description 13
- 238000013519 translation Methods 0.000 claims description 13
- 208000010727 head pressing Diseases 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 description 26
- 230000005540 biological transmission Effects 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Prostheses (AREA)
Abstract
The invention discloses a substrate repair method and device, a pressing mechanism and a substrate repairing device, belonging to the field of display manufacture. Wherein the method comprises the following steps: obtaining an image of a substrate surface; determining a foreign matter size and a foreign matter position of the visible foreign matter on the surface of the substrate based on the image of the substrate surface; determining a pressing parameter including a pressure head identification from the pre-acquired pressing strategy according to the parameter of the foreign body size; transmitting a control signal including the foreign matter position and the pressing parameter to the pressing mechanism, in order to make the press mechanism uses the pressure head corresponding to the pressure head identification, and pressing the substrate surface at the location of the foreign matter. The invention can realize a kind of bad maintenance method of foreign matters other than laser repair process, which is helpful to increase the scope of maintenance, reduce the occurrence of other bad situations caused by maintenance, and reduce the maintenance cost.
Description
Technical field
The present invention relates to art of display device manufacture, more particularly to a kind of method for repairing base plate and device, pressing mechanism, substrate
Prosthetic appliance.
Background technology
In TFT (Thin Film Transistor, thin film transistor (TFT)) LCD (Liquid Crystal Display, liquid crystal
Display) manufacturing process in, the yield and performance of product are directly connected to the bad process keeped in repair, therefore to bad
The process keeped in repair is standing concerned emphasis in whole technological process.At present, with the continuous release of production capacity, especially
Advanced lines line large scale shows the continuous improvement of product yield, and the impact caused by solid foreign materials badness is increasing, therefore
Maintenance to the badness has huge meaning for display manufacturing industry.
At present, the common method for repairing foreign body badness is that laser is fried penetrates.But existing laser maintaining technique and equipment
With following defect:
First, maintenance range is little:Size foreign body within the specific limits can only be removed, and it is off-limits to size
The maintenance time length of foreign body and success rate is low.
2nd, other are easily caused bad:The fried mode of penetrating of laser mainly is smashed foreign body to form little chip, and little chip is easy
Around being splashed to, cause a little bad or even line bad.
3rd, high cost:Maintenance process is higher to laser instrument requirement, and cannot reuse after service life expires, only
Laser instrument can more be renewed, be unfavorable for the saving of cost.
Therefore, a kind of the new of maintenance of foreign body badness is explored on the basis of existing laser maintaining technique and equipment
Equipment and new technology are very important.
The content of the invention
For defect of the prior art, the present invention provides a kind of method for repairing base plate and device, pressing mechanism, substrate are repaiied
Multiple equipment, can provide the foreign body badness maintenance mode beyond a kind of laser maintaining technique.
In a first aspect, the present invention provides a kind of method for repairing base plate, including:
Obtain the image of substrate surface;
Foreign matter size and the foreign body position of the visible foreign matters on the substrate surface are determined according to the image of the substrate surface
Put;
The pressing for including pressure head mark is determined according to the parameter including the foreign matter size by the pressing strategy for obtaining in advance
Parameter;
Sending to pressing mechanism includes the control signal of the foreign body position and the pressing parameter, so that the pressing machine
Structure using with the pressure head corresponding pressure head of mark, the pressing substrate surface at the foreign body position.
In a kind of possible implementation, the substrate surface includes at least two repeat regions, and any two repeats
The pixel cell of region correspondence equal number;The image for obtaining substrate surface, including:
Obtain image of the substrate surface at least two repeat region;
Accordingly, the image according to the substrate surface determines the foreign body chi of the visible foreign matters on the substrate surface
Very little and foreign body position, including:
By difference of the comparison substrate surface between the image at least two repeat regions, it is determined that comprising visible
The target image of foreign body;
The foreign matter size of visible foreign matters is determined in the target image;
According to the target image relative to the substrate position, and visible foreign matters are relative to the target image
Position, determines the foreign body position of visible foreign matters.
Second aspect, the present invention also provide a kind of substrate prosthetic device, including:
Acquisition module, for obtaining the image of substrate surface;
First determining module, for the visible foreign matters on the substrate surface are determined according to the image of the substrate surface
Foreign matter size and foreign body position;
Second determining module, for determining bag by the pressing strategy for obtaining in advance according to the parameter for including the foreign matter size
Include the pressing parameter of pressure head mark;
Sending module, for the control signal for including the foreign body position and the pressing parameter is sent to pressing mechanism,
So that the pressing mechanism using with the pressure head corresponding pressure head of mark, the pressing substrate table at the foreign body position
Face.
The third aspect, the present invention also provide a kind of method for repairing base plate, are applied to pressing mechanism, and the pressing mechanism includes
For placing the platform of substrate, the pressing head seat of electric magnet is configured with, the moving parts of the pressing head seat movement can be driven, and
At least two magnetic pressure heads can be separately fixed at the support member of respective setting position;The method for repairing base plate bag
Include:
Control signal is received, the control signal includes foreign body position and pressing parameter, and the pressing parameter includes pressure head
Mark;
The pressing head seat is controlled by the moving parts it is moved to set with the pressure head corresponding magnetic pressure head of mark
Positioning puts place;
To the electric magnet applied voltage, so that magnetic pressure head is attracted on the pressing head seat;
It is moved to above the platform by the moving parts control pressing head seat corresponding with the foreign body position
At position;
The pressing head seat is controlled along translating perpendicular to the direction of the platform by the moving parts, to complete the magnetic
Property pressure head pressing place the action of substrate on the platform;
The setting position that the pressing head seat is moved to the magnetic pressure head is controlled by the moving parts;
Stop to the electric magnet applied voltage, so that the magnetic pressure head is fixed on setting by the support member again
At position.
In a kind of possible implementation, the pressing mechanism also includes shooting part, and the moving parts can also
Drive the shooting part movement;
Accordingly, the reception control signal, the control signal include foreign body position and pressing parameter, the pressing ginseng
Before number includes pressure head mark, also include:
After substrate is placed on the platform, by the moving parts control shooting part above platform
Translation, to gather the image of the substrate surface;
The image of the substrate surface is sent to into processing mechanism, so that the processing mechanism:
Obtain the image of the substrate surface;
Foreign matter size and the foreign body position of the visible foreign matters on the substrate surface are determined according to the image of the substrate surface
Put;
The pressing for including pressure head mark is determined according to the parameter including the foreign matter size by the pressing strategy for obtaining in advance
Parameter;
Return includes the control signal of the foreign body position and the pressing parameter.
Fourth aspect, the present invention also provide a kind of substrate prosthetic device, are applied to pressing mechanism, and the pressing mechanism includes
For placing the platform of substrate, the pressing head seat of electric magnet is configured with, the moving parts of the pressing head seat movement can be driven, and
At least two magnetic pressure heads can be separately fixed at the support member of respective setting position;The substrate prosthetic device bag
Include:
Receiver module, for receiving control signal, the control signal includes foreign body position and pressing parameter, the pressing
Parameter includes that pressure head is identified;
First control module is right with pressure head mark for being moved to by the moving parts control pressing head seat
The setting position of the magnetic pressure head answered;
Voltage applies module, for the setting of magnetic pressure head corresponding with pressure head mark is moved in the pressing head seat
After at position, to the electric magnet applied voltage, so that magnetic pressure head is attracted on the pressing head seat;
Second control module, after being attracted on the pressing head seat in magnetic pressure head, by the moving parts
Control the pressing head seat to be moved to above the platform at position corresponding with the foreign body position;
3rd control module, for being moved to above the platform at position corresponding with the foreign body position in pressing head seat
Afterwards, the pressing head seat is controlled along translating perpendicular to the direction of the platform by the moving parts, to complete magnetic pressure head
The action of substrate on the platform is placed in pressing;
4th control module, for after the push action for completing the magnetic pressure head, by the moving parts control
Make the setting position that the pressing head seat is moved to the magnetic pressure head;
The voltage applies module and is additionally operable in the push action for completing the magnetic pressure head, and the pressing head seat is moved to institute
After stating the setting position of magnetic pressure head, stop to the electric magnet applied voltage, so that the magnetic pressure head is again by institute
State support member and be fixed on setting position.
In terms of 5th, the present invention also provides a kind of pressing mechanism, including platform, moving parts, pressing head seat and support member;
Wherein,
The platform is used to place substrate;
Electric magnet is configured with the pressing head seat;
At least two magnetic pressure heads can be separately fixed at respective setting position by the support member;
The moving parts can be under the control of the signal of telecommunication:
The plane translation of the specified altitude assignment for making the pressing head seat square on the platform;
The pressing head seat is made along the direction translation perpendicular to the platform;And,
The pressing head seat is made to be moved to the setting position of each magnetic pressure head and return.
In terms of 6th, the present invention also provides a kind of substrate prosthetic appliance, including at least one above-mentioned pressing of any one
Mechanism.
In a kind of possible implementation, at least one pressing mechanism as claimed in claim 7 includes the first pressing
Mechanism and the second pressing mechanism, the substrate prosthetic appliance also include that the first guide rail, the second guide rail, caching platform, substrate pick and place dress
Put and transfer device;Wherein,
The moving parts of first pressing mechanism, pressing head seat and support member are arranged at the first station;Described first
The platform of pressing mechanism is arranged on first guide rail, and the platform of first pressing mechanism can be along first guide rail
Move between first station and the second station;
The moving parts of second pressing mechanism, pressing head seat and support member are arranged at 3rd station;Described second
The platform of pressing mechanism is arranged on second guide rail, and the platform of second pressing mechanism can be along second guide rail
Move between the 3rd station and the 4th station;
The caching platform is arranged at the 5th station, and the substrate fetching device can be taken and place substrate, described turn
Moving device can drive the substrate fetching device between second station and the 5th station, and the 4th station
Move between the 5th station.
In a kind of possible implementation, second station, the 5th station and the 4th station are along first
Direction is arranged in order, and the transfer device includes the outstanding rail extended along the first direction, and can move along the outstanding rail
Linear machine people;The substrate fetching device is arranged on the linear machine people, and the linear machine people can drive institute
State substrate fetching device vertically to translate.
As shown from the above technical solution, the present invention can realize a kind of by pressing foreign body keeping in repair the side of foreign body badness
Formula.For laser maintaining mode, the present invention can will be seen that foreign body is directly pressed in pixel in the way of physical deformation
Portion, the pressure head for being used can be matched with foreign matter size, therefore can have bigger maintenance range;And, foreign body is pressed
Pressure is not easy surrounding is caused to damage, and thus results in other bad probabilities very low;Additionally, the used pressing mechanism of pressing
For plant equipment, cost can be greatlyd save for the laser maintaining mode of the laser instrument for needing to change often.
Description of the drawings
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below will be to making needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, can be obtaining other according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the flow chart of the method for repairing base plate that one embodiment of the invention is provided;
Fig. 2 is the surface texture schematic diagram of the substrate that one embodiment of the invention is provided;
Fig. 3 is the structural representation of the pressing mechanism that one embodiment of the invention is provided;
Fig. 4 is the flow chart of the method for repairing base plate that one embodiment of the invention is provided;
Fig. 5 to Fig. 7 is intermediateness of the pressing mechanism of one embodiment of the invention offer in substrate repair process
Schematic diagram;
Fig. 8 is the structural representation of moving parts in the pressing mechanism that one embodiment of the invention is provided;
Fig. 9 is the set-up mode schematic diagram of repeat region on the substrate of one embodiment of the invention offer;
Figure 10 is the structured flowchart of the substrate prosthetic device that one embodiment of the invention is provided;
Figure 11 is the structured flowchart of the substrate prosthetic device that one embodiment of the invention is provided;
Figure 12 is the overlooking structure figure of the substrate prosthetic appliance that one embodiment of the invention is provided.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
Fig. 1 is the flow chart of the method for repairing base plate that one embodiment of the invention is provided.Referring to Fig. 1, the base of the present embodiment
Plate restorative procedure includes:
Step 101:Obtain the image of substrate surface.
Step 102:The foreign matter size of the visible foreign matters on the substrate surface is determined according to the image of the substrate surface
With foreign body position.
Step 103:Determined including pressure head mark by the pressing strategy for obtaining in advance according to the parameter including the foreign matter size
The pressing parameter of knowledge.
Step 104:Sending to pressing mechanism includes the control signal of the foreign body position and the pressing parameter, so that institute
State pressing mechanism using with the pressure head corresponding pressure head of mark, the pressing substrate surface at the foreign body position.
It should be noted that the method for repairing base plate of the present embodiment can apply to any one comprising processing component and deposit
The electronic equipment of storage part, process assembly therein can include application specific integrated circuit (ASIC), digital signal processor
(DSP), digital signal processing appts (DSPD), PLD (PLD), field programmable gate array (FPGA), central authorities
At least one in processor (CPU), controller, microcontroller and microprocessor;Storage assembly therein can include read-only
At least one in memorizer (ROM), random access memory (RAM), tape, floppy disk, hard disk and optical data storage devices.
In a kind of possible implementation, be stored with storage assembly instruction corresponding with the method for repairing base plate of the present embodiment, above-mentioned
Instruction can be performed by the processing component of electronic equipment, to complete aforesaid substrate restorative procedure.
Also, it should be noted that substrate as herein described is referred to for forming the tabular material of any one display pattern
Material, such as array base palte (Array Substrate), color membrane substrates, contact panel (Touch Panel), liquid crystal panel, display
Panel etc..It is additionally, since bad any one link being likely to occur in during substrate manufacture, therefore the present embodiment
Method for repairing base plate substrate to be repaired is may be under any one intermediateness in manufacturing process.Referring to Fig. 2, one
Plant in possible implementation, substrate 21 is provided with the pixel cell Px of several array arrangements, and in each pixel cell Px
Substrate surface on can make the structure of such as metal material figure, insulation artwork, semi-conducting material figure etc..
During actual fabrication, visible foreign matters are there may be on the surface of substrate 21 and (refers mainly to observe under an optical microscope
The foreign body for arriving), and it is likely to cause foreign body badness.
Also, it should be noted that the mode that the image of substrate surface is obtained in the present embodiment is may, for example, be under microsize
Optical imagery, such as obtain digital lattice by way of the microimaging head for being furnished with imageing sensor is scanned on the surface of the substrate
Substrate surface image under formula.In the range of the method for the present embodiment can be implemented, the mode of the image of substrate surface is obtained
Non-visible light micro-imaging, PSTM imaging etc. are can also be, the present invention is not specifically limited to this.By base
The image procossing of the image of plate surface, it may be determined that visible foreign matters size in the picture and position, in the ratio through image
After conversion and the conversion of substrate position coordinate, it may be determined that the foreign matter size of visible foreign matters and foreign body position.
Also, it should be noted that the method for the present embodiment can by pressing mechanism send include the foreign body position with
It is described pressing parameter control signal so that pressing mechanism using with the pressure head corresponding pressure head of mark, in the foreign body position
Put place's pressing substrate surface.That is, the method for the present embodiment changes pressing mechanism pressing substrate by adjusting pressing parameter
The concrete mode on surface.Wherein, press parameter except pressure head mark in addition to, for example can also include press pressure, press angle,
Compressing time, according to pressing depth at least one.Based on this, the tactful figure by substrate surface of pressing being pre-configured with can be passed through
The information extracted as in (includes foreign matter size and foreign body position, can also include such as foreign body shape, foreign body transparency etc.
Information) determine pressing parameter.For example, 2mm, 5mm and 10mm are respectively for pressure head diameter, pressure head mark is respectively " #1 " " #2 "
Three pressure heads of " #3 ", pressing strategy can include:" #1 " is exported when foreign matter size is less than 2mm, is more than in foreign matter size
" #2 " is exported equal to 2mm and less than during 5mm, " #3 " is exported when foreign matter size is more than or equal to 5mm.Certainly, people in the art
Member according to the scope of selected pressing parameter, and can be carried in the image of substrate surface in scope in the cards
The scope of the information for taking, obtains the pressing plan of multi-form and content for example, by the mode of measuring or machine learning
Slightly, the present invention is without limitation.
Also, it should be noted that the pressing mechanism in the present embodiment can be used and pressure after control signal is received
Leader knows corresponding pressure head, and substrate surface, therefore the pressing mechanism of the present embodiment and the present embodiment institute are pressed at foreign body position
Using electronic equipment between should be pre-established with signal annexation, such as electronic equipment can have control signal output
Mouthful, the control signal output mouth can be connected with the control signal input mouth of pressing mechanism by holding wire, to realize control
Transmission of the signal between electronic equipment and pressing mechanism and reception;For another example, the signal processing of pressing mechanism is integrated in electricity
Among sub- equipment, the data of control signal are transmitted between the disparate modules of electronic equipment internal, as control signal in electronics
Transmission between equipment and pressing mechanism and a kind of possible implementation for receiving.
It can be seen that the embodiment of the present invention can realize it is a kind of by pressing foreign body keeping in repair the side of foreign body badness
Formula.For laser maintaining mode, the embodiment of the present invention can will be seen that foreign body directly will be different in the way of physical deformation
Inside thing press-in pixel, the pressure head for being used can be matched with foreign matter size, therefore can have bigger maintenance range;And
And, the pressing to foreign body is not easy surrounding is caused to damage, and thus results in other bad probabilities very low;Additionally, pressing institute
The pressing mechanism for using is plant equipment, can be significantly for the laser maintaining mode of the laser instrument for needing to change often
It is cost-effective.
Fig. 3 is the structural representation of the pressing mechanism that one embodiment of the invention is provided.Referring to Fig. 3, the present embodiment is pressed
Press mechanism includes platform 31, moving parts 32, pressing head seat 33 and support member 34.Wherein, the platform 31 is used to place substrate,
Electric magnet 331 is configured with the pressing head seat 33, at least two magnetic pressure head Ph can be fixed by the support member 34 respectively
In respective setting position.Additionally, the moving parts 32 can be under the control of the signal of telecommunication:The pressing head seat 33 is made in institute
The plane translation for stating the specified altitude assignment above platform 31 (such as along the left and right direction of arrow translation shown in Fig. 3, and does not exist
The edge illustrated in Fig. 3 is translated perpendicular to the direction of paper), the pressing head seat 33 is put down along the direction perpendicular to the platform 31
Move;And, the pressing head seat 33 is moved to the setting position of each magnetic pressure head Ph and is returned.
Based on the pressing mechanism shown in Fig. 3, Fig. 4 is the flow process of the method for repairing base plate that one embodiment of the invention is provided
Figure.As shown in figure 4, the method for repairing base plate includes:
Step 401:Control signal is received, control signal includes foreign body position and pressing parameter, and pressing parameter includes pressure head
Mark.
Step 402:The setting position that pressing head seat is moved to magnetic pressure head corresponding with pressure head mark is controlled by moving parts
Put place.
Step 403:To electric magnet applied voltage, so that magnetic pressure head is attracted on pressing head seat.
Step 404:Pressing head seat is controlled by moving parts to be moved to above platform at position corresponding with foreign body position.
Step 405:By moving parts control pressing head seat along perpendicular to platform direction translate, with complete magnetic pressure head by
Pressure is placed on the action of the substrate on platform.
Step 406:The setting position that pressing head seat is moved to magnetic pressure head is controlled by moving parts.
Step 407:Stop to electric magnet applied voltage so that magnetic pressure head supported member is fixed on setting position again
Place.
It should be noted that the method for repairing base plate can apply to set with the signal processing that pressing mechanism is used cooperatively
Standby, the signal handling equipment mainly includes processing component and memory unit, and process assembly therein can include application specific collection
Into circuit (ASIC), digital signal processor (DSP), digital signal processing appts (DSPD), PLD (PLD),
At least one in field programmable gate array (FPGA), central processing unit (CPU), controller, microcontroller and microprocessor;
Storage assembly therein can include read only memory (ROM), random access memory (RAM), tape, floppy disk, hard disk and light
At least one in data storage device.In a kind of possible implementation, it is stored with storage assembly and the present embodiment
The corresponding instruction of method for repairing base plate, above-mentioned instruction can be performed by the processing component of signal handling equipment, to realize aforesaid substrate
Restorative procedure.In alternatively possible implementation, above-mentioned instruction is stored in corresponding with the method for repairing base plate shown in Fig. 1
In the middle of the storage assembly of electronic equipment, so that the processing component of the electronic equipment performs above-mentioned instruction, to realize the present embodiment
Method for repairing base plate.
As can be seen that the pressing mechanism of the present embodiment can co-operatively in the control of control signal with method for repairing base plate
System it is lower using with the pressure head corresponding pressure head of mark at the foreign body position pressing substrate surface, such that it is able to the substrate shown in Fig. 1
The reparation of the flow process of restorative procedure co-operatively completing substrate.It can be seen that, the embodiment of the present invention can be realized a kind of by pressing
Foreign body is keeping in repair the mode of foreign body badness.For laser maintaining mode, the embodiment of the present invention can will be seen that foreign body
Directly foreign body is pressed into inside pixel in the way of physical deformation, the pressure head for being used can be matched with foreign matter size, therefore can
With with bigger maintenance range;And, the pressing to foreign body is not easy surrounding is caused to damage, and thus results in other bad
Probability is very low;Additionally, the used pressing mechanism of pressing is plant equipment, swashing compared to the laser instrument for needing to change often
Cost can be greatlyd save for light maintenance mode.And, the present embodiment can make pressing mechanism automatically complete under control signal
Absorption, the positioning of foreign body position into pressure head, pressed using pressure head, and pressure head such as puts back at the process, so as to be advantageously implemented
The pressing maintenance process of extensive automatization.
By taking the pressing mechanism shown in Fig. 3 as an example, each step shown in Fig. 4 can specifically include procedure below:
In step 401, signal handling equipment receives the control signal from electronic equipment, and the control signal includes foreign body position
Parameter is put and press, i.e., start pressing reparation to be carried out to substrate to be repaired for indicating pressing mechanism, the pressing position on substrate
Put and determined by the foreign body position in control signal, the every design parameter for pressing process is true by the pressing parameter in control signal
It is fixed.
In step 402, signal handling equipment determines pressure head to be drawn according to the pressure head mark that parameter is pressed in control signal
Setting position, so as to pass through the first output port by connecting line to moving parts 32 output first move control signal.Such as
Shown in Fig. 5, under the triggering of the first movement control signal, moving parts 32 can be first passed through and move to support in parallel direction
The top of part 34, makes aliging for pressing head seat 33 and the setting position of pressure head to be drawn, then by the translation on vertical direction
Pressing head seat 33 is declined, and the electric magnet 331 configured on pressing head seat 33 is made near pressure head to be drawn.
In step 403, signal handling equipment is receiving the corresponding with the first movement control signal of the transmission of moving parts 32
First complete signal after, by the second output port by connecting line to the electric magnet 331 being configured on pressing head seat 33
Input applied voltage, so that electric magnet 331 produces magnetic force, attracts pressure head to be drawn, complete magnetic pressure head and pressing head seat 33 it
Between cooperating under magneticaction.Hereafter, signal handling equipment yet by the second output port to being configured in pressing head seat 33
On the input of electric magnet 331 apply a certain size voltage, to keep the cooperation between magnetic pressure head and pressing head seat 33.
In step 404, signal handling equipment determines foreign body institute to be pressed on platform according to the foreign body position in control signal
The position at place, moves control signal to the output of moving parts 32 second by connecting line so as to pass through the first output port.Such as Fig. 6
Shown, under the triggering of the second movement control signal, moving parts 32 first drives the pressing head seat 33 and magnetic pressure head for cooperating
Certain altitude is risen to, the top of the substrate of the specified location for being placed on platform 31 is then moved in the horizontal direction, is made
The pressing head seat 33 and magnetic pressure head for cooperating is alignd with foreign body location to be pressed.
In step 405, receive moving parts 32 transmission with second movement control signal corresponding second complete letter
Number afterwards, signal handling equipment generates the 3rd according to the pressing parameter in addition to identifying except pressure head and moves control signal, so as to pass through
First output port moves control signal to the output of moving parts 32 the 3rd by connecting line.In touching for the 3rd movement control signal
Give, moving parts 32 drives pressing head seat 33 to rise after falling before perpendicular to the direction of platform, with according to pressing parameter indication
The parameters such as fixed press pressure, compressing time complete the action for pressing substrate.
In step 406, receive moving parts 32 transmission with the 3rd movement control signal the corresponding 3rd complete letter
Number afterwards, signal handling equipment by the first output port by connecting line to the 4th movement control letter of the output of moving parts 32
Number.As shown in figure 5, under the triggering of the 4th movement control signal, moving parts 32 can first pass through the translation in parallel direction
To the top of support member 34, make pressing head seat 33 and align with the setting position of the magnetic pressure head for coordinating, then by vertical
Pressing head seat 33 is declined by the translation on direction, magnetic pressure head is hovered over above its setting position.
Step 407:Receive moving parts 32 transmission with the 4th movement control signal the corresponding 4th complete signal
Afterwards, signal handling equipment stops by the second output port by connecting line to the electric magnet 331 being configured on pressing head seat 33
Input applied voltage so that electric magnet 331 produce magnetic force disappear, magnetic force attract under magnetic pressure head fall, lay equal stress on
New supported member 34 is fixed on its setting position.
In above process it is understood that on platform 31 place substrate process can before step 404 or
Complete before person's step 405, and substrate can be directly anchored to the exactly determined specified location of platform 31 and no longer enter
Row para-position, it is also possible to be placed in the range of the specified location of platform 31 and completed between magnetic pressure head and substrate by pressing mechanism again
Para-position, the present invention are without limitation.Furthermore, it is possible to any time after the pressing process of step 406 is completed is by substrate
Remove from platform 31, without magnetic pressure head put back to its setting position when moving parts 32, the present invention to this not
It is limited.
In a kind of possible implementation, the diameter of the magnetic pressure head used by above-mentioned pressing mechanism can be in 2~7mm
Between or 1~15mm between, the formation material of magnetic pressure head can include such as ferrum, tungsten, rustless steel, polyether-ether-ketone (PEEK)
Etc., those skilled in the art can be chosen in the range of it may implement according to application demand, and the present invention is not done to this
Limit.The difference of the aspects such as quantity corresponding, according to selected magnetic pressure head, specification, can arrange the support for matching
Each magnetic pressure head is fixed on respective setting position by part.
In a kind of possible implementation, the moving parts in above-mentioned pressing mechanism is as shown in Figure 8.As shown in figure 8, moving
Dynamic component includes the suspension base station 32a that can be translated in the horizontal direction, the cross sliding clock 32b being arranged on suspension base station 32a, with
And the lowering or hoisting gear 32c being arranged on cross sliding clock 32b.Wherein, suspension base station 32a is provided be vertically arranged many on side
Bar slide rail, every slide rail are horizontally extending.It is a plurality of on " ┐ " the type base plate of cross sliding clock 32b and suspension base station 32a
Slide rail is slidably engaged.So as to, suspension base station 32a translation in the horizontal direction and cross sliding clock 32b are along the water of a plurality of slide rail
Smooth moving can drive the object being fixed on the lift side of lowering or hoisting gear 32c to put down in the plane of the specified altitude assignment above platform
Move.Additionally, lowering or hoisting gear 32c can be vertically moving by lift side under the control of the signal of telecommunication, thus can drive solid
The object on the lift side of lowering or hoisting gear 32c is scheduled on along the direction translation perpendicular to platform.Based on horizontal direction translate with it is vertical
The combination of direction translation, moving parts as shown in Figure 8 can drive the object being fixed on the lift side of lowering or hoisting gear 32c to exist
Move in parallel in three dimensions, such that it is able to realizing the absorption of magnetic pressure head is realized when pressing head seat is fixed on lift side and putting
Return.
In a kind of possible implementation, above-mentioned pressing mechanism can also including the shooting part not shown in Fig. 3, should
Shooting part can be arranged on together with pressing head seat 33 on moving parts 32 so that moving parts 32 can drive shooting part to move
It is dynamic, to realize the image of above-mentioned acquisition substrate surface and/or above-mentioned the process of para-position will be carried out between magnetic pressure head and substrate.Example
Such as, above-mentioned steps 401:Control signal is received, control signal includes foreign body position and pressing parameter, and pressing parameter includes pressure head mark
Before knowledge, can also include not shown in figures:
Step 400a:After substrate is placed on the platform, the shooting part is controlled by the moving parts
Translate above platform, to gather the image of the substrate surface.
Step 400b:The image of the substrate surface is sent to into processing mechanism, so that the processing mechanism:Obtain described
The image of substrate surface, according to the image of the substrate surface determine the visible foreign matters on the substrate surface foreign matter size and
Foreign body position, is determined the pressing for including pressure head mark according to the parameter including the foreign matter size by the pressing strategy for obtaining in advance
Parameter, and return the control signal for including the foreign body position and the pressing parameter.
Wherein, the processing mechanism can include the electronic equipment using method for repairing base plate as shown in Figure 1, the base
The image of plate surface specifically can be sent into the electronic equipment.Based on this, can will be seen that the optical detection process of foreign body sets
Put in pressing mechanism, the station for carrying out optical detection is used alone to such that it is able to save, contribute to reducing equipment volume, lifted
Maintenance efficiency.
Additionally, the value volume and range of product of shooting part can be more than one, for example can be by the photographic head reality of different size
Existing multiple settings shooting part on the moving part, improves position such that it is able to the collaborative work by multiple shooting parts and obtains
The accuracy for taking, or corresponding function can be realized using other shooting parts when a shooting part can not be used.
In a kind of possible implementation, the image comparison that can pass through between repeat region quickly positions visible foreign matters
Position, such that it is able to simplify search visible foreign matters image processing process.Specifically, for example set on the substrate 21 shown in Fig. 2
There is several pixel cells Px, and the structure of normal conditions lower substrate surface is repeated between each pixel cell Px, or
Repeat between the region being made up of multiple pixel cell Px.Thus, it is possible to arrange at least two duplicate blocks on the surface of the substrate
Domain, makes the pixel cell Px of any two repeat region correspondence equal number.So as to above-mentioned steps 101:Obtain substrate surface
Image, can specifically include:Obtain image of the substrate surface at least two repeat region.Corresponding, on
State step 102:The foreign matter size and foreign body of the visible foreign matters on the substrate surface are determined according to the image of the substrate surface
Position, can specifically include not shown in figures:
Step 1021:By comparing difference of the substrate surface between the image at least two repeat regions, really
Surely include the target image of visible foreign matters.
Step 1022:The foreign matter size of visible foreign matters is determined in the target image.
Step 1023:According to the target image relative to the substrate position, and visible foreign matters are relative to described
The position of target image, determines the foreign body position of visible foreign matters.
As shown in figure 9, the localized positions of substrate be provided with six an equal amount of repeat region A1, A2, A3, A4, A5 and
A6 (such as each repeat region is made up of the pixel cell that 5 rows 5 are arranged), the in the ideal case surface in this six repeat regions
Structure should be on all four.Based on this point, the image of the substrate surface in this six repeat regions can be gathered respectively,
And the image for collecting is compared two-by-two, the 5th duplicate block caning be found that from comparative result in this six repeat regions
There is between the image of the image of domain A5 and other five repeat regions obvious difference.It is thus possible to the 5th duplicate block
The image of domain A5 is further processed, and there are visible foreign matters in determining image, by the foreign body of image measurement visible foreign matters
Size, and will be seen that position of the foreign body in the position of repeat region A5 with repeat region A5 on substrate combines, obtain
To visible foreign matters relative to substrate foreign body position.
Figure 10 is the structured flowchart of the substrate prosthetic device that one embodiment of the invention is provided.Referring to Figure 10, the present embodiment
Substrate prosthetic device include:
Acquisition module 51, for obtaining the image of substrate surface;
First determining module 52, for the visible foreign matters on the substrate surface are determined according to the image of the substrate surface
Foreign matter size and foreign body position;
Second determining module 53, for being determined by the pressing strategy for obtaining in advance according to the parameter for including the foreign matter size
Including the pressing parameter of pressure head mark;
Sending module 54, for the control letter for including the foreign body position and the pressing parameter is sent to pressing mechanism
Number so that the pressing mechanism using with the pressure head corresponding pressure head of mark, the pressing substrate at the foreign body position
Surface.
In a kind of possible implementation, the substrate surface includes at least two repeat regions, and any two repeats
The pixel cell of region correspondence equal number;The acquisition module 51 is further used for:
Obtain image of the substrate surface at least two repeat region;
Accordingly, first determining module 52 includes:
First determining unit, for by the comparison substrate surface between the image at least two repeat regions
Difference, it is determined that the target image comprising visible foreign matters;
Second determining unit, for the foreign matter size for determining visible foreign matters in the target image;
3rd determining unit, according to the target image relative to the substrate position, and visible foreign matters relative to
The position of the target image, determines the foreign body position of visible foreign matters.
With regard to the device in above-described embodiment, wherein modules perform the concrete mode of operation in relevant the method
Embodiment in be described in detail, explanation will be not set forth in detail herein.
Figure 11 is the structured flowchart of the substrate prosthetic device that one embodiment of the invention is provided.Referring to Figure 11, the present embodiment
Substrate prosthetic device be applied to pressing mechanism, the pressing mechanism is included for placing the platform of substrate, is configured with electric magnet
Pressing head seat, the moving parts of pressing head seat movement can be driven, and at least two magnetic pressure heads can be fixed respectively
In the support member of respective setting position.Based on this, the substrate prosthetic device includes:
Receiver module 61, for receiving control signal, the control signal includes foreign body position and pressing parameter, described to press
Pressure parameter includes that pressure head is identified;
First control module 62, is moved to and pressure head mark for controlling the pressing head seat by the moving parts
The setting position of corresponding magnetic pressure head;
Voltage applies module 63, sets with the pressure head corresponding magnetic pressure head of mark for being moved in the pressing head seat
After positioning puts place, to the electric magnet applied voltage, so that magnetic pressure head is attracted on the pressing head seat;
Second control module 64, after being attracted on the pressing head seat in magnetic pressure head, by the move portion
Part controls the pressing head seat and is moved to above the platform at position corresponding with the foreign body position;
3rd control module 65, for being moved to above the platform position corresponding with the foreign body position in pressing head seat
After place, the pressing head seat is controlled along translating perpendicular to the direction of the platform by the moving parts, to complete the magnetic
The push action of property pressure head;
4th control module 66, for after the push action for completing the magnetic pressure head, by the moving parts
Control the setting position that the pressing head seat is moved to the magnetic pressure head;
The voltage applies module 63 and is additionally operable in the push action for completing the magnetic pressure head, and the pressing head seat is moved to
After the setting position of the magnetic pressure head, stop to the electric magnet applied voltage so that the magnetic pressure head again by
The support member is fixed on setting position.
In a kind of possible implementation, the pressing mechanism also includes shooting part, and the moving parts can also
Drive the shooting part movement;
Accordingly, the substrate prosthetic device also includes:
5th control module, it is after placing on the platform in substrate, described by moving parts control
Shooting part is translated above platform, to gather the image of the substrate surface;
Sending module, for the image of substrate surface is sent to processing mechanism, so that the processing mechanism:
Obtain the image of the substrate surface;
Foreign matter size and the foreign body position of the visible foreign matters on the substrate surface are determined according to the image of the substrate surface
Put;
The pressing for including pressure head mark is determined according to the parameter including the foreign matter size by the pressing strategy for obtaining in advance
Parameter;
Return includes the control signal of the foreign body position and the pressing parameter.
With regard to the device in above-described embodiment, wherein modules perform the concrete mode of operation in relevant the method
Embodiment in be described in detail, explanation will be not set forth in detail herein.
Based on same inventive concept, the present embodiment provides a kind of substrate prosthetic appliance, the substrate prosthetic appliance include to
Few one above-mentioned any one pressing mechanism.Used as a kind of possible embodiment, Figure 12 is that one embodiment of the invention is carried
For substrate prosthetic appliance overlooking structure figure.Referring to Figure 12, the substrate prosthetic appliance includes the first pressing mechanism, the second pressing
Mechanism, the first guide rail 73, the second guide rail 74, caching platform 75, substrate fetching device 76 and transfer device 77, wherein:
Moving parts 71b, the pressing head seat 71c of first pressing mechanism and support member are arranged at the first station P1;
The platform 71a of first pressing mechanism is arranged on first guide rail 73, and the platform 71a of first pressing mechanism can
Move between the first station P1 and the second station P2 along first guide rail 73 such that it is able to drive substrate first
Position switching is carried out between station P1 and the second station P2.
Moving parts 72b, the pressing head seat 72c of second pressing mechanism and support member are arranged at 3rd station P3;
The platform 72a of second pressing mechanism is arranged on second guide rail 74, and the platform 72a of second pressing mechanism can
Move between 3rd station P3 and the 4th station P4 along second guide rail 74 such that it is able to drive substrate the 3rd
Position switching is carried out between station P3 and the 4th station P4.
The caching platform 75 is arranged at the 5th station P5, and the substrate fetching device 76 can be taken and place substrate,
The transfer device 77 can drive the substrate fetching device 76 the second station P2 and the 5th station P5 it
Between, and move between the 4th station P4 and the 5th station P5.
Based on this, it is possible to achieve the switching between several work pattern:
The unit platform work pattern of the first pressing mechanism:On the caching platform 75 that substrate to be repaired reaches the 5th station P5
Afterwards, substrate fetching device 76 is taken substrate, under the drive of transfer device 77 reaches the second station P2 from the 5th station P5, from
And substrate is in place on the platform 71a at the second station P2.Platform 71a moves to substrate at the first station P1, the
One pressing mechanism carries out the pressing process of substrate, completes rear platform 71a and substrate is moved to the second station P2 from the first station P1
Place, substrate fetching device 76 take at the second station P2 substrate, so as under the drive of transfer device 77 from the second station P2
The 5th station P5 is reached, is placed a substrate on caching platform 75, is completed the pressing repair of a substrate, wait front substrate
Removed, next substrate repeats said process when reaching the caching platform 75 of the 5th station P5.
The unit platform work pattern of the second pressing mechanism:On the caching platform 75 that substrate to be repaired reaches the 5th station P5
Afterwards, substrate fetching device 76 is taken substrate, under the drive of transfer device 77 reaches the 4th station P4 from the 5th station P5, from
And substrate is in place on the platform 72a at the 4th station P4.Platform 72a moves to substrate at 3rd station P3, the
One pressing mechanism carries out the pressing process of substrate, completes rear platform 72a and substrate is moved to the 4th station P4 from 3rd station P3
Place, substrate fetching device 76 take at the 4th station P4 substrate, so as under the drive of transfer device 77 from the 4th station P4
The 5th station P5 is reached, is placed a substrate on caching platform 75, is completed the pressing repair of a substrate, wait front substrate
Removed, next substrate repeats said process when reaching the caching platform 75 of the 5th station P5.
Two-shipper platform work pattern:After substrate to be repaired is reached on the caching platform 75 of the 5th station P5, substrate is picked and placeed
Device 76 is taken substrate, reaches the second station P2 from the 5th station P5, so as to substrate is placed under the drive of transfer device 77
To on the platform 71a at the second station P2, so that the first pressing mechanism proceeds by the pressing process of the substrate.By base
After plate is in place on the platform 71a at the second station P2, substrate fetching device 76 is at once in the drive of transfer device 77
Under return to the caching platform 75 of the 5th station P5, after reaching in next piece of substrate on the caching platform 75 of the 5th station P5, substrate
Fetching device 76 is taken substrate, under the drive of transfer device 77 reaches the 4th station P4 from the 5th station P5, so as to by substrate
It is in place on the platform 72a at the 4th station P4, so that the second pressing mechanism proceeds by the pressing process of the substrate.Base
Plate fetching device 76 is moved to the second station P2 from the 4th station P4 under the drive of transfer device 77, with when the first pressing machine
After structure completes pressing process, take and the substrate of the second station P2 is translated back into by platform 71a, under the drive of transfer device 77
The 5th station P5 is returned to from the second station P2, is then placed a substrate on caching platform 75, is completed the pressing reparation of one piece of substrate
Operation.Hereafter, substrate fetching device 76 is moved to the 4th station P4 from the 5th station P5 under the drive of transfer device 77, with etc.
After pressing process is completed to the first pressing mechanism, take and the substrate of the 4th station P4 is translated back into by platform 72a, in transfer dress
Put the 5th station P5 is returned to from the 4th station P4 under 77 drive.In the state of previous piece of substrate is removed, by substrate
It is placed on caching platform 75, completes the pressing repair of another piece of substrate.So as to coordinate external equipment by substrate to be repaired
It is placed on the caching platform 75 of the 5th station P5, and coordinates the substrate that reparation is completed by external equipment from the caching of the 5th station P5
Take away at platform 75, the first pressing mechanism and the second pressing mechanism can carry out pressing process simultaneously, so as to make compared to unit platform
Industry pattern reaches higher working performance.
As can be seen that one in two pressing mechanisms safeguard or failure in the state of, pressing mechanism can be with
Substrate repair is individually carried out, and substrate reparation work can be carried out jointly in two-shipper platform work pattern in two pressing mechanisms
Substrate prosthetic appliance under industry, therefore the implementation can reach very high equipment mobility and production capacity, contribute to whole product
The raising of the production efficiency of line.
Additionally, in a kind of possible implementation, second station, the 5th station and the 4th station edge
First direction is arranged in order, such as the second station P2, the 5th station P5 and the 4th station P4 in Figure 12 along Figure 12 from
Left-to-right direction is arranged in order;The transfer device includes the outstanding rail extended along the first direction, and can be along described
The linear machine people of outstanding rail movement;The substrate fetching device is arranged on the linear machine people, the linear machine people energy
The substrate fetching device is enough driven vertically to translate, so that substrate fetching device can be for example, by vac sorb
Mode coordinate the lifting of linear robot to take and place substrate.As can be seen that the implementation can shorten transfer device
The distance moved in a duty cycle is carried out, it is possible to reduce the volume and site area occupied required for whole equipment,
Contribute to the raising of actual production efficiency and the reduction of production cost.
The foregoing is only presently preferred embodiments of the present invention, not to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (10)
1. a kind of method for repairing base plate, it is characterised in that include:
Obtain the image of substrate surface;
Foreign matter size and the foreign body position of the visible foreign matters on the substrate surface are determined according to the image of the substrate surface;
The pressing parameter for including pressure head mark is determined according to the parameter including the foreign matter size by the pressing strategy for obtaining in advance;
Sending to pressing mechanism includes the control signal of the foreign body position and the pressing parameter, so that the pressing mechanism makes
With with the pressure head corresponding pressure head of mark, the pressing substrate surface at the foreign body position.
2. method for repairing base plate according to claim 1, it is characterised in that the substrate surface includes at least two repetitions
Region, the pixel cell of any two repeat region correspondence equal number;The image for obtaining substrate surface, including:
Obtain image of the substrate surface at least two repeat region;
Accordingly, the image according to the substrate surface determine the visible foreign matters on the substrate surface foreign matter size and
Foreign body position, including:
By difference of the comparison substrate surface between the image at least two repeat regions, it is determined that including visible foreign matters
Target image;
The foreign matter size of visible foreign matters is determined in the target image;
According to the target image relative to the substrate position, and visible foreign matters are relative to the position of the target image
Put, determine the foreign body position of visible foreign matters.
3. a kind of substrate prosthetic device, it is characterised in that include:
Acquisition module, for obtaining the image of substrate surface;
First determining module, for the foreign body of the visible foreign matters on the substrate surface is determined according to the image of the substrate surface
Size and foreign body position;
Second determining module, for being determined including pressure by the pressing strategy for obtaining in advance according to the parameter for including the foreign matter size
The pressing parameter that leader is known;
Sending module, for the control signal for including the foreign body position and the pressing parameter is sent to pressing mechanism, so that
The pressing mechanism using with the pressure head corresponding pressure head of mark, the pressing substrate surface at the foreign body position.
4. a kind of method for repairing base plate, is applied to pressing mechanism, it is characterised in that the pressing mechanism is included for placing substrate
Platform, be configured with the pressing head seat of electric magnet, the moving parts of pressing head seat movement can be driven, and can be by least two
Individual magnetic pressure head is separately fixed at the support member of respective setting position;The method for repairing base plate includes:
Control signal is received, the control signal includes foreign body position and pressing parameter, and the pressing parameter includes that pressure head is identified;
The setting position that the pressing head seat is moved to magnetic pressure head corresponding with pressure head mark is controlled by the moving parts
Put place;
To the electric magnet applied voltage, so that magnetic pressure head is attracted on the pressing head seat;
The pressing head seat is controlled by the moving parts and is moved to above the platform position corresponding with the foreign body position
Place;
The pressing head seat is controlled along translating perpendicular to the direction of the platform by the moving parts, to complete the magnetic pressure
The action of substrate on the platform is placed in head pressing;
The setting position that the pressing head seat is moved to the magnetic pressure head is controlled by the moving parts;
Stop to the electric magnet applied voltage, so that the magnetic pressure head is fixed on setting position by the support member again
Place.
5. method for repairing base plate according to claim 4, it is characterised in that the pressing mechanism also includes shooting part,
The moving parts can also drive the shooting part movement;
Accordingly, the reception control signal, the control signal include foreign body position and pressing parameter, the pressing parameter bag
Before including pressure head mark, also include:
After substrate is placed on the platform, the shooting part is controlled by the moving parts and is put down above platform
Move, to gather the image of the substrate surface;
The image of the substrate surface is sent to into processing mechanism, so that the processing mechanism:
Obtain the image of the substrate surface;
Foreign matter size and the foreign body position of the visible foreign matters on the substrate surface are determined according to the image of the substrate surface;
The pressing parameter for including pressure head mark is determined according to the parameter including the foreign matter size by the pressing strategy for obtaining in advance;
Return includes the control signal of the foreign body position and the pressing parameter.
6. a kind of substrate prosthetic device, is applied to pressing mechanism, it is characterised in that the pressing mechanism is included for placing substrate
Platform, be configured with the pressing head seat of electric magnet, the moving parts of pressing head seat movement can be driven, and can be by least two
Individual magnetic pressure head is separately fixed at the support member of respective setting position;The substrate prosthetic device includes:
Receiver module, for receiving control signal, the control signal includes foreign body position and pressing parameter, the pressing parameter
Identify including pressure head;
First control module, it is corresponding with pressure head mark for being moved to by the moving parts control pressing head seat
The setting position of magnetic pressure head;
Voltage applies module, for the setting position of magnetic pressure head corresponding with pressure head mark is moved in the pressing head seat
After place, to the electric magnet applied voltage, so that magnetic pressure head is attracted on the pressing head seat;
Second control module, after being attracted on the pressing head seat in magnetic pressure head, is controlled by the moving parts
The pressing head seat is moved to above the platform at position corresponding with the foreign body position;
3rd control module, for being moved to above the platform at position corresponding with the foreign body position it in pressing head seat
Afterwards, the pressing head seat is controlled along translating perpendicular to the direction of the platform by the moving parts, with complete magnetic pressure head by
Press the action for putting substrate on the platform;
4th control module, for, after the push action for completing the magnetic pressure head, controlling institute by the moving parts
State the setting position that pressing head seat is moved to the magnetic pressure head;
The voltage applies module and is additionally operable in the push action for completing the magnetic pressure head, and the pressing head seat is moved to the magnetic
Property pressure head setting position after, stop to the electric magnet applied voltage so that the magnetic pressure head is again by described
Support part part is fixed on setting position.
7. a kind of pressing mechanism, it is characterised in that including platform, moving parts, pressing head seat and support member;Wherein,
The platform is used to place substrate;
Electric magnet is configured with the pressing head seat;
At least two magnetic pressure heads can be separately fixed at respective setting position by the support member;
The moving parts can be under the control of the signal of telecommunication:
The plane translation of the specified altitude assignment for making the pressing head seat square on the platform;
The pressing head seat is made along the direction translation perpendicular to the platform;And,
The pressing head seat is made to be moved to the setting position of each magnetic pressure head and return.
8. a kind of substrate prosthetic appliance, it is characterised in that including at least one pressing mechanism as claimed in claim 7.
9. substrate prosthetic appliance according to claim 8, it is characterised in that at least one presses as claimed in claim 7
Press mechanism includes the first pressing mechanism and the second pressing mechanism, the substrate prosthetic appliance also include the first guide rail, the second guide rail,
Caching platform, substrate fetching device and transfer device;Wherein,
The moving parts of first pressing mechanism, pressing head seat and support member are arranged at the first station;First pressing
The platform of mechanism is arranged on first guide rail, and the platform of first pressing mechanism can be along first guide rail in institute
State and move between the first station and the second station;
The moving parts of second pressing mechanism, pressing head seat and support member are arranged at 3rd station;Second pressing
The platform of mechanism is arranged on second guide rail, and the platform of second pressing mechanism can be along second guide rail in institute
State and move between 3rd station and the 4th station;
The caching platform is arranged at the 5th station, and the substrate fetching device can be taken and place substrate, and the transfer is filled
Put the substrate fetching device can be driven between second station and the 5th station, and the 4th station and institute
State and move between the 5th station.
10. substrate prosthetic appliance according to claim 9, it is characterised in that second station, the 5th station and
4th station is arranged in order in the first direction, and the transfer device includes the outstanding rail extended along the first direction, and
Can be along the linear machine people of the outstanding rail movement;The substrate fetching device is arranged on the linear machine people, the line
Property robot can drive the substrate fetching device vertically to translate.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114594623A (en) * | 2022-04-20 | 2022-06-07 | 合肥京东方显示技术有限公司 | Repairing device and repairing method of liquid crystal panel |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100582344B1 (en) * | 2003-12-09 | 2006-05-22 | 삼성코닝정밀유리 주식회사 | Apparatus for inspecting a glass substrate |
CN1873744A (en) * | 2005-06-02 | 2006-12-06 | 飞而康公司 | Rotation-type display panel testing device and display panel testing method using the same |
CN101183182A (en) * | 2006-11-13 | 2008-05-21 | 东捷科技股份有限公司 | Laser reconditioning system of LCD panel |
CN101762897A (en) * | 2008-12-24 | 2010-06-30 | 株式会社日立高新技术 | Substrate processing unit and flat-panel display manufacturing installation |
CN205750194U (en) * | 2016-05-30 | 2016-11-30 | 京东方科技集团股份有限公司 | The manufacture device of display floater |
-
2017
- 2017-01-04 CN CN201710005817.1A patent/CN106526922B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100582344B1 (en) * | 2003-12-09 | 2006-05-22 | 삼성코닝정밀유리 주식회사 | Apparatus for inspecting a glass substrate |
CN1873744A (en) * | 2005-06-02 | 2006-12-06 | 飞而康公司 | Rotation-type display panel testing device and display panel testing method using the same |
CN101183182A (en) * | 2006-11-13 | 2008-05-21 | 东捷科技股份有限公司 | Laser reconditioning system of LCD panel |
CN101762897A (en) * | 2008-12-24 | 2010-06-30 | 株式会社日立高新技术 | Substrate processing unit and flat-panel display manufacturing installation |
CN205750194U (en) * | 2016-05-30 | 2016-11-30 | 京东方科技集团股份有限公司 | The manufacture device of display floater |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114594623A (en) * | 2022-04-20 | 2022-06-07 | 合肥京东方显示技术有限公司 | Repairing device and repairing method of liquid crystal panel |
CN114594623B (en) * | 2022-04-20 | 2024-04-12 | 合肥京东方显示技术有限公司 | Repairing device and repairing method for liquid crystal panel |
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