CN219136905U

CN219136905U - Multi-target gun vacuum coating equipment

Info

Publication number: CN219136905U
Application number: CN202223598401.0U
Authority: CN
Inventors: 朱伟杰; 刘东立; 杨猛; 刘霄
Original assignee: West Lake Instruments Hangzhou Technology Co ltd
Current assignee: West Lake Instruments Hangzhou Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-06-06
Anticipated expiration: 2032-12-30

Abstract

The utility model relates to a multi-target gun vacuum coating device which comprises a target gun group, a vacuum pump, a pre-pumping chamber with a feed port, a sputtering chamber and a molecular pump, wherein the vacuum pump, the pre-pumping chamber with the feed port and the feed port are sequentially communicated, a horizontal driving mechanism, a wafer clamping jaw arranged at the output end of the horizontal driving mechanism, a first rotary lifting mechanism and a wafer cage arranged at the output end of the first rotary lifting mechanism are arranged on the pre-pumping chamber, a second rotary lifting mechanism and a coating table arranged at the output end of the second rotary lifting mechanism are arranged on the sputtering chamber, the moving path of the wafer clamping jaw sequentially passes through the wafer cage and the coating table, and the target gun group is arranged on the sputtering chamber in a mode that a discharge port faces the coating table. According to the utility model, the movable wafer clamping jaw and the wafer cage are arranged, the pre-pumping chamber is arranged between the sputtering chamber and the external environment for buffering, and the movable coating table and the target gun group are arranged, so that the purposes of improving the processing efficiency and facilitating control of coating uniformity are achieved.

Description

Multi-target gun vacuum coating equipment

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a multi-target gun vacuum coating device.

Background

The wafer production comprises a plurality of process steps, the film plating is one of the important processes, a vacuum film plating process is widely adopted at present, a vacuum film plating chamber is needed to be utilized during the vacuum film plating, the vacuum film plating chamber is generally vacuumized by a vacuum pump, and sputtering film plating is realized by adopting a cathode and anode discharge bombarding target. When the existing magnetron sputtering device is used, the target gun and the substrate are in a relatively static state, uneven coating thickness is easy to cause, only a single substrate can be coated in order to reduce influence, the size of the substrate cannot be too large, and the use limitation is large.

The patent in China with the publication number of CN216378367U discloses a magnetron sputtering coating device for semiconductor photoelectricity, which comprises a cavity, interior bottom wall bolted connection of cavity has two target guns, the top bolted connection of cavity has rotary mechanism, rotary mechanism includes the fixed plate, the bottom bolted connection of fixed plate has step motor, step motor's top rotation is connected with first rotor, the top of fixed plate rotates and is connected with the second rotor, the bottom bolted connection of second rotor has the rolling disc, the bottom fixedly connected with of rolling disc puts the piece frame of six annular arrangements.

The prior art solutions described above have the following drawbacks: before and after each film coating, the device needs to manually open the bin gate to finish loading and unloading of the substrate on the film placing frame, which directly leads to the reduction of processing efficiency, and can lead to the rapid failure of the vacuum environment in the cavity, and during the next stage of processing, the gas in the cavity needs to be pumped out again through the mechanical pump, so that the processing time is prolonged; in addition, the rotating mechanism is only used for driving the film placing frame to rotate, so that the target material in the circumferential direction of the substrate can be sputtered uniformly, but the relative positions of the target gun and the film placing frame are fixed, the device also needs to monitor the sputtering thickness of the target material in a mode of monitoring through a film thickness meter, the control process is complex, and the improvement is needed.

Disclosure of Invention

The utility model aims to solve the problems of low processing efficiency and invariable film thickness control of the existing magnetron sputtering film plating device, and achieves the effects of improving the processing efficiency and being convenient for controlling film uniformity.

The above object of the present utility model is achieved by the following technical solutions:

the utility model provides a multi-target gun vacuum coating equipment, includes target rifle group and the vacuum pump of intercommunication in order, has the chamber of taking out in advance, sputtering cavity and molecular pump of feed inlet, be provided with horizontal actuating mechanism on the chamber of taking out in advance, set up in wafer clamping jaw, first rotatory elevating system of horizontal actuating mechanism output and set up in the wafer cage of first rotatory elevating system output, be provided with second rotatory elevating system on the sputtering cavity and set up in the coating film platform of second rotatory elevating system output, the travel path of wafer clamping jaw passes through in proper order wafer cage and coating film platform, target rifle group install in according to the mode of discharge inlet orientation coating film platform on the sputtering cavity.

By adopting the technical scheme, during processing, a plurality of wafers are stacked and loaded in the wafer cage in advance, the feed inlet and the discharge outlet of the pre-pumping chamber are kept in a closed state, then the pre-pumping chamber and the air in the sputtering chamber are pumped out by the vacuum pump so as to reach a higher vacuum state, then the wafer clamping jaw is driven by the horizontal driving mechanism to absorb the wafers on the wafer cage and insert the wafers into the coating table in the sputtering chamber, then the wafer clamping jaw is retracted, the molecular pump enables the sputtering chamber to reach a high-stability high-vacuum state, a certain amount of argon gas is filled into the sputtering chamber, the coating table is driven by the second rotary lifting mechanism to act, the target gun group also starts to work and targets are sputtered in the sputtering chamber in an ionic state, and various parameters such as the thickness uniformity of the coating required in the multi-variable-control magnetron sputtering process are reached by controlling various conditions such as the rotation speed, the height of the coating table, the power of the target gun group and the opening quantity of the target gun group; after the processing of the single wafer is finished, the wafer clamping jaw sends the film plating wafer on the film plating table back to the wafer cage, and the first rotary lifting mechanism transfers the next wafer to be processed on the wafer cage to the moving path of the wafer clamping jaw, so that the wafer clamping jaw is cycled and reciprocated until all the wafer films on the wafer cage are finished; after the processing of a batch of wafers is finished, the wafers on the wafer cage are taken out by opening the discharge hole, and the next batch of wafers are placed on the wafer cage, in the process, the pre-pumping chamber plays a role in buffering between the sputtering chamber and the external environment, so that the rapid loss of the vacuum state of the sputtering chamber can be avoided, and the time for vacuumizing next time can be reduced; in the process, by arranging the movable wafer clamping jaw and the wafer cage and arranging the pre-pumping chamber between the sputtering chamber and the external environment for buffering, the vacuum state can be achieved quickly, continuous loading and unloading of a batch of wafers can be realized in the vacuum state, and then the rotating speed, the height, the power of the target gun group, the number of the target gun groups and the like of the coating table are controlled through the movable coating table and the target gun groups so as to achieve various parameters such as coating thickness uniformity and the like required in the multivariable control magnetron sputtering process, thereby achieving the purposes of improving the processing efficiency and facilitating control of coating uniformity.

The utility model is further provided with: the horizontal driving mechanism comprises a linear module arranged on the pre-drawing cavity, a mounting seat arranged on a sliding block of the linear module, and a magnetic sample feeding rod arranged on the mounting seat, and the wafer clamping jaw is arranged on the magnetic sample feeding rod.

Through adopting above-mentioned technical scheme, the straight line module can drive the reciprocal rectilinear motion of magnetic force sample feeding pole through the mount pad, and then drives the wafer clamping jaw and move between wafer cage and coating film platform, and the magnetic force sample feeding pole can strengthen the adsorption affinity of wafer clamping jaw when absorbing the wafer, guarantees the stable transfer around the wafer coating film.

The utility model is further provided with: the first rotary lifting mechanism comprises a first supporting plate arranged on the pre-drawing cavity, a first lifting motor and a first sliding rail arranged on the first supporting plate, a first rotating seat which is connected to the first sliding rail in a sliding mode, a first screw pair arranged between the first supporting plate and the first rotating seat, a first belt transmission pair arranged between the first lifting motor and the first screw pair, a first rotating motor arranged on the first rotating seat, a first rotating shaft connected to the first rotating seat in a rotating mode, and a second belt transmission pair arranged between the first rotating motor and the first rotating shaft, wherein the wafer cage is arranged on the first rotating shaft.

By adopting the technical scheme, when in lifting, the first lifting motor is used as a driving source, the first sliding rail is used for guiding, the first screw rod pair and the first belt transmission pair are used for transmission, and the first rotating seat can be driven to lift, so that the wafer cage is driven to lift; when the wafer cage rotates, the first rotating motor is used as a driving source, and the second belt transmission pair is used for transmission, so that the first rotating shaft can be driven to rotate, and the wafer cage is driven to rotate; wherein, the first rotating shaft preferably adopts a magnetic fluid supporting rod.

The utility model is further provided with: the first screw rod pair comprises a first screw rod shaft rotatably connected to the first supporting plate and a first transmission nut arranged on the first rotating seat and in threaded connection with the first screw rod shaft; the first belt transmission pair comprises a first driving wheel arranged on the output shaft of the first lifting motor, a first driven wheel arranged on the first screw shaft, and a first transmission belt sleeved on the first driving wheel and the first driven wheel.

Through adopting above-mentioned technical scheme, screw transmission has that the starting torque is little, auto-lock is good advantage, cooperates the belt drive to transmit power between the biax, can realize the fixed point lift of first rotating seat, and then guarantees on the wafer cage that the next wafer of waiting to process can stable operation to the removal route of wafer clamping jaw.

The utility model is further provided with: the second belt transmission pair comprises a second driving wheel arranged on the output shaft of the first rotating motor, a second driven wheel arranged on the first rotating shaft, and a second transmission belt sleeved on the second driving wheel and the second driven wheel.

By adopting the technical scheme, the belt transmission has the advantages of stable operation, low noise and shock absorption and buffering, and can drive the wafer cage to rotate stably.

The utility model is further provided with: the second rotary lifting mechanism comprises a second supporting plate arranged on the sputtering chamber, a second lifting motor and a second sliding rail arranged on the second supporting plate, a second rotating seat which is connected to the second sliding rail in a sliding manner, a second screw rod pair arranged between the second supporting plate and the second rotating seat, a third belt transmission pair arranged between the second lifting motor and the second screw rod pair, a second rotary motor arranged on the second rotating seat, a second rotating shaft rotationally connected to the second rotating seat, and a fourth belt transmission pair arranged between the second rotary motor and the second rotating shaft, wherein the coating table is arranged on the second rotating shaft.

By adopting the technical scheme, when in lifting, the second lifting motor is used as a driving source, the second sliding rail is used for guiding, the second screw rod pair and the second belt transmission pair are used for transmission, and the second rotating seat can be driven to lift, so that the coating platform is driven to lift; when the coating machine rotates, the second rotating motor is used as a driving source, and the second rotating motor is driven by the third belt transmission pair to rotate, so that the coating table is driven to rotate; wherein, the second rotating shaft preferably adopts a magnetic fluid supporting rod.

The utility model is further provided with: the second screw rod pair comprises a second screw rod shaft rotatably connected to the second supporting plate and a second transmission nut arranged on the second rotating seat and in threaded connection with the second screw rod shaft; the third belt transmission pair comprises a third driving wheel arranged on the output shaft of the second lifting motor, a third driven wheel arranged on the second screw shaft and a third transmission belt sleeved on the third driving wheel and the third driven wheel.

Through adopting above-mentioned technical scheme, screw transmission has the advantage that starting moment is little, auto-lock is good, cooperates the belt drive to transmit power between the biax, can realize the fixed point lift of second rotation seat to control the coating film platform and shift to the height at predetermined coating film thickness place.

The utility model is further provided with: the fourth belt transmission pair comprises a fourth driving wheel arranged on the output shaft of the second rotating motor, a fourth driven wheel arranged on the second rotating shaft and a fourth transmission belt sleeved on the fourth driving wheel and the fourth driven wheel.

The utility model is further provided with: the target gun group is arranged on a piston rod of the lifting cylinder.

By adopting the technical scheme, the target gun group is conveniently separated from the sputtering chamber, and the target gun is conveniently debugged and the target material in the target gun is conveniently replaced.

The utility model is further provided with: valves are respectively arranged on the communication channels between the vacuum pump and the pre-pumping chamber and between the pre-pumping chamber and the sputtering chamber.

By adopting the technical scheme, the communication channels which are sequentially communicated with the vacuum pump, the pre-pumping chamber, the sputtering chamber and the molecular pump can be selectively opened and closed, so that the vacuum state of the sputtering chamber can be maintained.

In summary, the beneficial technical effects of the utility model are as follows: through setting up movable wafer clamping jaw and wafer cage to arrange the chamber of taking out in advance between sputtering cavity and external environment and cushion, can reach the vacuum state sooner, and realize the continuous unloading of a batch of wafer under the vacuum state, rethread movable coating table and target rifle group, each conditions such as the rotation rate of coating table, height, the power of target rifle group and the quantity that target rifle group opened are controlled to reach each item parameter such as required coating film thickness homogeneity among the multivariable control magnetron sputtering technology, reached the purpose that improves machining efficiency, be convenient for control coating film homogeneity.

Drawings

FIG. 1 is a schematic diagram of a multi-target gun vacuum coating apparatus of the present utility model.

Fig. 2 is a schematic structural view of the present utility model.

Fig. 3 is a schematic diagram of the connection between the wafer cage and the first rotary lift mechanism of the present utility model.

FIG. 4 is a schematic illustration of the connection between a sputtering chamber and a coating apparatus of the present utility model.

FIG. 5 is a schematic diagram of the connection between the coating station and the second rotary lifting mechanism of the present utility model.

In the figure, 1, a rack; 2. a pre-pumping chamber; 21. a material inlet and a material outlet; 3. a sputtering chamber; 4. a vacuum pump; 5. a molecular pump; 6. a feeding device; 61. a horizontal driving mechanism; 611. a linear module; 612. a mounting base; 613. a magnetic sample feeding rod; 62. wafer clamping jaws; 63. a first rotary lifting mechanism; 631. a first pallet; 632. a first lifting motor; 633. a first slide rail; 634. a first rotating seat; 635. the first screw rod pair; 6351. a first screw shaft; 6352. a first drive nut; 636. a first belt drive pair; 6361. a first drive wheel; 6362. a first driven wheel; 6363. a first belt; 637. a first rotating electric machine; 638. a first rotating shaft; 639. a second belt drive pair; 6391. a second driving wheel; 6392. a second driven wheel; 6393. a second belt; 64. a wafer cage; 7. a film plating device; 71. a lifting cylinder; 72. a target gun set; 73. a second rotary lifting mechanism; 731. a second pallet; 732. a second lifting motor; 733. a second slide rail; 734. a second rotating seat; 735. the second screw rod pair; 7351. a second screw shaft; 7352. a second drive nut; 736. a third belt drive pair; 7361. a third driving wheel; 7362. a third driven wheel; 7363. a third belt; 737. a second rotating electric machine; 738. a second rotating shaft; 739. a fourth belt drive pair; 7391. a fourth drive wheel; 7392. a fourth driven wheel; 7393. a fourth belt; 74. and a coating table.

Detailed Description

The utility model will be further described with reference to the drawings and detailed description in order to make the technical means, the creation characteristics, the achievement of the objects and the functions of the utility model more clear and easy to understand.

Referring to fig. 1, the multi-target gun vacuum coating equipment disclosed by the utility model comprises a frame 1, a pre-pumping chamber 2 and a sputtering chamber 3 which are arranged on the frame 1 and are communicated through an on-off valve, a vacuum pump 4 which is communicated with the pre-pumping chamber 2 through the on-off valve, a molecular pump 5 which is communicated with the sputtering chamber 3, a feeding device 6 which is arranged in the pre-pumping chamber 2, and a coating device 7 which is arranged in the sputtering chamber 3. The feeding device 6 realizes reciprocating transfer of the wafer between the pre-pumping chamber 2 and the sputtering chamber 3 in a translational feeding mode, after the feeding end of the feeding device 6 is retracted, the pre-pumping chamber 2 and the sputtering chamber 3 can be set to be in a non-communication state so as to ensure the vacuum degree of the sputtering chamber 3, and the coating device 7 controls various parameters such as the thickness uniformity of the coating required in the magnetron sputtering process by controlling the conditions such as the rotation speed, the height, the power of the target gun, the opening quantity of the target gun and the like of the wafer.

Referring to fig. 2, the feeding device 6 includes a horizontal driving mechanism 61, a wafer clamping jaw 62 disposed at an output end of the horizontal driving mechanism 61, a first rotation lifting mechanism 63, and a wafer cage 64 disposed at an output end of the first rotation lifting mechanism 63. The pre-pumping chamber 2 is provided with an openable and closable material inlet and outlet 21, and wafers on the wafer cage 64 enter and exit the pre-pumping chamber 2 through the material inlet and outlet 21.

The horizontal driving mechanism 61 includes a linear module 611 disposed on the pre-suction chamber 2, a mounting seat 612 disposed on a slider of the linear module 611, and a magnetic sample feeding rod 613 disposed on the mounting seat 612, where the wafer clamping jaw 62 is disposed on the magnetic sample feeding rod 613. The linear module 611 can drive the magnetic sample feeding rod 613 to reciprocate linearly through the mounting seat 612, so as to drive the wafer clamping jaw 62 to move between the wafer cage 64 and the coating table 74, and the magnetic sample feeding rod 613 can strengthen the adsorption force of the wafer clamping jaw 62 when the wafer is sucked, so that the stable transfer of the wafer before and after coating is ensured.

Referring to fig. 2 and 3, the first rotary elevating mechanism 63 includes a first tray 631 provided on the pre-suction chamber 2, a first elevating motor 632 and a first slide rail 633 provided on the first tray 631, a first rotating base 634 slidably coupled to the first slide rail 633, a first screw pair 635 provided between the first tray 631 and the first rotating base 634, a first belt transmission pair 636 provided between the first elevating motor 632 and the first screw pair 635, a first rotating motor 637 provided on the first rotating base 634, a first rotating shaft 638 rotatably coupled to the first rotating base 634, and a second belt transmission pair 639 provided between the first rotating motor 637 and the first rotating shaft 638, and the wafer cage 64 is provided on the first rotating shaft 638. The first screw pair 635 includes a first screw shaft 6351 rotatably connected to the first supporting plate 631, and a first transmission nut 6352 disposed on the first rotating seat 634 and screwed to the first screw shaft 6351; the first belt transmission pair 636 comprises a first driving wheel 6361 arranged on the output shaft of the first lifting motor 632, a first driven wheel 6362 arranged on the first screw shaft 6351, and a first transmission belt 6363 sleeved on the first driving wheel 6361 and the first driven wheel 6362; the second belt transmission pair 639 includes a second driving pulley 6391 provided on an output shaft of the first rotating motor 637, a second driven pulley 6392 provided on the first rotating shaft 638, and a second transmission belt 6393 fitted over the second driving pulley 6391 and the second driven pulley 6392.

When lifting, the first lifting motor 632 is used as a driving source, and the first sliding rail 633 is used for guiding, the first screw pair 635 and the first belt transmission pair 636 are used for transmission, so that the first rotating seat 634 can be driven to lift, and the wafer cage 64 is driven to lift. When rotating, the first rotating motor 637 is used as a driving source, and the first rotating shaft 638 can be driven to rotate by the transmission of the second belt transmission pair 639, so as to drive the wafer cage 64 to rotate. Among them, the first rotating shaft 638 is preferably a magnetic fluid supporting bar.

Referring to fig. 4, the coating apparatus 7 includes a lift cylinder 71, a target gun group 72 provided on a piston rod of the lift cylinder 71, a second rotary lift mechanism 73, and a coating table 74 provided at an output end of the second rotary lift mechanism 73, and a moving path of the wafer chuck 62 sequentially passes through the wafer cage 64 and the coating table 74. The sputtering chamber 3 is provided in a split type structure, and the target gun group 72 is mounted on the upper cover of the sputtering chamber 3 with the discharge port facing the coating table 74.

Referring to fig. 4 and 5, the second rotation elevating mechanism 73 includes a second supporting plate 731 provided on the sputtering chamber 3, a second elevating motor 732 and a second sliding rail 733 provided on the second supporting plate 731, a second rotating base 734 slidably connected to the second sliding rail 733, a second screw pair 735 provided between the second supporting plate 731 and the second rotating base 734, a third belt transmission pair 736 provided between the second elevating motor 732 and the second screw pair 735, a second rotating motor 737 provided on the second rotating base 734, a second rotating shaft 738 rotatably connected to the second rotating base 734, and a fourth belt transmission pair 739 provided between the second rotating motor 737 and the second rotating shaft 738, and the coating table 74 is provided on the second rotating shaft 738. The second screw pair 735 includes a second screw shaft 7351 rotatably connected to the second supporting plate 731, and a second driving nut 7352 disposed on the second rotating base 734 and screwed to the second screw shaft 7351; the third belt transmission pair 736 includes a third driving wheel 7361 provided on an output shaft of the second elevating motor 732, a third driven wheel 7362 provided on the second screw shaft 7351, and a third transmission belt 7363 sleeved on the third driving wheel 7361 and the third driven wheel 7362; the fourth belt transmission pair 739 includes a fourth driving pulley 7391 provided on an output shaft of the second rotating motor 737, a fourth driven pulley 7392 provided on the second rotating shaft 738, and a fourth transmission belt 7393 fitted over the fourth driving pulley 7391 and the fourth driven pulley 7392.

When lifting, the second lifting motor 732 is used as a driving source, and the second sliding rail 733 is used for guiding, the second screw pair 735 and the second belt transmission pair 639 are used for transmission, so that the second rotating seat 734 can be driven to lift, and the coating platform 74 is driven to lift. When rotating, the second rotating motor 737 is used as a driving source, and the second rotating shaft 738 is driven to rotate by the third belt transmission pair 736, so as to drive the coating table 74 to rotate. The second shaft 738 is preferably a magnetic fluid support rod.

The implementation principle of the embodiment is as follows: during processing, a plurality of wafers are stacked and loaded in the wafer cage 64 in advance, the feed inlet 21 and the feed outlet 21 of the pre-pumping chamber 2 are kept in a closed state, then the air in the pre-pumping chamber 2 and the sputtering chamber 3 is pumped out through the vacuum pump 4 to achieve a higher vacuum state, then the wafer clamping jaw 62 is driven by the horizontal driving mechanism 61 to suck the wafer on the wafer cage 64 and insert the wafer into the coating table 74 in the sputtering chamber 3, then the wafer clamping jaw 62 is retracted, the molecular pump 5 enables the sputtering chamber 3 to achieve a high stable high vacuum state, a certain amount of argon gas is filled into the sputtering chamber 3, the coating table 74 is driven by the second rotary lifting mechanism 73 to act, the target gun group 72 also starts to work, and targets are sputtered into the sputtering chamber 3 in an ionic state, and various parameters such as the rotation speed, the height of the coating table 74, the power of the target gun group 72, the opening quantity of the target gun group 72 and the like are controlled in the process to achieve various parameters such as the uniformity of coating thickness required in the multivariable control of a magnetron sputtering process. After the processing of the single wafer is completed, the wafer clamping jaw 62 sends the coated wafer on the coating table 74 back to the wafer cage 64, and the first rotary lifting mechanism 63 transfers the next wafer to be processed on the wafer cage 64 to the moving path of the wafer clamping jaw 62, so that the wafer clamping jaw is cycled until all the wafer coating on the wafer cage 64 is completed. After the processing of a batch of wafers is completed, the wafers on the wafer cage 64 are taken out by opening the discharge port, and the next batch of wafers are placed on the wafer cage 64, and in the process, the pre-pumping chamber 2 plays a role in buffering between the sputtering chamber 3 and the external environment, so that the rapid loss of the vacuum state of the sputtering chamber 3 can be avoided, and the time for vacuumizing next time can be reduced. In the process, by arranging the movable wafer clamping jaw 62 and the wafer cage 64 and arranging the pre-pumping chamber 2 between the sputtering chamber 3 and the external environment for buffering, the vacuum state can be quickly achieved, continuous loading and unloading of a batch of wafers can be realized in the vacuum state, and then the purposes of improving the processing efficiency and being convenient for controlling the coating uniformity are achieved by controlling the rotation speed, the height of the coating table 74, the power of the target gun set 72, the number of the target gun set 72 and the like through the movable coating table 74 and the target gun set 72.

Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present utility model, which is intended to be covered by the scope of the claims of the present utility model.

Claims

1. A multi-target gun vacuum coating device is characterized in that: including target rifle group (72), and vacuum pump (4) of intercommunication in order, have advance take out cavity (2), sputtering chamber (3) and molecular pump (5) of feed inlet and discharge outlet (21), be provided with horizontal actuating mechanism (61) on advance take out cavity (2), set up in wafer clamping jaw (62) of horizontal actuating mechanism (61) output, first rotatory elevating system (63) and set up in wafer cage (64) of first rotatory elevating system (63) output, be provided with second rotatory elevating system (73) on sputtering chamber (3) and set up in coating film platform (74) of second rotatory elevating system (73) output, the travel path of wafer clamping jaw (62) is passed through in proper order wafer cage (64) and coating film platform (74), target rifle group (72) install in on sputtering chamber (3) according to the mode of discharge gate orientation coating film platform (74).

2. The multi-target gun vacuum coating apparatus of claim 1, wherein: the horizontal driving mechanism (61) comprises a linear module (611) arranged on the pre-drawing chamber (2), a mounting seat (612) arranged on a sliding block of the linear module (611), and a magnetic sample feeding rod (613) arranged on the mounting seat (612), and the wafer clamping jaw (62) is arranged on the magnetic sample feeding rod (613).

3. The multi-target gun vacuum coating apparatus of claim 1, wherein: the first rotary lifting mechanism (63) comprises a first supporting plate (631) arranged on the pre-drawing cavity (2), a first lifting motor (632) and a first sliding rail (633) arranged on the first supporting plate (631), a first rotating seat (634) connected to the first sliding rail (633) in a sliding mode, a first screw pair (635) arranged between the first supporting plate (631) and the first rotating seat (634), a first belt transmission pair (636) arranged between the first lifting motor (632) and the first screw pair (635), a first rotary motor (637) arranged on the first rotating seat (634), a first rotating shaft (638) connected to the first rotating seat (634) in a rotating mode, and a second belt transmission pair (639) arranged between the first rotary motor (637) and the first rotating shaft (638), and the wafer cage (64) is arranged on the first rotating shaft (638).

4. A multi-target gun vacuum coating apparatus as in claim 3, wherein: the first screw pair (635) comprises a first screw shaft (6351) rotatably connected to the first supporting plate (631), and a first transmission nut (6352) arranged on the first rotating seat (634) and screwed on the first screw shaft (6351); the first belt transmission pair (636) comprises a first driving wheel (6361) arranged on an output shaft of the first lifting motor (632), a first driven wheel (6362) arranged on the first screw shaft (6351), and a first transmission belt (6363) sleeved on the first driving wheel (6361) and the first driven wheel (6362).

5. A multi-target gun vacuum coating apparatus as in claim 3, wherein: the second belt transmission pair (639) comprises a second driving wheel (6391) arranged on an output shaft of the first rotating motor (637), a second driven wheel (6392) arranged on the first rotating shaft (638), and a second transmission belt (6393) sleeved on the second driving wheel (6391) and the second driven wheel (6392).

6. The multi-target gun vacuum coating apparatus of claim 1, wherein: the second rotary lifting mechanism (73) comprises a second supporting plate (731) arranged on the sputtering chamber (3), a second lifting motor (732) and a second sliding rail (733) arranged on the second supporting plate (731), a second rotating seat (734) connected on the second sliding rail (733) in a sliding mode, a second screw pair (735) arranged between the second supporting plate (731) and the second rotating seat (734), a third belt transmission pair (736) arranged between the second lifting motor (732) and the second screw pair (735), a second rotary motor (737) arranged on the second rotating seat (734), a second rotating shaft (738) connected on the second rotating seat (734) in a rotating mode, and a fourth belt transmission pair (738 9) arranged between the second rotary motor (737) and the second rotating shaft (738), and the coating table (74) is arranged on the second rotating shaft (738).

7. The multi-target gun vacuum coating apparatus according to claim 6, wherein: the second screw pair (735) comprises a second screw shaft (7351) rotatably connected to the second supporting plate (731), and a second transmission nut (7352) arranged on the second rotary seat (734) and screwed to the second screw shaft (7351); the third belt transmission pair (736) comprises a third driving wheel (7361) arranged on the output shaft of the second lifting motor (732), a third driven wheel (7362) arranged on the second screw shaft (7351), and a third transmission belt (7363) sleeved on the third driving wheel (7361) and the third driven wheel (7362).

8. The multi-target gun vacuum coating apparatus according to claim 6, wherein: the fourth belt transmission pair (739) comprises a fourth driving wheel (7391) arranged on an output shaft of the second rotating motor (737), a fourth driven wheel (7392) arranged on the second rotating shaft (738), and a fourth transmission belt (7393) sleeved on the fourth driving wheel (7391) and the fourth driven wheel (7392).

9. The multi-target gun vacuum coating apparatus of claim 1, wherein: the target gun group (72) is arranged on a piston rod of the lifting cylinder (71).

10. The multi-target gun vacuum coating apparatus of claim 1, wherein: valves are respectively arranged on the communication channels between the vacuum pump (4) and the pre-pumping chamber (2) and between the pre-pumping chamber (2) and the sputtering chamber (3).