CN218997346U - Light-emitting device - Google Patents

Abstract

The present application discloses a light emitting device, comprising: the LED lamp comprises a support, a light emitting chip and a first lens, wherein the first lens is located above the support, a cavity structure is formed between the first lens and the support, the support is provided with a first surface and a second surface, a groove is formed in the first surface of the support, the light emitting chip and heat conducting resin are arranged in the groove of the support, and the heat conducting resin surrounds the light emitting chip and is in direct contact with the side face of the light emitting chip. The heat conducting resin surrounds the light emitting chip and is in direct contact with the side face of the light emitting chip, so that heat emitted by the light emitting chip can be conducted to the heat conducting resin through the side face of the light emitting chip while being conducted to the support to dissipate heat, and heat capacity of the light emitting device to dissipate heat is increased. In addition, the second lens is additionally arranged to improve the light energy conversion rate of energy, reduce the conversion of electric energy into heat energy and prolong the service life of the light-emitting device.

Description

Light-emitting device

Technical Field

The present disclosure relates to the field of optics and electronics, and more particularly, to a light emitting device.

Background

At present, the reason why the light emitting device generates heat is that the added electric energy is not converted into light energy, and most of the electric energy is converted into heat energy. The indicating lamp only has 100lm/W, and the electro-optical conversion efficiency is about 20% to 30%. That is, about 70% of the electrical energy is converted into thermal energy. The lifetime of the light emitting device is seriously affected by the light emitting device for a long time under a high heat environment, but the heat must be conducted through various paths to guide the air from the light emitting chip to the outside. The existing light source structure heat dissipation channel can only conduct heat to the bracket through the medium on the bottom surface of the light emitting chip, and the bracket conducts heat to the air through the external PCB, so that the heat dissipation effect is poor.

Therefore, for a high-power light emitting device, the heat dissipation problem is an important problem that needs to be solved at present.

Disclosure of Invention

The purpose of the present application is to provide a light emitting device, which can overcome the defect of poor heat dissipation effect existing in the prior art.

The present application provides a light emitting device, comprising: the LED lamp comprises a support, a light emitting chip and a first lens, wherein the first lens is located above the support, a cavity structure is formed between the first lens and the support, the support is provided with a first surface and a second surface, a groove is formed in the first surface of the support, the light emitting chip and heat conducting resin are arranged in the groove of the support, and the heat conducting resin surrounds the light emitting chip and is in direct contact with the side face of the light emitting chip.

The utility model provides a pass through form a cavity structure between first lens and the support, have the recess on the first surface of support be equipped with light emitting chip and heat conduction resin in the recess of support, heat conduction resin encircles light emitting chip, and with light emitting chip's side direct contact. The heat emitted by the light-emitting chip is conducted to the support through the bottom surface to dissipate heat, and meanwhile, the heat can be conducted to the heat conducting resin through the side surface of the light-emitting chip, so that the heat dissipation capacity of the light-emitting chip and the light-emitting device is increased, and the service lives of the light-emitting chip and the light-emitting device are prolonged.

Drawings

For a clearer description of embodiments of the present application or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description that follow are only some embodiments of the present application, and that other drawings may be obtained from these drawings by a person of ordinary skill in the art without inventive effort.

Fig. 1 is a sectional structural view of a light emitting device provided in a first embodiment of the present application;

fig. 2 is a sectional structural view of a light emitting device provided in a second embodiment of the present application;

fig. 3 is a sectional structural view of a light emitting device provided in a third embodiment of the present application;

fig. 4 is a sectional structural view of a light emitting device provided in a fourth embodiment of the present application;

fig. 5 is a sectional structural view of a light emitting device provided in a fifth embodiment of the present application.

Reference numerals:

1. the light emitting device comprises a support, 1a, a first surface, 1b, a second surface, 2, a light emitting chip, 21, a VCSEL light source, 3, a first lens, 4, a cavity structure, 5, a second lens, 6, gold wires, 11, grooves, 12, heat conducting resin, 71, a first electrode, 72, a second electrode, 70, a through hole, 101, a first heat conducting piece, 102, a second heat conducting piece, 103, a first fixing piece, 104, a second fixing piece, 105 and a clearance groove.

Detailed Description

In order to provide a better understanding of the present application, those skilled in the art will now make further details of the present application with reference to the drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In order to overcome the defect of poor heat dissipation effect in the prior art, the application provides a light-emitting device.

As shown in fig. 1, fig. 1 is a cross-sectional structural view of a light emitting device according to a first embodiment of the present application, the light emitting device including: the light-emitting diode comprises a support 1, a light-emitting chip 2 and a first lens 3, wherein the first lens 3 is located above the support 1, a cavity structure 4 is formed between the first lens and the support 1, the support 1 is provided with a first surface 1a and a second surface 1b, a groove 11 is formed in the first surface of the support 1, the light-emitting chip 2 and heat-conducting resin 12 are arranged in the groove 11 of the support 1, and the heat-conducting resin 12 surrounds the light-emitting chip 2 and is in direct contact with the side face of the light-emitting chip 2. The heat emitted by the light-emitting chip 2 can be conducted to the heat conducting resin 12 through the side face of the light-emitting chip 2 while being radiated through the bracket 1, so that the heat capacity of the light-emitting chip 2 and the heat radiation of the light-emitting device is increased, and the service lives of the light-emitting chip 2 and the light-emitting device are prolonged.

As shown in fig. 2, fig. 2 is a cross-sectional structure diagram of a light emitting device according to a second embodiment of the present application, where the light emitting device further includes a second lens 5, where the second lens 5 is located in the cavity structure 4 and covers the upper surface of the light emitting chip 2, and the arrangement of the second lens 5 makes light emitted from the light emitting chip 2, and when the light passes through the first lens 3, the light intensity of the light is improved, so that the electric energy is converted into the light energy with greater efficiency, and then the energy ratio of the electric energy converted into the heat energy is reduced, thereby improving the heat dissipation effect.

In a preferred embodiment, the thermally conductive resin 12 contains thermally conductive particles, and the thermally conductive particles are one or more of diamond powder, diamond-like powder, and ceramic powder.

In a preferred embodiment, the ceramic powder may be boron nitride particles, which are white particles having a reflection effect, and the boron nitride particles may improve the light emitting efficiency of the light emitting device.

In a preferred embodiment, the thermal conductivity of the thermally conductive resin 12 is greater than 170W/mK.

As shown in fig. 3, fig. 3 is a cross-sectional view of a light emitting device according to a third embodiment of the present application, and the light emitting device further includes a first electrode 71 and a second electrode 72 electrically connected to the light emitting chip 2, where the first electrode 71 and the second electrode 72 are disposed at an insulating interval therebetween. In this embodiment, the first electrode 71 is directly electrically connected to the light emitting chip 2, and the second electrode 72 is electrically connected to the light emitting chip 2 through the gold wire 6. The bracket 1 is further provided with a through hole 70, a conductive material is arranged in the through hole 70, and the electric signals and heat of the first electrode 71 and the second electrode 72 are conducted to the outer side of the second surface 1b of the bracket 1 through the conductive material of the through hole 70. The electrical connection is not limited to the present application, and the light emitting chip 2 may be provided so as to electrically connect the first electrode 71 and the second electrode 72, and the first electrode 71 and the second electrode 72 may be provided with an insulating space therebetween.

As shown in fig. 4, fig. 4 is a cross-sectional view of a light emitting device according to a fourth embodiment of the present application, and similarly, the light emitting device further includes a first electrode 71 and a second electrode 72 electrically connected to the light emitting chip 2, and the first electrode 71 and the second electrode 72 are disposed at an insulating interval therebetween. The bracket 1 comprises a first heat conducting member 101 and a second heat conducting member 102, the first electrode 71 is positioned on the first heat conducting member 101, the second electrode 72 is positioned on the second heat conducting member 102, and a clearance groove 105 is arranged between the first heat conducting member 101 and the second heat conducting member 102. The first heat conducting member 101 and the second heat conducting member 102 can greatly enhance the heat capacity of heat dissipation of the light emitting chip 2 and the light emitting device, i.e., greatly enhance the heat dissipation capacity of the light emitting chip 2 and the light emitting device.

In a preferred embodiment, the heat conductive resin 12 seals and covers the gap groove 105 at least on the first surface 1 a. Since the heat-conducting resin 12 is a single process, the air tightness of the bracket 1 can be increased without increasing the cost by disposing the heat-conducting resin 12 on the first surface 1a of the bracket 1, so that the air tightness of the whole light-emitting device is also greatly enhanced.

In a preferred embodiment, the first heat conductive member 101 and the second heat conductive member 102 may be a material having better heat conductivity than the heat conductive resin 12, which may enhance the heat conductive capability of the light emitting device.

In an alternative embodiment, the first heat conductive member 101 and the second heat conductive member 102 have a heat conduction coefficient higher than 150W/mK.

In a preferred embodiment, the first heat conducting member 101 and the second heat conducting member 102 are made of one or more materials selected from gold, silver, copper, aluminum, iron, aluminum alloy and iron alloy, that is, materials with good heat and electric conductivity, and the heat conductivity may be higher than 200W/mK. The first heat conductive member 101 and the second heat conductive member 102 have a gap 105 therebetween, so that crosstalk of signals between the first electrode 71 and the second electrode 72 can be prevented.

As shown in fig. 5, fig. 5 is a cross-sectional structure diagram of a light emitting device according to a fifth embodiment of the present application, in this embodiment, on the basis of the embodiment shown in fig. 3, a first fixing member 103 and a second fixing member 104 are additionally provided, where the first fixing member 103 is located on the outer side of the first heat conducting member 101 and is in snap connection with the first heat conducting member 101, the second fixing member 104 is located on the outer side of the second heat conducting member 102 and is in snap connection with the second heat conducting member 102, and the first fixing member 103 and the second fixing member 104 are connected and provided, and by means of snap fixing action of the first fixing member 103 and the second fixing member 104 on the first heat conducting member 101 and the second heat conducting member 102, stability of an overall structure of the light emitting device is improved.

In an alternative solution, the first surface 1a where the groove 11 is located has a micro concave-convex structure, so that the contact area between the heat conducting resin 12 and the groove can be increased, and the heat conducting capability of the heat conducting resin is improved.

In the alternative, the groove 11 may have a square, circular or trapezoid slot.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements is inherent to. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or device that comprises the element. In addition, the parts of the above technical solutions provided in the embodiments of the present application, which are consistent with the implementation principles of the corresponding technical solutions in the prior art, are not described in detail, so that redundant descriptions are avoided.

Specific examples are set forth herein to illustrate the principles and embodiments of the present application, and the description of the examples above is only intended to assist in understanding the methods of the present application and their core ideas. It should be noted that it will be apparent to those skilled in the art that various improvements and modifications can be made to the present application and the various embodiments in the present application can be combined without departing from the principles of the present application, and such improvements, modifications and combinations also fall within the scope of the claims of the present application.

Claims (8)

1. A light emitting device, comprising: support (1), light emitting chip (2) and first lens (3), first lens (3) are located support (1) top, and form a cavity structure (4) with between support (1), support (1) have first surface (1 a) and second surface (1 b), have recess (11) on the first surface of support (1) be equipped with light emitting chip (2) and heat conduction resin (12) in recess (11) of support (1), heat conduction resin (12) encircle light emitting chip (2), and with the side direct contact of light emitting chip (2).

2. A light emitting device according to claim 1, characterized in that the light emitting device further comprises a second lens (5), the second lens (5) being located within the cavity structure (4) and covering the upper surface of the light emitting chip (2).

3. A light emitting device according to claim 1, characterized in that the thermally conductive resin (12) contains thermally conductive particles therein.

4. The light-emitting device according to claim 1, further comprising a first electrode (71) and a second electrode (72) electrically connected to the light-emitting chip (2), wherein the first electrode (71) and the second electrode (72) are arranged at an insulating interval, wherein the support (1) comprises a first heat conducting member (101) and a second heat conducting member (102), wherein the first electrode (71) is located on the first heat conducting member (101), wherein the second electrode (72) is located on the second heat conducting member (102), and wherein a gap groove (105) is formed between the first heat conducting member (101) and the second heat conducting member (102).

5. A light emitting device according to claim 4, characterized in that the thermally conductive resin (12) sealingly covers the clearance groove (105) at least on the first surface (1 a).

6. The light-emitting device according to claim 4, further comprising a first fixing member (103) and a second fixing member (104), wherein the first fixing member (103) is located at an outer side of the first heat conducting member (101) and is in snap connection with the first heat conducting member (101), the second fixing member (104) is located at an outer side of the second heat conducting member (102) and is in snap connection with the second heat conducting member (102), and the first fixing member (103) and the second fixing member (104) are connected.

7. A light-emitting device as claimed in claim 1, characterized in that the first surface (1 a) on which the grooves (11) are present has a micro relief structure.

8. A light emitting device as claimed in claim 1, characterized in that the recess (11) has a grooved form of one of square, circular, trapezoid.

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