CN219303414U

CN219303414U - Patch film resistor

Info

Publication number: CN219303414U
Application number: CN202320473135.4U
Authority: CN
Inventors: 张一驰
Original assignee: Shenzhen Jiushengchang Electronics Co ltd
Current assignee: Shenzhen Jiushengchang Electronics Co ltd
Priority date: 2023-03-01
Filing date: 2023-03-01
Publication date: 2023-07-04
Anticipated expiration: 2033-03-01

Abstract

The utility model provides a patch film resistor, which comprises a film resistor body, wherein the film resistor body comprises a shell, pins, welding parts and resistor films, an insulating substrate is arranged in the shell, the resistor films are attached to the surface of each insulating substrate, the bottoms of the two ends of the shell are respectively provided with a pin, the bottom ends of the pins are provided with tin melting tanks, the welding parts are arranged in the tin melting tanks, parameter labels are attached to the surfaces of the shell, the bottom of the pins are provided with the tin melting tanks, soldering during welding passes through the welding holes through a plurality of welding holes on the inner side, the bottom plate parts of the pins and welding spots on a circuit board are uniformly welded and fixed, the firmness after welding is improved, the protection effect on internal electrode plates can be improved through the cooperation of the welding parts on the top to protect the shell, and the waterproof and dustproof functions are effectively realized.

Description

Patch film resistor

Technical Field

The utility model relates to the technical field of resistor elements, in particular to a patch film resistor.

Background

The chip film resistor is a resistor element made by evaporating a material with a certain resistivity on the surface of an insulating material by a similar evaporation method, and the insulating material commonly used for the resistor is a ceramic substrate. According to the technical scheme disclosed in the novel thin film resistor disclosed in the prior art as described in Chinese patent document CN201420281329.5, the heat dissipation metal base layer is arranged below the insulating substrate layer, so that the heat dissipation performance of the resistor is greatly optimized, and the thermal stability of the thin film resistor is better, namely the electrical property of the resistor is not obvious along with the change of temperature; in addition, an arc-shaped groove is formed on the upper surface of the insulating substrate layer, and the resistance film layer is evaporated in the arc-shaped groove, so that the performance of a product is optimized.

According to the technical scheme disclosed by the utility model, the pin part of the chip film resistor can be welded and installed on the preset welding spot on the surface of the circuit board in the prior art in a soldering way, so that the pin is exposed outside for a long time after being welded, short circuit is easy to occur after liquid is encountered, the soldering range of the soldering is difficult to accurately control, on the other hand, the conventional film resistor is also in a punctiform structure in the process of welding the pin, the connection firmness is weaker, and the situation that the welding spot is easy to break away after being impacted by the outside is avoided.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model aims to provide the patch film resistor so as to solve the problems in the background art.

In order to achieve the above object, the present utility model is realized by the following technical scheme: the utility model provides a paster sheet resistance, includes the sheet resistance body, the sheet resistance body includes shell, pin, weldment and resistance film, the internally mounted of shell has insulating substrate, the resistance film is attached at every insulating substrate's surface, the pin is all installed to the both ends bottom of shell, the bottom of pin is provided with melts the tin bath, the inside at melts the tin bath is installed to the weldment, the surface mounting of shell is equipped with parameter tag.

Further, the surface of pin is provided with the protection cover shell, molten tin bath sets up the surface in protection cover shell bottom, a plurality of welding holes have been seted up to molten tin bath's inboard, the end plate is installed at the top of protection cover shell, one side of molten tin bath inner wall is provided with the bottom electrode slice.

Further, an insulating bottom plate is attached to the bottom end of the tin melting tank, a middle electrode plate is arranged in the protective sleeve shell, and the bottom electrode plate is communicated with the middle electrode plate.

Further, the welding piece comprises a conducting plate and a metal tin plate, wherein the metal tin plate is attached to the bottom of the conducting plate, and a pressing pad is attached to the surface of the conducting plate.

Further, the side of the welding piece is in contact with the side of the inner wall of the tin melting tank in a fitting way, the bottom end of the metal tin plate is in contact with the top of each welding hole, and the thickness of the welding piece is the same as the depth of the tin melting tank.

Further, the metal tin plate flows downwards from the inside of the welding hole after being heated and melted, and the side edge of the conducting plate is contacted and attached with the bottom electrode plate part.

Further, the inside of end plate is provided with the top electrode slice, the inboard of shell is provided with a plurality of heat conduction silica gel pieces, and is provided with the intermediate layer between every adjacent heat conduction silica gel piece, insulating substrate has been packed to the inside of intermediate layer.

Further, a gap is formed between the insulating substrates, each heat-conducting silicon sheet is inserted into the gap, the heat-conducting silicon sheets are contacted and attached to the surface of the resistor film, and two ends of the resistor film are connected with the top electrode plates.

The utility model has the beneficial effects that: the utility model relates to a patch film resistor, which comprises a film resistor body, wherein the film resistor body comprises a shell, pins, welding parts, parameter labels, a pressing pad, a conducting plate, a metal tin plate, a tin melting tank, an insulating bottom plate, welding holes, a protective casing, a bottom electrode plate, a middle electrode plate, an end plate, a top electrode plate, an insulating substrate, a resistor film, a gap, a heat-conducting silica gel sheet and an interlayer.

1. The bottom of the pin is provided with the tin melting groove, and the tin soldering during welding passes through the welding holes through the plurality of welding holes on the inner side, so that the bottom plate part of the pin and the welding spots on the circuit board are uniformly welded and fixed, and the firmness degree after welding is improved.

2. This paster sheet resistance is after welding the pin part, presses down through the weldment at top, and cooperation protection cover shell can shelter from totally with the conductor part and seal, ensures simultaneously that inside conductor can not receive external influence, has improved the protection effect to inside electrode slice, effectively realizes waterproof dirt-proof function.

3. The patch film resistor is attached with a plurality of layers of resistor films through a plurality of insulating substrates in the shell, so that more resistor film attaching areas are provided, and the adjustable range of the resistance value of the film resistor is enlarged.

Drawings

FIG. 1 is a schematic diagram of the structure of the appearance of a chip resistor according to the present utility model;

FIG. 2 is a schematic diagram of a lead portion of a chip resistor according to the present utility model;

FIG. 3 is a schematic diagram of the structure of the inside of a chip resistor housing according to the present utility model;

fig. 4 is a front cross-sectional view of a chip resistor interlayer in accordance with the present utility model;

in the figure: 1. a housing; 2. pins; 3. a welding member; 4. parameter labels; 5. a pressing pad; 6. a conductive plate; 7. a metallic tin plate; 8. a tin melting tank; 9. an insulating base plate; 10. welding holes; 11. a protective sleeve; 12. a bottom electrode sheet; 13. a middle electrode plate; 14. an end plate; 15. a top electrode sheet; 16. an insulating substrate; 17. a resistive film; 18. a gap; 19. a thermally conductive silicone sheet; 20. and (5) an interlayer.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

Referring to fig. 1 to 4, the present utility model provides a technical solution: the utility model provides a chip resistor, includes the sheet resistor body, the sheet resistor body includes shell 1, pin 2, welding piece 3 and resistance film 17, the internally mounted of shell 1 has insulating substrate 16, the resistance film 17 is attached on the surface of every insulating substrate 16, pin 2 is all installed to the both ends bottom of shell 1, the bottom of pin 2 is provided with molten tin bath 8, the welding piece 3 is installed in molten tin bath 8's inside, the surface of shell 1 is pasted and is equipped with parameter tag 4, carries out heating treatment after the welding position alignment that should chip resistor will be both ends bottom pin 2 part and preset on the circuit board through welded form, is provided with the metal tin plate 7 that is heated to melt below welding piece 3, utilizes melting of metal tin plate 7 to wear out from the bottom of pin 2, can contact with the welded point on the circuit board, and the cooling of messenger's metal tin solution is stood, can accomplish the welding installation treatment to this sheet resistor.

In this embodiment, the surface of pin 2 is provided with protection cover shell 11, tin bath 8 sets up the surface at protection cover shell 11 bottom, a plurality of welding holes 10 have been seted up to the inboard of tin bath 8, end plate 14 is installed at the top of protection cover shell 11, one side of tin bath 8 inner wall is provided with bottom electrode piece 12, the bottom subsides of tin bath 8 are equipped with insulating bottom plate 9, the inside of protection cover shell 11 is provided with middle electrode piece 13, and bottom electrode piece 12 and middle electrode piece 13 are linked together, is provided with tin bath 8 in the bottom of pin 2 to the soldering when will welding through a plurality of welding holes 10 of inboard passes from welding hole 10, even with the bottom plate portion of pin 2 with the even welding fixation processing that carries out of solder joint on the circuit board, specific, through covering the insulating bottom plate 9 of pin 2 bottom on the circuit board, then heat up the metal tin plate 7 part, can be with the metal tin from every welding hole 10 down flow down easily to fix the inside of piece 3 at the welding point position, thereby the fixed liquid phase position of this tin bath is welded with the bottom plate 9, thereby the liquid phase position is welded with the bottom of the welding point position is fixed, thereby the liquid phase position is avoided the direct welding of the bottom point position to the bottom of the welding point position is welded, thereby the probability is reduced, the direct contact probability is avoided to the bottom point position of the bottom is welded to the bottom point position is welded, thereby has been welded with other point position has been reduced, and has been welded.

In this embodiment, the weldment 3 includes conducting plate 6 and metal tin plate 7, metal tin plate 7 is attached in the bottom of conducting plate 6, the surface subsides of conducting plate 6 is equipped with and presses pad 5, the side of weldment 3 is contacted with the inner wall side of molten tin bath 8 mutually, the bottom of metal tin plate 7 contacts with the top of every welded hole 10, the thickness of weldment 3 is the same with the degree of depth of molten tin bath 8, metal tin plate 7 is heated and melts the back and flows downwards from the inside of welded hole 10, the side and the bottom electrode slice 12 part of conducting plate 6 contact the laminating, and after the welding of pin 2 part, the welding piece 3 through the top is pressed downwards, and cooperation protection cover shell 11 can shelter from totally sealing conductor part, ensures simultaneously that inside conductor can not receive outside influence, has improved the protection effect to inside electrode slice, effectively realizes waterproof dustproof function, melts when welding, melts the inside of weldment 3 dress in molten tin bath 8, carries out metal plate 3 bottom metal plate 7 and carries out the inside of welded hole 10, and carries out the cooling down the metal plate 6 and carries out the inside of the metal plate 6 and the cooling down and the metal plate through the contact point 12, thereby can be carried out the cooling down and the metal plate is cooled down to the bottom electrode slice 6, and the inside is cooled down and the metal plate is carried out the inside the metal plate is cooled down and the metal plate is directly to the bottom plate is cooled down and the metal plate is cooled down.

In this embodiment, the top electrode plate 15 is disposed inside the end plate 14, the plurality of heat-conducting silicon sheets 19 are disposed inside the casing 1, an interlayer 20 is disposed between each two adjacent heat-conducting silicon sheets 19, an insulating substrate 16 is filled in the interlayer 20, a gap 18 is disposed between the insulating substrates 16, each heat-conducting silicon sheet 19 is inserted into the gap 18, the heat-conducting silicon sheets 19 are in contact with the surface of the resistor film 17, two ends of the resistor film 17 are connected with the top electrode plate 15, and a plurality of layers of resistor films 17 are attached to the inside of the casing through the plurality of insulating substrates 16, so that a more resistor film 17 attaching area is provided, the adjustable range of the resistance value of the resistor film is widened, meanwhile, the high-efficiency heat dissipation performance of each layer of resistor film 17 can be ensured by utilizing the plurality of heat-conducting silicon sheets 19, and in particular, more resistor film 17 attaching areas can be provided by means of the plurality of insulating substrates 16 by connecting the top electrode plates 15 at two ends, so that the resistance value control range of the resistor film can be widened.

While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. The utility model provides a paster sheet resistance, includes sheet resistance body, its characterized in that: the thin film resistor body comprises a shell (1), pins (2), welding pieces (3) and resistor films (17), wherein insulating substrates (16) are arranged in the shell (1), the resistor films (17) are attached to the surfaces of the insulating substrates (16), the pins (2) are arranged at the bottoms of the two ends of the shell (1), tin melting grooves (8) are formed in the bottoms of the pins (2), the welding pieces (3) are arranged in the tin melting grooves (8), and parameter labels (4) are attached to the surfaces of the shell (1).

2. A chip resistor as claimed in claim 1, wherein: the surface of pin (2) is provided with protection cover shell (11), melt tin bath (8) and set up the surface in protection cover shell (11) bottom, a plurality of welding holes (10) have been seted up to the inboard in tin bath (8), end plate (14) are installed at the top of protection cover shell (11), one side of tin bath (8) inner wall is provided with bottom electrode piece (12).

3. A chip resistor as claimed in claim 2, wherein: the bottom of tin melting tank (8) is pasted and is equipped with insulating bottom plate (9), the inside of protection cover shell (11) is provided with middle part electrode slice (13), and bottom electrode slice (12) are linked together with middle part electrode slice (13).

4. A chip resistor as claimed in claim 2, wherein: the welding piece (3) comprises a conducting plate (6) and a metal tin plate (7), wherein the metal tin plate (7) is attached to the bottom of the conducting plate (6), and a pressing pad (5) is attached to the surface of the conducting plate (6).

5. The chip resistor of claim 4, wherein: the side of welding piece (3) is laminated with the inner wall side of molten tin bath (8) and is contacted, the bottom of metal tin plate (7) is contacted with the top of every welding hole (10), the thickness of welding piece (3) is the same with the degree of depth of molten tin bath (8).

6. The chip resistor of claim 5, wherein: the metal tin plate (7) flows downwards from the inside of the welding hole (10) after being heated and melted, and the side edge of the conductive plate (6) is in contact fit with the part of the bottom electrode plate (12).

7. A chip resistor as claimed in claim 2, wherein: the inside of end plate (14) is provided with top electrode piece (15), the inboard of shell (1) is provided with a plurality of heat conduction silica gel pieces (19), and is provided with intermediate layer (20) between every adjacent heat conduction silica gel piece (19), insulating base plate (16) are filled with to the inside of intermediate layer (20).

8. The chip resistor of claim 7, wherein: a gap (18) is formed between the insulating substrates (16), each heat-conducting silica gel piece (19) is inserted into the gap (18), the heat-conducting silica gel pieces (19) are contacted and attached to the surface of the resistor film (17), and two ends of the resistor film (17) are connected with the top electrode plates (15).