CN219269206U

CN219269206U - Bonding pad packaging structure

Info

Publication number: CN219269206U
Application number: CN202223181206.8U
Authority: CN
Inventors: 乔金彪; 侯庆河; 宋方震
Original assignee: Jiangsu Yanxin Microelectronics Co ltd
Current assignee: Jiangsu Yanxin Microelectronics Co ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-06-27
Anticipated expiration: 2032-11-29

Abstract

The utility model discloses a bonding pad packaging structure, relates to the technical field of LGA bonding pads, and aims to solve the problems that a common LGA bonding pad packaging structure in the prior art mostly adopts a visible bare soldering leg structure, when a chip is packaged, the chip cannot be effectively limited, used soldering tin can easily flow to other places of a circuit board after being heated, and the use is not safe and reliable enough. The bonding pad is installed to the top of integrated circuit board, and bonding pad and integrated circuit board welded connection, spacing bounding box is installed to the top of integrated circuit board, and spacing bounding box and integrated circuit board welded connection, spacing bounding box wholly surrounds the bonding pad, the both ends of bonding pad are provided with first quick detach strip and second quick detach strip respectively, the end of first quick detach strip and second quick detach strip all sets up in the outside of spacing bounding box.

Description

Bonding pad packaging structure

Technical Field

The utility model relates to the technical field of LGA bonding pads, in particular to a bonding pad packaging structure.

Background

LGA, land array package, is a surface mount type package in which a land array is formed on the bottom of a substrate. The LGA package has the characteristics of high packaging density and low device mounting height, and is very suitable for application occasions needing compact mounting; because no lead is arranged, noise generated by parasitic inductance of the lead can be avoided, and meanwhile, the core plate is tightly welded on the surface of the bottom plate, so that the anti-dropping and anti-bending capabilities of the product are improved;

for example, application publication number CN212436044U, a circuit board pad package structure, comprising: the steel mesh body is provided with at least one steel mesh opening, and the steel mesh openings correspond to the welding pads of the circuit board one by one; defining the extending direction of the steel mesh opening as a first direction, defining the extending direction perpendicular to the steel mesh opening as a second direction, wherein the length of the steel mesh opening in the first direction is larger than the diameter of the circuit board bonding pad, and the length of the steel mesh opening in the second direction is smaller than the diameter of the circuit board bonding pad;

the circuit board bonding pad packaging structure obviously shortens the escape path of the gas in the solder paste, reduces the gas escape resistance, further promotes the gas escape in the solder paste, effectively reduces or eliminates the bubble of the welding point, and improves the reliability of the welding point and the product; meanwhile, the first directions of two adjacent steel mesh openings are vertical or parallel, a sufficient safety distance is ensured between the adjacent steel mesh openings and between the bonding pad and the steel mesh openings of the adjacent bonding pad, and welding connection tin is avoided, but when the chip is packaged, the chip cannot be effectively limited, and used soldering tin easily flows to other places of the circuit board after being heated, so that the use is not safe and reliable enough, and therefore, the market is urgent to develop a bonding pad packaging structure to help people solve the existing problems.

Disclosure of Invention

The utility model aims to provide a bonding pad packaging structure, which solves the problems that the common LGA bonding pad packaging structure proposed in the background technology mostly adopts a visible bare soldering leg structure, the chip cannot be effectively limited when being packaged, and used soldering tin can easily flow to other places of a circuit board after being heated, so that the use is not safe and reliable enough.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a pad packaging structure, includes the integrated circuit board, the pad is installed to the top of integrated circuit board, and pad and integrated circuit board welded connection, spacing bounding box is installed to the top of integrated circuit board, and spacing bounding box and integrated circuit board welded connection, spacing bounding box wholly encircles the pad.

Preferably, the two ends of the bonding pad are respectively provided with a first quick-release strip and a second quick-release strip, and the ends of the first quick-release strip and the second quick-release strip are arranged on the outer side of the limiting surrounding frame.

Preferably, the end of the first quick-release strip is provided with a threaded hole, the threaded hole and the first quick-release strip are arranged into an integrated structure, and a counterpoint notch is arranged above the bonding pad.

Preferably, a first soldering leg is installed above the bonding pad, the first soldering leg is connected with the bonding pad in a welding mode, a first copper disc is installed on the inner side of the first soldering leg, and the first copper disc is connected with the bonding pad in a welding mode.

Preferably, the inner side of the first copper plate is provided with a first jack, the first jack and the first copper plate are arranged into an integrated structure, the second welding leg is arranged above the welding pad, and the second welding leg is connected with the welding pad in a welding mode.

Preferably, a second copper plate is installed above the second soldering leg, the second copper plate is connected with the second soldering leg in a welded mode, a second jack is arranged on the inner side of the second copper plate, and the second jack and the second copper plate are arranged into an integrated structure.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the limiting surrounding frame is additionally arranged on the integrated circuit board, the limiting surrounding frame is utilized to fully surround the mounting area of the bonding pad, when the LGA chip is welded and packaged on the integrated circuit board, soldering tin is smeared above the soldering leg and then heated, and becomes liquid after being heated, because the limiting surrounding frame exists, liquefied soldering tin cannot flow to other places of the integrated circuit board, so that pollution is not caused to the integrated circuit board, and meanwhile, when the chip is placed above the bonding pad, the limiting surrounding frame can be contacted with the periphery of the chip, so that preliminary limiting work is realized, the chip is prevented from being arranged at a cheap mounting position, quick positioning can be realized, and the welding and mounting of the chip are facilitated, so that the bonding pad packaging structure is more convenient to use and safer and more reliable.

2. According to the utility model, through the arrangement of the first quick-release strip and the second quick-release strip, the structures of the first quick-release strip and the second quick-release strip are the same, the two quick-release strips are respectively arranged at two ends of the bonding pad, the first quick-release strip, the second quick-release strip and the limiting surrounding frame can slide, during installation, the first quick-release strip and the second quick-release strip are fixed by soldering tin, and when the chip is dismounted, the soldering tin can be quickly separated from the bonding pad after being pulled back and forth by the first quick-release strip and the second quick-release strip after being heated and softened, so that the chip can be dismounted conveniently.

Drawings

FIG. 1 is a top view of a pad package structure of the present utility model;

FIG. 2 is a front view of a pad package structure of the present utility model;

FIG. 3 is an enlarged schematic view of the utility model at A;

fig. 4 is an enlarged schematic view of the present utility model at B.

In the figure: 1. an integrated circuit board; 2. a bonding pad; 3. limiting the surrounding frame; 4. a first quick release strip; 5. the second quick release strip; 6. a first leg; 7. a first copper plate; 8. a first jack; 9. aligning the notch; 10. a threaded hole; 11. a second leg; 12. a second copper plate; 13. and a second jack.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-4, an embodiment of the present utility model is provided: the utility model provides a pad packaging structure, including integrated circuit board 1, the pad 2 is installed to the top of integrated circuit board 1, and the welding of pad 2 and integrated circuit board 1 connects, spacing surrounding frame 3 is installed to the top of integrated circuit board 1, and spacing surrounding frame 3 and integrated circuit board 1 welded connection, spacing surrounding frame 3 wholly surrounds pad 2, install a spacing surrounding frame 3 additional on integrated circuit board 1, utilize spacing surrounding frame 3 to fully surround the installation region of pad 2, when carrying out LGA chip welding encapsulation to integrated circuit board 1, the top of just soldering foot will be paintd to the soldering tin, then heat the soldering tin, become liquid after the soldering tin heats, because there is spacing surrounding frame 3's existence, the soldering tin after the liquefaction can not flow to the elsewhere of integrated circuit board 1, thereby can not cause the pollution to integrated circuit board 1, simultaneously, chip place when bonding pad 2 top, spacing surrounding frame 3 can be contacted with the periphery of chip, realize preliminary spacing work, avoid the chip to install the position, thereby can realize quick location, the convenience is to the installation of chip, make this packaging structure more safe and more reliable.

Further, the two ends of the bonding pad 2 are respectively provided with a first quick-release strip 4 and a second quick-release strip 5, the ends of the first quick-release strip 4 and the second quick-release strip 5 are arranged on the outer side of the limiting surrounding frame 3, the first quick-release strip 4 and the second quick-release strip 5 can slide between the limiting surrounding frame 3, when the bonding pad is installed, the first quick-release strip 4 and the second quick-release strip 5 are fixed by soldering tin, and when a chip is detached, the soldering tin is softened by heating, and can be quickly separated from the bonding pad by pulling back and forth of the first quick-release strip 4 and the second quick-release strip 5.

Further, the end setting of first quick detach strip 4 has screw hole 10 in addition, and screw hole 10 sets up to integrated into one piece structure with first quick detach strip 4, and the top of pad 2 is provided with counterpoint notch 9, and the end of second quick detach strip 5 has also set up screw hole 10 equally, installs the vertical bar additional for first quick detach strip 4 and second quick detach strip 5 through screw hole 10, facilitates the use of first quick detach strip 4 and second quick detach strip 5, through setting up of counterpoint notch 9, conveniently discerns the installation direction of chip.

Further, a first soldering leg 6 is installed above the bonding pad 2, the first soldering leg 6 is in welded connection with the bonding pad 2, a first copper disc 7 is installed on the inner side of the first soldering leg 6, the first copper disc 7 is in welded connection with the bonding pad 2, the first soldering leg 6 is a main connection endpoint of the bonding pad 2, and when a chip is connected with the bonding pad 2, a plurality of pins are connected with the first soldering leg 6.

Further, the inside of first copper dish 7 is provided with first jack 8, and first jack 8 sets up to an organic whole structure with first copper dish 7, and second leg 11 is installed to the top of pad 2, and second leg 11 and pad 2 welded connection, when the chip is installed to pad 2, the inside of first jack 8 will be inserted to the pin of chip, realizes the end point and connects to still have spacing location's effect to the chip.

Further, the second copper plate 12 is installed to the top of second leg 11, and second copper plate 12 and second leg 11 welded connection, and the inboard of second copper plate 12 is provided with second jack 13, and second jack 13 and second copper plate 12 set up as an organic whole structure, and the area of second leg 11 needs to be obviously greater than first leg 6, and the effect of second leg 11 is the convenience left and right sides of distinguishing the chip, makes things convenient for the installation of chip.

Working principle: when in use, the bonding pad 2 is welded above the integrated circuit board 1, then the limiting surrounding frame 3 is arranged around the bonding pad 2, the limiting surrounding frame 3 is welded with the integrated circuit board 1, when a chip is arranged, soldering tin is smeared on the soldering feet, the soldering feet are divided into a first soldering feet 6 and a second soldering feet 11, the first soldering feet 6 are main connecting endpoints, when the chip is connected with the bonding pad 2, a plurality of pins are connected with the first soldering feet 6, when the chip is arranged on the bonding pad 2, the pins of the chip are inserted into the first jack 8 to realize endpoint connection, and the chip is also provided with limiting and positioning effects, the positioning notch 9 and the second soldering feet 11 can play a role of prompting an installer to distinguish the left and right mounting positions of the chip, after the soldering tin is smeared on the soldering feet, the soldering tin is heated, so that the soldering tin is liquefied, because of the existence of the limiting surrounding frame 3, the liquefied soldering tin cannot flow to other places of the integrated circuit board 1, therefore, the integrated circuit board 1 can not be polluted, meanwhile, when the chip is placed above the bonding pad 2, the limiting surrounding frame 3 can be contacted with the periphery of the chip, preliminary limiting work is realized, the chip is prevented from being cheaply installed, thereby realizing quick positioning, the chip is convenient to weld and install, the bonding pad packaging structure is more convenient to use, is safer and more reliable, then the soldering tin is waited to cool and solidify, the chip and the bonding pad 2 are welded together, the first quick release strip 4 and the second quick release strip 5 are fixed by the soldering tin during installation, when the chip is required to be detached, after the soldering tin is softened by heating, the chip and the bonding pad can be quickly separated by pulling back and forth of the first quick release strip 4 and the second quick release strip 5, the threaded holes 10 are arranged at the ends of the first quick release strip 4 and the second quick release strip 5, vertical bars are additionally arranged on the first quick release bar 4 and the second quick release bar 5 through the threaded holes 10, so that the first quick release bar 4 and the second quick release bar 5 are convenient to use.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A pad package structure comprising an integrated circuit board (1), characterized in that: the bonding pad (2) is installed above the integrated circuit board (1), the bonding pad (2) is in welded connection with the integrated circuit board (1), the limiting surrounding frame (3) is installed above the integrated circuit board (1), the limiting surrounding frame (3) is in welded connection with the integrated circuit board (1), and the limiting surrounding frame (3) integrally surrounds the bonding pad (2).

2. The pad packaging structure of claim 1, wherein: the two ends of the bonding pad (2) are respectively provided with a first quick-release strip (4) and a second quick-release strip (5), and the ends of the first quick-release strip (4) and the second quick-release strip (5) are arranged on the outer side of the limiting surrounding frame (3).

3. The pad packaging structure of claim 2, wherein: the end of the first quick release strip (4) is provided with a threaded hole (10), the threaded hole (10) and the first quick release strip (4) are integrally formed, and an alignment notch (9) is formed above the bonding pad (2).

4. The pad packaging structure of claim 1, wherein: the upper side of pad (2) is installed first leg (6), and first leg (6) and pad (2) welded connection, first copper dish (7) are installed to the inboard of first leg (6), and first copper dish (7) and pad (2) welded connection.

5. The pad packaging structure of claim 4, wherein: the inside of first copper dish (7) is provided with first jack (8), and first jack (8) and first copper dish (7) set up to the integral structure, second leg (11) are installed to the top of pad (2), and second leg (11) and pad (2) welded connection.

6. The pad packaging structure of claim 5, wherein: the upper portion of second leg (11) is installed second copper dish (12), and second copper dish (12) and second leg (11) welded connection, the inboard of second copper dish (12) is provided with second jack (13), and second jack (13) and second copper dish (12) set up to integral structure.