CN219041896U - Gateway device with stacked distribution main board - Google Patents

Gateway device with stacked distribution main board Download PDF

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Publication number
CN219041896U
CN219041896U CN202221568919.7U CN202221568919U CN219041896U CN 219041896 U CN219041896 U CN 219041896U CN 202221568919 U CN202221568919 U CN 202221568919U CN 219041896 U CN219041896 U CN 219041896U
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heat dissipation
movable shell
gateway device
accommodating cavity
interface
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CN202221568919.7U
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Chinese (zh)
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陈如兵
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Wanrun Smart Guangdong Technology Co ltd
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Wanrun Smart Guangdong Technology Co ltd
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Abstract

A gateway device with a stacked distribution motherboard, comprising: the device comprises an L-shaped mounting seat, a movable shell, a main board and a heat dissipation fan; the vertical plate is vertically arranged on the bottom plate; the movable shell is provided with a containing cavity; the movable shell is detachably arranged on the bottom plate, the bottom opening of the accommodating cavity is covered by the bottom plate, and the side opening of the accommodating cavity is covered by the vertical plate, so that the inside and the outside of the accommodating cavity are separated; the plurality of mainboards are horizontally arranged in the accommodating cavity, two adjacent mainboards are vertically stacked, and a heat dissipation gap is formed between the two mainboards; the heat dissipation fan is arranged on the side face of the movable shell and is used for introducing air flow to the main board so that the air flow passes through the plurality of heat dissipation gaps. The gateway device with the stacked distribution main boards is characterized in that the main boards are distributed on the bottom board in a stacked mode, so that the heat dissipation fan drives air flow to pass through heat dissipation gaps at all height positions, and the heat dissipation efficiency of the main boards is improved; meanwhile, the gateway device can be connected in a split mode, so that daily maintenance of the main board is facilitated, and the problem that the operation is influenced by the heat dissipation fan when the main board is debugged is avoided.

Description

Gateway device with stacked distribution main board
Technical Field
The utility model relates to the technical field of gateway devices, in particular to a gateway device with a stacked distribution main board.
Background
In the conventional gateway device, the main board is generally covered in the housing in order to prevent external medium from entering the interior of the device. The hood generally adopts a sealed structure, so that the hood is relatively troublesome to take out and has poor heat dissipation effect, and heat emitted by the main board during working cannot be timely discharged, so that the normal use of the gateway device is affected.
Disclosure of Invention
The utility model aims to provide a gateway device with a stacked distribution main board, which improves the heat dissipation efficiency of the main board by distributing the main board on a bottom board in a stacked mode so that heat dissipation fans can drive air flow to pass through heat dissipation gaps at various height positions.
To achieve the purpose, the utility model adopts the following technical scheme:
a gateway device with a stacked distribution motherboard, comprising: the device comprises an L-shaped mounting seat, a movable shell, a main board and a heat dissipation fan;
the L-shaped structure comprises a bottom plate and a vertical plate, wherein the vertical plate is vertically arranged on the bottom plate; the movable shell is provided with a containing cavity; the movable shell is detachably arranged on the bottom plate, the bottom opening of the accommodating cavity is covered by the bottom plate, and the side opening of the accommodating cavity is covered by the vertical plate, so that the inside and the outside of the accommodating cavity are separated;
the plurality of mainboards are horizontally arranged in the accommodating cavity, two adjacent mainboards are vertically stacked, and a heat dissipation gap is formed between the two mainboards; the heat dissipation fan is arranged on the side face of the movable shell and is used for introducing air flow to the main board so that the air flow passes through the plurality of heat dissipation gaps.
Preferably, the movable shell is provided with a plurality of heat dissipation grooves with the inside and the outside communicated.
More preferably, one end of the movable shell along the length direction is provided with the side opening, the other opposite end is provided with the heat dissipation fan, and a plurality of side surfaces between two ends of the movable shell are provided with the heat dissipation grooves.
Preferably, the method further comprises: a connection assembly;
the connection assembly includes: an L-shaped fastener;
the L-shaped fastener is arranged at the bottom of the movable shell; the L-shaped fastener is provided with a vertical fastener extending vertically and a transverse fastener extending transversely; one end of the vertical fastener is connected with the movable shell, and the other end of the vertical fastener is connected with the transverse fastener;
the bottom plate is provided with a fixed groove along the length direction; the transverse fastener is clamped in the fixing groove, so that the movable shell is detachably arranged on the bottom plate.
More preferably, the vertical plate is provided with a buckling groove;
the connection assembly further includes: a buckling piece; one end of the movable shell along the length direction is provided with the L-shaped fastener, and the other end of the movable shell is provided with the buckle plate;
the buckle piece includes: the first buckle plate and the second buckle plate;
one end of the first buckle plate is connected with the movable shell, and the other end of the first buckle plate passes through the buckle groove and is rotatably connected with the second buckle plate.
Further optimally, the upper surface of the bottom plate is provided with limit strips along two side edges respectively; two opposite side surfaces of the accommodating cavity are respectively abutted against the limiting strips, so that the bottom opening of the accommodating cavity is clamped on the limiting strips on two sides.
More preferably, the method further comprises: a functional interface;
the functional interface is electrically and/or communicatively connected to the main board;
the functional interface is arranged on the vertical plate and is positioned on the outer side of the accommodating cavity.
Further preferably, the functional interface includes: at least one of an Ethernet interface, an optical fiber interface, a LAN/POE interface, a power interface, a USB connection interface and a SIM card interface.
The technical scheme provided by the utility model can comprise the following beneficial effects:
the gateway device with the stacked distribution main boards is characterized in that the main boards are distributed on the bottom board in a stacked mode, so that the heat dissipation fan drives air flow to pass through heat dissipation gaps at various height positions, and the heat dissipation efficiency of the main boards is improved. Meanwhile, the gateway device can be connected in a split mode, the L-shaped mounting seat is detachably connected with the movable shell, the main board positioned on the L-shaped mounting seat and the heat dissipation fan positioned on the movable shell can be separated independently, daily maintenance of the main board is facilitated, the problem that the operation is influenced by the heat dissipation fan when the main board is debugged is avoided, and the installation convenience of the gateway device is improved.
Drawings
FIG. 1 is a schematic view of one embodiment of an L-shaped mount and a movable housing in combination;
FIG. 2 is a schematic view of one embodiment of the L-shaped mount and the movable housing prior to assembly;
FIG. 3 is a schematic view of one embodiment of the L-shaped mount and the movable housing prior to assembly;
fig. 4 is an enlarged view of a portion a in fig. 2.
Wherein:
the device comprises an L-shaped mounting seat 1, a movable shell 2, a main board 3 and a heat dissipation fan 4; a connection assembly 5; a limit bar 6; a functional interface 8;
a bottom plate 11, a vertical plate 12, a fixed groove 13, a buckling groove 14 and a heat dissipation groove 15; a housing cavity 21, a bottom opening 22, a side opening 23; a heat dissipation gap 31;
an L-shaped fastener 51, a buckle piece 52;
vertical fasteners 511 and horizontal fasteners 512; a first gusset 521, a second gusset 522;
an ethernet interface 81, an optical fiber interface 82, a LAN/POE interface 83, a power interface 84, a USB connection interface 85, and a SIM card interface 86.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The technical scheme of the scheme is further described through the specific embodiments with reference to the accompanying drawings.
A gateway device with a stacked distribution motherboard, comprising: the device comprises an L-shaped mounting seat 1, a movable shell 2, a main board 3 and a heat dissipation fan 4;
the L-shaped structure is provided with a bottom plate 11 and a vertical plate 12, and the vertical plate 12 is vertically arranged on the bottom plate 11; the movable housing 2 is provided with a containing cavity 21; the movable housing 2 is detachably mounted on the bottom plate 11, a bottom opening 22 of the accommodating cavity 21 is covered by the bottom plate 11, and a side opening 23 of the accommodating cavity 21 is covered by the vertical plate 12, so that the inside and the outside of the accommodating cavity 21 are separated;
the plurality of mainboards 3 are horizontally arranged in the accommodating cavity 21, two adjacent mainboards 3 are vertically stacked, and a heat dissipation gap 31 is formed between the two mainboards 3; the heat dissipation fan 4 is mounted on the side surface of the movable housing 2, and is configured to introduce an air flow into the main board 3, so that the air flow passes through the plurality of heat dissipation gaps 31.
The present solution provides a gateway device with stacked distribution boards, which distributes the boards 3 in a stacked manner on a base plate 11, so that a heat dissipation fan 4 drives air flow to pass through heat dissipation gaps 31 at various height positions, thereby improving the heat dissipation efficiency of the boards 3. Meanwhile, the gateway device can be connected in a split mode, the L-shaped mounting seat 1 is detachably connected with the movable shell 2, the main board 3 positioned on the L-shaped mounting seat 1 and the heat dissipation fan 4 positioned on the movable shell 2 can be separated independently, daily maintenance of the main board 3 is facilitated, the problem that the operation is influenced by the heat dissipation fan 4 when the main board 3 is debugged is avoided, and the installation convenience of the gateway device is improved.
Specifically, the L-shaped mounting seat 1 is detachably connected with the movable shell 2, as shown in fig. 1-4, the L-shaped mounting seat 1 is of an L-shaped structure and is provided with a vertical riser 12 and a horizontal bottom plate 11; while the mobile casing 2 is provided with a containing cavity 21, wherein a bottom opening 22 of the containing cavity 21 is downward opened, and a side opening 23 is positioned on the side wall; thus, when the L-shaped mounting seat 1 is assembled with the movable shell 2, the vertical plate 12 of the L-shaped mounting seat 1 can cover the opening of the side wall of the accommodating cavity 21, and the bottom plate 11 of the L-shaped mounting seat 1 can cover the opening 22 at the bottom of the accommodating cavity 21; thereby, the opening of the accommodating chamber 21 is completely covered, and the inside and outside of the accommodating chamber 21 are separated; the movable case 2, the bottom plate 11 and the riser 12 enclose the main plate 3, the main plate 3 is sealed, and external impurities are not easily introduced into the accommodating chamber 21. The heat radiation fan 4 is arranged on the side surface of the movable shell 2; the plurality of mainboards 3 are horizontally arranged in an extending way and are arranged in a stacking way from bottom to top in sequence, and a heat dissipation gap 31 is formed between the mainboards 3 and the mainboards 3; the heat dissipation gap 31 extends horizontally, and when the heat dissipation fan 4 is mounted on the side surface of the movable housing 2, the air flow from the outside of the accommodating cavity 21 can be directly transferred into the accommodating cavity 21, and the air flow passes through the heat dissipation gap 31 between the main board 3 and the main board 3, so that the heat dissipation efficiency of the main board 3 is improved, and the main board 3 is prevented from overheating. When the main board 3 is required to be debugged, only the L-shaped mounting seat 1 and the movable shell 2 are required to be separated, and as the radiating fan 4 and the main board 3 can be mutually separated and are connected to the same base, a worker can avoid contacting the radiating fan 4 during debugging; and L type mount pad 1 is L type structure, after separating out heat dissipation fan 4, L type mount pad 1 has four face at least and can communicate with each other with the air, can dismantle heat dissipation fan 4 after carrying out heat transfer, avoids the overheated problem of appearance when mainboard 3 debugging.
Preferably, the movable housing 2 is provided with a plurality of heat dissipation grooves 15 communicating between the inside and the outside.
As shown in fig. 1-3, a plurality of heat dissipation grooves 15 are disposed on the movable housing 2, and may be disposed on a plurality of sides of the movable housing 2, for example, on two sides along the length direction, or on the upper surface of the movable housing 2, and the air flow introduced from the heat dissipation fan 4 on one side of the movable housing 2 may be output from the heat dissipation grooves 15 of the movable housing 2, so as to improve the fluidity of the air flow, and timely discharge the air flow with higher temperature and timely discharge the heat.
More preferably, one end of the movable housing 2 along the length direction is provided with the side opening 23, the other opposite end is provided with the heat dissipation fan 4, and a plurality of side surfaces between the two ends of the movable housing 2 are provided with the heat dissipation grooves 15.
As shown in fig. 1 and 3, the movable housing 2 is provided with a side opening 23 at one end in the length direction and a heat radiation fan 4 at the other end in the length direction; and a plurality of heat dissipation grooves 15 are formed on the left side, the right side and the upper side between the two ends in the length direction so as to discharge heat from different positions of the accommodating cavity 21, thereby realizing multi-directional heat exchange of the air flow in the accommodating cavity 21.
Preferably, the method further comprises: a connection assembly 5;
the connection assembly 5 includes: an L-shaped fastener 51;
the L-shaped fastener 51 is mounted at the bottom of the movable shell 2; the L-shaped fastener 51 is provided with a vertical fastener 511 extending vertically and a transverse fastener 512 extending transversely; one end of the vertical fastener 511 is connected to the movable housing 2, and the other end is connected to the horizontal fastener 512;
the bottom plate 11 is provided with a fixed groove 13 along the length direction; the cross fastener 512 is fastened to the fixing slot 13, so that the movable housing 2 is detachably mounted on the base plate 11.
As shown in fig. 3, when the L-shaped fastener 51 is mounted on the movable housing 2 and the movable housing 2 is required to be mounted on the bottom plate 11, the transverse fastener 512 of the L-shaped fastener 51 is required to be clamped in the fixing groove 13; the inner wall of the fixed slot 13 has a limiting function on the transverse fastening piece 512, so that the transverse fastening piece 512 can be prevented from swinging along the two sides of the length direction of the movable shell 2, and the stability of the movable shell 2 on the bottom plate 11 is improved.
More preferably, the riser 12 is provided with a buckle slot 14;
the connection assembly 5 further comprises: a buckle plate 52; one end of the movable shell 2 along the length direction is provided with the L-shaped fastener 51, and the other end is provided with the buckle plate 52;
the buckle member 52 includes: a first gusset 521 and a second gusset 522;
one end of the first buckle 521 is connected to the movable housing 2, and the other end thereof is rotatably connected to the second buckle 522 after passing through the buckle slot 14.
As shown in fig. 2-4, an L-shaped fastener 51 is installed at the bottom of one end of the movable housing 2, and a buckling piece 52 is installed at the top of the other end; the buckling piece 52 is provided with a first buckling piece 521 and a second buckling piece 522, and the first buckling piece 521 and the second buckling piece 522 are rotatably connected; when the movable shell 2 is required to be mounted on the bottom plate 11, the second buckle 522 and the first buckle 521 only need to sequentially pass through the buckle groove 14, the first buckle 521 is limited in the buckle groove 14, and the first buckle 521 is limited by the inner wall of the buckle groove 14; the second buckling plate 522 and the first buckling plate 521 are rotatably connected, and only the second buckling plate 522 is required to be rotated to enable the first buckling plate 521 and the second buckling plate 522 to be in a nonlinear connection angle, so that the first buckling plate 521 is prevented from being separated from the buckling groove 14, and the first buckling plate 521 is kept limited in the buckling groove 14; the structure is combined with the L-shaped fastener 51, the front end and the rear end of the movable shell 2 are fixed on the L-shaped mounting seat 1, so that the fixing stability is improved, and the movable shell is detachable.
Further optimally, the upper surface of the bottom plate 11 is provided with limit strips 6 along two side edges respectively; two opposite sides of the accommodating cavity 21 respectively abut against the limit bars 6, so that the bottom opening 22 of the accommodating cavity 21 is clamped to the limit bars 6 on two sides.
As shown in fig. 1 and 3, the bottom plate 11 is provided with a limiting strip 6, and based on that the two ends of the movable shell 2 are respectively provided with an L-shaped fastener 51 and a buckle plate 52, the bottom of the accommodating cavity 21 can be further clamped to the limiting strip 6 positioned at two sides of the bottom plate 11, the limiting strip 6 can open the accommodating cavity 21, so that the inward retraction between the two ends of the accommodating cavity 21 is avoided, the strength of the movable shell 2 is further improved, and the fixing stability of the movable shell 2 is also improved.
More preferably, the method further comprises: a functional interface 8;
the functional interface 8 is electrically and/or communicatively connected to the motherboard 3;
the functional interface 8 is mounted on the riser 12 and is located outside the housing cavity 21.
As shown in fig. 2, the functional interface 8 is used for electrically and/or communicatively connecting with the motherboard 3, so that an external device can form a connection relationship with the motherboard 3; the function interface 8 is a well-known mechanism having a connection to the motherboard 3, such as a well-known ethernet interface 81, LAN interface, WAN interface, optical fiber interface 82, LAN/POE interface 83, power interface 84, USB connection interface 85, SMA antenna interface, and the like. And because the function interface 8 of this scheme sets up in riser 12, and mainboard 3 installs in bottom plate 11, and the relative position between function interface 8 and the mainboard 3 is shorter, and required wire is short, and connects conveniently, can avoid the influence of heat dissipation fan 4 to the wiring again.
More preferably, the functional interface 8 comprises: at least one of an ethernet interface 81, an optical fiber interface 82, a LAN/POE interface 83, a power interface 84, a USB connection interface 85, and a SIM card interface 86.
The ethernet interface 81 includes a LAN interface and a WAN interface; the LAN interface is used for connecting the Internet equipment to form an interconnection local area network, and the WAN interface is used for connecting the Internet to form a wide area network.
The fiber interface 82 may also be implemented to couple up to a wide area network, with the fiber supporting single mode and multimode fibers and the portal supporting 10/100/1000M adaptation.
The LAN/POE interface 83 is used to provide network power control. The LAN/POE interface 83 is capable of powering POE devices such as cameras, WIFI hotspots, etc.
The power interface 84 is used to power the gateway device. The USB connection interface 85 is used to connect an external device, and enable the external device to perform data transmission with the gateway apparatus.
The SIM card interface 86 is used to connect to a SIM card, and may access the mobile public network through a 4G or 5G module.
The technical principle of the present solution is described above in connection with the specific embodiments. The description is only intended to explain the principles of the present solution and should not be construed in any way as limiting the scope of the present solution. Based on the explanations herein, other embodiments of the present solution will be apparent to those skilled in the art without undue burden, and such modifications will fall within the scope of the present solution.

Claims (8)

1. A gateway device with a stacked distribution motherboard, comprising: the device comprises an L-shaped mounting seat, a movable shell, a main board and a heat dissipation fan;
the L-shaped mounting seat is provided with a bottom plate and a vertical plate, and the vertical plate is vertically arranged on the bottom plate; the movable shell is provided with a containing cavity; the movable shell is detachably arranged on the bottom plate, the bottom opening of the accommodating cavity is covered by the bottom plate, and the side opening of the accommodating cavity is covered by the vertical plate, so that the inside and the outside of the accommodating cavity are separated;
the plurality of mainboards are horizontally arranged in the accommodating cavity, two adjacent mainboards are vertically stacked, and a heat dissipation gap is formed between the two mainboards; the heat dissipation fan is arranged on the side face of the movable shell and is used for introducing air flow to the main board so that the air flow passes through the plurality of heat dissipation gaps.
2. The gateway device with stacked distribution boards according to claim 1, wherein the movable housing is provided with a plurality of heat dissipation grooves communicating between the inside and the outside.
3. The gateway device with stacked distribution boards according to claim 2, wherein one end of the movable housing in the length direction is provided with the side opening, the other opposite end is provided with the heat dissipation fan, and a plurality of sides between the two ends of the movable housing are provided with the heat dissipation grooves.
4. The gateway device with stacked distribution motherboard of claim 1, further comprising: a connection assembly;
the connection assembly includes: an L-shaped fastener;
the L-shaped fastener is arranged at the bottom of the movable shell; the L-shaped fastener is provided with a vertical fastener extending vertically and a transverse fastener extending transversely; one end of the vertical fastener is connected with the movable shell, and the other end of the vertical fastener is connected with the transverse fastener;
the bottom plate is provided with a fixed groove along the length direction; the transverse fastener is clamped in the fixing groove, so that the movable shell is detachably arranged on the bottom plate.
5. The gateway device with stacked distribution boards of claim 4, wherein the riser is provided with a buckle slot;
the connection assembly further includes: a buckling piece; one end of the movable shell along the length direction is provided with the L-shaped fastener, and the other end of the movable shell is provided with the buckle plate;
the buckle piece includes: the first buckle plate and the second buckle plate;
one end of the first buckle plate is connected with the movable shell, and the other end of the first buckle plate passes through the buckle groove and is rotatably connected with the second buckle plate.
6. The gateway device with the stacked distribution main board according to claim 5, wherein limit strips are respectively arranged on the upper surface of the bottom board along two side edges; two opposite side surfaces of the accommodating cavity are respectively abutted against the limiting strips, so that the bottom opening of the accommodating cavity is clamped on the limiting strips on two sides.
7. A gateway device with stacked distribution boards according to any one of claims 1-6, further comprising: a functional interface;
the functional interface is electrically and/or communicatively connected to the main board;
the functional interface is arranged on the vertical plate and is positioned on the outer side of the accommodating cavity.
8. The gateway device with stacked distribution boards of claim 7, wherein the functional interface comprises: at least one of an Ethernet interface, an optical fiber interface, a LAN/POE interface, a power interface, a USB connection interface and a SIM card interface.
CN202221568919.7U 2022-06-22 2022-06-22 Gateway device with stacked distribution main board Active CN219041896U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221568919.7U CN219041896U (en) 2022-06-22 2022-06-22 Gateway device with stacked distribution main board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221568919.7U CN219041896U (en) 2022-06-22 2022-06-22 Gateway device with stacked distribution main board

Publications (1)

Publication Number Publication Date
CN219041896U true CN219041896U (en) 2023-05-16

Family

ID=86316007

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221568919.7U Active CN219041896U (en) 2022-06-22 2022-06-22 Gateway device with stacked distribution main board

Country Status (1)

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CN (1) CN219041896U (en)

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