CN214376276U - Heat dissipation device for server case and server case - Google Patents

Heat dissipation device for server case and server case Download PDF

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Publication number
CN214376276U
CN214376276U CN202122163475.0U CN202122163475U CN214376276U CN 214376276 U CN214376276 U CN 214376276U CN 202122163475 U CN202122163475 U CN 202122163475U CN 214376276 U CN214376276 U CN 214376276U
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China
Prior art keywords
side plate
airflow
accommodating cavity
box body
curb plate
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CN202122163475.0U
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Chinese (zh)
Inventor
金尧
邹晓光
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Shenzhen Huachu Information Technology Development Co Ltd
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Shenzhen Huachu Information Technology Development Co Ltd
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Abstract

The utility model discloses a heat dissipation device for a server case and the server case, the heat dissipation device comprises a box body, a fan component and a flow guide structure, wherein the box body is provided with a containing cavity, an air inlet and an air outlet which are communicated with the containing cavity; the fan assembly is arranged in the accommodating cavity and provided with an airflow input end and an airflow output end, the airflow input end is communicated with the air inlet, and the airflow output end is communicated with the air outlet; the water conservancy diversion structure is located and is held the intracavity, the water conservancy diversion structure includes first curb plate and second curb plate, the one end of first curb plate and second curb plate is connected respectively in the both sides of air outlet, the other end of first curb plate and second curb plate is connected respectively in the both sides of air current output end, enclose between first curb plate and the second curb plate and close formation air current passageway, in the air-out direction, interval between first curb plate and the second curb plate crescent, integrate the fan subassembly in the box body, can make things convenient for installing in server machine incasement of pull formula, make things convenient for heat abstractor's installation, maintain and change.

Description

Heat dissipation device for server case and server case
Technical Field
The utility model relates to a server technical field especially relates to a heat abstractor and server machine case for server machine case.
Background
With the rapid development of computer technology, the heat dissipation requirement of the server is higher and higher. The blade server can be a computer with high density and high performance, and is a rack-mounted computer with standard height, wherein a plurality of card-type server units can be inserted into the rack-mounted computer case, and the blade server can be applied to special industries and high-density computing environments. In the existing server chassis, the fan is usually directly installed in the chassis through a fixing structure such as a screw, which is inconvenient to install, maintain and replace.
Disclosure of Invention
In view of this, the utility model provides a heat abstractor and server machine case for server machine case.
The utility model provides a heat abstractor for server machine case, include:
the box body is provided with an accommodating cavity, an air inlet and an air outlet which are communicated with the accommodating cavity;
the fan assembly is arranged in the accommodating cavity and provided with an airflow input end and an airflow output end, the airflow input end is communicated with the air inlet, and the airflow output end is communicated with the air outlet;
the diversion structure is arranged in the accommodating cavity and comprises a first side plate and a second side plate, one end of the first side plate is connected with one end of the second side plate respectively, the other end of the first side plate is connected with the other end of the second side plate respectively, the first side plate and the second side plate are enclosed to form an airflow channel, and the distance between the first side plate and the second side plate is gradually increased in the air outlet direction.
Further, the first side plate is an inner wall of one side of the box body.
Further, the included angle between the first side plate and the second side plate is 24-26 degrees.
Further, the fan subassembly includes fan and circuit board, the fan is equipped with airflow input end with airflow output end, the circuit board with the fan electricity is connected, the circuit board install in be close to in the box body the one end of air intake.
Further, the heat dissipation device further comprises an indicator light, the indicator light is mounted on the box body, and the indicator light is electrically connected with the circuit board through an electric wire.
Furthermore, one side of the second side plate, which is opposite to the first side plate, and the inner wall of the other side of the box body enclose to form a wiring channel, and an electric wire of the indicator light penetrates through the wiring channel to be electrically connected with the circuit board.
Further, the air outlet comprises a plurality of hexagonal holes, and the hexagonal holes form a honeycomb structure.
Further, the box body comprises a bottom shell and an upper shell, and the bottom shell and the upper shell are detachably connected and enclosed to form the accommodating cavity.
The utility model provides a server case, which comprises a case body, wherein a first accommodating cavity for accommodating a hard disk module and a second accommodating cavity for accommodating the heat dissipation device are arranged in the case body, the hard disk module is connected with the first accommodating cavity in a telescopic manner, and the heat dissipation device is connected with the second accommodating cavity in a telescopic manner; the first accommodating cavity and the second accommodating cavity are separated through a back plate, the back plate is further provided with a hollow structure to enable the first accommodating cavity to be communicated with the second accommodating cavity, the air inlet is externally leaked from the hollow structure of the back plate and faces the hard disk module in the second accommodating cavity, and the fan assembly is used for driving airflow to dissipate heat of the hard disk module and then inputting the heat into the box body from the air inlet and blowing the heat out of the air outlet through the flow guide structure.
Furthermore, the box body comprises a top plate, a bottom plate, a left side plate and a right side plate, and the top plate, the bottom plate, the left side plate and the right side plate surround the periphery of the back plate; the box body is provided with a first elastic buckle structure, a second elastic buckle structure is arranged at the position, corresponding to the first elastic buckle structure, of the top plate, the bottom plate, the left side plate or the right side plate, and the first elastic buckle structure is connected with the second elastic buckle structure through elastic buckles, so that the box body is locked in the second accommodating cavity.
According to the technical scheme, the fan assembly is integrated in the box body, so that the heat dissipation device can be conveniently installed in a server case in a drawing mode, and the heat dissipation device is convenient to install, maintain and replace; through the setting of water conservancy diversion structure, can guide the air current to concentrate from the air outlet output, prevent that the air current from flowing back the air current input to make this heat abstractor's radiating effect better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.
Fig. 2 is a schematic view of an internal structure of a heat dissipation device according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a server chassis according to an embodiment of the present invention.
Fig. 4 is a schematic view of an internal structure of a box body according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a top plate according to an embodiment of the present invention.
In the drawings, a heat dissipating device 100; a case 10; a bottom case 10 a; an upper case 10 b; an air inlet 11; an air outlet 12; a fan assembly 20; an airflow input 21; an airflow output 22; a fan 23; a circuit board 24; a first side plate 31; a second side plate 32; an air flow passage 33; a routing channel 34; an indicator light 40; a server chassis 200; a case 201; a top plate 201 a; a first cover 2011, a second cover 2012; a slot 2013; a protrusion 2014; a bottom plate 201 b; a left side plate 201 c; a right side plate 201 d; a first receiving cavity 202; a second receiving cavity 203; a back plate 204; a first opening 205; a second opening 206; a card slot 207; an elastic sheet 300; a latch tongue 301.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As shown in fig. 1-3, an embodiment of the present invention provides a heat dissipation apparatus 100 for a server chassis, including a box body 10, a fan assembly 20, and a flow guiding structure, where the box body 10 is provided with a containing cavity, an air inlet 11 communicated with the containing cavity, and an air outlet 12; the fan assembly 20 is arranged in the accommodating cavity, the fan assembly 20 is provided with an airflow input end 21 and an airflow output end 22, the airflow input end 21 is communicated with the air inlet 11, and the airflow output end 22 is communicated with the air outlet 12; the diversion structure is arranged in the accommodating cavity and comprises a first side plate 31 and a second side plate 32, one end of each of the first side plate 31 and the second side plate 32 is connected to two sides of the air outlet 12 respectively, the other end of each of the first side plate 31 and the second side plate 32 is connected to two sides of the air flow output end 22 respectively, an air flow channel 33 for outputting air flow is formed by enclosing and closing the first side plate 31 and the second side plate 32, and the distance between the first side plate 31 and the second side plate 32 is gradually increased in the air outlet direction.
In the embodiment of the present invention, the fan assembly 20 is integrated in the box body 10, which not only facilitates the pull-type installation in the server chassis 200, but also facilitates the installation, maintenance and replacement of the heat dissipation device 100 due to the modular design, and facilitates the heat dissipation of the hard disk module, thereby improving the heat dissipation effect; the fan assembly 20 is used for driving airflow to flow, so that heat of the hard disk module is taken away and then is input into the box body 10 from the air inlet 11, and is output to an airflow channel 33 formed by enclosing the flow guide structure through the airflow output end 22, and airflow is output from the air outlet 12 in a centralized manner; through the setting of water conservancy diversion structure, can guide the air current to concentrate from air outlet 12 output, prevent that the air current from flowing back air current input 21 to through in the air-out direction, make the interval gradual increase's between first curb plate 31 and the second curb plate 32 setting, can promote the air volume, thereby make this heat abstractor 100's radiating effect better.
Optionally, the first side plate 31 is an inner wall of one side of the box 10, the inner wall of one side of the box 10 is used as the first side plate, so that the inner structure of the box 10 can be simplified, and only the inclined second side plate 32 needs to be arranged, it can be understood that a plate body can be added to tightly attach to the inner wall of the box 10 to form the first side plate, and then the first side plate and the second side plate 32 enclose to form the airflow channel 33, and the design of the second side plate 32 enables the airflow with heat, which is driven by the fan assembly 20 to be input into the box 10, to be concentrated and output from the airflow channel 33 to the air outlet 12, so that the airflow is prevented from flowing back to the airflow input end 21 or being scattered from other gaps to affect heat dissipation.
Optionally, the angle between the first side plate 31 and the second side plate 32 is 24 ° to 26 °. The design can be 24 °, 25 °, 25.3 °, 25.5 ° or 26 °, since the width of the airflow output end 22 of the fan assembly 20 is smaller than the width of the box body 10, a gap is left between the airflow output end 22 and the inner wall of the box body 10, and the airflow output by the airflow output end 22 cannot be prevented from being scattered out of the gap or flowing back to the airflow input end 21, so that the airflow output end 22 is disposed on the inner wall of one side close to the box body 10, and then the second side plate 32 and the inner wall of the box body 10 are arranged to form the airflow channel 33 in a surrounding manner, so as to prevent the airflow from being scattered out of the gap or flowing back to the airflow input end 21.
Optionally, the fan assembly 20 includes a fan 23 and a circuit board 24, the fan 23 is provided with an airflow input end 21 and an airflow output end 22, the circuit board 24 is electrically connected to the fan 23, and the circuit board 24 is installed at an end of the box body 10 close to the air inlet 11.
Optionally, the heat dissipation device 100 further includes an indicator light 40, the indicator light 40 is installed in the box body 10, the indicator light 40 is electrically connected to the circuit board 24 through an electric wire, and is used for displaying a starting state of the heat dissipation module, so as to conveniently observe whether the heat dissipation device 100 normally works, exemplarily, the indicator light 40 is installed in one side of the box body 10 where the air outlet 12 is arranged, so that the indicator light 40 is located outside the server chassis 200, and is convenient for observation.
Optionally, a side of the second side plate 32 facing away from the first side plate 31 and an inner wall of the other side of the box body 10 enclose to form a wiring channel 34, and an electric wire of the indicator 40 passes through the wiring channel 34 and is electrically connected to the circuit board 24. The separation of the routing channel 34 from the air flow channel 33 is achieved by the above arrangement using a simple structural arrangement, preventing mutual interference.
Optionally, the air outlet 12 includes a plurality of hexagonal holes, and the plurality of hexagonal holes form a honeycomb structure, so that the ventilation effect of the air outlet 12 of the honeycomb structure is better than that of the existing quadrilateral air outlet 12.
Optionally, the box body 10 includes a bottom shell 10a and an upper shell 10b, the bottom shell 10a and the upper shell 10b are detachably connected to form a containing cavity, the bottom shell 10a and the upper shell 10b can be connected through screws, and are convenient to detach and install, and can also be detachably connected through other modes such as a buckle structure, and the box body 10 is of a cuboid structure, so that the drawing type of convenience is installed in the server case 200.
As shown in fig. 3-5, an embodiment of the present invention further provides a server chassis 200, which includes a box 201, a first receiving cavity 202 for receiving a hard disk module and a second receiving cavity 203 for receiving the heat dissipation device 100 are disposed in the box 201, the hard disk module is connected to the first receiving cavity 202 in a drawable manner, and the heat dissipation device 100 is connected to the second receiving cavity 203 in a drawable manner; the first accommodating cavity 202 and the second accommodating cavity 203 are separated by a back plate 204, the back plate 204 is further provided with a hollow structure to enable the first accommodating cavity 202 and the second accommodating cavity 203 to be communicated, the air inlet 11 is communicated with the hollow structure of the back plate 204, and the fan assembly 20 is used for driving airflow to input the airflow into the box body 10 from the air inlet 11 after the airflow dissipates heat of the hard disk module and blow out from the air outlet 12 through the flow guide structure.
In the embodiment of the present invention, the motherboard module and the power module are installed in the second receiving cavity 202 in a drawing manner, and the circuit board 24 of the motherboard module, the power module and the fan assembly 20 is provided with connectors for plugging plugs on the back plate 204, so that the power module supplies power to the hard disk module, the motherboard module and the fan 23, and the connectors on the back plate 204 are also used for data transmission between the hard disk module and the motherboard module; the main board module, the power module, the hard disk module and the heat dissipation device 100 are designed to be drawn and pulled, so that the main board module, the power module, the hard disk module and the heat dissipation device 100 are convenient to install, maintain and replace, a first opening 205 and a second opening 206 are respectively arranged at two ends of the box body 201 in the length direction, the first accommodating cavity 202 is communicated with the first opening 205, the second accommodating cavity 203 is communicated with the second opening 206, the heat dissipation device 100 drives airflow to be input from the first opening 205, the airflow enters the second accommodating cavity 203 after entering the first accommodating cavity 202 to take away heat of the hard disk module, the airflow with heat is output from the second opening 206 by the driving of the heat dissipation device 100, and the heat dissipation effect is good.
Optionally, the box 201 includes a top plate 201a, a bottom plate 201b, a left side plate 201c and a right side plate 201d, and the top plate 201a, the bottom plate 201b, the left side plate 201c and the right side plate 201d surround the back plate 204; the box body 10 is provided with a first elastic buckle structure, a second elastic buckle structure is arranged at a position of the top plate 201a, the bottom plate 201b, the left side plate 201c or the right side plate 201d corresponding to the first elastic buckle structure, and the first elastic buckle structure is elastically buckled and connected with the second elastic buckle structure, so that the box body 10 is locked in the second accommodating cavity 203.
Illustratively, the first elastic fastening structure is an elastic piece 300 installed on the heat sink 100, the elastic piece 300 extends to form a protruding locking tongue 301, the second elastic fastening structure is a clamping groove 207 arranged at a corresponding position of the top plate 201a and the bottom plate 201b, when the heat sink 100 is inserted into the corresponding position, the locking tongue 301 is clamped into the clamping groove 207 to lock the heat sink 100, and because the elastic piece 300 has elasticity, the heat sink 100 needs to be pulled out forcibly when the heat sink 100 needs to be pulled out.
Illustratively, the left side plate 201c and the right side plate 201d are respectively vertically connected to two sides of the bottom plate 201b, and are integrally formed to form a U-shaped structure, and the top plate 201a covers the U-shaped structure and is riveted with the U-shaped structure, so that the assembly and disassembly are convenient; the top plate 201a includes a first cover plate 2011 covering the first receiving cavity 202 and a second cover plate 2012 covering the second receiving cavity 203, the first cover plate 2011 is provided with a first buckle structure towards one side of the second cover plate 2012, the second cover plate 2012 is provided with a second buckle structure towards one side of the first cover plate 2011, and the first buckle structure is connected with the second buckle structure in a buckle manner.
Specifically, the first locking structure is a slot 2013 disposed on a side of the first cover 2011 facing the second cover 2012, and the second locking structure is a protrusion 2014 disposed on a side of the second cover 2012 facing the first cover 2011, it is understood that the slot 2013 may also be disposed on a side of the second cover 2012 facing the first cover 2011, and the protrusion 2014 may also be disposed on a side of the first cover 2011 facing the second cover 2012; the roof 201a is split into a first cover plate 2011 and a second cover plate 2012, the first containing cavity 202 and the second containing cavity 203 are covered respectively, the detachable connection is realized through the matching of the slot 2013 and the protrusion 2014, the first containing cavity 202 and the second containing cavity 203 are conveniently opened respectively, and therefore any functional module in the box body 201 can be conveniently dismounted.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A heat dissipation device for a server chassis, comprising:
the box body is provided with an accommodating cavity, an air inlet and an air outlet which are communicated with the accommodating cavity;
the fan assembly is arranged in the accommodating cavity and provided with an airflow input end and an airflow output end, the airflow input end is communicated with the air inlet, and the airflow output end is communicated with the air outlet;
the diversion structure is arranged in the accommodating cavity and comprises a first side plate and a second side plate, one end of the first side plate is connected with one end of the second side plate respectively, the other end of the first side plate is connected with the other end of the second side plate respectively, the first side plate and the second side plate are enclosed to form an airflow channel, and the distance between the first side plate and the second side plate is gradually increased in the air outlet direction.
2. The heat dissipating device of claim 1, wherein said first side plate is an inner wall of one side of said case.
3. The heat sink of claim 2, wherein the angle between the first side panel and the second side panel is between 24 ° and 26 °.
4. The heat dissipating device of claim 2, wherein the fan assembly comprises a fan and a circuit board, the fan has the airflow input end and the airflow output end, the circuit board is electrically connected to the fan, and the circuit board is mounted at an end of the box body close to the air inlet.
5. The heat sink of claim 4, further comprising an indicator light mounted to the case, the indicator light being electrically connected to the circuit board by a wire.
6. The heat dissipation device as claimed in claim 5, wherein a side of the second side plate facing away from the first side plate and an inner wall of the other side of the box body enclose a wiring channel, and the electric wire of the indicator passes through the wiring channel to be electrically connected to the circuit board.
7. The heat dissipating device of claim 1, wherein said air outlet comprises a plurality of hexagonal cells forming a honeycomb structure.
8. The heat dissipating device of claim 1, wherein said housing comprises a bottom shell and an upper shell, said bottom shell and said upper shell being detachably connected to enclose said receiving cavity.
9. A server case is characterized by comprising a case body, wherein a first accommodating cavity for accommodating a hard disk module and a second accommodating cavity for accommodating a heat dissipation device according to any one of claims 1 to 8 are arranged in the case body, the hard disk module is connected to the first accommodating cavity in a drawing mode, and the heat dissipation device is connected to the second accommodating cavity in a drawing mode; the first accommodating cavity and the second accommodating cavity are separated through a back plate, the back plate is further provided with a hollow structure, so that the first accommodating cavity is communicated with the second accommodating cavity, the air inlet is communicated with the hollow structure of the back plate, and the fan assembly is used for driving airflow to dissipate heat of the hard disk module, then the airflow is input into the box body from the air inlet, and the airflow passes through the flow guide structure and then is blown out from the air outlet.
10. The server chassis of claim 9, wherein the box comprises a top panel, a bottom panel, a left side panel, and a right side panel, the top panel, the bottom panel, the left side panel, and the right side panel surrounding the back panel; the box body is provided with a first elastic buckle structure, a second elastic buckle structure is arranged at the position, corresponding to the first elastic buckle structure, of the top plate, the bottom plate, the left side plate or the right side plate, and the first elastic buckle structure is connected with the second elastic buckle structure through elastic buckles, so that the box body is locked in the second accommodating cavity.
CN202122163475.0U 2021-09-08 2021-09-08 Heat dissipation device for server case and server case Active CN214376276U (en)

Priority Applications (1)

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CN202122163475.0U CN214376276U (en) 2021-09-08 2021-09-08 Heat dissipation device for server case and server case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122163475.0U CN214376276U (en) 2021-09-08 2021-09-08 Heat dissipation device for server case and server case

Publications (1)

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CN214376276U true CN214376276U (en) 2021-10-08

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CN202122163475.0U Active CN214376276U (en) 2021-09-08 2021-09-08 Heat dissipation device for server case and server case

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114599204A (en) * 2022-01-29 2022-06-07 联想(北京)有限公司 Heat dissipation device and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114599204A (en) * 2022-01-29 2022-06-07 联想(北京)有限公司 Heat dissipation device and electronic equipment

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