CN219203124U - Wafer alignment device for upper and lower wafers of wafer bonding equipment - Google Patents
Wafer alignment device for upper and lower wafers of wafer bonding equipment Download PDFInfo
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- CN219203124U CN219203124U CN202320191425.XU CN202320191425U CN219203124U CN 219203124 U CN219203124 U CN 219203124U CN 202320191425 U CN202320191425 U CN 202320191425U CN 219203124 U CN219203124 U CN 219203124U
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Abstract
The utility model relates to the technical field of wafer bonding, and provides an upper and lower wafer alignment device of wafer bonding equipment, which is used for realizing alignment bonding of a first wafer and a second wafer and comprises a carrier, a compression joint shaft and a plurality of alignment mechanisms; the carrier is used for bearing and adsorbing the first wafer, the compression joint shaft is used for adsorbing and driving the second wafer to move towards the carrier, and the plurality of alignment mechanisms are uniformly distributed along the circumferential direction of the carrier; the alignment mechanism comprises an alignment table, a supporting table and an alignment driving component, wherein the alignment table is arranged on the outer side of the carrier, the supporting table is arranged above the carrier, one side of the supporting table is connected with one side of the alignment table, which faces the carrier, the other side of the supporting table extends towards the direction of the carrier, and the alignment driving component is used for driving the alignment table to approach or depart from the carrier along the horizontal direction. The alignment device provided by the utility model has a simpler structure, and effectively improves the alignment bonding efficiency of the wafers on the basis of ensuring that the first wafer and the second wafer can be aligned accurately and reducing the cost required by alignment.
Description
Technical Field
The utility model relates to the technical field of wafer bonding, in particular to an upper and lower wafer alignment device of wafer bonding equipment.
Background
Wafer bonding refers to bonding two wafers face to face, and applying external conditions such as certain pressure, temperature, voltage and the like to enable bonding between the surfaces of the two wafers to reach certain strength, so that the two wafers are integrated, and the number of devices in a unit area can be effectively increased.
The bonding of the wafers is usually completed by adopting wafer bonding equipment, two wafers are usually required to be aligned before bonding, most of the wafer bonding equipment is currently aligned by adopting an upper wafer and a lower wafer in a twice alignment mode, a first wafer is firstly placed on a carrier, then aligned by a arraying mechanism, after alignment, another group of mechanisms move forward and catch a second wafer, then aligned by the arraying mechanism again, and after alignment, another group of mechanisms of the second wafer are withdrawn, and then two-side bonding is performed. In addition, some wafer bonding devices adopt an optical lens to select reference points on an upper wafer and a lower wafer, and the bonding of the upper wafer and the lower wafer is realized in a bonding mode after the alignment by the equivalent alignment of an XY theta axis, but the system used in the mode has high cost and low cost performance in the bonding field with low requirements on non-graphic bonding processing and the like.
Disclosure of Invention
The utility model aims to provide an upper and lower wafer alignment device of wafer bonding equipment, which at least reduces the cost required by alignment and improves the wafer alignment bonding efficiency on the basis of simplifying the whole structure of the alignment device.
The aim of the utility model is achieved by the following technical scheme:
the utility model provides an upper and lower wafer alignment device of wafer bonding equipment, which is used for realizing alignment bonding of a first wafer and a second wafer and comprises a carrier, a compression joint shaft and a plurality of alignment mechanisms;
the shape of the carrying platform is matched with that of the first wafer, the carrying platform is used for carrying and adsorbing the first wafer, the compression joint shaft is arranged right above the carrying platform and used for adsorbing and driving the second wafer to move towards the carrying platform, and the alignment mechanisms are uniformly distributed along the circumferential direction of the carrying platform;
the alignment mechanism comprises an alignment table, a support table and an alignment driving component, wherein the alignment table is arranged on the outer side of the carrier table, the support table is located above the carrier table, one side of the support table is connected with one side of the alignment table, which faces the carrier table, of the support table, the other side of the support table extends towards the direction where the carrier table is located, and the alignment driving component is used for driving the alignment table to approach or depart from the carrier table along the horizontal direction.
In some possible embodiments, the top surface of the pedestal is beveled and is adapted to the lower surface of the second wafer.
In some possible embodiments, the upper part of the alignment table is in a bevel structure on the side close to the carrier, and the diameter of the crimping shaft is smaller than the diameter of the carrier.
In some possible embodiments, the diameter of the crimp shaft is 1.5mm smaller than the diameter of the carrier.
In some possible embodiments, the alignment device further includes a jacking mechanism, where the jacking mechanism includes a plurality of pins and a jacking driving component, and the plurality of pins are vertically disposed on the top surface of the carrier, and the jacking driving component is used to drive the pins to reciprocate along a vertical direction.
The technical scheme of the embodiment of the utility model has at least the following advantages and beneficial effects:
compared with the existing wafer alignment device, the upper and lower wafer alignment device of the wafer bonding equipment provided by the utility model has the advantages that the structure of the whole alignment device is simpler, the alignment bonding of the first wafer and the second wafer can be realized at the same time, the two alignments are not needed, the first wafer and the second wafer can be accurately aligned, and the alignment bonding efficiency of the wafer is effectively improved on the basis of reducing the cost required by alignment.
Drawings
FIG. 1 is a schematic diagram of a wafer alignment apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a wafer alignment apparatus during a first step of wafer alignment bonding stage;
FIG. 3 is a schematic diagram of a wafer alignment apparatus during a second step of wafer alignment bonding;
FIG. 4 is a schematic diagram of a wafer alignment apparatus during a third step of wafer alignment bonding stage;
FIG. 5 is a schematic diagram of a wafer alignment apparatus during a fourth step of wafer alignment bonding stage;
fig. 6 is a schematic structural diagram of the wafer alignment device when the fifth step is performed in the wafer alignment bonding stage.
Icon: 10-carrier, 20-crimping shaft, 30-aligning mechanism, 31-aligning table, 32-carrier, 40-thimble, 50-sensor, 100-first wafer, 200-second wafer.
Detailed Description
Examples
Referring to fig. 1 to 6, the present embodiment provides an upper and lower wafer alignment device of a wafer bonding apparatus for implementing alignment bonding between a first wafer 100 and a second wafer 200, so as to reduce the cost required for alignment and improve the wafer alignment bonding efficiency at least on the basis of simplifying the overall structure of the alignment device. Specifically, the alignment device includes a stage 10, a press-fit shaft 20, and a plurality of alignment mechanisms 30.
In the present embodiment, in combination with what is shown in fig. 2 to 6, the shape of the carrier 10 is adapted to the first wafer 100, that is, the carrier 10 in the present embodiment is also circular based on a conventional wafer, and thus the diameter of the carrier 10 is the same as that of the first wafer 100, so as to carry and absorb the first wafer 100 by the carrier 10. Note that, for the technical means for adsorbing the first wafer 100 by the stage 10, reference may be made to an adsorption mechanism (for example, a vacuum adsorption mechanism) used in the conventional wafer bonding apparatus, and this portion is not modified according to the present embodiment, and the structure of the adsorption mechanism is not described herein.
In this embodiment, as shown in fig. 1, the pressing shaft 20 is disposed directly above the carrier 10 and can reciprocate along a vertical direction, the pressing shaft 20 is used to adsorb and drive the second wafer 200 to move toward the carrier 10, that is, after the first wafer 100 and the second wafer 200 are aligned, the pressing shaft 20 can adsorb and drive the second wafer 200 to approach the first wafer 100 carried on the carrier 10, so that the lower surface of the second wafer 200 contacts and adheres to the upper surface of the first wafer 100, and a certain pressure is applied to the first wafer 100 and the second wafer 200 by the pressing shaft 20, so as to bond the first wafer 100 and the second wafer 200.
It should be noted that, for the driving component that drives the pressing shaft 20 to reciprocate in the vertical direction, reference may be made to the driving component in the conventional wafer bonding apparatus, and the description thereof will not be repeated here. Also, for the technical means for sucking the second wafer 200 by the press-bonding shaft 20, reference may be made to a suction mechanism (e.g., a vacuum suction mechanism) used in the conventional wafer bonding apparatus, and this portion is not modified based on the present embodiment, and the structure of the suction mechanism will not be described herein.
In order to simplify the overall structure of the alignment device used in the process of aligning and bonding two wafers and improve the efficiency of aligning and bonding the two wafers, a plurality of alignment mechanisms 30 for simultaneously aligning the first wafer 100 and the second wafer 200 are added in this embodiment, wherein the plurality of alignment mechanisms 30 are uniformly distributed along the circumferential direction of the carrier 10, specifically, the plurality of alignment mechanisms 30 are distributed in an annular array along the circumferential direction of the carrier 10, and, for example, in combination with the content shown in fig. 1, two alignment mechanisms 30 are symmetrically disposed on two sides of the carrier 10, and of course, the number of the alignment mechanisms 30 may be selected according to the needs in practical implementation, for example, four, six or eight alignment mechanisms 30 may be selected to improve the reliability when the wafer is clamped by using the alignment mechanisms 30 in the alignment stage.
Specifically, with continued reference to fig. 1, the alignment mechanism 30 for effecting alignment of the first wafer 100 and the second wafer 200 includes an alignment stage 31, a stage 32, and an alignment driving member (not shown in the figure). The alignment table 31 is disposed on the outer side of the carrier 10, the supporting table 32 is disposed above the carrier 10, one side of the supporting table 32 is connected to one side of the alignment table 31 facing the carrier 10, the other side of the supporting table 32 extends toward the carrier 10 to temporarily support the second wafer 200 through the supporting table 32 in the alignment stage, and the alignment driving component is used for driving the alignment table 31 to approach or depart from the carrier 10 along the horizontal direction so as to limit the positions of the first wafer 100 and the second wafer 200 through the alignment table 31 and clamp the first wafer 100 and the second wafer 200 during alignment. The alignment driving component in this embodiment may be, but not limited to, a conventional linear driving device such as an air cylinder, a hydraulic cylinder, or an electric push rod.
Meanwhile, considering that the upper and lower surfaces of the conventional wafer are both arc structures with outwards protruding centers, in order to avoid friction damage to the lower surface of the second wafer 200 when the second wafer 200 is temporarily placed on the supporting platform 32 of the plurality of alignment mechanisms 30 and the supporting platform 31 is driven by the alignment driving component to move towards the center of the second wafer 200, in combination with the content shown in fig. 1, the top surface of the supporting platform 32 is an inclined surface and is adapted to the lower surface of the second wafer 200, specifically, the position of the top surface of the supporting platform 32 close to one side of the carrying platform 10 is lower, so that the contact between the top surface of the supporting platform 32 and the lower surface of the second wafer 200 belongs to line contact in the moving process, and the lower surface of the second wafer 200 is prevented from being scratched when the supporting platform 32 is used for carrying the second wafer 200, in addition, after the first wafer 100 and the second wafer 200 are aligned, the supporting platform 31 is always adsorbed by the crimping shaft 20, and therefore, when the plurality of alignment mechanisms 30 drive the corresponding supporting platform 32 towards the direction of the carrying platform 10, dust is not scratched from being firmly, and dust is prevented from being generated, and the quality of the second wafer 200 is not scratched from being firmly moving from the carrying the second wafer 200.
In addition, in order to avoid touching the alignment mechanism 30 during the downward movement of the crimp shaft 20 in the bonding stage, with continued reference to fig. 1, the present embodiment sets the upper portion of the alignment stage 31 of each alignment mechanism 30 near the stage 10 to be of a slant structure, and the upper portion of the alignment stage 31 near the stage 10 is lower, while limiting the diameter of the crimp shaft 20 to be smaller than the diameter of the stage 10, preferably, the diameter of the crimp shaft 20 is smaller than the diameter of the stage 10 by 1.5mm.
On the other hand, in order to facilitate the picking of the bonded first wafer 100 and second wafer 200 on the carrier 10 after the bonding is completed, with continued reference to fig. 1, the alignment apparatus further includes a lifting mechanism, where the lifting mechanism includes a plurality of pins 40 and a lifting driving component (not shown in the drawing), and the plurality of pins 40 are vertically disposed on the top surface of the carrier 10, that is, the axis of the pins 40 is perpendicular to the top surface of the carrier 10, and the lifting driving component is used to drive the pins 40 to reciprocate along the vertical direction, so that the pins 40 can extend to the top surface of the carrier 10 or be hidden inside the carrier 10.
It will be appreciated that the lift driving means for driving the ejector pins 40 to reciprocate in the vertical direction may be a conventional linear driving device such as a cylinder, a hydraulic cylinder or an electric push rod, which is not particularly limited herein.
In order to more clearly and intuitively understand the alignment device for the upper and lower wafers of the wafer bonding apparatus provided in this embodiment, the working principle of the alignment device will be further described below, so as to facilitate understanding of a specific alignment bonding process of the first wafer 100 and the second wafer 200.
Specifically, the process of bonding the first wafer 100 and the second wafer 200 in alignment includes:
in the first step, in the initial state, the plurality of pins 40 of the lifting mechanism extend to the top surface of the carrier 10, the plurality of alignment mechanisms 30 are located at positions far away from the carrier 10, the pressing shaft 20 is also located at positions far away from the carrier 10, the first wafer 100 is placed on the carrier 10 by using a manipulator or a hand to support the first wafer 100 by the plurality of pins 40, and then the plurality of pins 40 are driven by the lifting driving component to move downwards and are hidden inside the carrier 10, so that the first wafer 100 is directly carried on the top surface of the carrier 10, and the structure of the wafer alignment device is shown in fig. 2.
In the second step, the alignment driving means of the alignment mechanisms 30 simultaneously drive the corresponding alignment table 31 to move a certain distance in the direction of the carrier 10 until the support 32 of each alignment mechanism 30 moves to a position where at least a portion is located right above the carrier 10. Subsequently, the second wafer 200 is placed on the stages 32 of the plurality of alignment mechanisms 30 to commonly support the second wafer 200 by the stages 32 of the plurality of alignment mechanisms 30, at which time the wafer alignment apparatus is structured as shown in fig. 3. It should be noted that, in order to reduce the motion deviation caused by the excessively long distance of the pressing shaft 20 driving the second wafer 200 to move downward, the distance between the second wafer 200 and the first wafer 100 should be sufficiently small, preferably about 5mm after the second wafer 200 is placed.
In the third step, the alignment driving parts of the alignment mechanisms 30 simultaneously drive the corresponding alignment stages 31 to move towards the direction of the carrier 10 again, based on the shape of the carrier 10 being adapted to the shape of the first wafer 100, and the shape of the first wafer 100 being identical to the shape of the second wafer 200, therefore when the side of the alignment stages 31 of the alignment mechanisms 30 close to the carrier 10 contacts the outer wall of the carrier 10, the side of the alignment stages 31 close to the carrier 10 just contacts the circumferential side walls of the first wafer 100 and the second wafer 200, so that the first wafer 100 and the second wafer 200 are clamped by the alignment stages 31 of the alignment mechanisms 30, and the first wafer 100 and the second wafer 200 are accurately aligned, and then the carrier 10 firmly adsorbs the first wafer 100 to fix the position of the first wafer 100, and at this time, the wafer alignment device is structured as shown in fig. 4.
Fourth, the pressing shaft 20 starts to move downward along the vertical direction until the pressing shaft 20 stops moving after the bottom surface of the pressing shaft 20 contacts with the upper surface of the second wafer 200, so as to firmly adsorb the second wafer 200 by using the pressing shaft 20, and then, the alignment driving components of the alignment mechanisms 30 simultaneously drive the corresponding alignment platforms 31 to move in a direction away from the carrier 10 until the alignment platforms 31 of all the alignment mechanisms 30 drive the corresponding pallets 32 to leave the area of the carrier 10, at this time, the structure of the wafer alignment device is shown in fig. 5. It will be appreciated that in connection with the description of fig. 1-6, a corresponding sensor 50 (e.g., a positioning sensor or an induction sensor) may be provided at a location corresponding to the stage 32 of the alignment mechanism 30 in order to be able to stop in time when the crimp shaft 20 moves down to the location of the second wafer 200, thereby avoiding the crimp shaft 20 from crushing the second wafer 200.
Fifth, the pressing shaft 20 moves downward again along the vertical direction to drive the second wafer 200 to move toward the position of the first wafer 100 until the lower surface of the second wafer 200 contacts with the upper surface of the first wafer 100, and then a certain pressure is applied to the first wafer 100 and the second wafer 200 by the pressing shaft 20, so as to achieve the bonding of the first wafer 100 and the second wafer 200, and at this time, the structure of the wafer alignment device is shown in fig. 6. After bonding is completed, the press-connection shaft 20 moves upward along the vertical direction and resets, and at this time, the plurality of ejector pins 40 can be driven by the lifting driving component to move upward so as to lift the bonded first wafer 100 and second wafer 200 off from the top surface of the carrier 10, so that the bonded first wafer 100 and second wafer 200 can be removed.
Therefore, compared with the existing wafer alignment device, the wafer alignment device provided by the embodiment has a simpler structure, can realize alignment bonding of the first wafer 100 and the second wafer 200 at the same time, does not need two times of alignment, ensures that the first wafer 100 and the second wafer 200 can be aligned accurately, and reduces the cost required by alignment, thereby effectively improving the wafer alignment bonding efficiency.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (5)
1. An upper and lower wafer alignment device of wafer bonding equipment is used for realizing alignment bonding of a first wafer and a second wafer and is characterized by comprising a carrier, a compression joint shaft and a plurality of alignment mechanisms;
the shape of the carrying platform is matched with that of the first wafer, the carrying platform is used for carrying and adsorbing the first wafer, the compression joint shaft is arranged right above the carrying platform and used for adsorbing and driving the second wafer to move towards the carrying platform, and the alignment mechanisms are uniformly distributed along the circumferential direction of the carrying platform;
the alignment mechanism comprises an alignment table, a support table and an alignment driving component, wherein the alignment table is arranged on the outer side of the carrier table, the support table is located above the carrier table, one side of the support table is connected with one side of the alignment table, which faces the carrier table, of the support table, the other side of the support table extends towards the direction where the carrier table is located, and the alignment driving component is used for driving the alignment table to approach or depart from the carrier table along the horizontal direction.
2. The wafer alignment device of claim 1, wherein the top surface of the support is a bevel and is adapted to the bottom surface of the second wafer.
3. The alignment device for upper and lower wafers of wafer bonding equipment according to claim 1, wherein the upper part of the alignment table is in an inclined surface structure on one side close to the carrier, and the diameter of the press-connection shaft is smaller than the diameter of the carrier.
4. The wafer bonding apparatus upper and lower wafer alignment device according to claim 3, wherein the diameter of the press-fit shaft is 1.5mm smaller than the diameter of the stage.
5. The wafer alignment device for wafer bonding equipment according to claim 1, further comprising a lifting mechanism, wherein the lifting mechanism comprises a plurality of ejector pins and a lifting driving component, the ejector pins are vertically arranged on the top surface of the carrier, and the lifting driving component is used for driving the ejector pins to reciprocate along a vertical direction.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202320191425.XU CN219203124U (en) | 2023-02-03 | 2023-02-03 | Wafer alignment device for upper and lower wafers of wafer bonding equipment |
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| CN202320191425.XU CN219203124U (en) | 2023-02-03 | 2023-02-03 | Wafer alignment device for upper and lower wafers of wafer bonding equipment |
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| CN219203124U true CN219203124U (en) | 2023-06-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117133708A (en) * | 2023-10-26 | 2023-11-28 | 迈为技术(珠海)有限公司 | Bonding device and semiconductor bonding equipment |
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- 2023-02-03 CN CN202320191425.XU patent/CN219203124U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117133708A (en) * | 2023-10-26 | 2023-11-28 | 迈为技术(珠海)有限公司 | Bonding device and semiconductor bonding equipment |
| CN117133708B (en) * | 2023-10-26 | 2024-01-30 | 迈为技术(珠海)有限公司 | Bonding device and semiconductor bonding equipment |
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