CN219163372U

CN219163372U - Wafer edge exposure device

Info

Publication number: CN219163372U
Application number: CN202222636255.XU
Authority: CN
Inventors: 程泽西; 王利; 周瑜
Original assignee: Gmc Semitech Co ltd
Current assignee: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd.
Priority date: 2022-10-08
Filing date: 2022-10-08
Publication date: 2023-06-09
Anticipated expiration: 2032-10-08

Abstract

The utility model relates to a wafer exposure device, in particular to a wafer edge exposure device, which comprises a sucker, an exposure device and a linear CCD, and further comprises: the frame, the exposer and the linear CCD are both arranged on the frame, and the linear CCD is positioned at one side of the exposer; the linear module is arranged on the frame; the movable seat is arranged on the sliding table of the linear module; the rotating motor is arranged on the movable seat, the sucker is arranged on the rotating motor, the axis of the sucker, the axis of the linear module and the axis of the exposure device are all in the same plane, the exposure device and the linear CCD are arranged opposite to the sucker, the linear CCD is used for detecting the eccentric distance between the wafer and the sucker, and the linear module is used for moving and compensating the eccentric distance of the wafer. The wafer edge exposure device provided by the utility model realizes the control of wafer movement by adopting the linear module and the linear CCD, reduces the volume, reduces the control requirement, realizes higher position precision and has a more compact structure.

Description

Wafer edge exposure device

Technical Field

The present utility model relates to a wafer exposure apparatus, and more particularly, to a wafer edge exposure apparatus.

Background

The edge of the wafer needs to be exposed by ultraviolet light, typically forming a ring-shaped exposure. When the wafer is placed on the sucker, the center of the wafer cannot coincide with the center of the sucker, so that the wafer is required to be moved according to the current state of the wafer during rotation, the exposure is enabled to form a uniform ring shape, and the exposure size is ensured. At present, the sucking disc is mainly arranged on a cross-shaped linear module, so that the bidirectional adjustment of an X axis and a Y axis is realized, and the edge of a wafer and an aerator are always in a fixed position, so that a uniform ring shape is formed. The thickness of the cross-shaped linear module is larger, so that the whole volume is larger, more space is occupied, the control requirement is higher, and the position accuracy is reduced by the two linear modules due to accumulated errors.

Disclosure of Invention

In order to solve the problems, the utility model provides a wafer edge exposure device which adopts a corresponding linear module, reduces the volume and has high precision, and the specific technical scheme is as follows:

the wafer edge exposure device comprises a sucker, an exposure device and a linear CCD, and further comprises: the frame, the said exposer and said linear CCD are installed on said frame, and the said linear CCD locates at one side of the said exposer; the linear module is arranged on the rack; the movable seat is arranged on the sliding table of the linear module; the rotary motor is installed on the movable seat, the sucker is installed on the rotary motor, the axis of the sucker, the axis of the linear module and the axis of the exposure device are all in the same plane, the exposure device and the linear CCD are arranged opposite to the sucker, the linear CCD is used for detecting the eccentricity of a wafer and the sucker, and the linear module is used for moving and compensating the eccentricity of the wafer.

Preferably, the linear module is mounted at the bottom of the base plate, the movable seat is movably inserted in a movable groove of the base plate, and the rotary motor is located at the top of the base plate.

Preferably, the height adjusting device is further included, and the height adjusting device includes: the exposure seat is fixed on the frame; the lifting seat is slidably arranged on the exposure seat, and the exposure device is arranged on the lifting seat; the differential head is arranged on the exposure seat and movably propped against the lifting seat to adjust the height of the lifting seat.

Further, the method further comprises the following steps: the connecting seat is fixed on the lifting seat; and the wear-resistant rod is fixed on the connecting seat and abuts against the differential head.

Preferably, the lifting device is further included, and the lifting device includes: the lifting cylinder is arranged on the frame; the lifting plate is arranged on the lifting cylinder, a lifting groove is formed in the lifting plate, and the sucker is positioned in the lifting groove; and the lifting rods are fixed on the lifting plate and are arranged along the lifting grooves, and the number of the lifting rods is not less than three and the lifting rods are used for lifting the wafer.

The wafer lifting device further comprises a lifting head, wherein the lifting head is installed on the lifting rod and used for being in contact with a wafer.

Further, the wafer processing device also comprises a lifting sensor, wherein the lifting sensor is arranged on the lifting plate and is opposite to the wafer.

Preferably, the method further comprises: the front baffle is fixed at one end of the frame and is provided with a feeding groove which is arranged opposite to the sucker; the rear baffle is arranged at the other end of the frame, and is opposite to the front baffle in height; the side baffles are fixed on two sides of the rack; and the top baffle plate is fixed at the top of the frame.

Compared with the prior art, the utility model has the following beneficial effects:

the wafer edge exposure device provided by the utility model realizes the control of wafer movement by adopting the linear module and the linear CCD, reduces the volume, reduces the control requirement, realizes higher position precision and has a more compact structure.

Drawings

FIG. 1 is a schematic diagram of a wafer edge exposure apparatus;

FIG. 2 is a schematic view of a wafer edge exposure apparatus with a wafer mounted thereon;

FIG. 3 is a schematic view of a wafer edge exposure apparatus equipped with a shutter;

FIG. 4 is a schematic view of a wafer edge exposure apparatus with a hidden frame;

FIG. 5 is a front view of FIG. 4;

FIG. 6 is a top view of FIG. 4;

fig. 7 is a schematic view of the structure of the lifting device.

Detailed Description

The utility model will now be further described with reference to the accompanying drawings.

Example 1

As shown in fig. 1 to 7, a wafer edge exposure apparatus includes a chuck 3, an exposure device 6, a linear CCD5, a frame 10, a linear module 2, a movable base 22, a rotary motor 4, and a substrate 11.

The frame 10 is a rectangular frame, the base plate 11 is fixed in the frame 10, the front baffle 12, the rear baffle 13, the side baffles 14 and the top baffle 15 are respectively arranged on the periphery and the top of the frame 10, and the feed chute 121 is arranged on the front baffle 12.

The linear module 2 is mounted on the substrate 11 and is located at the bottom of the substrate 11, the substrate 11 is provided with moving grooves 111 parallel to the linear module 2, and the moving grooves 111 are symmetrically located at two sides of the linear module 2. The moving seat 22 is fixed on the sliding table 21 of the linear module 2 and passes through the two moving grooves 111. The linear module 2 is located below the substrate 11, so that parts above the substrate 11 are reduced, a working area is tidier, cleaning is convenient, and influence on a wafer is reduced.

The rotating electrical machines 4 are installed at the top of the movable seat 22, the motor shafts of the rotating electrical machines 4 are hollow shafts, the suckers 3 are fixed on the hollow shafts, the bottoms of the hollow shafts are connected with rotary joints 41, the rotary joints 41 are connected with vacuum generators, and the vacuum generators are used for generating vacuum so that the suckers 3 can suck wafers. The suction cup 3 is also arranged opposite the feed chute 121.

The linear CCDs 5 are all mounted on top of the base plate 11, the exposer 6 is mounted on the frame 10 or the top baffle 15, and the linear CCDs 5 are located on one side of the exposer 6. The UV shutter of the exposure device 6 is mounted on the frame 10 through a shutter seat and is disposed opposite to the exposure device 6.

The axis of the sucker 3, the axis of the linear module 2 and the axis of the exposer 6 are all in the same plane, the axis of the sucker 3 and the axis of the exposer 6 are mutually parallel, and the axis of the sucker 3 and the axis of the exposer 6 are also perpendicular to the axis of the linear module 2. The exposure device 6 and the linear CCD5 are arranged opposite to the sucker 3, the linear CCD5 is used for detecting the eccentricity of the wafer and the sucker 3, and the linear module 2 is used for moving and compensating the eccentricity of the wafer.

During operation, the manipulator firstly places the wafer on the sucker 3, the sucker 3 sucks the wafer, then the linear module 2 drives the sucker 3 and the wafer to move towards the linear CCD5, the rotating motor 4 drives the wafer to rotate a circle after moving to the detection origin, the linear CCD5 collects edge data of the wafer, meanwhile, the system records the rotation angle of the sucker 3, then the edge data of the wafer and the rotation angle of the sucker 3 are in one-to-one correspondence according to the positioning notch of the wafer, the eccentricity of the wafer is calculated according to the obtained data, and then the linear module 2 is adjusted according to the eccentricity corresponding to the angle of the sucker 3, so that when the wafer rotates, the distance between the center of the wafer and the exposer 6 is kept consistent, and finally the axis of the obtained exposure ring coincides with the wafer coaxial line. As only one linear module 2 is adopted, the control is convenient, the control precision is improved, the structure is more compact, the volume is reduced, and the cost is also reduced.

Example two

As shown in fig. 1 to 7, the present utility model further includes a height adjusting device including an exposure base 61, a lift base 63, a micro head 64, a connection base 65, and a wear lever 66, in addition to the first embodiment. The exposure seat 61 is fixed on the frame 10; the lifting seat 63 is slidably mounted on the exposure seat 61 through a linear guide rail pair, and the exposure device 6 is mounted on the lifting seat 63; the differential head 64 is installed on the exposure seat 61, the connecting seat 65 is fixed on the lifting seat 63, the wear-resistant rod 66 is fixed on the connecting seat 65 and abuts against the differential head 64, and the differential head 64 and the wear-resistant rod 66 are used for adjusting the height of the lifting seat 63 together, so that the height adjustment of the exposure device 6 is realized. The adjustment accuracy of the differential head 64 is high.

Example III

As shown in fig. 1 to 7, the lift device further includes a lift cylinder 71, a lift plate 72, a lift head 74, and a lift sensor 75, in addition to any of the above embodiments. The lifting cylinder 71 is a double-shaft cylinder, has a simple structure, and is arranged at the top of the substrate 11 and positioned at one end of the linear module 2. The lifting plate 72 is mounted on a piston rod of the lifting cylinder 71, a U-shaped lifting groove 721 is formed in the lifting plate 72, and the sucker 3 is movably positioned in the lifting groove 721. The annular array of the lifting rods 73 is three, and is fixed on the lifting plate 72 through threads, and is arranged along the lifting grooves 721, the lifting heads 74 are fixed on the lifting rods 73, are made of PEEK materials, can protect wafers, and the lifting plate 72 can adjust the height of the lifting heads 74. The lift sensor 75 is mounted on the lift plate 72 and is disposed opposite the wafer. The lifting device is used for grabbing the wafer by the mechanical arm, so that the simultaneous feeding and discharging can be realized, and the efficiency is improved.

The technical principle of the present utility model is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the utility model and should not be taken in any way as limiting the scope of the utility model. Other embodiments of the utility model will occur to those skilled in the art from consideration of the specification and practice of the utility model without the need for inventive faculty, and are within the scope of the claims.

Claims

1. The wafer edge exposure device comprises a sucker (3), an exposure device (6) and a linear CCD (5), and is characterized by further comprising:

a frame (10), wherein the exposer (6) and the linear CCD (5) are both arranged on the frame (10), and the linear CCD (5) is positioned at one side of the exposer (6);

the linear module (2) is arranged on the frame (10);

a moving seat (22), wherein the moving seat (22) is arranged on a sliding table (21) of the linear module (2); a kind of electronic device with high-pressure air-conditioning system

Rotating electrical machines (4), rotating electrical machines (4) are installed on moving seat (22), sucking disc (3) are installed on rotating electrical machines (4), the axis of sucking disc (3) the axis of sharp module (2) with the axis of exposure ware (6) is all in the coplanar, exposure ware (6) with linear CCD (5) all with sucking disc (3) set up relatively, linear CCD (5) are used for detecting the eccentric distance of wafer and sucking disc (3), the eccentric distance that sharp module (2) are used for removing and compensating the wafer.

2. The wafer edge exposure apparatus according to claim 1, further comprising a base plate (11), wherein the base plate (11) is mounted on the frame (10), the linear module (2) is mounted at the bottom of the base plate (11), the movable seat (22) is movably inserted into a movable groove (111) of the base plate (11), and the rotary motor (4) is located at the top of the base plate (11).

3. The wafer edge exposure apparatus according to claim 1, further comprising a height adjusting device, the height adjusting device comprising:

an exposure mount (61), the exposure mount (61) being fixed to the frame (10);

a lifting base (63), wherein the lifting base (63) is slidably mounted on the exposure base (61), and the exposure device (6) is mounted on the lifting base (63);

and the differential head (64) is arranged on the exposure seat (61) and movably butts against the lifting seat (63) for adjusting the height of the lifting seat (63).

4. A wafer edge exposure apparatus according to claim 3, further comprising:

the connecting seat (65), the said connecting seat (65) is fixed on said lifting seat (63); a kind of electronic device with high-pressure air-conditioning system

And the wear-resistant rod (66), wherein the wear-resistant rod (66) is fixed on the connecting seat (65) and is propped against the differential head (64).

5. The wafer edge exposure apparatus according to any one of claims 1 to 4, further comprising a lifting device comprising:

a lifting cylinder (71), the lifting cylinder (71) being mounted on the frame (10);

the lifting plate (72), the lifting plate (72) is arranged on the lifting cylinder (71), a lifting groove (721) is formed in the lifting plate (72), and the sucker (3) is positioned in the lifting groove (721); a kind of electronic device with high-pressure air-conditioning system

And the lifting rods (73), wherein the lifting rods (73) are fixed on the lifting plate (72) and are arranged along the lifting grooves (721), and the number of the lifting rods (73) is not less than three and used for lifting the wafer.

6. The wafer edge exposure apparatus according to claim 5, further comprising a lift head (74), the lift head (74) being mounted on the lift rod (73) for contact with a wafer.

7. The wafer edge exposure apparatus according to claim 5, further comprising a lift sensor (75), wherein the lift sensor (75) is mounted on the lift plate (72) and disposed opposite to the wafer.

8. The wafer edge exposure apparatus according to any one of claims 1 to 4, further comprising:

the front baffle (12), the front baffle (12) is fixed at one end of the frame (10), and the front baffle (12) is provided with a feeding groove (121) which is arranged opposite to the sucker (3);

a rear baffle (13), wherein the rear baffle (13) is arranged at the other end of the frame (10) and is opposite to the front baffle (12);

side guards (14), wherein the side guards (14) are fixed on two sides of the frame (10); a kind of electronic device with high-pressure air-conditioning system

And the top baffle plate (15) is fixed on the top of the frame (10).