CN217098383U - Wafer scribing machine - Google Patents

Abstract

The utility model relates to the technical field of wafer processing, in particular to a wafer dicing machine, which comprises a moving component, a dicing workpiece, and an adsorption component. When the wafer needs to be diced, the wafer is placed on the On the plate, the vacuum pump inside the placement tank is started, and the output end of the vacuum pump drives the connected connecting pipe to adsorb the fixedly connected adsorption plate, and the adsorption plate absorbs the upper placement plate. Above the placement plate, there are several The adsorption hole allows the wafer placed above to be adsorbed through a plurality of adsorption holes, so that the wafer can be fixed. After it is fixed, the upper mobile component is activated, and the mobile component drives the fixedly connected dicing below. It is very convenient to perform dicing processing on the fixed wafer, thereby improving the processing efficiency.

Description

A wafer dicing machine

technical field

The utility model relates to the technical field of wafer processing, in particular to a wafer dicing machine.

Background technique

Most of the current wafer dicing machines manually move the dicing workpiece when dicing the wafer, which is very inconvenient and prone to errors and also affects the processing progress.

At present, there is a wafer dicing machine. By arranging a moving assembly above the dicing workpiece, the motor of the moving assembly drives a lead screw, and the slider set above the lead screw can drive the dicing workpiece below. It can be moved so that its wafers can be easily processed, which is very convenient and thus improves the processing progress.

However, when the above-mentioned moving component drives the dicing workpiece to process the wafer, the wafer needs to be fixed, and the existing wafer dicing machine has poor fixing effect on the wafer, thus affecting the processing effect.

Utility model content

The purpose of the utility model is to provide a wafer dicing machine, which aims to solve the problem in the prior art that when the wafer is processed, the wafer needs to be fixed, and the existing wafer dicing machine has the Fixed technical problems with poor results that affected the processing results.

In order to achieve the above purpose, a wafer dicing machine adopted by the present invention includes a moving component and a dicing workpiece, and also includes an adsorption component,

The adsorption assembly includes a base, an operation table, a placement table, a vacuum pump, a connecting pipe, an adsorption tray and a placement tray. The operation table is fixedly connected to the base and is located above the base, and the placement table is arranged on the base. Above the operating table, the placing table has a placing groove, the vacuum pump is fixedly connected to the placing table, and is located inside the placing groove, and one end of the connecting pipe is fixedly connected to the output end of the vacuum pump, The other end of the vacuum pump is communicated with the adsorption disk, the adsorption disk is arranged above the placement groove, the placement disk has a plurality of adsorption holes, the placement disk is fixedly connected with the adsorption disk, and is located at the position of the adsorption disk. above the suction tray, and the placement tray is located below the dicing workpiece.

Wherein, the adsorption assembly further includes an annular rubber frame, the annular rubber frame is fixedly connected with the adsorption disk, and is located on the side of the adsorption disk.

Wherein, the adsorption assembly further includes a sealing collar, which is fixedly connected with the vacuum pump and is located on the side of the vacuum pump, and the sealing collar is sleeved on the outside of the connecting pipe.

Wherein, the wafer dicing machine further includes an auxiliary component, the auxiliary component is fixedly connected with the operating table, and is located above the operating table and on the side of the placing table.

Wherein, the auxiliary assembly includes a limit plate, an air cylinder, an extension rod and a connecting plate, the limit plate is fixedly connected to the operating table and is located above the operating table, and the air cylinder is connected to the limit plate It is fixedly connected and located on the side of the limit plate. One end of the extension rod is fixedly connected to the output end of the cylinder, and the other end of the extension rod is fixedly connected to the connecting plate. The placing table is fixedly connected and located on the side of the placing table.

Wherein, the moving assembly includes a column, a beam, a motor, a lead screw, a slider and a connecting rod, the number of the columns is two, and the two columns are respectively arranged above the base, the beam and the The column is fixedly connected and located above the column, the beam has a chute, the motor is arranged on the side of the beam, and one end of the lead screw is fixedly connected with the output end of the motor, so The other end of the lead screw is inserted into the beam and is located inside the chute, the slider is arranged above the lead screw, and one end of the connecting rod is fixedly connected to the slider, and the connection The other end of the rod is fixedly connected with the dicing workpiece, and the dicing workpiece is located above the adsorption assembly.

Wherein, the moving assembly further includes a connecting sleeve, the connecting sleeve is fixedly connected with the sliding block, is located below the sliding block, and is sleeved on the outside of the connecting rod.

A wafer dicing machine of the utility model, when the wafer needs to be diced, the wafer is placed on the placement tray, and the vacuum pump inside the placement groove is activated, and the vacuum pump The output end will drive the connected connecting pipe to adsorb the fixedly connected adsorption disk, and the adsorption disk will adsorb the placement disk above, and above the placement disk are provided a plurality of the The adsorption hole is used to adsorb the wafer placed above through a plurality of the adsorption holes, so that the wafer can be fixed. After it is fixed, the moving component above is activated. The two vertical columns of the moving assembly are respectively arranged opposite to the upper part of the base, and can support the upper beam, the beam has the chute, and the motor is arranged on the side of the beam, When the wafer fixed below needs to be diced, the dicing workpiece is driven to move, the dicing workpiece is diced, the motor is started, and the output end of the motor drives the fixed The connected lead screw rotates inside the chute, so as to drive the slider set above the lead screw to move inside the slide slot, thereby driving the slider set below the slider The connecting rod moves, so that the connecting rod can drive the fixedly connected dicing workpiece to scribe the wafer fixed below to improve the dicing of the wafer, thereby improving the processing effect, which is very convenient.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic diagram of the overall structure of the first embodiment of the present invention.

FIG. 2 is an overall cross-sectional view of the first embodiment of the present invention.

FIG. 3 is a schematic diagram of the overall structure of the second embodiment of the present invention.

FIG. 4 is an overall cross-sectional view of the second embodiment of the present invention.

101-Scribing workpiece, 102-Base, 103-Operation table, 104-Place table, 105-Vacuum pump, 106-Connecting pipe, 107-Adsorption plate, 108-Place plate, 109-Place slot, 110-Adsorption hole, 111 -Annular rubber frame, 112-sealing collar, 213-limiting plate, 214-cylinder, 215-extension rod, 216-connecting plate, 317-post, 318-beam, 319-motor, 320-lead screw, 321- Slider, 322-connecting rod, 323-chute, 324-connecting sleeve.

Detailed ways

The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to be used to explain the present invention, but should not be construed as a limitation of the present invention.

In the description of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical" , "horizontal", "top", "bottom", "inside", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, only for the convenience of describing the present utility model and simplifying the description, Rather than indicating or implying that the indicated device or element must have a particular orientation, be constructed and operate in a particular orientation, it should not be construed as a limitation of the present invention. In addition, in the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

The first embodiment of the present application is:

Please refer to FIG. 1 and FIG. 2, the wafer dicing machine includes a moving component and a dicing workpiece 101, and also includes an adsorption component. The adsorption component includes a base 102, an operation table 103, a placing table 104, a vacuum pump 105, a connection The tube 106, the suction plate 107 and the placing plate 108, the operation table 103 is fixedly connected with the base 102 and is located above the base 102, the placing table 104 is arranged above the operation table 103, the The placing table 104 has a placing groove 109, the vacuum pump 105 is fixedly connected with the placing table 104, and is located inside the placing groove 109, and one end of the connecting pipe 106 is fixedly connected with the output end of the vacuum pump 105, so The other end of the vacuum pump 105 is communicated with the suction plate 107, the suction plate 107 is arranged above the placement groove 109, the placement plate 108 has a plurality of suction holes 110, and the placement plate 108 is connected to the suction plate The tray 107 is fixedly connected and located above the suction tray 107 , and the placing tray 108 is located below the dicing workpiece 101 .

The placing table 104 has a placing groove 109 , the vacuum pump 105 is fixedly connected to the placing table 104 and located inside the placing groove 109 , and one end of the connecting pipe 106 is fixedly connected to the output end of the vacuum pump 105 , the other end of the vacuum pump 105 is communicated with the adsorption plate 107, the adsorption plate 107 is arranged above the placement groove 109, the placement plate 108 has a plurality of adsorption holes 110, and the placement plate 108 is connected to the The suction tray 107 is fixedly connected and located above the suction tray 107 , and the placement tray 108 is located below the dicing workpiece 101 .

The suction assembly further includes an annular rubber frame 111 , and the annular rubber frame 111 is fixedly connected to the suction disk 107 and located on the side of the suction disk 107 .

The adsorption assembly further includes a sealing collar 112 , the sealing collar 112 is fixedly connected with the vacuum pump 105 and is located on the side of the vacuum pump 105 , and the sealing collar 112 is sleeved on the connecting pipe 106 the exterior.

The moving assembly includes a column 317, a beam 318, a motor 319, a lead screw 320, a slider 321 and a connecting rod 322. The number of the columns 317 is two, and the two columns 317 are respectively opposite to the base 102. Above, the beam 318 is fixedly connected with the column 317, and is located above the column 317, the beam 318 has a chute 323, the motor 319 is arranged on the side of the beam 318, the wire One end of the rod 320 is fixedly connected to the output end of the motor 319 , the other end of the lead screw 320 is inserted into the beam 318 and is located inside the chute 323 , and the slider 321 is arranged on the lead screw Above 320, one end of the connecting rod 322 is fixedly connected with the slider 321, and the other end of the connecting rod 322 is fixedly connected with the dicing workpiece 101, and the dicing workpiece 101 is located in the suction assembly above.

The moving assembly further includes a connecting sleeve 324 , the connecting sleeve 324 is fixedly connected with the sliding block 321 , is located below the sliding block 321 , and is sleeved on the outside of the connecting rod 322 .

The moving component can drive the dicing workpiece 101 disposed below to move, and the adsorption component can adsorb and fix the wafer to be diced, so that the wafer can be diced stably.

The operating table 103 is arranged above the base 102 and can support the operating table 103 , and the placing table 104 is arranged above the operating table 103 , and the placing table 104 has the placing groove 109 , the vacuum pump 105 is arranged inside the placing slot 109, the output end of the vacuum pump 105 is connected with the connecting pipe 106, the suction plate 107 is connected with the connecting pipe 106, and the placing plate 108 is set Above the placement groove 109 , the annular rubber frame 111 is disposed above the suction disk to protect the placed wafer, and the sealing collar 112 is sleeved on the outside of the connecting pipe 106 . When the vacuum pump is in operation, the connecting pipe 106 can be protected and the sealing effect can be enhanced. When the wafer needs to be diced, the wafer is placed on the placing plate 108, and the operation is started. The vacuum pump 105 inside the placement tank 109, the output end of the vacuum pump 105 drives the connected connecting pipe 106 to adsorb the fixedly connected adsorption disk 107, and the adsorption disk 107 will move the upper The placement tray 108 is adsorbed, and a plurality of the adsorption holes 110 are arranged above the placement tray 108 , and the wafers placed above are adsorbed through the plurality of adsorption holes 110 , so that the wafers can be adsorbed. After it is fixed, the moving assembly above is activated. The moving assembly and the two uprights 317 of the moving assembly are respectively arranged opposite to the upper part of the base 102, and can face the upper part of the moving assembly. The beam 318 supports the beam 318. The beam 318 has the chute 323. The motor 319 is arranged on the side of the beam 318. When the wafer fixed below needs to be diced, the dicing workpiece is driven. 101 to move, the scribing workpiece 101 will scrib it, then the motor 319 will be activated, and the output end of the motor 319 will drive the fixedly connected lead screw 320 to rotate inside the chute 323 , so as to drive the slider 321 disposed above the lead screw 320 to move inside the chute 323, and to drive the connecting rod 322 disposed under the slider 321 to move, so that the connection The rod 322 can drive the fixedly connected dicing workpiece 101 to scribe the wafer fixed below to improve the dicing of the wafer, thereby improving the processing effect, which is very convenient.

The second embodiment of the present application is:

Please refer to FIG. 3 and FIG. 4 , on the basis of the first embodiment, the wafer dicing machine further includes an auxiliary component, which is fixedly connected to the operation table 103 and located on the side of the operation table 103 . above and on the side of the placing table 104 .

The auxiliary assembly includes a limit plate 213, a cylinder 214, an extension rod 215 and a connecting plate 216. The limit plate 213 is fixedly connected to the operating table 103 and is located above the operating table 103. The air cylinder 214 It is fixedly connected with the limit plate 213 and is located on the side of the limit plate 213. One end of the extension rod 215 is fixedly connected to the output end of the air cylinder 214, and the other end of the extension rod 215 is connected to the The connecting plate 216 is fixedly connected, the connecting plate 216 is fixedly connected to the placing table 104 and is located on the side of the placing table 104 .

The auxiliary component is disposed above the operating table 103 and on the side of the placing table 104. After the suction component fixes the wafer, the auxiliary component can assist the wafer to change the direction of dicing , so as to facilitate the dicing of its wafers.

When the moving component drives the dicing workpiece 101 disposed below to perform dicing on the wafer surface, the auxiliary component on the side of the placing table 104 is activated, and the side of the limiting plate 213 is activated. The cylinder 214, the output end of the cylinder 214 drives the extension rod 215 that is fixedly connected to extend, the extension rod 215 pushes the connection plate 216 that is fixedly connected, and the connection plate 216 drives The fixedly connected placing table 104 is pushed left and right on the operating table 103, so that the dicing direction of the wafer can be changed, the dicing of the wafer can be strengthened, and the dicing effect can be improved.

What has been disclosed above is only a preferred embodiment of the present invention, and of course it cannot limit the scope of the rights of the present invention. Those of ordinary skill in the art can understand that all or part of the process for realizing the above-mentioned embodiment can be implemented according to the present invention. The equivalent changes made by the claims of the utility model still belong to the scope covered by the utility model.

Claims (7)

1. A wafer dicing saw comprises a moving assembly and a dicing workpiece, wherein the moving assembly is fixedly connected with the dicing workpiece and is positioned above the dicing workpiece,

also comprises an adsorption component which is arranged on the shell,

the adsorption component comprises a base, an operating platform, a placing platform, a vacuum pump, a connecting pipe, an adsorption disc and a placing disc, wherein the operating platform is fixedly connected with the base and is positioned above the base, the placing platform is arranged above the operating platform and is provided with a placing groove, the vacuum pump is fixedly connected with the placing platform and is positioned inside the placing groove, one end of the connecting pipe is fixedly connected with the output end of the vacuum pump, the other end of the vacuum pump is communicated with the adsorption disc, the adsorption disc is arranged above the placing groove, the placing disc is provided with a plurality of adsorption holes, the placing disc is fixedly connected with the adsorption disc and is positioned above the adsorption disc, and the placing disc is positioned below the scribing workpiece.

2. The wafer dicing saw of claim 1,

the adsorption component further comprises an annular rubber frame, and the annular rubber frame is fixedly connected with the adsorption disc and is positioned on the side edge of the adsorption disc.

3. The wafer dicing saw of claim 2,

the adsorption component further comprises a sealing sleeve ring, the sealing sleeve ring is fixedly connected with the vacuum pump and is positioned on the side edge of the vacuum pump, and the sealing sleeve ring is sleeved outside the connecting pipe.

4. The wafer dicing saw of claim 3,

the wafer scribing machine further comprises an auxiliary assembly, wherein the auxiliary assembly is fixedly connected with the operating platform, is positioned above the operating platform and is positioned on the side edge of the placing platform.

5. The wafer dicing saw of claim 4,

the auxiliary assembly comprises a limiting plate, a cylinder, an extension rod and a connecting plate, the limiting plate is fixedly connected with the operating platform and is located above the operating platform, the cylinder is fixedly connected with the limiting plate and is located on the side edge of the limiting plate, one end of the extension rod is fixedly connected with the output end of the cylinder, the other end of the extension rod is fixedly connected with the connecting plate, and the connecting plate is fixedly connected with the placing platform and is located on the side edge of the placing platform.

6. The wafer dicing saw of claim 5,

the movable assembly comprises two columns, a cross beam, a motor, a lead screw, a sliding block and a connecting rod, wherein the columns are respectively and oppositely arranged above the base, the cross beam is fixedly connected with the columns and positioned above the columns, the cross beam is provided with a sliding groove, the motor is arranged on the side edge of the cross beam, one end of the lead screw is fixedly connected with the output end of the motor, the other end of the lead screw is inserted into the cross beam and positioned inside the sliding groove, the sliding block is arranged above the lead screw, one end of the connecting rod is fixedly connected with the sliding block, the other end of the connecting rod is fixedly connected with the scribing workpiece, and the scribing workpiece is positioned above the adsorption assembly.

7. The wafer dicing saw of claim 6,

the moving assembly further comprises a connecting sleeve, the connecting sleeve is fixedly connected with the sliding block and located below the sliding block, and the connecting sleeve is sleeved outside the connecting rod.

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