CN220171511U - Fan module structure and server heat abstractor - Google Patents
Fan module structure and server heat abstractor Download PDFInfo
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- CN220171511U CN220171511U CN202321658893.XU CN202321658893U CN220171511U CN 220171511 U CN220171511 U CN 220171511U CN 202321658893 U CN202321658893 U CN 202321658893U CN 220171511 U CN220171511 U CN 220171511U
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- 238000009434 installation Methods 0.000 claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 238000012423 maintenance Methods 0.000 abstract description 8
- 230000005611 electricity Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a fan module structure and a server heat dissipation device, wherein the fan module structure comprises: the front frame body and the rear frame body are connected to form an installation cavity, the installation cavity comprises an upper installation cavity and a lower installation cavity, the upper installation cavity and the lower installation cavity are distributed in a front-back staggered mode, an upper 2U fan is placed in the upper installation cavity, and a lower 2U fan is placed in the lower installation cavity. The front frame body and the rear frame body are connected to form a mounting cavity, the mounting cavity comprises an upper mounting cavity and a lower mounting cavity, the upper mounting cavity and the lower mounting cavity are distributed in a front-back staggered mode, the upper mounting cavity is provided with an upper 2U fan, and the lower mounting cavity is provided with a lower 2U fan; the upper 2U fan can be directly and electrically connected to the main board, the lower 2U fan is electrically connected to the fan board, the number of the adapter cables can be effectively reduced, the cost is reduced, and the upper 2U fan and the lower 2U fan can not interfere with each other when installation and maintenance are needed, so that the operation is convenient.
Description
Technical Field
The utility model relates to the technical field of server heat dissipation, in particular to a fan module structure and a server heat dissipation device.
Background
In the prior art, the 4U server needs to develop an independent fan board, the fan board supplies power to 8 fans simultaneously, all power supplies need to be switched from a main board through cables, the size of the fan board is large, the number of used switching cables is large, the cost is high, and meanwhile, the installation and maintenance are inconvenient.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provides a fan module structure and a server heat dissipation device.
In order to solve the technical problems, the utility model adopts the following technical scheme:
in a first aspect, an embodiment of the present utility model provides a fan module structure, including: the front frame body and the rear frame body are connected to form an installation cavity, the installation cavity comprises an upper installation cavity and a lower installation cavity, the upper installation cavity and the lower installation cavity are distributed in a front-back staggered mode, an upper 2U fan is placed in the upper installation cavity, and a lower 2U fan is placed in the lower installation cavity.
In a specific embodiment, the upper 2U fan is connected with an upper connector, the upper connector extends out of the upper mounting cavity, the lower 2U fan is connected with a lower connector, and the lower connector extends out of the lower mounting cavity.
In a specific embodiment, the upper end of the rear frame body extends outwards to form an upper connection position, the lower end extends outwards to form a lower connection position, the upper connection position is used for fixing the upper connector, and the lower connection position is used for fixing the lower connector.
In a specific embodiment, the upper end of the front frame body is further provided with a containing cavity, the containing cavity is located at the front end of the upper mounting cavity, and the containing cavity is provided with a waveguide plate.
In a specific embodiment, the accommodating cavity is further provided with a fastener for fixing the waveguide plate.
In a specific embodiment, a handle is further provided on the top of the front frame.
In a specific embodiment, the front frame body is provided with an upper air inlet and a lower air inlet corresponding to the upper mounting cavity and the lower mounting cavity, and the rear frame body is provided with an upper air outlet and a lower air outlet corresponding to the upper mounting cavity and the lower mounting cavity.
In one embodiment, the upper 2U fan is located at the rear end of the lower 2U fan in the vertical direction.
Compared with the prior art, the fan module structure has the beneficial effects that: the front frame body and the rear frame body are connected to form a mounting cavity, the mounting cavity comprises an upper mounting cavity and a lower mounting cavity, the upper mounting cavity and the lower mounting cavity are distributed in a front-back staggered mode, an upper 2U fan is arranged in the upper mounting cavity, and a lower 2U fan is arranged in the lower mounting cavity; the upper 2U fan can be directly and electrically connected to the main board, the lower 2U fan is electrically connected to the fan board, the number of the adapter cables can be effectively reduced, the cost is reduced, and the upper 2U fan and the lower 2U fan can not interfere with each other when installation and maintenance are needed, so that the operation is convenient.
In a second aspect, an embodiment of the present utility model provides a server heat dissipation device, where at least one fan module structure, a chassis, a motherboard, a fan board and a bracket as described above are adopted, the motherboard, the fan board and the bracket are mounted on the chassis, the fan module structure is mounted on the bracket, the upper 2U fan is electrically connected to the motherboard, the lower 2U fan is electrically connected to the fan board, and the fan board is electrically connected to the motherboard.
In one embodiment, the upper connector is electrically connected to the motherboard and the lower connector is electrically connected to the fan board.
Compared with the prior art, the server heat dissipation device has the beneficial effects that: through installing mainboard, fan board and support in the quick-witted case, fan module structure installs in the support, goes up 2U fan electricity and is connected in the mainboard, and lower 2U fan electricity is connected in the fan board, and the fan board is connected with the mainboard electricity, has solved the server fan and all need get the problem of electricity through fan board switching mainboard, can effectively reduce the quantity of use of keysets cable, reduce cost, and when needing installation maintenance, go up 2U fan and lower 2U fan can not mutual interference, convenient operation.
The utility model is further described below with reference to the drawings and specific embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a fan module structure according to an embodiment of the present utility model;
FIG. 2 is an exploded view of a fan module structure according to an embodiment of the present utility model;
fig. 3 is a schematic perspective view of a heat dissipating device of a server according to an embodiment of the present utility model;
fig. 4 is an exploded schematic view of a heat dissipating device of a server according to an embodiment of the present utility model;
fig. 5 is a second exploded view of the heat dissipating device of the server according to the embodiment of the present utility model.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and the detailed description, in order to make the objects, technical solutions and advantages of the present utility model more apparent.
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be attached, detached, or integrated, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms should not be understood as necessarily being directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, one skilled in the art can combine and combine the different embodiments or examples described in this specification.
Referring to fig. 1 to 2, the present utility model discloses a specific embodiment of a fan module structure, which includes: the front frame body 10 and the rear frame body 20, the front frame body 10 and the rear frame body 20 are connected to form a mounting cavity 30, the mounting cavity 30 comprises an upper mounting cavity 31 and a lower mounting cavity 32, the upper mounting cavity 31 and the lower mounting cavity 32 are distributed in a front-back staggered mode, an upper 2U fan 40 is placed in the upper mounting cavity 31, and a lower 2U fan 50 is placed in the lower mounting cavity 32.
Where U is a unit, 1u=44.45 mm, for representing the height of the server.
Specifically, go up installation cavity 31 and lower installation cavity 32 and be the dislocation distribution around, go up the rear end that installation cavity 32 was located down in installation cavity 31, 2U fan 40 has been placed through last installation cavity 31, 2U fan 50 has been placed down in lower installation cavity 32 for go up 2U fan 40 and dislocation distribution around 2U fan 50 down, so that 2U fan 40 can direct electric connection in the mainboard, 2U fan 50 electricity is connected in the fan board down, can effectively reduce the quantity of use of patch cable, reduce cost, and when needing the installation maintenance, go up 2U fan 40 and 2U fan 50 down can not mutual interference, convenient operation.
Preferably, the upper 2U fan 40 and the lower 2U fan 50 have the same structure, are convenient to operate, and reduce production costs.
In one embodiment, the upper 2U fan 40 is connected to an upper connector 41, the upper connector 41 extends out of the upper mounting cavity 31, the lower 2U fan 50 is connected to a lower connector 51, and the lower connector 51 extends out of the lower mounting cavity 32.
Specifically, the upper connector 41 extends out of the upper end of the rear frame 20 along the upper mounting cavity 31, the lower connector 51 extends out of the lower end of the rear frame 20 along the lower mounting cavity 32, and the lower connector 51 avoids the space of the upper connector 41, so that the upper connector 41 can be directly and electrically connected to the motherboard without using an adapter cable, and the lower connector 51 is electrically connected to the fan board, thereby effectively reducing the volume of the fan board.
In an embodiment, the upper end of the rear frame 20 extends outwards to form an upper connection position 21, the lower end extends outwards to form a lower connection position 22, the upper connection position 21 is used for fixing the upper connector 41, and the lower connection position 22 is used for fixing the lower connector 51.
Specifically, by extending the upper connection portion 21 outwardly from the upper end of the rear frame 20 and extending the lower connection portion 22 outwardly from the lower end, the upper connector 41 can be fixed to the upper connection portion 21 so that the upper connector 41 can be directly plugged into the motherboard, and the lower connector 51 can be fixed to the lower connection portion 22 so that the lower connector 51 can be directly plugged into the fan board.
Preferably, the upper connecting position 21, the lower connecting position 22 and the rear frame body 20 are integrally formed, so that the strength is high, only one set of production die is needed, and the production cost is reduced.
Preferably, the front frame body 10 and the rear frame body 20 are made of plastic materials, and have elasticity, so that the front frame body and the rear frame body are convenient to assemble and disassemble.
In an embodiment, the upper end of the front frame 10 is further provided with a receiving cavity 11, the receiving cavity 11 is located at the front end of the upper mounting cavity 31, and the waveguide plate 60 is mounted in the receiving cavity 11.
Specifically, the accommodating chamber 11 is located at the front end of the upper mounting chamber 31, and the waveguide plate 60 is installed in the accommodating chamber 11 to guide flow and reduce air vibration so as to reduce wind noise.
In an embodiment, the accommodating chamber 11 is further provided with a fastener 70, and the fastener 70 is used for fixing the waveguide plate 60.
Specifically, the fastener 70 is mounted in the accommodating cavity 11 and is clamped with the front frame body 10, so as to limit and fix the waveguide plate 60, so that the waveguide plate 60 is not easy to shift.
In other embodiments, in addition to the waveguide plate 60 installed at the upper end of the front frame 10, the waveguide plate 60 may also be installed at the lower end of the front frame 10, so as to form a situation that the waveguide plate 60 is installed up and down, so as to adapt to different application scenarios.
In an embodiment, a handle 12 is further provided on the top of the front frame 10.
Specifically, the handle 12 is rotatably connected to two sides of the top of the front frame 10, and the handle 12 can rotate 90 degrees (i.e. rotate from the front frame 10 to the rear frame 20), so as to facilitate the insertion and removal maintenance of the fan module structure.
In an embodiment, the front frame 10 is provided with an upper air inlet 13 and a lower air inlet 14 corresponding to the upper mounting cavity 31 and the lower mounting cavity 32, and the rear frame 20 is provided with an upper air outlet 23 and a lower air outlet 24 corresponding to the upper mounting cavity 31 and the lower mounting cavity 32.
Specifically, the upper air inlet 13 corresponds to the upper air outlet 23, and the lower air inlet 14 corresponds to the lower air outlet 24, so that the upper and lower fans perform heat dissipation at the same time, thereby improving heat dissipation performance.
In one embodiment, the upper 2U fan 40 is located at the rear end of the lower 2U fan 50 in the vertical direction.
Specifically, the upper 2U fan 40 is disposed at the rear end of the lower 2U fan 50 in the vertical direction, so as to achieve front-rear dislocation distribution.
Preferably, the front frame body 10 and the rear frame body 20 are fixed by clamping, so that the front frame body and the rear frame body are convenient to assemble and disassemble and have a compact structure.
Referring to fig. 3 to 5, the present utility model further discloses a heat dissipating device for a server, which adopts at least one of the above-mentioned fan module structure, the chassis 70, the main board 80, the fan board 90 and the bracket 100, wherein the main board 80, the fan board 90 and the bracket 100 are mounted on the chassis 70, the fan module structure is mounted on the bracket 100, the upper 2U fan 40 is electrically connected to the main board 80, the lower 2U fan 50 is electrically connected to the fan board 90, and the fan board 90 is electrically connected to the main board 80.
Specifically, the fan board 90 is firstly installed in the chassis 70, then the main board 80 is installed in the chassis 70, the fan board 90 and the main board 80 are electrically connected through the patch cable, the bracket 100 is installed in the chassis 70, and finally the fan module structure is installed in the bracket 100, so that the upper 2U fan 40 is electrically connected with the main board 80 to directly take electricity, the lower 2U fan 50 is electrically connected with the fan board 90, the problem that the server fans are all required to take electricity through the fan board 90 to the main board 80 is solved, the use quantity of the patch cable can be effectively reduced, the cost is reduced, and the upper 2U fan 40 and the lower 2U fan 50 cannot interfere with each other when installation and maintenance are required, and the operation is convenient.
In one embodiment, the upper connector 41 is electrically connected to the main board 80, and the lower connector 51 is electrically connected to the fan board 90.
Specifically, the upper connector 41 is directly and electrically connected to the motherboard 80, so that the use of an adapter cable is avoided, the lower connector 51 is electrically connected to the fan board 90, all connectors are prevented from being electrically connected to the fan board 90, the volume of the fan board 90 can be effectively reduced, the motherboard 80 can be compatible with 2U and 4U servers at the same time, the compatibility of the motherboard 80 is improved, and the cost of the fan board 90 and the adapter cable is saved.
In an embodiment, the fan module structure used by the server heat dissipation device is 2 or 4, and the like, which is not limited herein.
The server heat radiator can realize the low-speed working requirement of the fan in the non-starting state of the server, so that the main board 80 can be compatible with the 4U and 2U machine boxes 70 at the same time, the lower 2U fan 50 is powered by a small fan plate 90, the lower 2U fan 50 is arranged obliquely below the upper 2U fan 40, 8 fan connectors are distributed in the middle position of the 4U machine boxes 70, and the pull handle 12 is matched, so that the disassembly, assembly and maintenance are more convenient.
The foregoing embodiments are preferred embodiments of the present utility model, and in addition, the present utility model may be implemented in other ways, and any obvious substitution is within the scope of the present utility model without departing from the concept of the present utility model.
Claims (10)
1. A fan module structure, comprising: the front frame body and the rear frame body are connected to form an installation cavity, the installation cavity comprises an upper installation cavity and a lower installation cavity, the upper installation cavity and the lower installation cavity are distributed in a front-back staggered mode, an upper 2U fan is placed in the upper installation cavity, and a lower 2U fan is placed in the lower installation cavity.
2. The fan module structure of claim 1, wherein the upper 2U fan is connected with an upper connector, the upper connector extends out of the upper mounting cavity, the lower 2U fan is connected with a lower connector, and the lower connector extends out of the lower mounting cavity.
3. The fan module structure of claim 2, wherein the rear frame body has an upper connecting portion extending outward from an upper end thereof and a lower connecting portion extending outward from a lower end thereof, the upper connecting portion being adapted to fix the upper connector, and the lower connecting portion being adapted to fix the lower connector.
4. The fan module structure according to claim 2, wherein the upper end of the front frame body is further provided with a receiving cavity, the receiving cavity is located at the front end of the upper mounting cavity, and the receiving cavity is provided with a waveguide plate.
5. The fan module structure of claim 4, wherein the housing cavity is further provided with a fastener for fixing the waveguide plate.
6. The fan module structure of claim 2, wherein a handle is further provided on top of the front frame.
7. The fan module structure according to claim 2, wherein the front frame body is provided with an upper air inlet and a lower air inlet corresponding to the upper mounting chamber and the lower mounting chamber, and the rear frame body is provided with an upper air outlet and a lower air outlet corresponding to the upper mounting chamber and the lower mounting chamber.
8. The fan module structure of claim 2, wherein the upper 2U fan is located at a rear end of the lower 2U fan in a vertical direction.
9. A server heat dissipation device, characterized in that at least one fan module structure, a chassis, a main board, a fan board and a bracket according to any one of claims 2-8 are adopted, the main board, the fan board and the bracket are mounted on the chassis, the fan module structure is mounted on the bracket, the upper 2U fan is electrically connected to the main board, the lower 2U fan is electrically connected to the fan board, and the fan board is electrically connected to the main board.
10. The server heatsink of claim 9, wherein the upper connector is electrically connected to the motherboard and the lower connector is electrically connected to the fan board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321658893.XU CN220171511U (en) | 2023-06-27 | 2023-06-27 | Fan module structure and server heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321658893.XU CN220171511U (en) | 2023-06-27 | 2023-06-27 | Fan module structure and server heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220171511U true CN220171511U (en) | 2023-12-12 |
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ID=89053766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321658893.XU Active CN220171511U (en) | 2023-06-27 | 2023-06-27 | Fan module structure and server heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220171511U (en) |
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2023
- 2023-06-27 CN CN202321658893.XU patent/CN220171511U/en active Active
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