CN219305303U

CN219305303U - Ethernet switch

Info

Publication number: CN219305303U
Application number: CN202223582665.7U
Authority: CN
Inventors: 乔治.汤姆斯
Original assignee: Science And Motion Control System Suzhou Co ltd
Current assignee: Science And Motion Control System Suzhou Co ltd
Priority date: 2022-12-31
Filing date: 2022-12-31
Publication date: 2023-07-04
Anticipated expiration: 2032-12-31

Abstract

The utility model discloses an Ethernet switch, comprising: the switch body comprises an outer shell and a circuit board arranged in the outer shell, a heat radiation opening is formed in the outer shell, a heat radiation plate is arranged on the heat radiation opening, the heat radiation plate comprises a heat conduction rod and a plurality of heat radiation blades arranged on the heat conduction rod, and a heat exchange channel is formed by gaps among the heat radiation blades; be provided with integrated chip on the circuit board, integrated chip up end posts the semiconductor conducting strip, semiconductor conducting strip refrigeration face is towards integrated chip, semiconductor conducting strip is connected with the heat conduction pole, with the produced heat of integrated chip through semiconductor conducting strip transmission to the heat conduction pole on, in the heat transfer board was passed through to the heat conduction piece transmission, when dispelling the heat through radiator fin, when guaranteeing radiating efficiency, be provided with a plurality of heat dissipation convex patterns on the radiator fin, compare smooth surface, increased the last radiating efficiency of unit radiating area, have obvious enhancement effect to the heat dispersion of radiator fin.

Description

Ethernet switch

Technical Field

The present utility model relates to the field of switches, and in particular, to an ethernet switch.

Background

The Ethernet exchanger is based on the exchanger of Ethernet transmission data, ethernet adopts the local area network of the shared bus type transmission media mode, the structure of the Ethernet exchanger is that each port is directly connected with the host computer, and generally all works in the full duplex mode, the exchanger can communicate a plurality of pairs of ports at the same time, so that each pair of the host computers which communicate with each other can transmit the number in a collision-free way like exclusive communication media.

The existing ethernet switch generally adopts a shell opening mode to achieve the purpose of heat dissipation, for example, publication number CN217183667U discloses an ethernet switch convenient for heat dissipation, and the specific characteristics are as follows: an integrated chip is arranged on the printed circuit board; the shell comprises an upper shell and a lower shell, the upper shell and the lower shell are connected to form a sealed square structure matched with the printed circuit board, and the printed circuit board is arranged in the sealed square structure; the upper surface of the upper shell is provided with a heat dissipation groove connected with the external space, and the bottom end of the heat dissipation groove is attached to the upper end surface of the integrated chip; a radiating fin and a fan are arranged at the corresponding position of the integrated chip in the radiating groove; the heat generated by the integrated chip is conducted to the heat conducting sheet in the heat radiating groove through the upper shell, and the problems that the heat radiating efficiency of the Ethernet switch is low or electronic components are damaged due to the fact that dust easily enters the Ethernet switch are solved, but only a small heat radiating groove is arranged, and the heat cannot be radiated well inside the switch.

An ethernet switch has now been proposed to solve the above-mentioned problems.

Disclosure of Invention

The utility model overcomes the defects of the prior art and provides an Ethernet switch.

In order to achieve the above purpose, the utility model adopts the following technical scheme: an ethernet switch, comprising: the switch body comprises an outer shell and a circuit board arranged in the outer shell;

the heat dissipation device comprises a shell body, wherein a heat dissipation opening is formed in the shell body, a plurality of heat dissipation plates are arranged on the heat dissipation opening, each heat dissipation plate comprises a heat conduction rod and a plurality of heat dissipation blades arranged on the heat conduction rod, and a heat exchange channel is formed by gaps among every 2 heat dissipation blades;

an integrated chip is arranged on the circuit board, a semiconductor heat conducting sheet is stuck on the upper end surface of the integrated chip, and the refrigerating surface of the semiconductor heat conducting sheet faces to the integrated chip;

the semiconductor heat conducting fin is connected with the heat conducting rod, and heat generated by the integrated chip is transmitted to the heat conducting rod through the semiconductor heat conducting fin.

In a preferred embodiment of the present utility model, the circuit board is further provided with an ethernet port, an optical fiber port, a power switch and a power interface, and the integrated chip, the ethernet port, the optical fiber port, the power switch and the power interface are electrically connected with the circuit board and are disposed on the same surface of the circuit board.

In a preferred embodiment of the present utility model, the surface of the housing is provided with a plurality of anti-collision protrusions, and the anti-collision protrusions are disposed on the same side of the ethernet port, the optical fiber port, the power switch and the power interface.

In a preferred embodiment of the present utility model, the heat dissipation port is disposed on an opposite side of the ethernet port, the optical fiber port, the power switch, and the power interface.

In a preferred embodiment of the present utility model, a cooling fan is disposed on the cooling port, the fan is disposed on the top of the cooling plate, and the cooling fan blows air into the heat exchange channel from the top.

In a preferred embodiment of the present utility model, the heat dissipating fins are disposed on the heat dissipating blade, the heat dissipating fins are disposed on the surface of the heat dissipating blade in parallel and spaced apart from each other, and the extending direction of each heat dissipating fin is parallel to the central axis of the heat conducting rod.

In a preferred embodiment of the present utility model, all the heat dissipating fins are uniformly distributed on the periphery of the heat conducting rod, and the included angles between every 2 heat dissipating fins are equal.

In a preferred embodiment of the present utility model, the rib width of each fin is greater than the groove width between every 2 fins at the surface of the fin.

In a preferred embodiment of the present utility model, the plurality of heat conducting rods are all disposed on the same heat conducting plate, and the heat conducting plate is connected to the semiconductor heat conducting sheet.

In a preferred embodiment of the present utility model, a vent hole is disposed in the outer housing and near the circuit board, and a cooling fan is disposed on the vent hole.

The utility model solves the defects existing in the background technology, and has the following beneficial effects:

according to the utility model, the plurality of radiating plates are arranged on the radiating opening, the radiating plate comprises the heat conducting plate and the radiating blades with the periphery on the heat conducting rod, heat in the circuit board is transmitted to the heat conducting plate through the heat conducting plate, the radiating blades are used for radiating, the radiating efficiency is ensured, and meanwhile, the radiating blades are provided with the plurality of radiating ribs, compared with the smooth surface, the radiating area of the radiating ribs is increased by 18% -42%, the radiating efficiency on the unit radiating area is increased, and the radiating performance of the radiating blades is obviously enhanced.

Drawings

The utility model is further described below with reference to the drawings and examples;

fig. 1 is a perspective structural view of a switch body according to a preferred embodiment of the present utility model;

fig. 2 is a perspective structural view of a switch body according to a preferred embodiment of the present utility model;

fig. 3 is a cross-sectional view of a switch body of a preferred embodiment of the present utility model;

fig. 4 is a perspective view of a heat dissipating plate according to a preferred embodiment of the present utility model.

In the figure: 1. an outer housing; 11. a heat radiation port; 12. a heat dissipation plate; 120. a heat conduction rod; 121. a heat radiation blade; 1210. a heat exchange channel; 1211. a heat dissipating rib; 122. a heat conductive plate; 13. an ethernet port; 14. an optical fiber port; 15. a power switch; 16. a power interface; 17. an anti-collision bump; 18. a vent hole; 2. a circuit board; 21. a semiconductor heat conductive sheet.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or be present as another intermediate element through which the element is fixed. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1-3, an ethernet switch, comprising: the switch body, the switch body includes shell body 1 and sets up circuit board 2 in the shell body 1, be provided with thermovent 11 on the shell body 1, be provided with a plurality of heating panel 12 on the thermovent 11, heating panel 12 includes heat conduction pole 120 and sets up a plurality of fin 121 on the heat conduction pole 120, every 2 clearance between fin 121 forms heat transfer channel 1210, be provided with integrated chip on the circuit board 2, the integrated chip up end has pasted semiconductor conducting strip 21, semiconductor conducting strip 21 refrigeration face orientation integrated chip, semiconductor conducting strip 21 with the heat conduction pole 120 is connected, will the produced heat of integrated chip passes through semiconductor conducting strip 21 transmits to on the heat conduction pole 120.

By providing a plurality of heat dissipation plates 12 on the heat dissipation port 11, and the heat dissipation plate 12 is composed of a heat conduction plate 122 and a plurality of heat dissipation fins 121 having peripheral portions on the heat conduction rod 120, heat in the circuit board 2 is transferred to the heat conduction plate 122 through the heat conduction fins, and heat dissipation is performed by the heat dissipation fins 121.

In a preferred embodiment of the present utility model, the circuit board 2 is further provided with an ethernet port 13, an optical fiber port 14, a power switch 15 and a power interface 16, and the integrated chip, the ethernet port 13, the optical fiber port 14, the power switch 15 and the power interface 16 are electrically connected to the circuit board 2 and are disposed on the same surface of the circuit board 2. The power interface 16 is used for connecting direct current or alternating current to provide direct current or alternating current power for electronic components on the circuit board 2, the ethernet port 13 is used for inputting and outputting ethernet data, and the optical fiber interface is respectively responsible for inputting and outputting ethernet.

The surface of the shell is provided with a plurality of anti-collision convex blocks 17, the anti-collision convex blocks 17 are arranged on the same side of the Ethernet port 13, the optical fiber port 14, the power switch 15 and the power interface 16, and the external interface is prevented from being damaged when the switch collides or falls.

The heat dissipation port 11 is disposed on the opposite side of the ethernet port 13, the optical fiber port 14, the power switch 15, and the power interface 16, so as to form a heat dissipation channel, so that heat is primarily dissipated when flowing from one side to the other side.

The heat dissipation port 11 is provided with a heat dissipation fan, the fan is arranged at the top of the heat dissipation plate 12, and the heat dissipation fan blows air from the top into the heat exchange channel 1210. The heat dissipation fins 121 are provided with heat dissipation ribs 1211, the heat dissipation ribs 1211 are disposed on the surface of the heat dissipation fin 121 at intervals in parallel, and the extending direction of each heat dissipation rib 1211 is parallel to the central axis of the heat conducting rod. All the heat radiating fins 121 are uniformly distributed on the periphery of the heat conducting rod, and included angles among every 2 heat radiating fins 121 are equal. At the surface of the radiating fin, the rib width of each radiating rib is larger than the groove width between every 2 radiating ribs, and a plurality of radiating ribs 1211 are arranged on the radiating fin 121, so that compared with a smooth surface, the surface structure of the radiating ribs 1211 increases the radiating area by 18% -42%, increases the radiating efficiency on the unit radiating area, and has obvious enhancement effect on the radiating performance of the radiating fin.

In a preferred embodiment of the present utility model, the plurality of heat conducting rods 120 are disposed on the same heat conducting plate 122, and the heat conducting plate 122 is connected to the semiconductor heat conducting sheet 21.

In a preferred embodiment of the present utility model, a vent hole 18 is disposed in the outer housing 1 near the circuit board 2, and a heat dissipation fan is disposed on the vent hole 18.

When the heat exchanger is used, when the heat exchanger works, the temperature of the circuit board 2 is lengthened along with the working time, a great amount of heat is generated, the heat is conducted to the heat conducting rod 120 through the contact of the semiconductor heat conducting sheet 21 and the heat conducting plate 122, the heat is transferred to the heat radiating blade 121 through the heat conducting rod 120, and finally the heat is sent away through the operation of the heat radiating fan arranged at the top of the heat radiating hole. The heat radiating fins 121 are provided with a plurality of heat radiating ribs 1211, compared with a smooth surface, the surface structure of the heat radiating ribs 1211 increases the heat radiating area by 18% -42%, increases the heat radiating efficiency on the unit heat radiating area, has obvious enhancement function on the heat radiating performance of the heat radiating fins, effectively reduces the volume of the heat radiating fins, thereby reducing the manufacturing cost, and when in use, the heat radiating fan arranged on one side of the air vent 18 can also work, thereby better radiating the heat of the exchanger and avoiding the damage to the internal electronic element caused by overhigh temperature due to overlarge working efficiency.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, it is possible to make several modifications and improvements without departing from the concept of the present utility model, which are equivalent to the above embodiments according to the essential technology of the present utility model, and these are all included in the protection scope of the present utility model.

Claims

1. An ethernet switch, comprising: the switch body, its characterized in that, switch body

The body comprises an outer shell and a circuit board arranged in the outer shell;

2. An ethernet switch as claimed in claim 1, wherein: the integrated chip, the Ethernet port, the optical fiber port, the power switch and the power interface are electrically connected with the circuit board and are arranged on the same surface of the circuit board.

3. An ethernet switch as claimed in claim 2, wherein: the surface of the shell is provided with a plurality of anti-collision convex blocks, and the anti-collision convex blocks are arranged on the same side of the Ethernet port, the optical fiber port, the power switch and the power interface.

4. An ethernet switch as claimed in claim 2, wherein: the heat dissipation port is arranged on one side opposite to the Ethernet port, the optical fiber port, the power switch and the power interface.

5. An ethernet switch as claimed in claim 1, wherein: the heat dissipation port is provided with a heat dissipation fan, the fan is arranged at the top of the heat dissipation plate, and the heat dissipation fan blows air from the top into the heat exchange channel.

6. An ethernet switch as claimed in claim 1, wherein: the heat dissipation fin is characterized in that heat dissipation ribs are arranged on the heat dissipation fin, the surfaces of the heat dissipation fins are arranged in parallel at intervals, and the extending direction of each heat dissipation rib is parallel to the central axis of the heat conducting rod.

7. An ethernet switch as claimed in claim 1, wherein: all the radiating fins are uniformly distributed on the periphery of the heat conducting rod, and included angles among every 2 radiating fins are equal.

8. An ethernet switch as claimed in claim 1, wherein: at the surface of the fin, the rib width of each fin is greater than the groove width between every 2 fins.

9. An ethernet switch as claimed in claim 1, wherein: the heat conducting rods are arranged on the same heat conducting plate, and the heat conducting plate is connected with the semiconductor heat conducting sheet.

10. An ethernet switch as claimed in claim 1, wherein: and a vent hole is formed in one side, close to the circuit board, of the outer shell body, and a cooling fan is arranged on the vent hole.