JP2004111377A - Light irradiation device - Google Patents

Light irradiation device Download PDF

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JP2004111377A
JP2004111377A JP2003296874A JP2003296874A JP2004111377A JP 2004111377 A JP2004111377 A JP 2004111377A JP 2003296874 A JP2003296874 A JP 2003296874A JP 2003296874 A JP2003296874 A JP 2003296874A JP 2004111377 A JP2004111377 A JP 2004111377A
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led
light
housing
irradiation device
light irradiation
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JP4119329B2 (en
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Kenji Yoneda
米田 賢治
Takashi Sugita
杉田 隆
Kenji Miura
三浦 健司
Shigeki Masumura
増村 茂樹
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CCS Inc
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CCS Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light irradiation device of a kind especially using a power LED as a light source, having a structure providing a high heat dissipation, a compact size, an easy installation, and a high irradiation accuracy. <P>SOLUTION: The device is equipped with an LED 5, a casing 2 incorporating therein the LED 5 and having a dissipating section, and a first casing element 21 and a second casing element 22 connected to the casing 2 in series along a predetermined axial line. A sandwitching structure 3 tightly sandwitches the LED 5 between a first pressure face 3b provided to the first casing element 21 and a second pressure face 3a provided to the second casing element 22 along the connection of the casing elements 21 and 22. A positioning structure 4 positions the LED 5 such that an optical axis of the LED 5 corresponds to the axial line along the connection. <P>COPYRIGHT: (C)2004,JPO

Description

 本発明は、工場等において光を照射して製品の外観や傷の検査等に用いられる光照射装置に関する。(4) The present invention relates to a light irradiating device used for inspecting the appearance and scratches of a product by irradiating light at a factory or the like.

 従来、この種の光照射装置の光源部分にはハロゲンランプが用いられていたが、製品検査における能率や精度を考えた場合、その光度安定性、寿命、速応性等について十分なものであるとは言い難かったため、これらの点を改善し得る新たな光源としてLEDを用いたものが開発されてきている。具体的には、本願出願人が先に提案している特開2000−21206のように、基板上に多数のLEDを配設し、これら多数のLEDからそれぞれ光ファイバを介して光を導くようにしたものや、或いは各LEDを円錐凹面上に配設し、LEDから出た光を直接集光するようにしたものが知られている。このように複数のLEDを用いているのは、従来、LED単体で検査等に十分な光量を得ることが難しかったためである。Conventionally, a halogen lamp was used as the light source part of this type of light irradiation device.However, considering efficiency and accuracy in product inspection, it is considered that the light intensity stability, life, quick response, etc. are sufficient. Thus, a light source using an LED has been developed as a new light source that can improve these points. Specifically, as disclosed in Japanese Patent Application Laid-Open No. 2000-21206 previously proposed by the present applicant, a large number of LEDs are arranged on a substrate, and light is guided from each of the large number of LEDs via an optical fiber. In addition, there is a known configuration in which each LED is disposed on a conical concave surface, and light emitted from the LED is directly collected. The reason why a plurality of LEDs are used in this way is that it has conventionally been difficult to obtain a sufficient amount of light for inspection or the like by using the LED alone.

 ところで、近時パワーLEDと称され単体で大光量を発することのできる発光素子が開発されてきている。このものは、従来精々数十mAの電流しか流せなかったLEDと異なり、数百mA流せるようにしたもので、それに応じた光量を単体で発することができるようにしたものである。発 光 By the way, a light emitting element which is recently called a power LED and can emit a large amount of light by itself has been developed. This LED is different from an LED which can only flow a current of at most several tens mA in the past, and is capable of flowing several hundred mA, and is capable of emitting a light amount corresponding to the current alone.

 かかるパワーLEDを用いれば、光源部分のコンパクト化等を図れ、従来にない用い方等、種々の点でこの種の光照射装置に新たな可能性を提供できる。If such a power LED is used, it is possible to make the light source portion compact and the like, and to provide a new possibility to this type of light irradiation device in various points such as a method of using the light LED which has not been used conventionally.

 しかしながら、パワーLEDを用いた場合には、その電流量の大きさから熱問題が発生するため放熱が必須となる。LEDでは一般的に高い温度になると、光量が低下し、寿命も短くなるためである。従来、複数のLEDを用いたものの場合には、各LEDの固定簡単化も兼ねて基板に取り付けていたところ、LED単体には大きな電流が流れないうえに、複数が離散的に配置されていたため、その基板を放熱フィンを有した筐体に取り付けるなどして熱の問題を解決し得た。ところがパワーLEDは、従来アルミ基板を介して放熱していたが、アルミ基板といえども絶縁のためにガラスエポキシ層(熱伝導率0.3〜0.4W/mk)を介して放熱しているので、パワーLEDのベアチップから発する熱を放熱するには限界があった。その結果単純にパワーLEDを採用しただけでは、放熱部分が大きくなるなどして、前述したコンパクト性という利点が損なわれてしまう。However, when a power LED is used, heat dissipation is indispensable because a heat problem occurs due to the amount of current. This is because, in general, when the temperature of an LED becomes high, the amount of light is reduced and its life is shortened. Conventionally, when a plurality of LEDs are used, each LED is mounted on a substrate for simplification of fixing, but a large current does not flow through the LEDs alone, and a plurality of LEDs are discretely arranged. Then, the problem of heat could be solved by attaching the substrate to a housing having a radiation fin. However, the power LED conventionally dissipates heat through an aluminum substrate, but even an aluminum substrate dissipates heat via a glass epoxy layer (thermal conductivity: 0.3 to 0.4 W / mk) for insulation. Therefore, there is a limit in radiating heat generated from the bare chip of the power LED. As a result, simply adopting a power LED results in an increase in the heat radiation portion, thereby impairing the aforementioned advantage of compactness.

 さらに、組み立てを考えた場合、基板に対して半田付け等でパワーLEDを取り付けるにはその位置精度に限界があるため、前記基板を正確に位置決めして筐体に取り付けても、基板とパワーLEDとの位置関係が不均一なものとなる。したがって例えば光ファイバに光を導く場合にパワーLEDからの光を光ファイバの光導入端に正確に入れられず、その部分で光量損失が生じて、前述した大光量であるという利点が損なわれることも考えられる。一方、これを単純に防止しようとすると組み立てに時間やコストが大きくかかってしまう恐れが生じる。In addition, when assembling, there is a limit in the positional accuracy of attaching the power LED to the board by soldering or the like. Is non-uniform. Therefore, for example, when guiding light to an optical fiber, the light from the power LED cannot be accurately input to the light introduction end of the optical fiber, and a light amount loss occurs at that portion, thereby deteriorating the advantage of the large light amount described above. Is also conceivable. On the other hand, if simply trying to prevent this, there is a risk that it takes a long time and cost to assemble.

 そこで本発明は、特にパワーLEDを光源として用いたこの種の光射出装置において、上述した問題点を一挙に解決し、放熱性、コンパクト化、組み立て簡単化、照射光精度に同時に寄与できる構造の光照射装置を提供することをその主たる所期課題としたものである。Therefore, the present invention solves the above-mentioned problems at once in a light emitting device of this type using a power LED as a light source, and has a structure capable of simultaneously contributing to heat radiation, compactness, simplification of assembly, and irradiation light accuracy. It is an object of the present invention to provide a light irradiation device.

 すなわち本発明にかかる光照射装置は、LEDと、このLEDを内蔵するとともに放熱部を有してなる筐体とを具備し、その筐体が所定軸線に沿って直列に結合した第1筐体要素と第2筐体要素とを有するものであって、前記各筐体要素との結合に伴って前記第1筐体要素に設定した第1押圧面と前記第2筐体要素に設定した第2押圧面との間でLEDを狭圧固定する狭圧構造と、同結合に伴ってLEDの光軸を前記軸線に一致するように当該LEDの位置決めを行う位置決め構造とを具備することを特徴とする。That is, a light irradiation device according to the present invention includes an LED, and a housing including the LED and having a heat radiating portion, and a first housing in which the housings are connected in series along a predetermined axis. An element and a second housing element, wherein a first pressing surface set on the first housing element and a second pressing element set on the second housing element in association with each of the housing elements. (2) a narrow pressure structure for narrowly fixing the LED between the pressing surface and a positioning structure for positioning the LED so that the optical axis of the LED coincides with the axis with the coupling. And

 このようなものであれば、第1筐体要素と第2筐体要素とを結合することにより、前記狭圧構造によるLEDの狭圧固定と、前記位置決め構造によるLEDの正確な位置決めとが同時に行われることになる、したがって、組み立ての簡単化を実現しつつ、LEDから射出される光を正確に設定でき、なおかつ、放熱部を有してなる筐体に直接的に又は何らかの介在部材を介してLEDが強く接することとなるので、無用に筐体を大きくすることなく極めて効果的に十分な放熱が図れる。介在部材としては、例えば、各押圧面とLEDとの間の面粗さを吸収して密着性を高め熱伝導性を向上させる熱伝導部材シリコーングリス等を塗布しても構わない。In such a case, by combining the first housing element and the second housing element, the narrow pressure fixing of the LED by the narrow pressure structure and the accurate positioning of the LED by the positioning structure are simultaneously performed. Therefore, it is possible to accurately set the light emitted from the LED while realizing the simplification of the assembly, and furthermore, directly or through some intervening member to the housing having the heat radiating portion. As a result, the LEDs come into strong contact with each other, so that sufficient heat dissipation can be achieved extremely effectively without unnecessarily increasing the size of the housing. As the intervening member, for example, a heat conductive member such as silicone grease which absorbs the surface roughness between each pressing surface and the LED to increase the adhesion and improve the heat conductivity may be applied.

 本発明の効果が特に顕著となる具体的実施態様としては、前記LEDが単体で電流を200mA〜300mA以上流すことのできるものを挙げることができる。具体 As a specific embodiment in which the effects of the present invention are particularly remarkable, there can be cited one in which the LED alone can pass a current of 200 mA to 300 mA or more.

 押圧状態を良好に保つには、前記第1押圧面又は第2押圧面の少なくともいずれか一方が、対応する筐体要素に弾性部材を介して設けられているものが好ましい。保 つ In order to maintain a good pressing state, it is preferable that at least one of the first pressing surface and the second pressing surface is provided on a corresponding housing element via an elastic member.

 第2押圧面の具体的実施態様としては、前記第2筐体要素が周壁とその周壁から突出する突出体とを備え、前記突出体の先端面に設定した第2押圧面をLEDの底面の一部又は全部に密接させるように構成しているものを挙げることができる。この場合、突出体を前記周壁とは別体をなすものにしておいてもよい。LEDによっては、筐体周壁との間で絶縁しなければならないものがあり、その場合に、突出体のみを絶縁性を有するような素材にすればよいからである。As a specific embodiment of the second pressing surface, the second housing element includes a peripheral wall and a protruding body protruding from the peripheral wall, and the second pressing surface set at the distal end surface of the protruding body is formed on the bottom surface of the LED. One that is configured to be in close contact with a part or the whole can be given. In this case, the projecting body may be formed separately from the peripheral wall. This is because some LEDs need to be insulated from the peripheral wall of the housing, and in such a case, only the protruding body may be made of a material having an insulating property.

 配線や抵抗搭載等の関係からLEDに基板を取り付けるほうが好ましい場合には、基板を環状をなすものとし、前記突出体を前記基板の中心孔を貫通させてLEDの底面に密接させておけばよい。In the case where it is preferable to attach the substrate to the LED from the viewpoint of wiring or mounting of a resistor, the substrate is formed in an annular shape, and the protruding body may be passed through the center hole of the substrate and may be in close contact with the bottom surface of the LED. .

 前記位置決め構造の具体的実施態様としては、前記筐体に取り付けられた前記軸線を中心とするリング部を利用するものであり、そのリング部の中心貫通孔をLEDの外周に略隙間なく外嵌させて当該LEDの位置決めを行うように構成したものを挙げることができる。As a specific embodiment of the positioning structure, a ring portion attached to the housing and centered on the axis is used, and a center through hole of the ring portion is fitted around the outer periphery of the LED with almost no gap. Then, an LED configured to perform the positioning of the LED can be given.

 この場合、前記リング部がその内周面を鏡面状円錐凹面状とし光を前方へ案内するためのものであれば、位置決め構造に光反射機能を兼備させることができるため、部品点数を無理なく削減して構造簡単化に大きく寄与できる。In this case, if the ring portion has an inner peripheral surface that is a mirror-shaped conical concave surface and guides light forward, the positioning structure can also have a light reflecting function, so that the number of parts can be reasonably reduced. This can greatly contribute to simplifying the structure.

 また、前記筐体に内蔵させたレンズ機構をさらに備え、LEDから発された光を前記レンズ機構を介して所定の部位に設定した集光部に所定径で集光するように構成しているものであれば、その集光部に光ファイバ(束)やガラスロッド等の光案内部材の光導入端部を位置させ、その光案内部材の光射出端から光を効率よく射出することができる。Further, a lens mechanism incorporated in the housing is further provided, and the light emitted from the LED is configured to be condensed at a predetermined diameter on a condensing portion set at a predetermined portion via the lens mechanism. If the light guide member is a light guide member, the light introduction end of a light guide member such as an optical fiber (bundle) or a glass rod is located at the light condensing portion, and light can be efficiently emitted from the light exit end of the light guide member. .

 一方、前記筐体に内蔵させたレンズ機構をさらに備えたものにおいて、このレンズ機構を利用して前記位置決め構造を形成し、部品点数を無理なく削減して構造簡単化を図るには、前記位置決め構造が、前記レンズ機構を構成するレンズに設けた凹部にLEDをがたなく嵌合させ当該LEDの位置決めを行うように構成したものであることが好ましい。On the other hand, in a device further provided with a lens mechanism incorporated in the housing, the positioning mechanism is formed by using the lens mechanism, and the number of components is reasonably reduced to simplify the structure. It is preferable that the structure is such that the LED is fitted into the concave portion provided in the lens constituting the lens mechanism without any play, thereby positioning the LED.

 集光に好ましいレンズ機構の態様としては、前記レンズ機構が、前記LEDから照射される照射光を略平行な平行光にする第1レンズと、前記第1レンズからでた光を前記集光部に集光する第2レンズとからなるものを挙げることができる。As an aspect of the lens mechanism preferable for light collection, the lens mechanism may be configured to convert the light emitted from the LED into substantially parallel parallel light, and the light emitted from the first lens to the light focusing unit. And a second lens that condenses light.

 放熱部の好ましい実施態様としては、筐体の外周部に設けたフィン状をなすものを挙げることができる。好 ま し い As a preferred embodiment of the heat radiating portion, a fin-shaped member provided on the outer peripheral portion of the housing can be cited.

 以下に本発明の第1実施形態について図面を参照して説明する。Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

 本実施形態にかかる光照射装置1は、図1に示すように、単体のLED5と、このLED5を内蔵するとともに放熱部たる放熱フィン25を有してなる筐体2とを具備するもので、LED5から発された光を、前記筐体2の一端面に設けた光射出口2aから射出するものである。As shown in FIG. 1, the light irradiation device 1 according to the present embodiment includes a single LED 5 and a housing 2 including the LED 5 and having a radiation fin 25 serving as a radiation part. The light emitted from the LED 5 is emitted from a light emission port 2 a provided on one end surface of the housing 2.

 各部を説明すると、前記LED5は、特に図2に示すように、金属製(例えば銅製)の熱伝導体を兼用した導体51と、その導体上にダイボンディング等により固定された1個のLEDチップ52と、前記導体6に外嵌してこれを支持する樹脂フレーム56と、前記LEDチップ52のカソード側電極(図示せず)又はアノード側電極(図示せず)に直接的に又は前記導体51を介して間接的に一端が接続される2本のリード線(ボンディングワイヤーとも言う)53a、53bと、それら各リード線53a、53bの他端が接続される一対の電極54a、54bと、前記LEDチップ52、リード線53a、53b、電極54a、54bの一部を密封保護するための透明性を有する材料(エポキシやシリコーン等のプラスチック、エラストマー、あるいはガラス等)でなる樹脂モールド部55とからなるもので、これらを一体にしていわゆるパワーLED5として製品化されているものである。このLED5は、所定時間連続して300mA以上の電流を流すことが可能なものであり、単体でも従来に比して非常に大きな光量で発光する。また本実施形態では、前記樹脂フレーム56の底面に円環状をなすガラスエポキシ基板6を装着し、このガラスエポキシ基板6を介して、前記電極54a、54bと電気ケーブルCAとの接続を行っている。To explain each part, the LED 5 is, as shown in FIG. 2 in particular, a conductor 51 also serving as a metal (for example, copper) heat conductor, and one LED chip fixed on the conductor by die bonding or the like. 52, a resin frame 56 that is fitted to and supports the conductor 6, and the cathode 51 (not shown) or the anode (not shown) of the LED chip 52 directly or on the conductor 51. Two lead wires (also referred to as bonding wires) 53a and 53b, one end of which is connected indirectly through a pair of electrodes, and a pair of electrodes 54a and 54b to which the other end of each of the lead wires 53a and 53b is connected; A transparent material (for example, a plastic such as epoxy or silicone, or an elastomer) for sealingly protecting the LED chip 52, the lead wires 53a and 53b, and a part of the electrodes 54a and 54b. Mer or made of a resin mold portion 55. made of glass or the like), these are those commercialized as so-called power LED5 and integrally. The LED 5 is capable of continuously supplying a current of 300 mA or more for a predetermined time, and emits a very large amount of light as compared with the related art. In the present embodiment, an annular glass epoxy substrate 6 is mounted on the bottom surface of the resin frame 56, and the electrodes 54a and 54b and the electric cable CA are connected via the glass epoxy substrate 6. .

 筐体2は、図1に示すように、所定軸線たる中心軸線Lに沿って直列に結合した第1筐体要素21と第2筐体要素22とを有する中空のもので、各筐体要素21、22はその結合部分に形成したねじ部Bにより互いに締結される。As shown in FIG. 1, the housing 2 is a hollow body having a first housing element 21 and a second housing element 22 connected in series along a central axis L which is a predetermined axis. The parts 21 and 22 are fastened to each other by a screw part B formed at the connection part.

 第1筐体要素21は、前記軸線L方向に貫通する貫通孔21aを有する円筒状をなすもので、その貫通孔21aの一端開口を前記光照射口2aとしている。この貫通孔21aは前記光照射口2a側に形成した小径部と、その反対側に形成した大径部とからなる。小径部には、本実施形態では光案内部材たるガラスロッドGLが嵌め入れられている。一方、大径部には、前記軸線Lを中心として奥から順に弾性部材であるOリングOR、レンズ機構8、リング部7がラジアル方向にがたなく嵌め込まれている。レンズ機構8は第1レンズ81及び第2レンズ82を前記軸線L方向に沿って直列に配置してなるもので、第1レンズ81によりLED5から出た光を略平行な光とし、第2レンズ82でその光を前記ガラスロッドGLの基端面が位置する部位に設定した集光部9に、ガラスロッドGLの実効径と略同径となるように集光する。リング部7は、光の進む方向に向かってその内周面が外拡がり形状となるように構成した金属製又は樹脂製のもので、前記内周面は鏡面状に構成してある。The first housing element 21 has a cylindrical shape having a through hole 21a penetrating in the direction of the axis L, and one end opening of the through hole 21a is the light irradiation port 2a. The through hole 21a has a small diameter portion formed on the light irradiation port 2a side and a large diameter portion formed on the opposite side. In this embodiment, a glass rod GL as a light guide member is fitted into the small diameter portion. On the other hand, an O-ring OR, which is an elastic member, a lens mechanism 8, and a ring portion 7 are fitted into the large-diameter portion in the radial direction in order from the back with respect to the axis L. The lens mechanism 8 includes a first lens 81 and a second lens 82 arranged in series along the direction of the axis L. The first lens 81 converts light emitted from the LED 5 into substantially parallel light, and the second lens At 82, the light is condensed on the condensing portion 9 set at the position where the base end face of the glass rod GL is located so that the diameter becomes substantially the same as the effective diameter of the glass rod GL. The ring portion 7 is made of a metal or a resin whose inner peripheral surface is formed so as to expand outward in the direction in which light travels, and the inner peripheral surface is formed in a mirror-like shape.

 第2筐体要素22は、前記第1筐体要素21側の端面に開口する有底穴22aを有した断面円形状のものであり、側壁及び底壁からなる周壁23と、その底壁中央部分から前記軸線L方向に沿って第1筐体要素21側に延伸させた円柱状の突出体24とを備えたものである。そしてこの第2筐体要素22の外周に複数の有底溝を設けて放熱フィン25を形成している。もちろんこの放熱フィン25は第1筐体要素21に設けても構わない。The second housing element 22 has a circular cross section having a bottomed hole 22a opened on the end surface on the first housing element 21 side, and a peripheral wall 23 including a side wall and a bottom wall, and a center of the bottom wall. And a columnar protrusion 24 extending from the portion toward the first housing element 21 along the axis L direction. A plurality of bottomed grooves are provided on the outer periphery of the second housing element 22 to form the radiation fins 25. Of course, the radiation fins 25 may be provided on the first housing element 21.

 しかして、本実施形態では前記各筐体要素21、22の締結に伴って前記第1筐体要素21側に設定した第1押圧面3bと前記第2筐体要素22側に設定した第2押圧面3aとの間でLED5を狭圧固定する狭圧構造3と、同締結に伴ってLED5の光軸を前記軸線Lに一致するように当該LED5の位置決めを行う位置決め構造4とを設けている。According to the present embodiment, the first pressing surface 3b set on the first housing element 21 side and the second pressing surface 3b set on the second housing element 22 side with the fastening of the housing elements 21 and 22. A narrow pressure structure 3 for narrowly fixing the LED 5 with the pressing surface 3a and a positioning structure 4 for positioning the LED 5 so that the optical axis of the LED 5 coincides with the axis L with the fastening. I have.

 前記狭圧構造3における第1押圧面3bは、前記第1筐体要素21の小径部と大径部の境界にある段部の第2筐体要素22を向く面の一部に設定してあって、この第1押圧面3bがOリングOR、レンズ機構8、リング部7を介してLED5の樹脂モールド部に設定した段部5a(図2に示す)を押圧するように構成している。第2押圧面3aは、第2筐体要素22における突出体24の先端面に設定してあって、この第2押圧面3aがLED5における前記導体51の底面5bを押圧するように構成している。なお、レンズ機構8は、第1押圧面3bから押圧力を付与されるが、第1押圧面3bとレンズ機構8の間にはOリングORが介在し、これが弾性部材として作用して、締結によるレンズ81、82等の破壊を防止するとともに一定の圧力を付与させ押圧力のばらつきをなくして狭圧状態をがたのない良好なものに保つ。The first pressing surface 3b in the narrow pressure structure 3 is set to a part of a surface facing the second housing element 22 of the step portion at the boundary between the small diameter portion and the large diameter portion of the first housing element 21. The first pressing surface 3b presses a step 5a (shown in FIG. 2) set on the resin mold portion of the LED 5 via the O-ring OR, the lens mechanism 8, and the ring portion 7. . The second pressing surface 3a is set at the distal end surface of the protruding body 24 in the second housing element 22, and is configured such that the second pressing surface 3a presses the bottom surface 5b of the conductor 51 in the LED 5. I have. The lens mechanism 8 is provided with a pressing force from the first pressing surface 3b, but an O-ring OR is interposed between the first pressing surface 3b and the lens mechanism 8, and this acts as an elastic member, thereby fastening the lens mechanism 8. The lens 81, 82 and the like are prevented from being destroyed by the pressure, and a constant pressure is applied to eliminate a variation in the pressing force, thereby keeping the narrow pressure state good without play.

 一方、前記位置決め構造4は、前記各筐体要素21、22の締結に伴ってリング部7の中心貫通孔7aをLED5の外周に略隙間なく外嵌させ、LED5から発される光の光軸を前記軸線Lに一致するように構成したものである。具体的には、リング部7の底面開口部が、LED5の樹脂モールド部55の外周面にがたなく嵌まり込み、その位置決めが行われるようにしてある。On the other hand, the positioning structure 4 allows the central through-hole 7a of the ring portion 7 to be fitted around the outer periphery of the LED 5 with almost no gap as the housing elements 21 and 22 are fastened, and the optical axis of light emitted from the LED 5 Is configured to coincide with the axis L. Specifically, the bottom opening of the ring portion 7 is fitted into the outer peripheral surface of the resin mold portion 55 of the LED 5 without any play, and the positioning is performed.

 しかしてこのように構成した光照射装置1の組み立て方法について簡単に説明する。A brief description will be given of a method of assembling the light irradiation device 1 configured as described above.

 ます、第1筐体要素21にガラスロッドGL、OリングOR、レンズ機構8、リング部7を組み込む。その一方で、第2筐体要素22に基板6及び電源ケーブルCAを装着してなるLED5を、その底面が突出体24の先端面3aに密着するように載置する。First, the glass rod GL, the O-ring OR, the lens mechanism 8, and the ring portion 7 are incorporated in the first housing element 21. On the other hand, the LED 5 in which the substrate 6 and the power cable CA are mounted on the second housing element 22 is placed so that the bottom surface thereof is in close contact with the distal end surface 3 a of the protruding body 24.

 次に、第1筐体要素21を第2筐体要素22に対し締結していく。このことにより第1筐体要素21は第2筐体要素22に接近していくが、それに連れ、前記リング部7の底面開口部がLED5の先端部に外嵌し、軸線Lに対するラジアル方向の位置決めが行われる。さらに各筐体要素21、22を締結していくと前記各押圧面3a、3bがLED5を軸線方向に沿った対向する方向から押圧し、これを挟み込んで固定保持する。なお前記基板6は突出体24よりも大きい径の中心孔6aを有し、またその外径は第2筐体要素22の内径よりも小さく設定してあって、LED5のラジアル方向の位置決めが、前記位置決め構造4のみによって行われ、他の構造がその位置決めをなんら阻害しないように構成してある。Next, the first housing element 21 is fastened to the second housing element 22. As a result, the first housing element 21 approaches the second housing element 22, and accordingly, the bottom opening of the ring portion 7 fits over the tip of the LED 5, and the first housing element 21 moves in the radial direction with respect to the axis L. Positioning is performed. When the housing elements 21 and 22 are further fastened, the pressing surfaces 3a and 3b press the LED 5 from opposite directions along the axial direction, and sandwich and hold the LED 5 therebetween. The substrate 6 has a center hole 6a having a diameter larger than that of the protruding body 24, and its outer diameter is set smaller than the inner diameter of the second housing element 22, so that the positioning of the LED 5 in the radial direction can be performed. The positioning is performed only by the positioning structure 4 so that other structures do not hinder the positioning.

 すなわち、本実施形態によれば、第1筐体要素21と第2筐体要素22とを結合させるだけで、その内部に構成した狭圧構造3及び位置決め構造4の作用により、自動的にLED5の固定と正確な位置決めとが同時に行われることになる、したがって、組み立てが極めて簡単化され、なおかつ放熱部を有してなる筐体2に直接的にLED5が接することとなるので、放熱スピードを早め熱をこもらせずにLED5のジャンクション温度を下げる効果により輝度低下を防ぎ、LED5の寿命も長くすることができる。また、LED5の位置が正確なものとなり、前記集光部9に確実に光が照射されるので、光案内部材GLとの間での伝達ロスも可及的に低減させることができる。That is, according to the present embodiment, only by connecting the first housing element 21 and the second housing element 22, the LED 5 is automatically turned on by the action of the narrowing pressure structure 3 and the positioning structure 4 formed therein. The fixing and the accurate positioning are simultaneously performed. Therefore, the assembly is extremely simplified, and the LED 5 comes in direct contact with the housing 2 having the heat radiating portion. The effect of lowering the junction temperature of the LED 5 without prematurely retaining heat can prevent a decrease in luminance and prolong the life of the LED 5. In addition, since the position of the LED 5 is accurate and the light is reliably irradiated to the condensing portion 9, the transmission loss between the light guide member GL and the light guide member GL can be reduced as much as possible.

 なお、この狭圧構造3による放熱効果は、図3に示すように、実験から非常に顕著なものである。すなわち、単に押圧面3a、3bとLED5とを接触させただけの状態(B)と、狭圧固定した場合の状態(C)とを例えば初期照度からの60分後の照度低下で比較すると、狭圧固定した場合の方が照度低下が少なく大きな効果を生じていることがわかる。また、各押圧面3a、3bとLED5との間には、それら面粗さを吸収して密着性を高め熱伝導性を向上させるべく、シリコーングリス等を塗布しているものの、ほぼ直接的に接触させており、この場合(B)、(C)とその間に放熱シートを介在させた場合(A)とを比較すると、直接的に接触させたものの方が照度低下が少なく大きな効果を生じていることがわかる。放熱 The heat radiation effect of the narrow pressure structure 3 is very remarkable from an experiment, as shown in FIG. That is, when the state (B) in which the pressing surfaces 3a and 3b are simply brought into contact with the LED 5 and the state (C) in the case where the pressure is fixed with a narrow pressure are compared with, for example, the decrease in illuminance 60 minutes after the initial illuminance, It can be seen that the illuminance is less reduced and a greater effect is obtained when the pressure is fixed at a narrow pressure. Although silicone grease or the like is applied between the pressing surfaces 3a and 3b and the LED 5 in order to absorb the surface roughness and improve the adhesion and improve the thermal conductivity, almost directly. In this case, when (B) and (C) are compared with (A) in which a heat dissipation sheet is interposed therebetween, the direct contact has a smaller effect on illuminance and has a larger effect. You can see that there is.

 さらに本実施形態では、LED5の導体51が底面に表出しているため、この底面に筐体2を接触させて放熱を図るには、筐体2の周壁23との間で絶縁しなければならないところ、周壁23との間に突出体24を介在させているので、突出体24のみの加工や素材選択で絶縁が可能となる。すなわち第2筐体要素22全てに絶縁加工を施す必要がなく、また例えば窒化アルミニウムのような熱伝導性がよく絶縁性のある高価な材料を少なくできる。Further, in the present embodiment, since the conductor 51 of the LED 5 is exposed on the bottom surface, in order to contact the housing 2 with the bottom surface and to dissipate heat, the conductor 51 must be insulated from the peripheral wall 23 of the housing 2. However, since the protruding body 24 is interposed between the peripheral wall 23 and the protruding body 24, insulation can be achieved by processing only the protruding body 24 or selecting a material. That is, it is not necessary to perform insulation processing on all of the second housing elements 22, and it is possible to reduce expensive heat-insulating and expensive materials such as aluminum nitride.

 また、リング部7に、LED5から発される光の反射部材、位置決め構造4、及び狭圧構造3としての機能を兼備させているので、部品点数を無理なく削減して構造簡単化に大きく寄与できる。In addition, since the ring portion 7 also has a function as a reflection member of the light emitted from the LED 5, the positioning structure 4, and the narrow pressure structure 3, the number of components is reduced without difficulty, greatly contributing to the simplification of the structure. it can.

 以下に本発明の第2実施形態について図4、図5を参照して説明する。Hereinafter, a second embodiment of the present invention will be described with reference to FIGS.

 本実施形態にかかる光照射装置1Aは、図4に示すように、筐体2AにLED5Aを内蔵させたものであり、前記第1実施形態と同様に筐体2Aを構成する筐体要素21A、22Aの締結に伴って、前記第1筐体要素21Aに設定した第1押圧面3bAと前記第2筐体要素22Aに設定した第2押圧面3aAとの間で、前記LED5Aを狭圧固定する狭圧機構3Aと、同締結に伴って、所定軸線たる中心軸線Lを中心として前記LED5Aから発する光の光軸が一致するように、当該LED5Aの位置決めを行う位置決め構造4Aとを備えているものである。As shown in FIG. 4, the light irradiation device 1A according to the present embodiment has a housing 2A with a built-in LED 5A, and similarly to the first embodiment, a housing element 21A constituting the housing 2A, With the fastening of 22A, the LED 5A is narrowly fixed between the first pressing surface 3bA set on the first housing element 21A and the second pressing surface 3aA set on the second housing element 22A. A device having a narrow pressure mechanism 3A and a positioning structure 4A for positioning the LED 5A such that the optical axis of the light emitted from the LED 5A about the center axis L, which is a predetermined axis, coincides with the fastening. It is.

 以下に、各部について特に第1実施形態の光照射装置1との相違点を中心に詳述する。(4) Hereinafter, each part will be described in detail focusing on differences from the light irradiation device 1 of the first embodiment.

 筐体2Aは、前述したように第1筐体要素21A及び第2筐体要素22Aを備えてなる中空筒状のもので、その内部にLED5A、レンズ機構8A等を収容するものである。The housing 2A is a hollow cylinder having the first housing element 21A and the second housing element 22A as described above, and houses the LED 5A, the lens mechanism 8A, and the like inside.

 第1筐体要素21Aは、前記第1実施形態とほぼ同様の構成であるため、ここでの説明は省略する。第2筐体要素22Aは、第1実施形態同様、側壁22aA、底壁22bA及び円柱状の突出体24Aを備えるものであるが、その突出体24Aが底壁22bAに一体に設けられている点で第1実施形態と異なる。The first housing element 21A has substantially the same configuration as that of the first embodiment, and a description thereof will not be repeated. As in the first embodiment, the second housing element 22A includes a side wall 22aA, a bottom wall 22bA, and a columnar protrusion 24A, but the protrusion 24A is provided integrally with the bottom wall 22bA. This is different from the first embodiment.

 前記LED5Aは、LEDチップを保護するための樹脂モールド55Aの形状が半球状である点等、外形の点で前記第1実施形態のものと若干相違する。なお、図5中符号5bAは、前記第1実施形態におけるLED5と同様に樹脂モールド55Aの底面中央部に表出させた導体51Aの底面であり、その周囲を囲むように円環状をなす基板6Aを設けている。LED The LED 5A is slightly different from that of the first embodiment in the outer shape such as the shape of the resin mold 55A for protecting the LED chip is hemispherical. Reference numeral 5bA in FIG. 5 denotes a bottom surface of the conductor 51A exposed at the center of the bottom surface of the resin mold 55A similarly to the LED 5 in the first embodiment, and an annular substrate 6A surrounding the periphery thereof. Is provided.

 レンズ機構8Aは、第1レンズ81Aと、第2レンズ82Aと、各レンズ81A、82A間に介在させたスペーサ9Aとを備えたものである。The lens mechanism 8A includes a first lens 81A, a second lens 82A, and a spacer 9A interposed between the lenses 81A, 82A.

 第1レンズ81Aは、外形がわずかに側面を膨らませた概略切頭円錐状をなす例えば樹脂製の透明体であり、その外周面を後述するスペーサ9Aを介して第2筐体要素22Aの内周面に嵌合させることにより、第2筐体要素22Aの軸線LAにその中心軸を一致させてラジアル方向にがた無く配設されている。The first lens 81A is a transparent body made of, for example, a resin having a substantially truncated conical shape with a slightly bulged side surface, and has an outer peripheral surface formed on the inner periphery of the second housing element 22A via a spacer 9A described later. By being fitted to the surface, the second housing element 22A is arranged without any backlash in the radial direction with its central axis coinciding with the axis LA.

 第2レンズ82Aは、前記第1実施形態と同様のものであり、前記第1筐体要素21Aの大径部21aAに、その一方の半部がラジアル方向にがた無く嵌まり込むとともに、他方の半部が後述するスペーサ9Aを介して第2筐体要素22Aの内周面に嵌合することにより、その中心軸を前記軸線LAに一致させるとともに、第1筐体要素21A及び第2筐体要素22Aの軸合わせをも行う。なお、前記大径部21aAの底面と第2レンズ82Aとの間にはOリングORAを介在させてある。The second lens 82A is the same as that of the first embodiment. One half of the second lens 82A fits radially in the large-diameter portion 21aA of the first housing element 21A, while the other half fits. Is fitted to the inner peripheral surface of the second housing element 22A via a spacer 9A, which will be described later, so that the center axis of the second housing element 22A matches the axis LA, and the first housing element 21A and the second housing element 22A. The alignment of the body element 22A is also performed. An O-ring ORA is interposed between the bottom surface of the large diameter portion 21aA and the second lens 82A.

 前記スペーサ9Aは、円筒状をなすスペーサ本体91Aと、そのスペーサ本体91Aの内周面略中央部より内方に向かって一体に突出させたリング状の突条部92Aとを備えたもので、この突条部92Aの互いに背向する面に各レンズ81A、82Aの周縁部端面を接触させることで、レンズ81A、82A間の距離を担保するとともに、レンズ81A、82A間の摩擦を低減し、各筐体要素21A、22Aの締結時に回転トルクが第1レンズ81Aを介してLED5Aに伝達されるのを防止するように構成してある。スペーサ9Aの材質は金属製又は樹脂製で、摩擦係数の小さいものが好ましい。The spacer 9A includes a cylindrical spacer main body 91A and a ring-shaped protrusion 92A integrally protruding inward from a substantially central portion of an inner peripheral surface of the spacer main body 91A. By bringing the peripheral edges of the lenses 81A and 82A into contact with the opposite surfaces of the ridge 92A, the distance between the lenses 81A and 82A is secured, and the friction between the lenses 81A and 82A is reduced. When the housing elements 21A and 22A are fastened, the rotation torque is prevented from being transmitted to the LED 5A via the first lens 81A. The material of the spacer 9A is preferably made of metal or resin and has a small friction coefficient.

 しかして本実施形態にかかる狭圧機構3Aは、その第1押圧面3bAを、第1実施形態同様、前記第1筐体要素21Aの大径部21aAの内面に設けた段部の第2筐体要素22A側に向く面、すなわち、前記第1筐体要素21AにおけるOリングORAとの接触面に設定している。また、その第2押圧面3aAを、やはり第1実施形態同様、前記第2筐体要素22Aにおける突出体24Aの前記第1筐体要素21A側を向く面、すなわち、突出体24A先端面に設定している。In the narrow pressure mechanism 3A according to the present embodiment, the first pressing surface 3bA is provided on the inner surface of the large-diameter portion 21aA of the first housing element 21A as in the first embodiment. It is set to the surface facing the body element 22A, that is, the contact surface with the O-ring ORA in the first housing element 21A. Further, the second pressing surface 3aA is also set to the surface of the projection 24A of the second housing element 22A facing the first housing element 21A side, that is, the front end surface of the projection 24A, similarly to the first embodiment. are doing.

 そして、前記第1筐体要素21Aと前記第2筐体要素22Aを締結していくにつれて、第1押圧面3bAと第2押圧面3aAとが中心軸線LAに沿って互いに近づき、前記第1押圧面3bAからOリングORA及びレンズ機構8Aを介し、また一方では前記第2押圧面3aAから後述する熱伝導体26Aを介して前記LED5Aを軸線L方向に狭圧するようにしてある。この熱伝導体26Aは前記LED5Aの導体底面5bAと前記第2筐体要素22Aの第2押圧面3aAとの間に配置されるもので、材質としては窒化アルミニウム、放熱溶融樹脂、液状セラミック等のように、熱伝導性が高く、電気的絶縁性を有するものが好ましい。Then, as the first housing element 21A and the second housing element 22A are fastened, the first pressing surface 3bA and the second pressing surface 3aA approach each other along the center axis LA, and the first pressing surface 3bA and the second pressing surface 3aA approach each other. The LED 5A is narrowed in the direction of the axis L from the surface 3bA via the O-ring ORA and the lens mechanism 8A, and on the other hand, from the second pressing surface 3aA via a heat conductor 26A described later. The heat conductor 26A is disposed between the conductor bottom surface 5bA of the LED 5A and the second pressing surface 3aA of the second housing element 22A, and is made of a material such as aluminum nitride, heat-dissipating molten resin, or liquid ceramic. Thus, those having high thermal conductivity and electrical insulation are preferable.

 一方、本実施形態にかかる位置決め構造4Aは、前記第1レンズ81Aの小径側端面に開口させた断面円形状の凹部81aAと、前記LED5Aの樹脂モールド55Aとの嵌合により構成されるものである。そして、前記第1筐体要素21Aと前記第2筐体要素22Aとの締結にしたがい、前記凹部81aAと樹脂モールド55Aとを互いにがた無く嵌合させることにより、LED5Aの光軸を前記軸線LAに一致させ、そのラジアル方向の位置決めを行う。On the other hand, the positioning structure 4A according to the present embodiment is configured by fitting a concave portion 81aA having a circular cross section opened on the small-diameter side end surface of the first lens 81A and a resin mold 55A of the LED 5A. . Then, in accordance with the fastening of the first housing element 21A and the second housing element 22A, the concave portion 81aA and the resin mold 55A are fitted without any backlash, so that the optical axis of the LED 5A is aligned with the axis LA. And the positioning in the radial direction is performed.

 なお、この凹部81aAの底面を膨出湾曲面として屈折部81bAを形成しており、前記LED5Aから発された光のうち、光軸から所定角度内の光を、その屈折部81bAによって屈折させ平行化する一方、それより外側に拡がる光は、第1レンズ81Aの外周の境界面で反射させることにより、LED5Aから発された光のほとんどを効率よく平行化して光軸方向に進行させ得るように構成してある。The refraction portion 81bA is formed by using the bottom surface of the concave portion 81aA as a swelling curved surface, and of the light emitted from the LED 5A, light within a predetermined angle from the optical axis is refracted by the refraction portion 81bA and parallelized. On the other hand, the light that spreads outward from the LED 5A is reflected by the outer peripheral boundary surface of the first lens 81A so that most of the light emitted from the LED 5A can be efficiently collimated and travel in the optical axis direction. It is composed.

 しかして、このように構成した光照射装置1Aの組み立て方法について一例を挙げ簡単に説明する。However, a method of assembling the light irradiation device 1A thus configured will be briefly described with an example.

 まず、第1筐体要素21AにガラスロッドGLA、OリングORA、第2レンズ82A及びスペーサ9Aを組み込む。その一方で、基板6A及び電源ケーブルCAAを装着してなるLED5Aに第1レンズ81Aを取り付け、締結時にLED5Aの導体底面5bAが熱伝導体26Aを介して第2筐体要素22Aに密着することができるように載置し、第2筐体要素22Aに組み込む。First, the glass rod GLA, the O-ring ORA, the second lens 82A, and the spacer 9A are assembled into the first housing element 21A. On the other hand, the first lens 81A is attached to the LED 5A on which the substrate 6A and the power cable CAA are attached, and the conductor bottom surface 5bA of the LED 5A may be in close contact with the second housing element 22A via the heat conductor 26A at the time of fastening. It is placed so as to be able to be installed and assembled into the second housing element 22A.

 次に、第1筐体要素21Aを第2筐体要素22Aに対して締結する。このことにより第1押圧面3bA及び第2押圧面3aAが近づき、その間の各部品、すなわち、OリングORA、レンズ機構8A、LED5A及び熱伝導体26Aを押圧して、筐体2A内部に前記各部品が固定される。Next, the first housing element 21A is fastened to the second housing element 22A. As a result, the first pressing surface 3bA and the second pressing surface 3aA approach each other, and press the respective components therebetween, that is, the O-ring ORA, the lens mechanism 8A, the LED 5A, and the heat conductor 26A, and press the respective components into the housing 2A. Parts are fixed.

 また、この締結に連れて前記凹部81aAとLED5Aの樹脂モールド55Aとが互いにがた無く嵌合し、LED5Aの光軸が前記軸線LAに一致するようにそのラジアル方向の位置決めが行われる。その際、基板6Aの中心孔6aAと前記突出体24Aとの間には若干の隙間が形成されているため、これらがLED5Aの位置決め構造5Aによる位置決めを阻害することはない。{Circle around (4)} With this fastening, the concave portion 81aA and the resin mold 55A of the LED 5A are fitted with each other without any gap, and the positioning in the radial direction is performed so that the optical axis of the LED 5A coincides with the axis LA. At this time, since a slight gap is formed between the center hole 6aA of the substrate 6A and the protruding body 24A, they do not hinder the positioning of the LED 5A by the positioning structure 5A.

 このように本実施形態によれば、前記第1実施形態と同様の効果を奏し、また、特にこの実施形態では第1レンズ81Aに設けた凹部81aAを利用してLED5Aの位置決めが行っているのでので、部品点数を無理なく削減して構造簡単化を図ることが可能である。As described above, according to the present embodiment, the same effects as those of the first embodiment are obtained. In particular, in this embodiment, the LED 5A is positioned using the concave portion 81aA provided in the first lens 81A. Therefore, it is possible to simplify the structure by reasonably reducing the number of parts.

 放熱性に関して具体的な効果を数値として挙げておく。図6、図7は、赤色LEDと青色LEDの場合についてそれぞれ調べた結果である。赤色LEDについては、従来のように、ガラスエポキシ層を表面に有したアルミ基板を介して放熱行う構造のもの(従来品)と、この実施形態の構造で十分押圧したもの(本発明品、赤、強締結)とで比較している。半田温度、筐体温度ともにこの実施形態にかかるものの方が温度上昇が少なく、また照度変化も小さいことが明らかにわかる。青色LEDについては、本実施形態の構造で、押圧力が大きいもの(本発明品、青、強締結)と小さいもの(本発明品、青、弱締結)とで比較している。押圧力が大きいものの方が、温度上昇が小さいことがわかる。Specific effects on heat dissipation are listed as numerical values. FIG. 6 and FIG. 7 show the results of the investigation for the red LED and the blue LED, respectively. The red LED has a structure in which heat is dissipated through an aluminum substrate having a glass epoxy layer on the surface (conventional product), and a red LED which is sufficiently pressed by the structure of this embodiment (product of the present invention, red). , Strong conclusion). It is clear that both the solder temperature and the housing temperature according to this embodiment have a smaller temperature rise and a smaller change in illuminance. Regarding the blue LED, in the structure of the present embodiment, a large pressing force (product of the present invention, blue, strong fastening) and a small pressing force (product of the present invention, blue, weak fastening) are compared. It can be seen that the larger the pressing force, the smaller the temperature rise.

 なお本発明は上記実施形態に限られず、種々変更が可能である。The present invention is not limited to the above embodiment, but can be variously modified.

 例えば、狭圧構造はLEDの形態や筐体の形態によって変更可能であるのは言うまでもない。For example, it goes without saying that the narrow pressure structure can be changed depending on the form of the LED and the form of the housing.

 基板6も場合によっては不要にできる。単体のLEDでありながらLEDチップを複数有するものでも構わない。また、光案内部材としてガラスロッドを用いたが、これの代わりに光ファイバ(束)を装着しても構わないし、ガラスロッドがなくとも構わない。(4) The substrate 6 may be unnecessary in some cases. A single LED may have a plurality of LED chips. Further, although a glass rod is used as the light guide member, an optical fiber (bundle) may be mounted instead of the glass rod, or the glass rod may not be provided.

 さらに、筐体とLEDとを直接的に接触させず、例えば高い熱伝導性を発揮し、電気的には絶縁性を持った柔軟性に富むギャップフィラーの等を介在させてもよい。もちろん本光照射装置は照明用のみならず、例えば化学反応を促進させるような用途に用いても構わないのは言うまでもない。Furthermore, instead of bringing the housing and the LED into direct contact, for example, a highly flexible gap filler that exhibits high thermal conductivity and is electrically insulative may be interposed. Needless to say, the light irradiation apparatus may be used not only for illumination but also for, for example, an application for accelerating a chemical reaction.

 本発明の第1実施形態における光照射装置の内部構造を示す縦断面図。縦 A longitudinal sectional view showing the internal structure of the light irradiation device according to the first embodiment of the present invention.  同実施形態におけるLED及び基板の縦断面図。<< Vertical sectional view of LED and the board in the embodiment.  同実施形態における光照射装置の効果を示す効果説明表。効果 Effect explanation table showing effects of the light irradiation device in the same embodiment.  本発明の第2実施形態における光照射装置の内部構造を示す縦断面図。縦 A longitudinal sectional view showing the internal structure of the light irradiation device according to the second embodiment of the present invention.  同実施形態におけるLED及び基板の縦断面図。<< Vertical sectional view of LED and the board in the embodiment.  同実施形態における光照射装置の効果を示す効果説明表。効果 Effect explanation table showing effects of the light irradiation device in the same embodiment.  同実施形態における光照射装置の効果を示す効果説明表。効果 Effect explanation table showing effects of the light irradiation device in the same embodiment.

符号の説明Explanation of reference numerals

1、1A・・・光照射装置
2、2A・・・筐体
21、21A・・・第1筐体要素
22、22A・・・第2筐体要素
23・・・周壁
24、24A・・・突出体
25・・・放熱部(放熱フィン)
3、3A・・・狭圧構造
3a、3aA・・・第1押圧面
3b、3bA・・・第2押圧面
4、4A・・・位置決め構造
5、5A・・・LED
5b・・・LEDの底面
6、6A・・・基板
6a・・・基板の中心孔
7・・・リング部
7a・・・リング部の中心貫通孔
8、8A・・・レンズ機構
81、81A・・・第1レンズ
82、82A・・・第2レンズ
9・・・集光部
L・・・所定軸線
OR、ORA・・・弾性部材(Oリング)
1, 1A: Light irradiation device 2, 2A: Housing 21, 21A: First housing element 22, 22A: Second housing element 23: Peripheral wall 24, 24A ... Projecting body 25: heat radiation part (heat radiation fin)
3, 3A: narrow pressure structure 3a, 3aA: first pressing surface 3b, 3bA: second pressing surface 4, 4A: positioning structure 5, 5A: LED
5b: LED bottom surface 6, 6A: substrate 6a: substrate central hole 7: ring portion 7a: ring portion central through hole 8, 8A: lens mechanism 81, 81A ··· First lens 82, 82A ··· Second lens 9 ··· Condenser L ··· Predetermined axis line OR, ORA ··· Elastic member (O-ring)

Claims (11)

LEDと、このLEDを内蔵するとともに放熱部を有してなる筐体とを具備し、その筐体が所定軸線に沿って直列に結合した第1筐体要素と第2筐体要素とを有するものであって、
 前記筐体要素同士の結合に伴って前記第1筐体要素側に設けた第1押圧面と前記第2筐体要素側に設けた第2押圧面との間でLEDを狭圧固定する狭圧構造と、同結合に伴ってLEDの光軸を前記軸線に一致するように当該LEDの位置決めを行う位置決め構造とを具備することを特徴とする光照射装置。
An LED and a housing including the LED and having a heat radiating portion, the housing including a first housing element and a second housing element coupled in series along a predetermined axis. Thing,
Narrowing the LED between the first pressing surface provided on the first housing element side and the second pressing surface provided on the second housing element side with the coupling of the housing elements. A light irradiation device comprising: a pressure structure; and a positioning structure for positioning the LED such that the optical axis of the LED coincides with the axis along with the coupling.
前記LEDが単体で定常的に電流を200mA〜300mA以上流すことのできるものである請求項1記載の光照射装置。The light irradiation device according to claim 1, wherein the LED is capable of constantly flowing a current of 200 mA to 300 mA or more by itself. 前記第1押圧面又は第2押圧面の少なくともいずれか一方とLEDとの間に弾性部材を介在させている請求項1乃至2いずれか記載の光照射装置。The light irradiation device according to claim 1, wherein an elastic member is interposed between at least one of the first pressing surface and the second pressing surface and the LED. 前記第2筐体要素が周壁とその周壁から突出する突出体とを備え、前記突出体の第1筐体要素側を向く面に前記第2押圧面を設定している請求項1乃至3いずれか記載の光照射装置。The second housing element includes a peripheral wall and a protruding body protruding from the peripheral wall, and the second pressing surface is set on a surface of the protruding body facing the first housing element side. A light irradiation device according to any one of claims 1 to 4. LEDを環状をなす基板に取り付けたものであって、前記突出体を前記基板の中心孔を貫通させてLEDの底面に直接又は熱伝導部材を介在させて密接させている請求項4記載の光照射装置。5. The light according to claim 4, wherein the LED is mounted on a ring-shaped substrate, and wherein the protruding body penetrates a center hole of the substrate and is in close contact with a bottom surface of the LED directly or through a heat conductive member. Irradiation equipment. 前記位置決め構造が、前記筐体に取り付けられたリング部を利用してなり、前記LEDを筐体要素同士の結合に伴って前記リング部の中心貫通孔にがたなく嵌合させ当該LEDの位置決めを行うものである請求項1乃至5いずれか記載の光照射装置。The positioning structure utilizes a ring portion attached to the housing, and the LED is fitted without loosely fitting into a center through hole of the ring portion as the housing elements are connected to each other to position the LED. The light irradiation device according to any one of claims 1 to 5, which performs the following. 前記リング部が、その内周面を鏡面状円錐凹面状とし光を前方へ案内する機能を有するものである請求項6記載の光照射装置。The light irradiating apparatus according to claim 6, wherein the ring portion has a function of guiding light forward by making its inner peripheral surface a mirror-shaped conical concave surface. 前記筐体に内蔵させたレンズ機構をさらに備えたものであって、前記位置決め構造が、前記レンズ機構を構成するレンズに設けた凹部にLEDをがたなく嵌合させ、当該LEDの位置決めを行うものである請求項1乃至5いずれか記載の光照射装置。The apparatus further comprises a lens mechanism built in the housing, wherein the positioning structure fits an LED without a gap into a concave portion provided in a lens constituting the lens mechanism, and positions the LED. The light irradiation device according to any one of claims 1 to 5, which is a light irradiation device. 前記筐体に内蔵させたレンズ機構をさらに備え、LEDから発された光を前記レンズ機構を介して所定の部位に設定した集光部に所定径で集光するように構成している請求項1乃至8いずれか記載の光照射装置。The apparatus according to claim 1, further comprising a lens mechanism built in the housing, wherein the light emitted from the LED is condensed at a predetermined diameter on a light condensing portion set at a predetermined portion via the lens mechanism. 9. The light irradiation device according to any one of 1 to 8. 前記レンズ機構が、前記LEDから照射される照射光を略平行な平行光にする第1レンズと、前記第1レンズからでた光を前記集光部に集光する第2レンズとからなる請求項9記載の光照射装置。The lens mechanism includes a first lens that converts irradiation light emitted from the LED into substantially parallel light, and a second lens that collects light emitted from the first lens to the light collection unit. Item 10. A light irradiation device according to item 9. 前記放熱部が筐体の外周部に設けたフィン状をなすものである請求項1乃至10記載の光照射装置。The light irradiation device according to any one of claims 1 to 10, wherein the heat radiating portion has a fin shape provided on an outer peripheral portion of the housing.
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