CN111736667B - Vehicle-mounted host structure meeting design of DFA (distributed feedback architecture) assemblability - Google Patents
Vehicle-mounted host structure meeting design of DFA (distributed feedback architecture) assemblability Download PDFInfo
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- CN111736667B CN111736667B CN202010602474.9A CN202010602474A CN111736667B CN 111736667 B CN111736667 B CN 111736667B CN 202010602474 A CN202010602474 A CN 202010602474A CN 111736667 B CN111736667 B CN 111736667B
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- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 112
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000741 silica gel Substances 0.000 claims description 20
- 229910002027 silica gel Inorganic materials 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims 9
- 230000005855 radiation Effects 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a vehicle-mounted host structure meeting the design of DFA assemblability in the field of automobile accessories, which comprises a host lower cover, a fan, a host middle plate and a host upper cover, wherein a connecting plate is arranged on the host lower cover, a connecting blind hole is arranged on the connecting plate, a connecting hole is arranged on the host middle plate, a core PCBA plate is connected between the host lower cover and the host middle plate, a core mounting hole is arranged on the core PCBA plate, a fixing plate is arranged on the host middle plate, a fixing blind hole is arranged on the fixing plate, a fixing hole is arranged on the host upper cover, a main PCBA plate is connected between the host middle plate and the host upper cover, a main mounting hole is arranged on the main PCBA plate, a fan mounting plate is arranged on the host lower cover, a fan mounting groove is arranged on the fan mounting plate, and a fan mounting area for accommodating the fan is formed in a space between the fan mounting groove and the host lower cover; the invention has the advantages of convenient assembly and high heat dissipation efficiency, accords with the design of DFA assemblability, and can be applied to the assembly connection work of the vehicle-mounted host structure which accords with the design of assemblability.
Description
Technical Field
The invention belongs to the field of automobile accessories, and particularly relates to a host structure.
Background
Along with the increasing demands of customers on production line production precision and error management and control, the demands of automatic production are also more and more strong, in the traditional design, as the design concept of DFA is not considered excessively, the product needs to be overturned in the production process, so that the traditional design scheme cannot meet the demand of the automatic production line on the assembly simplicity of the whole machine, and more influences of the structural design scheme on the manufacturability and the assembly of the DFA automatic line body are considered in the existing structural design.
In addition, as the demands of customers for vehicle-mounted electronic products are diversified nowadays, the demands for electronic components are more severe, which also results in the increase of power of various electronic components, and the heat dissipation power of the electronic components is also continuously improved. With this premise, the heat dissipation requirement for the on-board host electronics is also increasing.
In the traditional design, a device needing heat dissipation is generally attached to a heat dissipation sheet and dissipates heat in a natural convection mode, but under the conditions that the thermal power is too high and the whole structure is very compact, the heat dissipation requirement of a chip cannot be met only by natural convection.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to solve the defects in the prior art, solve the technical problems of troublesome assembly and low heat dissipation efficiency in the prior art, and provide the vehicle-mounted host structure meeting the design of the DFA assemblability.
The purpose of the invention is realized in the following way: the utility model provides a satisfy on-vehicle host computer structure of DFA assemblability design, includes host computer lower cover and fan, the host computer lower cover is connected with the host computer medium plate detachable, be equipped with four lower side boards down on the host computer lower cover, be equipped with at least one connecting plate on the lower side board, be equipped with the connection blind hole on the connecting plate, the relative connection blind hole is provided with the connecting hole on the host computer medium plate, be connected with core PCBA board between host computer lower cover and the host computer medium plate, core PCBA board is between four lower side boards, and the downside laminating of core PCBA board is in the upside of connecting plate, be equipped with at least one core mounting hole on the core PCBA board, the connecting hole is linked together with the connecting blind hole through the core mounting hole, be equipped with four upper side boards on the host computer medium plate, be equipped with at least one fixed plate on the upper side board, be equipped with the fixed blind hole on the fixed plate on the host computer medium plate, be connected with the PCBA board between host computer medium plate and the host computer medium plate, the core PCBA board is equipped with the fan assembly between the fan and the fan is equipped with the fan on the side board, the fan is equipped with the fan assembly through the at least one side mounting hole, the fan assembly is seted up to the fan assembly on the side of the host computer medium board.
When the invention is assembled and connected, the host lower cover is firstly placed on an automatic production line, then the core PCBA board is taken to the position right above the host lower cover, the core PCBA board is downwards moved to the position where the host lower cover is positioned, the core PCBA board is placed between the four lower side plates, the core mounting hole is aligned with and coaxial with the connecting blind holes, the lower side of the core PCBA board is abutted against the connecting plate of the host lower cover, the core PCBA board is loosened, the host middle plate is taken to the position right above the core PCBA board, the connecting hole of the host middle plate is downwards moved towards the position where the core PCBA board is positioned, the connecting hole is aligned with the core mounting hole, the connecting hole is coaxial with the core mounting hole, bolts are sequentially screwed into the connecting hole, the core mounting hole and the connecting blind holes from top to bottom, the realization of the host lower cover, the core PCBA board and the host middle plate are then put into the fan mounting area, one side of the fan air outlet of the fan is connected to the fan mounting plate, the realization of the heat dissipation assembly is mounted on the host, the main PCBA board is loosened from right above the connecting plate, the host middle plate is downwards moved towards the position where the host middle plate is taken to the host board, the main PCBA board is aligned with the main PCBA board, the hole is fixedly arranged on the main PCBA board and the main hole is fixedly screwed to the main printed hole, the main printed board is fixedly aligned with the main board and the main printed board, and the main board is fixedly screwed to the main board and the main board. The air flow takes away the heat generated by the main PCBA board and the core PCBA board and discharges the heat from the heat radiation port, so that the heat radiation inside the host structure is realized; according to the invention, through the arrangement of the connecting holes, the core mounting holes and the connecting blind holes, the sandwich structure of the host lower cover, the core PCBA board and the host middle board can be realized, the arrangement of the fixing holes, the main mounting holes and the fixing blind holes can be realized, the sandwich structure of the host middle board, the main PCBA board and the host upper cover can be realized, and when the novel multifunctional PCBA is used for a long time, scraps generated by corrosion of bolts can directly fall into the connecting blind holes, so that the work of the core PCBA board is not influenced; the host machine lower cover, the core PCBA board, the host machine middle board, the main PCBA board and the host machine upper cover are arranged, so that all parts can be assembled in a single stacking mode sequentially from top to bottom, overturning is not needed, and the automatic production and assembly are convenient; the heat dissipation assembly is arranged, so that ventilation of air inside and outside the shell can be enhanced, flow of the air inside the shell is increased, and heat dissipation effects on the main PCBA board and the core PCBA board are improved; the method can be applied to the assembly connection work of the vehicle-mounted host structure conforming to the assembly design.
In order to realize the connection of fan subassembly and mainboard lower cover, the radiator unit is still including the fan support that has the installation cavity, be equipped with the elasticity knot on the fan support, when the fan card was gone into the installation cavity, the elasticity was detained locking fan, four elasticity bosss that are the rectangle setting have been arranged to one side that the fan mounting panel was inwards, the relative elasticity boss in one side that the fan was outwards is provided with the recess, in the elasticity boss can block into the recess, still be equipped with the screw hole on the fan mounting panel, be equipped with the locking hole on the fan support, when the elasticity boss card was gone into the recess, the locking hole was coaxial with the screw hole.
In order to realize the position location to the fan subassembly when installing the fan subassembly on the mainboard lower cover, the symmetry is provided with the eye-splice that extends inwards on the fan mounting panel, be equipped with the slot on the eye-splice, the both sides of fan support are equipped with the plug connector, the plug connector can block into in the slot.
In order to realize the quick-speed matching of host computer lower cover and core PCBA board and host computer medium plate respectively, be equipped with the setting element of vertical upwards extending on the connecting piece board, core board constant head tank has been opened to the relative setting element on the core PCBA board, it has the medium plate constant head tank to open on the host computer medium plate, when inserting core board constant head tank and medium plate constant head tank in proper order to the setting element, connecting hole, core mounting hole, connection blind hole are linked together.
In order to realize the quick match of host computer medium plate with main PCBA board and host computer upper cover respectively, be equipped with vertical upwards extending guide on the fixed plate, main PCBA board is last to open to the guide has the mainboard constant head tank, it has the upper cover constant head tank to cover on the host computer, when the guide inserts mainboard constant head tank and upper cover constant head tank in proper order, fixed orifices, main mounting hole, fixed blind hole are linked together.
In order to realize effective heat dissipation of core PCBA board, be equipped with the SOC fin between host computer lower cover and the core PCBA board, be equipped with four connection protruding on the host computer lower cover, be equipped with the lower cover connecting hole on the connection protruding, the connection protruding connection boss that is equipped with on the SOC fin relatively, be equipped with the heat dissipation connecting hole on the connection boss, the heat dissipation connecting hole is coaxial with the lower cover connecting hole, the relative chip is equipped with the SOC radiating groove on the SOC fin, it has the SOC heat conduction silica gel pad to paste in the SOC radiating groove, the downside of core PCBA board is equipped with chip one, the downside of chip one is laminated with the upside of SOC heat conduction silica gel pad mutually.
In order to realize the effective heat dissipation of main PCBA board, the active amplifier fin is connected to one side of the relative main PCBA board of host computer medium plate, be equipped with the power amplifier radiating groove on the power amplifier fin, paste the active amplifier heat conduction silica gel pad in the power amplifier radiating groove, be equipped with chip two on the main PCBA board, the downside of chip two is laminated mutually with the upside of power amplifier heat conduction silica gel pad.
In order to realize the location locking when host computer lower cover is connected to the host computer medium plate, be equipped with the picture peg that upwards extends on the lower side board, the picture peg is between two connecting plates, be equipped with the draw-in groove on the curb plate of picture peg below, be equipped with spacing knot on the host computer medium plate between two adjacent connecting holes, be equipped with the spacing groove on the spacing knot, be equipped with spacing arch on the spacing knot of spacing groove below, when the picture peg inserts the spacing inslot, spacing arch just blocked into the draw-in groove.
In order to realize the location locking when host computer upper cover connects the host computer medium plate, be equipped with the plugboard that upwards extends on the upper side board, the plugboard is between two fixed plates, be equipped with locking arch on the plugboard, host computer upper cover is equipped with the hasp with the plugboard relatively, and it has the locked groove to open on the hasp, the space between hasp and the host computer upper cover forms U type locked groove, and when the plugboard inserted U type locked inslot, locking arch just blocked into the locked groove.
Drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is a perspective view of the present invention.
Fig. 3 is an exploded view of the present invention.
Fig. 4 is a second explosion diagram of the present invention.
Fig. 5 is a schematic structural diagram of a lower cover of a host in the present invention.
Fig. 6 is a schematic structural diagram of an SOC heat sink according to the present invention.
Fig. 7 is a first perspective view of a heat dissipation plate of a power amplifier connected to a board in a host computer according to the present invention.
Fig. 8 is a second perspective view of the present invention after the heat dissipation sheet of the power amplifier is connected to the middle board of the host.
Fig. 9 is a schematic structural diagram of a heat dissipating assembly according to the present invention.
Fig. 10 is a schematic structural diagram of the heat dissipating assembly according to the present invention.
Fig. 11 is a schematic structural diagram of a top cover of a host in the present invention.
Wherein, 1 host lower cover, 101 lower side plate, 101a plugboard, 101b clamping groove, 102 connecting plate, 102a connecting blind hole, 102b positioning piece, 103 fan mounting plate, 103a heat dissipation port, 103b elastic boss, 103c plugin, 103d slot, 104 connecting bulge, 104a lower cover connecting hole, 105 screw hole, 2 host middle plate, 201 upper side plate, 201a plugboard, 201b locking bulge, 202 fixing plate, 202a fixing blind hole, 202b guiding piece, 203 connecting hole, 204 fan mounting groove, 205 middle plate positioning groove, 206 spacing buckle, 206a spacing groove, 206b spacing bulge, 3 core PCBA plate, 301 core mounting hole, 302 core plate positioning groove, 303 chips I, 4 host computer upper covers, 401 fixing holes, 402 upper cover positioning grooves, 403 lock catches, 403a lock grooves, 404U type lock grooves, 5 main PCBA boards, 501 main mounting holes, 502 main board positioning grooves, 503 chips II, 6 heat dissipation components, 601 fans, 601a air inlets, 601b air outlets, 601c grooves, 602 fan brackets, 602a mounting cavities, 602b elastic buckles, 602c connectors, 603 lock holes, 7 fan mounting areas, 8 gaps, 9 SOC heat dissipation fins, 901 connecting bosses, 901a heat dissipation connecting holes, 902 SOC heat dissipation grooves, 10 SOC heat conduction silica gel pads, 11 power amplifier heat dissipation fins, 1101 power amplifier heat dissipation grooves and 12 power amplifier heat conduction silica gel pads.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The vehicle-mounted host structure meeting the design of DFA assemblability as shown in figures 1-11 comprises a host lower cover 1 and a fan 601, wherein a host middle plate 2 is detachably connected to the host lower cover 1, four lower side plates 101 are arranged on the host lower cover 1, at least one connecting plate 102 is arranged on the lower side plates 101, connecting blind holes 102a are arranged on the connecting plates 102, connecting holes 203 are arranged on the host middle plate 2 opposite to the connecting blind holes 102a, a core PCBA board 3 is connected between the host lower cover 1 and the host middle plate 2, the core PCBA board 3 is arranged between the four lower side plates 101, the lower side of the core PCBA board 3 is attached to the upper side of the connecting plate 102, the core PCBA board 3 is provided with at least one core mounting hole 301, the connecting hole 203 is communicated with the connecting blind hole 102a through the core mounting hole 301, the connecting piece board is provided with a positioning piece 102b extending vertically upwards, the core PCBA board 3 is provided with a core board positioning groove 302 corresponding to the positioning piece 102b, the host board 2 is provided with a middle board positioning groove 205, and when the positioning piece 102b is sequentially inserted into the core board positioning groove 302 and the middle board positioning groove 205, the connecting hole 203, the core mounting hole 301 and the connecting blind hole 102a are communicated; the lower side plate 101 is provided with an upward extending plugboard 101a, the plugboard 101a is arranged between the two connecting plates 102, a clamping groove 101b is formed in the side plate below the plugboard 101a, a limit button 206 is arranged on the host middle plate 2 between two adjacent connecting holes 203, a limit groove 206a is formed in the limit button 206, a limit protrusion 206b is arranged on the limit button 206 below the limit groove 206a, and when the plugboard 101a is inserted into the limit groove 206a, the limit protrusion 206b is just clamped into the clamping groove 101 b; four upper side plates 201 are arranged on the host medium plate 2, at least one fixing plate 202 is arranged on the upper side plates 201, a fixing blind hole 202a is arranged on the fixing plate 202, a host upper cover 4 is detachably connected on the host medium plate 2, a fixing hole 401 is arranged on the host upper cover 4 relative to the fixing blind hole 202a, a main PCBA plate 5 is connected between the host medium plate 2 and the host upper cover 4, the lower side of the main PCBA plate 5 is attached to the upper side of the fixing plate 202, at least two main mounting holes 501 are arranged on the main PCBA plate 5, the fixing hole 401 is communicated with the fixing blind hole 202a through the main mounting holes 501, a guide piece 202b which extends vertically upwards is arranged on the fixing plate 202, the main PCBA board 5 is provided with a main board positioning groove 502 opposite to the guide piece 202b, the host upper cover 4 is provided with an upper cover positioning groove 402, and when the guide piece 202b is sequentially inserted into the main board positioning groove 502 and the upper cover positioning groove 402, the fixing hole 401, the main mounting hole 501 and the fixing blind hole 202a are communicated; the upper side plate 201 is provided with an upward extending plugboard 201a, the plugboard 201a is arranged between the two fixed plates 202, the plugboard 201a is provided with a locking protrusion 201b, the host upper cover 4 is provided with a lock catch 403 opposite to the plugboard 201a, the lock catch 403 is provided with a locking groove 403a, a U-shaped locking groove 404 is formed in the space between the lock catch 403 and the host upper cover 4, and when the plugboard 201a is inserted into the U-shaped locking groove 404, the locking protrusion 201b is just blocked into the locking groove 403 a; one side plate of the host lower cover 1 is provided with a fan 601 mounting plate 103, a heat radiation opening 103a is formed in the fan 601 mounting plate 103, a heat radiation component 6 is detachably connected to the fan 601 mounting plate 103, the heat radiation component 6 comprises a fan 601 and a fan bracket 602, one side of the host middle plate 2 opposite to the fan 601 mounting plate 103 is provided with a fan 601 mounting groove 204, a space between the fan 601 mounting groove 204 and the host lower cover 1 forms a fan mounting area 7 capable of accommodating the fan 601, a gap 8 is reserved between one side of an air inlet 601a of the fan 601 and the main PCBA board 5 and the core PCBA board 3, the fan bracket 602 is provided with an elastic buckle 602b, when the fan 601 is clamped into the installation cavity 602a, the elastic buckle 602b locks the fan 601, four elastic bosses 103b which are arranged in a rectangular shape are arranged on one inward side of the fan 601 installation plate 103, a groove 601c is arranged on one outward side of the fan 601 opposite to the elastic bosses 103b, the elastic bosses 103b can be clamped into the groove 601c, the fan 601 installation plate 103 is symmetrically provided with an inward extending inserting buckle 103c, the inserting buckle 103c is provided with a slot 103d, two sides of the fan bracket 602 are provided with inserting connectors 602c, the inserting connectors 602c can be clamped into the slot 103d, the fan 601 mounting plate 103 is further provided with a threaded hole 105, the fan bracket 602 is provided with a locking hole 603, and when the elastic boss 103b is clamped into the groove 601c, the locking hole 603 is coaxial with the threaded hole 105.
In order to further effectively dissipate heat of the core PCBA board 3, an SOC heat radiation sheet 9 is arranged between the host lower cover 1 and the core PCBA board 3, four connecting protrusions 104 are arranged on the host lower cover 1, lower cover connecting holes 104a are arranged on the connecting protrusions 104, connecting bosses 901 are arranged on the SOC heat radiation sheet 9 and correspond to the connecting protrusions 104, heat radiation connecting holes 901a are arranged on the connecting bosses 901, the heat radiation connecting holes 901a are coaxial with the lower cover connecting holes 104a, SOC heat radiation grooves 902 are formed on the SOC heat radiation sheet 9 and correspond to chips, SOC heat radiation silica gel pads 10 are adhered in the SOC heat radiation grooves 902, a first chip 303 is arranged on the lower side of the core PCBA board 3, and the lower side of the first chip 303 is adhered to the upper side of the SOC heat radiation silica gel pads 10.
In order to further effectively dissipate heat of the main PCBA board 5, one side of the main PCBA board 5, opposite to the main PCBA board 5, of the main machine middle board 2 is connected with an active power amplifier heat dissipation sheet 11, a power amplifier heat dissipation groove 1101 is formed in the active power amplifier heat dissipation sheet 11, an active power amplifier heat conduction silica gel pad 12 is adhered in the power amplifier heat dissipation groove 1101, a second chip 503 is arranged on the main PCBA board 5, and the lower side of the second chip 503 is adhered to the upper side of the active power amplifier heat conduction silica gel pad 12.
When the invention is assembled and connected, firstly, the heat radiation component 6 is assembled, the fan 601 is arranged in the installation cavity 602a of the fan bracket 602, the elastic buckle 602b locks the fan 601 to complete the assembly of the heat radiation component 6 for standby, then the power amplifier heat radiation sheet 11 is connected to the host computer middle plate 2 for standby, the host computer lower cover 1 is placed on an automatic production line, the heat radiation pretreatment is carried out on the host computer lower cover 1, namely, the SOC heat radiation sheet 9 is taken out, the connection boss 901 of the SOC heat radiation sheet 9 is aligned with the connection boss 104 of the host computer lower cover 1, the heat radiation connection hole 901a is aligned with the lower cover connection hole 104a, the SOC heat radiation sheet 9 is downwards moved towards the direction of the host computer lower cover 1 and is installed on the host computer lower cover 1, through the heat radiation connecting hole 901a and the lower cover connecting hole 104a in sequence, the SOC heat radiating fin 9 is connected on the lower cover 1 of the host machine, after the SOC heat radiating fin 9 is connected, the SOC heat conduction silica gel pad 10 is stuck in the SOC heat radiating groove 902, then the core PCBA board 3 is taken right above the lower cover 1 of the host machine, the core board positioning groove 302 is kept aligned with the positioning piece 102b and moves downwards to the position of the lower cover 1 of the host machine, as the positioning piece 102b slowly passes through the core board positioning groove 302, the core mounting hole 301 is aligned with the connecting blind hole 102a and is coaxial with the connecting blind hole 102a, after the lower side of the core PCBA board 3 is attached with the upper side of the connecting plate 102 of the lower cover 1 of the host machine, the core PCBA board 3 is loosened, the upper side of the SOC heat-conducting silica gel pad 10 is just adhered to the first chip 303, the core PCBA board 3 is placed between the four lower side boards 101, the installation of the core PCBA board 3 is realized, after the host board 2 is taken right above the core PCBA board 3, the limit button 206 is aligned with the plugboard 101a, the middle board positioning groove 205 is kept aligned with the positioning piece 102b, the position of the core PCBA board 3 is moved downwards, the positioning piece 102b slowly passes through the middle board positioning groove 205 as the plugboard 101a is inserted into the limit groove 206a, the limit protrusion 206b is just clamped into the clamping groove 101b, the connecting hole 203 of the host computer middle plate 2 is aligned to the core mounting hole 301, the connecting hole 203 is coaxial with the core mounting hole 301, the host computer middle plate 2 is mounted, the connecting hole 203, the core mounting hole 301 and the connecting blind hole 102a are screwed in sequence from top to bottom by bolts, the host computer lower cover 1, the core PCBA board 3 and the host computer middle plate 2 are finally firmly connected, then the heat dissipation component 6 is placed into the fan mounting area 7 from top to bottom, the side of the air inlet 601a of the fan 601 is inwards, the side of the air outlet 601b of the fan 601 is inwards towards the fan 601 mounting plate 103, when the plug-in piece 602c of the fan bracket 602 is inserted into the slot 103d, the elastic boss 103b is just clamped into the groove 601c, at this time, the locking hole 603 is coaxial with the threaded hole 105, and finally the locking hole 603 and the threaded hole 105 are screwed in sequence by bolts, so that the heat dissipation component 6 is connected to the lower cover 1 of the host machine, after the power amplification heat conduction silica gel pad 12 is stuck in the power amplification heat dissipation groove 1101, the main PCBA board 5 is taken directly above the host machine middle board 2, the main PCBA board 5 is moved downwards towards the position of the host machine middle board 2, the main board positioning groove 502 is kept aligned with the guide piece 202b, the guide piece 202b passes through the main board positioning groove 502, the main mounting hole 501 of the main PCBA board 5 is aligned with the fixing blind hole 202a of the main machine middle board 2 and is coaxial, when the lower side of the main PCBA board 5 is attached to the upper side of the fixing board 202, the main PCBA board 5 is loosened, the second chip 503 of the main PCBA board 5 is just attached to the upper side of the power amplifier heat-conducting silica gel pad 12, the main PCBA board 5 is placed between the four upper side boards 201, the connection of the main PCBA board 5 and the main machine middle board 2 is realized, finally the main machine upper cover 4 is taken to be right above the main PCBA board 5, the lock catch 403 is aligned with the plugboard 201a, the fixing hole 401 is aligned with the main mounting hole 501, moving downwards towards the position of the main PCBA board 5, along with the insertion of the insertion plate 201a into the U-shaped locking groove 404, the guide piece 202b also slowly passes through the upper cover positioning groove 402, when the insertion plate 201a is inserted into the U-shaped locking groove 404, the locking protrusion 201b is just blocked into the locking groove 403a, the fixing hole 401 and the main mounting hole 501 are coaxial, the connection of the host upper cover 4 and the host middle plate 2 is realized, finally, the fixing hole 401, the main mounting hole 501 and the fixing blind hole 202a are screwed in sequence from top to bottom by bolts, the firm connection of the host upper cover 4, the main PCBA board 5 and the host middle plate 2 is realized, and finally, the mounting and matching of the whole host structure are completed,
When the invention works, the main PCBA 5 and the core PCBA 3 work to generate heat, the fan 601 rotates to generate air flow in the host structure, the air flow takes away the heat generated by the main PCBA 5 and the core PCBA 3 and discharges the heat from the heat radiation port 103a, so that the heat radiation in the host structure is realized; the invention can realize the sandwich structure of the host lower cover 1, the core PCBA board 3 and the host middle plate 2 through the arrangement of the connecting holes 203, the core mounting holes 301 and the connecting blind holes 102a, and the arrangement of the fixing holes 401, the main mounting holes 501 and the fixing blind holes 202a can realize the sandwich structure of the host middle plate 2, the main PCBA board 5 and the host upper cover 4, and when the invention is used for a long time, scraps generated by the rust of bolts can directly fall into the connecting blind holes 102a without influencing the work of the core PCBA board 3; the host machine lower cover 1, the core PCBA board 3, the host machine middle board 2, the main PCBA board 5 and the host machine upper cover 4 can realize that all parts are assembled in a single stacking mode from top to bottom in sequence, and the host machine lower cover is free from overturning, so that the host machine upper cover is convenient for automatic production and assembly; the heat dissipation assembly 6 can enhance the ventilation of air inside and outside the shell, increase the flow of air inside the shell and improve the heat dissipation effect on the main PCBA board 5 and the core PCBA board 3; the heat dissipation areas of the core PCBA 3 and the main PCBA 5 are increased by arranging the SOC heat conduction silica gel pad 10, the SOC heat dissipation sheet 9, the power amplifier heat conduction silica gel pad 12 and the power amplifier heat dissipation sheet 11, so that the heat dissipation efficiency of a host structure is improved; the method can be applied to the assembly connection work of the vehicle-mounted host structure conforming to the assembly design.
The present invention is not limited to the above-described embodiments, and based on the technical solutions of the present disclosure, those skilled in the art may make some substitutions and modifications to some technical features thereof without creative efforts, which are all within the scope of the present invention.
Claims (8)
1. The utility model provides a satisfy on-vehicle host computer structure of DFA assemblability design which characterized in that: the heat dissipation device comprises a host lower cover and a fan, wherein a host middle plate is detachably connected to the host lower cover, four lower side plates are arranged on the host lower cover, at least one connecting plate is arranged on the lower side plates, connecting blind holes are arranged on the connecting plates, connecting holes are arranged on the host middle plate in a detachable mode, a core PCBA board is connected between the host lower cover and the host middle plate, the core PCBA board is arranged between the four lower side plates, the lower side of the core PCBA board is attached to the upper side of the connecting plate, at least one core mounting hole is arranged on the core PCBA board, the connecting holes are communicated with the connecting blind holes through the core mounting holes, four upper side plates are arranged on the host middle plate, at least one fixing plate is arranged on the upper side plates, a fixing blind hole is arranged on the fixing plate, a main PCBA board is arranged on the main upper cover in a fixing hole, a main PCBA board is connected between the host middle plate and the host upper cover, the lower side of the main PCBA board is attached to the upper side of the fixing plate, at least one main PCBA board is provided with a fan, at least one fan is arranged on the main PCBA board, a fan is arranged in the main PCBA board is arranged in a cooling fan assembly, a cooling fan is arranged in the main fan assembly, and the cooling fan assembly is arranged in the cooling assembly, and comprises a cooling fan assembly and a cooling assembly is arranged in the cooling assembly, and a cooling assembly is arranged in the cooling assembly. The fan is locked by the elastic buckle, four elastic bosses which are arranged in a rectangular shape are arranged on one inward side of the fan mounting plate, grooves are formed in one outward side of the fan, opposite to the elastic bosses, the elastic bosses can be clamped into the grooves, threaded holes are further formed in the fan mounting plate, locking holes are formed in the fan support, and when the elastic bosses are clamped into the grooves, the locking holes are coaxial with the threaded holes.
2. The vehicle-mounted host structure satisfying a DFA assemblability design according to claim 1, wherein: the fan mounting plate is symmetrically provided with inwards extending eye-splice, the eye-splice is provided with a slot, two sides of the fan support are provided with plug connectors, and the plug connectors can be clamped into the slot.
3. The vehicle-mounted host structure satisfying a DFA assemblability design according to claim 1, wherein: the utility model discloses a core PCBA board, including connecting plate, connecting hole, core mounting hole, connecting blind hole, core PCBA board, be equipped with the setting element of vertical upwards extending on the connecting plate, core board constant head tank has been opened to the setting element on the core PCBA board, it has medium plate constant head tank to open on the host computer medium plate, when inserting core board constant head tank and medium plate constant head tank in proper order, connecting hole, core mounting hole, connecting blind hole are linked together.
4. The vehicle-mounted host structure satisfying a DFA assemblability design according to claim 1, wherein: the fixing plate is provided with a guide piece extending vertically upwards, the main PCBA plate is provided with a main board positioning groove relative to the guide piece, the main machine upper cover is provided with an upper cover positioning groove, and when the guide piece is sequentially inserted into the main board positioning groove and the upper cover positioning groove, the fixing hole, the main mounting hole and the fixing blind hole are communicated.
5. The vehicle-mounted host structure satisfying a DFA assemblability design according to claim 1, wherein: be equipped with the SOC fin between host computer lower cover and the core PCBA board, be equipped with four connection protruding under the host computer, be equipped with the lower cover connecting hole on the connection protruding, the connection protruding connection boss that is equipped with relatively on the SOC fin, be equipped with the heat dissipation connecting hole on the connection boss, the heat dissipation connecting hole is coaxial with the lower cover connecting hole, the chip is equipped with the SOC radiating groove relatively on the SOC fin, it has the SOC heat conduction silica gel pad to paste in the SOC radiating groove, the downside of core PCBA board is equipped with chip one, the downside of chip one is laminated with the upside of SOC heat conduction silica gel pad mutually.
6. A vehicle-mounted host structure satisfying DFA assemblability design according to claim 3, wherein: the power amplifier heat dissipation device is characterized in that one side of the host computer middle plate, which is opposite to the main PCBA plate, is connected with a power amplifier heat dissipation groove, a power amplifier heat conduction silica gel pad is stuck in the power amplifier heat dissipation groove, a chip II is arranged on the main PCBA plate, and the lower side of the chip II is attached to the upper side of the power amplifier heat conduction silica gel pad.
7. The vehicle-mounted host structure satisfying the DFA assemblability design according to claim 6, wherein: the lower side plate is provided with an upward extending plugboard, the plugboard is arranged between the two connecting plates, the side plate below the plugboard is provided with a clamping groove, a host middle plate between two adjacent connecting holes is provided with a limiting buckle, the limiting buckle is provided with a limiting groove, the limiting buckle below the limiting groove is provided with a limiting protrusion, and when the plugboard is inserted into the limiting groove, the limiting protrusion is just clamped into the clamping groove.
8. The vehicle-mounted host structure satisfying the DFA assemblability design according to claim 7, wherein: the upper side plate is provided with an upward extending plugboard, the plugboard is arranged between the two fixed plates, the plugboard is provided with a locking protrusion, the host upper cover is provided with a lock catch relative to the plugboard, the lock catch is provided with a locking groove, a U-shaped locking groove is formed in a space between the lock catch and the host upper cover, and when the plugboard is inserted into the U-shaped locking groove, the locking protrusion is just blocked into the locking groove.
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| CN202010602474.9A CN111736667B (en) | 2020-06-29 | 2020-06-29 | Vehicle-mounted host structure meeting design of DFA (distributed feedback architecture) assemblability |
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| CN202010602474.9A CN111736667B (en) | 2020-06-29 | 2020-06-29 | Vehicle-mounted host structure meeting design of DFA (distributed feedback architecture) assemblability |
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| CN111736667B true CN111736667B (en) | 2024-06-11 |
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| CN2648141Y (en) * | 2003-10-23 | 2004-10-13 | 英业达股份有限公司 | Assembling sheet |
| CN101662921A (en) * | 2008-08-29 | 2010-03-03 | 富准精密工业(深圳)有限公司 | Heat radiation device and computer equipment with same |
| CN203013255U (en) * | 2012-11-22 | 2013-06-19 | 惠州华阳通用电子有限公司 | Head unit |
| CN206472409U (en) * | 2017-03-02 | 2017-09-05 | 东软集团股份有限公司 | On-vehicle host and vehicle-mounted information and entertainment system |
| CN209460713U (en) * | 2019-04-02 | 2019-10-01 | 湖北亿咖通科技有限公司 | A kind of radiator for vehicle electronic device |
| CN210317862U (en) * | 2019-03-26 | 2020-04-14 | 广州昭创电子科技有限公司 | Conveniently-disassembled installation anti-falling device of cooling fan |
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2020
- 2020-06-29 CN CN202010602474.9A patent/CN111736667B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2648141Y (en) * | 2003-10-23 | 2004-10-13 | 英业达股份有限公司 | Assembling sheet |
| CN101662921A (en) * | 2008-08-29 | 2010-03-03 | 富准精密工业(深圳)有限公司 | Heat radiation device and computer equipment with same |
| CN203013255U (en) * | 2012-11-22 | 2013-06-19 | 惠州华阳通用电子有限公司 | Head unit |
| CN206472409U (en) * | 2017-03-02 | 2017-09-05 | 东软集团股份有限公司 | On-vehicle host and vehicle-mounted information and entertainment system |
| CN210317862U (en) * | 2019-03-26 | 2020-04-14 | 广州昭创电子科技有限公司 | Conveniently-disassembled installation anti-falling device of cooling fan |
| CN209460713U (en) * | 2019-04-02 | 2019-10-01 | 湖北亿咖通科技有限公司 | A kind of radiator for vehicle electronic device |
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|---|---|
| CN111736667A (en) | 2020-10-02 |
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