CN218783022U - Bypass diode frame and bypass diode - Google Patents

Abstract

The utility model belongs to the technical field of bypass diode, concretely relates to bypass diode frame and bypass diode. The utility model discloses a: the first frame is provided with a chip placing area, and abdicating notches are formed in two sides of the root part of the chip placing area; and one end of the second frame is provided with two pins which are respectively arranged at two sides of the chip placing area. The utility model is used for solve the packaging body combination department of bypass diode positive and negative among the prior art, packaging body and frame easily produce the gap, and the easy infiltration gap of aqueous vapor then gets into inside the bypass diode, leads to the technical problem that the bypass diode breaks down.

Description

Bypass diode frame and bypass diode

Technical Field

The utility model belongs to the technical field of bypass diode, concretely relates to bypass diode frame and bypass diode.

Background

Bypass diode is often used in the photovoltaic industry, specifically, bypass diode is used in solar photovoltaic panel, and solar photovoltaic panel is outdoor use, but outdoor temperature & humidity can't go to control, bypass diode's service environment is just comparatively abominable, current bypass diode breaks down after outdoor long-time use easily, finds the reason majority that leads to bypass diode trouble after the inspection and is: as shown in fig. 4, gaps are easily generated at the joint of the packaging bodies on the front and back sides of the bypass diode and at the contact position of the packaging bodies and the frame, and then moisture can enter from the gaps, but the packaging bodies with sufficient length are not arranged on the two sides of the chip region to block the gaps, so that the moisture can penetrate into the chip region, and finally the failure of the bypass diode is caused.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in overcoming prior art's not enough, provides a bypass diode frame and bypass diode for the packaging body of the bypass diode positive and negative among the solution prior art combines department, packaging body and frame to easily produce the gap, and the easy infiltration gap of aqueous vapor gets into the bypass diode inside then, leads to the technical problem that the bypass diode broke down.

The utility model provides an above-mentioned technical problem's technical scheme as follows: a bypass diode frame, comprising:

the first frame is provided with a chip placing area, and abdicating notches are formed in two sides of the root of the chip placing area;

and one end of the second frame is provided with two pins, and the two pins are respectively arranged on two sides of the chip placing area.

The bypass diode frame has seted up the breach of stepping down in the root both sides that the district was placed to the chip, and two pins place the both sides in district at the chip, and then the pin can directly communicate the breach of stepping down with the slot that the district was formed is placed to the chip for the length of slot can extend, can block comprehensively that the chip places the district, forms the wall.

Further: the chip placing area and the pins are provided with a plurality of through holes;

the beneficial effects of the step are as follows: the through holes are used for enabling the packaging bodies on the front side and the back side to be communicated, and the connection effect of the packaging bodies and the bypass diode frame is enhanced.

Further: the diameter of the through hole is 0.8-1.5 mm;

the beneficial effects of the step are as follows: the diameter of the through hole is too small, so that the package body in a molten state is not favorable to flowing in the through hole, and the too large diameter of the through hole can occupy too large area of the frame, so that the strength of the pin and the chip placing area is reduced.

Further: the outer side surface of the pin is also provided with a wave-shaped bulge;

the beneficial effects of the step are as follows: the wavy bulge is used for increasing the contact area between the outer side surface of the pin and the packaging body, and further increasing the connection strength between the pin and the packaging body.

Further, the method comprises the following steps: the front and back surfaces of the rear section of the chip placing area and the rear section of the pin are provided with continuous wave-shaped grooves;

the beneficial effects of the step are as follows: the wavy groove is still used for enhancing the contact area between the chip placing area and the pins and the packaging body, and further enhancing the connection strength between the chip placing area and the pins.

The utility model also provides a bypass diode, include:

the bypass diode frame according to any one of claims 1 to 5, the chip placement region for placing a chip;

the jumper wire is used for electrically connecting the chip and the pin;

and the packaging body is used for packaging the chip placing area and the pins.

This bypass diode lets the packaging body fill the slot between pin and the chip area of placing in, because the slot is through the extension of stepping down the breach for the packaging body can stop the both sides in the area are placed to the chip completely, even have the aqueous vapor to get into in the gap that the packaging body produced, also can not get into the chip and place the area, guarantees bypass diode normal work.

The utility model has the advantages that:

the grooves formed by the abdication gap extension pins and the chip placing area are utilized, so that the grooves on the two sides can completely cover the chip placing area, then the packaging body filled in the groove is utilized as a barrier to prevent water vapor from further entering the chip placing area, and the normal work of the bypass diode is ensured.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a structural diagram of a bypass diode frame provided by the present invention;

FIG. 2 is a bottom view of FIG. 1;

fig. 3 is a structural diagram of a bypass diode according to the present invention;

fig. 4 is a block diagram of a prior art bypass diode.

Reference numerals are as follows:

1-a first frame; 2-a second frame; 3-a through hole; 4-wave-shaped bulges; 5-a wave-shaped groove; 6-packaging body;

11-chip placement area; 12-abdication gap; 21-pin.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only used to illustrate the technical solutions of the present invention more clearly, and therefore are only used as examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Examples

As shown in fig. 1, fig. 2 and fig. 3, the present invention provides a bypass diode frame, including:

the first frame 1 is provided with a chip placing area 11, and abdicating notches 12 are formed in two sides of the root of the chip placing area 11;

and one end of the second frame 2 is provided with two pins 21, and the two pins 21 are respectively arranged on two sides of the chip placing area 11.

The notch 12 of stepping down has been seted up in the root both sides of district 11 is placed to the chip to the bypass diode frame, and two pins 21 place the both sides of district 11 at the chip, then the slot that district 11 formed is placed to pin 21 and chip can directly communicate notch 12 of stepping down for the length of slot can extend, can be used for holding packaging body 6, then utilize the packaging body that the inslot positive and negative fused as blockking the wall, can block comprehensively that the district 11 is placed to the chip, form and cut off, block the entering of aqueous vapor.

As shown in fig. 1 and 3, the chip placement region 11 and the leads 21 are both provided with a plurality of through holes 3; the through hole 3 is for the encapsulation 6 of the positive and negative can communicate, strengthens the connected effect of encapsulation 6 and bypass diode frame.

Wherein the diameter of the through hole 3 is 0.8-1.5 mm; too small a diameter of the through hole 3 is not conducive to the flow of the package 6 in a molten state inside the through hole, and too large a diameter occupies too large an area of the frame, thereby reducing the strength of the lead 21 and the chip placement area 11.

As shown in fig. 1 and 3, the outer side surface of the pin 21 is further provided with a wave-shaped protrusion 4; the wavy bumps 4 are used for increasing the contact area between the outer side surfaces of the leads 21 and the package 6, and further increasing the connection strength between the leads 21 and the package 6.

As shown in fig. 2, the front and back surfaces of the rear section of the chip placement region 11 and the rear section of the lead 21 are provided with continuous wave-shaped grooves 5; the wavy grooves 5 are still used for enhancing the contact area between the chip placement region 11 and the leads 21 and the package body 6, and further enhancing the connection strength between the two.

The utility model also provides a bypass diode, include:

a bypass diode frame, the chip placing area 11 is used for placing a chip;

a jumper wire for electrically connecting the chip and the pin 21;

and the packaging body 6 is used for packaging the chip placing area 11 and the pins 21 by the packaging body 6.

The bypass diode is formed by filling the packaging body 6 into a groove between the pin 21 and the chip placing area 11, and the groove extends through the abdicating notch 12, so that the packaging body 6 can completely block two sides of the chip placing area 11, and even if water enters a gap generated by the packaging body 6, the water cannot enter the chip placing area 11, and the normal work of the bypass diode is ensured.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims (6)

1. A bypass diode frame, comprising:

the first frame is provided with a chip placing area, and abdicating notches are formed in two sides of the root of the chip placing area;

and one end of the second frame is provided with two pins, and the two pins are respectively arranged at two sides of the chip placing area.

2. The bypass diode frame of claim 1, wherein the chip placement area and the leads are each formed with a plurality of through holes.

3. The bypass diode frame according to claim 2, wherein the through-hole has a diameter of 0.8 to 1.5mm.

4. The bypass diode frame according to claim 1, wherein the outer side of the leads is further provided with a wave-shaped protrusion.

5. The bypass diode frame according to claim 1, wherein the front and back surfaces of the rear section of the chip placement area and the rear section of the leads are each provided with a continuous wave-shaped groove.

6. A bypass diode, comprising:

the bypass diode frame according to any one of claims 1 to 5, the chip placement region for placing a chip;

the jumper wire is used for electrically connecting the chip and the pin;

and the packaging body is used for packaging the chip placing area and the pins.

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