CN219163372U - Wafer edge exposure device - Google Patents

Abstract

The utility model relates to a wafer exposure device, especially a wafer edge exposure device. The CCD is located on one side of the exposure device; the linear module is installed on the frame; the moving seat is installed on the slide table of the linear module; the rotating motor is installed on the moving seat, and the suction cup is installed on the rotating motor. The axis of the group and the axis of the exposure device are in the same plane. Both the exposure device and the linear CCD are set opposite to the suction cup. The linear CCD is used to detect the eccentricity between the wafer and the suction cup, and the linear module is used to move and compensate the eccentricity of the wafer. distance. The wafer edge exposure device provided by the utility model adopts a linear module and a linear CCD to control the movement of the wafer, which reduces the volume and control requirements, and achieves higher position accuracy and a more compact structure.

Description

A wafer edge exposure device

technical field

The utility model relates to a wafer exposure device, in particular to a wafer edge exposure device.

Background technique

The edge of the wafer needs to be exposed by UV light, usually forming a ring exposure. When the wafer is placed on the chuck, the center of the wafer cannot coincide with the center of the chuck. Therefore, when the wafer is rotated, the position of the wafer needs to be moved according to the current state of the wafer, so that the exposure forms a uniform ring and ensures the accuracy of the exposure. size. At present, the suction cup is mainly installed on the cross-shaped linear module to realize the two-way adjustment of the X-axis and the Y-axis, thereby ensuring that the edge of the wafer and the aerator are always in a fixed position, forming a uniform ring. The thickness of the cross-shaped linear module is relatively large, which leads to a larger overall volume, takes up more space, and has higher requirements for control, and the two linear modules reduce the position accuracy due to the accumulated error.

Utility model content

In order to solve the above problems, the utility model provides a wafer edge exposure device with a reduced volume and high precision using a linear module. The specific technical solution is:

A wafer edge exposure device, including a suction cup, an exposure device and a linear CCD, and also includes: a frame, the exposure device and the linear CCD are installed on the frame, and the linear CCD is located on the exposure One side of the device; a linear module, the linear module is installed on the frame; a moving seat, the moving seat is installed on the slide table of the linear module; a rotating motor, the rotating motor is installed on the On the moving base, the suction cup is installed on the rotating motor, the axis of the suction cup, the axis of the linear module and the axis of the exposure device are all in the same plane, the exposure device and the The linear CCDs are arranged opposite to the suction cups, the linear CCDs are used to detect the eccentricity between the wafer and the suction cups, and the linear modules are used to move and compensate the eccentricity of the wafers.

Preferably, it also includes a base plate, the base plate is installed on the frame, the linear module is installed on the bottom of the base plate, the moving seat is movably inserted in the moving slot of the base plate, and the rotating motor located on top of the substrate.

Preferably, a height adjustment device is also included, and the height adjustment device includes: an exposure seat, the exposure seat is fixed on the frame; a lifting seat, the lifting seat is slidably installed on the exposure seat, and the exposure The differential head is installed on the exposure seat and moves against the lifting seat for adjusting the height of the lifting seat.

Further, it also includes: a connection seat, the connection seat is fixed on the lifting seat; and a wear-resistant rod, the wear-resistant rod is fixed on the connection seat and abuts against the differential head.

Preferably, it also includes a lifting device, and the lifting device includes: a lifting cylinder, the lifting cylinder is installed on the frame; a lifting plate, the lifting plate is installed on the lifting cylinder , the lifting plate is provided with a lifting groove, the suction cup is located in the lifting groove; and a lifting rod, the lifting rod is fixed on the lifting plate and arranged along the lifting groove, There are no less than three lifting rods for lifting the wafer.

Wherein, a lifting head is also included, and the lifting head is installed on the lifting rod for contacting with the wafer.

Further, a lifting sensor is also included, and the lifting sensor is installed on the lifting plate and arranged opposite to the wafer.

Preferably, it also includes: a front baffle, the front baffle is fixed at one end of the frame, and a feeding chute opposite to the suction cup is arranged on the front baffle; a rear baffle, the rear baffle the plate height is at the other end of the frame, and is arranged opposite to the front baffle; side baffles, the side baffles are fixed on both sides of the frame; and top baffles, the top baffles fixed to the top of the rack.

Compared with the prior art, the utility model has the following beneficial effects:

The wafer edge exposure device provided by the utility model adopts a linear module and a linear CCD to control the movement of the wafer, which reduces the volume and control requirements, and achieves higher position accuracy and a more compact structure.

Description of drawings

Fig. 1 is a structural schematic diagram of a wafer edge exposure device;

Fig. 2 is a schematic structural view of a wafer edge exposure device equipped with a wafer;

3 is a schematic structural view of a wafer edge exposure device equipped with a baffle;

Fig. 4 is a schematic structural diagram of a wafer edge exposure device with a hidden rack;

Fig. 5 is the front view of Fig. 4;

Fig. 6 is the plan view of Fig. 4;

Fig. 7 is a schematic structural view of the lifting device.

Detailed ways

Now in conjunction with accompanying drawing, the utility model is further described.

Embodiment one

As shown in FIGS. 1 to 7 , a wafer edge exposure device includes a chuck 3 , an exposure device 6 , a linear CCD 5 , a frame 10 , a linear module 2 , a moving seat 22 , a rotary motor 4 and a substrate 11 .

The frame 10 is a rectangular frame, and the base plate 11 is fixed inside the frame 10. Front baffles 12, rear baffles 13, side baffles 14 and top baffles 15 are respectively installed around and on the top of the frame 10, wherein the front baffles The plate 12 is provided with a feeding groove 121 .

The linear module 2 is installed on the base plate 11 and is located at the bottom of the base plate 11 . The base plate 11 is provided with moving grooves 111 parallel to the linear module 2 , and the moving grooves 111 are symmetrically located on both sides of the linear module 2 . The moving base 22 is fixed on the slide table 21 of the linear module 2 and passes through the two moving slots 111 . The linear module 2 is located below the substrate 11, thereby reducing the parts above the substrate 11, making the working area more tidy, easy to clean, and reducing the impact on the wafer.

The rotary motor 4 is installed on the top of the moving base 22, the motor shaft of the rotary motor 4 is a hollow shaft, the suction cup 3 is fixed on the hollow shaft, the bottom of the hollow shaft is connected with the rotary joint 41, and the rotary joint 41 is connected with the vacuum generator, and the vacuum is generated The device is used to generate vacuum to make the suction cup 3 suck the wafer. The suction cup 3 is also arranged opposite to the feeding chute 121 .

The linear CCDs 5 are all mounted on the top of the substrate 11 , the exposure device 6 is mounted on the frame 10 or the top baffle 15 , and the linear CCDs 5 are located at one side of the exposure device 6 . The UV block of the exposure device 6 is installed on the frame 10 through the block seat, and is arranged opposite to the exposure device 6 .

The axis of the suction cup 3, the axis of the linear module 2 and the axis of the exposure device 6 are all in the same plane, the axis of the suction cup 3 and the axis of the exposure device 6 are parallel to each other, and the axis of the suction cup 3 and the axis of the exposure device 6 are also aligned with the straight line The axis of module 2 is vertical. Both the exposure device 6 and the linear CCD 5 are arranged opposite to the chuck 3 , the linear CCD 5 is used to detect the eccentricity between the wafer and the chuck 3 , and the linear module 2 is used to move and compensate the eccentricity of the wafer.

When working, the manipulator first places the wafer on the suction cup 3, the suction cup 3 holds the wafer, and then the linear module 2 drives the suction cup 3 and the wafer to move to the linear CCD5, and after moving to the detection origin, the rotary motor 4 drives the wafer to rotate for a circle , the linear CCD5 collects the edge data of the wafer, and the system records the rotation angle of the chuck 3 at the same time. eccentricity, and then adjust the linear module 2 according to the eccentricity corresponding to the angle of the chuck 3, so that when the wafer rotates, the distance between the center of the wafer and the exposure device 6 is kept consistent, and the axis of the final exposure ring is consistent with the wafer The coaxial lines coincide. Since only one linear module 2 is used, the control is convenient, the control precision is improved, the structure is more compact, the volume is reduced, and the cost is also reduced.

Embodiment two

As shown in FIGS. 1 to 7 , on the basis of the first embodiment above, a height adjustment device is also included. The height adjustment device includes an exposure seat 61 , an elevating seat 63 , a differential head 64 , a connecting seat 65 and a wear-resistant rod 66 . The exposure seat 61 is fixed on the frame 10; the lifting seat 63 is slidably installed on the exposure seat 61 through the linear guide rail pair, and the exposure device 6 is installed on the lifting seat 63; the differential head 64 is installed on the exposure seat 61, and the connecting seat 65 is fixed on On the lifting seat 63, the wear-resistant rod 66 is fixed on the connecting seat 65, and is against the differential head 64. The differential head 64 and the wear-resistant rod 66 are used to adjust the height of the lifting seat 63, thereby realizing the height adjustment of the exposure device 6 . The adjustment precision of the differential head 64 is high.

Embodiment three

As shown in FIGS. 1 to 7 , on the basis of any one of the above embodiments, a lifting device is also included, and the lifting device includes a lifting cylinder 71 , a lifting plate 72 , a lifting head 74 and a lifting sensor 75 . The lifting cylinder 71 is a biaxial cylinder with a simple structure. The lifting cylinder 71 is installed on the top of the base plate 11 and located at one end of the linear module 2 . The lifting plate 72 is installed on the piston rod of the lifting cylinder 71, the lifting plate 72 is provided with a U-shaped lifting groove 721, and the suction cup 3 is movable in the lifting groove 721. There are three lifting rods 73 in an annular array, all of which are screwed on the lifting plate 72 and arranged along the lifting groove 721. The lifting head 74 is fixed on the lifting rod 73 and is made of PEEK material, which can protect the wafer, and the lifting plate 72 can adjust the height of the lifting head 74 . The lifting sensor 75 is installed on the lifting plate 72 and is set opposite to the wafer. The lifting device is used for the robot to grab the wafer, which can realize simultaneous loading and unloading and improve efficiency.

The technical principles of the present utility model have been described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the utility model, and cannot be construed as limiting the protection scope of the utility model in any way. Based on the explanations here, those skilled in the art can think of other specific implementations of the utility model without creative work, and these modes will all fall within the protection scope of the claims of the utility model.

Claims (8)

1. A wafer edge exposure device, comprising a suction cup (3), an exposure device (6) and a linear CCD (5), is characterized in that, also includes: Frame (10), the exposure device (6) and the linear CCD (5) are installed on the frame (10), and the linear CCD (5) is located at the exposure device (6) side; A linear module (2), the linear module (2) is installed on the frame (10); a moving seat (22), the moving seat (22) is installed on the slide table (21) of the linear module (2); and Rotating motor (4), described rotating motor (4) is installed on the described moving seat (22), and described sucker (3) is installed on the described rotating motor (4), and the axis of described sucker (3), The axis of the linear module (2) and the axis of the exposure device (6) are all in the same plane, and the exposure device (6) and the linear CCD (5) are both opposite to the suction cup (3) The linear CCD (5) is used to detect the eccentricity between the wafer and the chuck (3), and the linear module (2) is used to move and compensate the eccentricity of the wafer. 2. A wafer edge exposure device according to claim 1, further comprising a substrate (11), the substrate (11) being installed on the frame (10), and the linear module (2) installed on the bottom of the base plate (11), the moving seat (22) is movably inserted in the moving groove (111) of the base plate (11), and the rotating motor (4) is located on the base plate ( 11) Top. 3. a kind of wafer edge exposure device according to claim 1, is characterized in that, also comprises height adjustment device, and described height adjustment device comprises: an exposure seat (61), the exposure seat (61) is fixed on the frame (10); Lifting seat (63), the lifting seat (63) is slidably installed on the exposure seat (61), and the exposure device (6) is installed on the lifting seat (63); A differential head (64), the differential head (64) is installed on the exposure seat (61), and moves against the lifting seat (63), for adjusting the height of the lifting seat (63). 4. A kind of wafer edge exposure device according to claim 3, is characterized in that, also comprises: A connecting seat (65), the connecting seat (65) is fixed on the lifting seat (63); and A wear-resistant rod (66), the wear-resistant rod (66) is fixed on the connecting seat (65) and abuts against the differential head (64). 5. A wafer edge exposure device according to any one of claims 1 to 4, further comprising a lifting device, the lifting device comprising: Lifting the cylinder (71), the lifting cylinder (71) is installed on the frame (10); Lifting plate (72), described lifting plate (72) is installed on the described lifting cylinder (71), and described lifting plate (72) is provided with lifting groove (721), and described suction cup (3 ) is located in the lifting channel (721); and Lifting rod (73), the lifting rod (73) is fixed on the lifting plate (72), and arranged along the lifting groove (721), the lifting rod (73) is not less than Three, used to lift the wafer. 6. A wafer edge exposure device according to claim 5, further comprising a lifting head (74), the lifting head (74) being installed on the lifting rod (73), Used to make contact with the wafer. 7. A wafer edge exposure device according to claim 5, further comprising a lifting sensor (75), the lifting sensor (75) being installed on the lifting plate (72), And set opposite to the wafer. 8. A wafer edge exposure device according to any one of claims 1 to 4, further comprising: A front baffle (12), the front baffle (12) is fixed on one end of the frame (10), and the front baffle (12) is provided with a feeding chute opposite to the suction cup (3) (121); a rear baffle (13), the height of the rear baffle (13) is at the other end of the frame (10), and is arranged opposite to the front baffle (12); side baffles (14), the side baffles (14) are fixed on both sides of the frame (10); and A top baffle (15), the top baffle (15) is fixed on the top of the frame (10).

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