CN218244036U

CN218244036U - Case equipment

Info

Publication number: CN218244036U
Application number: CN202221321142.4U
Authority: CN
Inventors: 周鸿飞; 管金库
Original assignee: Xinhuazhang Technology Co ltd
Current assignee: Xinhuazhang Intelligent Technology Shanghai Co ltd
Priority date: 2022-05-27
Filing date: 2022-05-27
Publication date: 2023-01-06
Anticipated expiration: 2032-05-27

Abstract

The embodiment of the application provides a case device, including chassis body and setting up the inside first printed circuit board of chassis body, with the second printed circuit board that first printed circuit board electricity is connected, wherein, chassis body includes relative first side and second side, first printed circuit board is fixed in the first side, the second printed circuit board is fixed in the second side, the chassis include with first side and second side vertically third side and fourth side, the third side is provided with the air intake, the fourth side is provided with the air outlet, the air intake with form heat dissipation channel between the air outlet, heat dissipation channel is located first printed circuit board with between the second printed circuit board. In the case equipment provided by the embodiment of the application, the heat dissipation channel is formed between the air inlet and the air outlet of the case, so that the heat dissipation performance of the internal space of the case is integrally improved, and the heat dissipation problem of a compact space is solved.

Description

Case equipment

Technical Field

The embodiment of the application relates to the technical field of electronic communication equipment, in particular to case equipment.

Background

The chassis device is a part of the computing device and is primarily used to house and hold various accessories (e.g., printed circuit boards). In the existing chassis device, there is usually only one printed circuit board, which results in a dense arrangement of chips on the printed circuit board and also increases the overall size of the chassis. Along with the increasing development of integrated circuits, the power consumption of chips is also increasing continuously, the heat dissipation problem of chassis equipment is a main problem to be faced after the power consumption of the chips is increased, and under the condition that technical nodes are continuously explored, how to ensure that each chip on a single printed circuit board runs at a reasonable working temperature is a difficult problem of structural thermal design, and especially, great test is provided for heat dissipation in an environment with limited space.

SUMMERY OF THE UTILITY MODEL

In view of the above, embodiments of the present application provide a chassis device to solve or partially solve the above problems.

The embodiment of the application provides a case device, including case body and setting up the inside first printed circuit board of case body, with the second printed circuit board that first printed circuit board electricity is connected, wherein, case body includes relative first side and second side, first printed circuit board is fixed in the first side, second printed circuit board is fixed in the second side, the case include with first side and second side vertically third side and fourth side, the third side is provided with the air intake, the fourth side is provided with the air outlet, the air intake with form heat dissipation channel between the air outlet, heat dissipation channel is located between first printed circuit board and the second printed circuit board.

In the chassis device provided by the embodiment of the application, because the first printed circuit board and the second printed circuit board are respectively arranged on the first side and the second side which are opposite to each other, the space for arranging the chips is increased, and meanwhile, the heat dissipation channel is formed between the first printed circuit board and the second printed circuit board, so that the heat dissipation of each chip is more uniform. The design makes the size of the whole case equipment more compact, solves the heat dissipation problem of a compact space, and improves the heat dissipation performance of the whole case equipment.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the description below are only one or more embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without creative efforts.

Fig. 1 shows a schematic diagram of a split structure of an exemplary chassis device according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional diagram illustrating an exemplary enclosure device provided in an embodiment of the present application.

Fig. 3 illustrates an explosive structure diagram of an exemplary air cowl according to embodiments of the present application.

FIG. 4 illustrates a schematic view of an exemplary mounting arrangement for a wind scooper according to an embodiment of the present application.

Fig. 5 shows a schematic structural diagram of an exemplary chassis device provided in an embodiment of the present application.

Fig. 6 shows a schematic structural diagram of an exemplary enclosure device viewed from another angle according to an embodiment of the present application.

Description of reference numerals:

1-case body, 2-first side plate, 3-second side plate, 4-third side plate, 5-fourth side plate, 6-first printed circuit board, 7-second printed circuit board, 8-back plate, 9-heat dissipation channel, 10-air inlet, 11-air outlet, 12-first chip, 13-first radiator, 14-second chip, 15-second radiator, 16-wind scooper, 17-wind scooper base body, 18-front fixing plate, 19-first side fixing plate, 20-second side fixing plate, 21-first sliding groove, 22-second sliding groove, 23-first guide pin, 24-second guide pin, 25-first groove, 26-second groove, 27-front outlet connector, 28-air outlet fan and 29-rear outlet connector.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a case equipment. Fig. 1 is a schematic diagram of a split structure of an exemplary chassis device according to an embodiment of the present disclosure. As shown in fig. 1, the chassis apparatus may include a chassis body 1, a first printed circuit board 6, a second printed circuit board 7, and a backplane 8.

The case body 1 is a frame structure for supporting other electronic components in the case device, and provides mounting positions and mounting spaces for the other electronic components. In some embodiments, the chassis body 1 may further include a first side panel 2 and a second side panel 3 disposed opposite to each other, and a third side panel 4 and a fourth side panel 5 perpendicular to the first side and the second side. The four side plates 2-5 are fixedly connected through screws in sequence and form a case body 1 with a closed space with the other two side plates for matching and connection. The first side plate 2 fixes the first printed circuit board 6 on the surface facing the inside of the case body 1. The second printed circuit board 7 is fixed on one surface of the second side plate 3 facing the inside of the case body 1.

In some embodiments, as shown in fig. 1, the third side plate 4 may be provided with an air inlet 10, the fourth side plate 5 may be provided with an air outlet 11 communicating with the outside, a heat dissipation channel 9 facilitating air flow to reduce the internal temperature of the chassis body may be formed between the air inlet 10 and the air outlet 11, and the heat dissipation channel 9 may be located between the first printed circuit board 6 and the second printed circuit board 7 for dissipating heat from the first printed circuit board 6 and the second printed circuit board 7.

In some embodiments, as shown in fig. 1, the air inlet 10 may be a hole-cut design so that the external ambient air can enter the inside of the chassis body 1, and the air outlet 11 may be two circles of the hole-cut design. In some embodiments, as shown in fig. 1, a back plate 8 may be fixed on a side of the fourth side plate 5 facing the inside of the chassis body 1, and a side of the air outlet 11 facing the inside of the chassis body 1 communicates with the inside of the chassis body 1 through an opening on the back plate 7. The back plate 8 may be a printed circuit board, a data cable, or the like. The back plate 8 may be disposed between the first printed circuit board 6 and the second printed circuit board 7. The first printed circuit board 6 is electrically connected to the second printed circuit board 7 through the back plate 8, thereby realizing high-speed data transmission between the first printed circuit board 6 and the second printed circuit board 7. In this way, the first printed circuit board 6 and the second printed circuit board 7 can be disposed on both sides of the heat dissipation channel, respectively, without affecting the overall calculation performance.

In some embodiments, as shown in fig. 1, an exhaust fan may be disposed on the air outlet 11, so as to accelerate air circulation in the heat dissipation channel and improve the heat dissipation effect.

Fig. 2 is a schematic cross-sectional diagram of an exemplary enclosure device according to an embodiment of the present application. Referring to fig. 2, two first chips 12 may be soldered on the first printed circuit board 6, and two second chips 14 may be soldered on the second printed circuit board 7. It is understood that the number of chips on the first printed circuit board 6 and the second printed circuit board 7 is merely exemplary, and in actual operation, the number of chips may be set as desired. A first heat sink 13 may be placed over the first chip 12, and the first heat sink 13 may be fixed to the first printed circuit board 6 by screws. A second heat sink 15 may be placed over the second chip 14, and the second heat sink 15 may be fixed to the second printed circuit board 7 by screws. The number of chips and heat sinks is merely exemplary here.

In the related art, the heat dissipation channels 9 inside the chassis body 1 are arranged in a disordered manner, which causes uneven heat dissipation of the electronic components inside the chassis body 1, and thus the overall heat dissipation performance of the chassis is poor.

Thus, as shown in fig. 2, in some embodiments, in order to accelerate the gas flow, the heat dissipation channel 9 between the first heat sink 13 and the second heat sink 15 may be provided with a heat dissipation device that guides the gas flow. For example, specifically includes a wind scooper 16. The air guide cover 16 can guide air to flow rapidly in a specified narrow channel, so that the heat dissipation of the surface of the chip is improved.

The embodiment of the application further provides a heat dissipation device, so that the chassis body 1 realizes air conduction through the heat dissipation device in the heat dissipation channel 9, and the heat dissipation performance of the whole chassis is enhanced.

Fig. 3 illustrates an explosive structure diagram of an exemplary air cowl according to embodiments of the present application. Referring to FIG. 3, the wind scooper 16 includes a wind scooper base 17, a front mounting plate 18, a first side mounting plate 19 and a second side mounting plate 20. The wind scooper base 17 may be made of foam, and the front fixing plate 18 and the two side fixing plates may be made of metal or plastic and may be connected to the wind scooper base 17 by gluing or the like.

FIG. 4 illustrates a schematic view of an exemplary mounting arrangement for a wind scooper according to an embodiment of the present application. As shown in fig. 3 and 4, the first side fixing plate 19 and the second side fixing plate 20 are respectively provided with a first sliding slot 21 and a second sliding slot 22, and the two side plates for mating connection in the casing body 1 are provided with a first guide pin 23 and a second guide pin 24 for supporting the wind scooper 16. The first guide pin 23 and the second guide pin 24 may be pins, screws, or the like. One surface of the wind scooper, which is adhered with the front fixing plate 18, faces the air inlet 10, the other surface opposite to the surface faces the air outlet 11, and the first sliding groove 21 and the second sliding groove 22 are inserted with the first guide pin 23 and the second guide pin 24 to fix the position of the wind scooper 16. Two first grooves 25 having the same shape as the first radiator 13 are provided on the surface of the wind scooper 16 facing the first radiator 13 by cutting the wind scooper 16, and two second grooves 26 having a shape matching the second radiator 15 are formed on the surface of the wind scooper 16 facing the second radiator 15. Wherein, a certain gap is left between the first groove 25 and the second groove 26 and the first heat sink 13 and the second heat sink 15. Referring to fig. 1 and fig. 2 again, when cold air enters the interior of the chassis body 1 through the air inlet 10, due to the blockage of the solid portion of the air guiding cover 16, the air flow can only pass through the gap between the air guiding cover 16 and the heat sink uniformly and take away the heat of the heat sink, so as to cool the heat sink, thereby achieving the purpose of heat dissipation.

Fig. 5 shows a schematic structural diagram of an exemplary chassis device provided in an embodiment of the present application. Referring to fig. 5, front outlet connectors 27 are disposed above and below the third side plate 4, one end of each front outlet connector 27 facing the inside of the chassis body 1 is electrically connected to the first printed circuit board 6 and the second printed circuit board 7 by welding, and one end facing the outside of the chassis body 1 is electrically connected to an external electronic device through an interface on the third side plate 4.

Fig. 6 shows a schematic structural diagram of an exemplary enclosure device as provided in an embodiment of the present application, viewed from another angle. Referring to fig. 6, an air outlet 11 is disposed on the fourth side plate 5, two exhaust fans 28 are disposed on a channel of the air outlet 11, and heat inside the chassis body 1 can be exhausted to the outside more quickly by rotation of the exhaust fans 28. As shown in fig. 6, a rear outlet connector 29 may be further disposed above and below the fourth side plate 5, for example, through the back panel 8, one end of the rear outlet connector 29 facing the inside of the chassis body 1 is electrically connected to the first printed circuit board 6 and the second printed circuit board 7 by welding, and one end facing the outside of the chassis body 1 is connected to an external electronic device through an interface of the fourth side plate 5. As shown in fig. 5 and fig. 6, the chassis device can be connected to more external electronic devices by the ordered arrangement of the outlet connectors on the third side plate 4 and the fourth side plate 5.

In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless explicitly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood in specific cases by those of ordinary skill in the art.

In addition, the technical features mentioned in the different embodiments of the present application can be combined with each other as long as they do not conflict with each other.

So far, the technical solutions of the present application have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present application is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the present application, and the technical scheme after the changes or substitutions will fall into the protection scope of the present application.

Claims

1. The case device is characterized by comprising a case body, a first printed circuit board and a second printed circuit board, wherein the first printed circuit board and the second printed circuit board are arranged in the case body, the second printed circuit board is electrically connected with the first printed circuit board, the case body comprises a first side and a second side which are opposite, the first printed circuit board is fixed on the first side, the second printed circuit board is fixed on the second side, the case comprises a third side and a fourth side which are perpendicular to the first side and the second side, an air inlet is formed in the third side, an air outlet is formed in the fourth side, a heat dissipation channel is formed between the air inlet and the air outlet, and the heat dissipation channel is located between the first printed circuit board and the second printed circuit board.

2. The chassis device of claim 1, wherein a first chip is disposed on a side of the first printed circuit board away from the first side, the first chip having a first heat sink disposed thereon; and arranging a second chip on one surface of the second printed circuit board far away from the second side, and arranging a second radiator on the second chip.

3. The chassis apparatus of claim 2, wherein a wind scooper is disposed in the heat dissipation channel.

4. The cabinet device according to claim 3, wherein guide pins are respectively disposed on inner walls of two sides of the cabinet body, sliding grooves are correspondingly disposed on two sides of the wind scooper, and the guide pins are inserted into the sliding grooves to support the wind scooper.

5. The chassis apparatus of claim 3, wherein a side of the wind scooper facing the first printed circuit board has a first recess that matches the shape of the first heat sink, a side of the wind scooper facing the second printed circuit board has a second recess that matches the shape of the second heat sink, and a gap between the first recess and the first heat sink and a gap between the second recess and the second heat sink form a portion of the heat dissipation channel.

6. The chassis device of any of claims 1-5, further comprising a backplane disposed inside the chassis body, the backplane disposed between the first printed circuit board and the second printed circuit board, the first printed circuit board electrically connected to the second printed circuit board through the backplane.

7. The chassis device of claim 6, wherein the air outlet is provided with an exhaust fan, the back plate is disposed on one side of the air outlet of the chassis body, and an opening for accommodating the exhaust fan is disposed on the back plate.

8. The chassis apparatus of claim 3, wherein the wind scooper includes a wind scooper body, a front fixing plate and two side fixing plates, and the front fixing plate and the two side fixing plates are attached to an outer surface of the wind scooper body.

9. The chassis apparatus of claim 8, wherein the material of the wind scooper body is foamed plastic.