CN218969345U - Substrate processing chamber capable of reducing dust pollution - Google Patents
Substrate processing chamber capable of reducing dust pollution Download PDFInfo
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- CN218969345U CN218969345U CN202121052414.0U CN202121052414U CN218969345U CN 218969345 U CN218969345 U CN 218969345U CN 202121052414 U CN202121052414 U CN 202121052414U CN 218969345 U CN218969345 U CN 218969345U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a substrate processing chamber capable of reducing dust pollution, which mainly comprises a reaction cavity, a bearing plate, a containing cavity and a shielding mechanism, wherein the reaction cavity is connected with the containing cavity, and the bearing plate is positioned in the reaction cavity. The shielding mechanism comprises at least one guiding unit, at least one connecting seat, a shielding plate, at least one driving arm, at least one bushing and a bias power supply, wherein the bushing is used for cladding the guiding unit and the connecting seat, and the driving arm drives the connecting seat to displace in the bushing along the guiding unit, so that the shielding plate displaces between the accommodating cavity and the reaction cavity. The bias power supply is connected with the bushing, and forms bias on the bushing to adsorb particles generated when the connecting seat moves along the guide unit, so as to prevent the particles generated in the process of driving the connecting seat and the shielding plate to move by the driving arm from polluting the reaction cavity.
Description
Technical Field
The utility model relates to a substrate processing chamber capable of reducing dust pollution, which can prevent particles generated in the process of driving a connecting seat and a shielding plate to displace by a driving arm from polluting a reaction cavity.
Background
Chemical Vapor Deposition (CVD), physical Vapor Deposition (PVD), and Atomic Layer Deposition (ALD) are common thin film deposition equipment and are commonly used in the manufacture of integrated circuits, light emitting diodes, and displays.
The deposition apparatus mainly comprises a chamber and a wafer carrying tray, wherein the wafer carrying tray is positioned in the chamber and is used for carrying at least one wafer. Taking physical vapor deposition as an example, a target needs to be disposed in the chamber, wherein the target faces the wafers on the wafer carrier. During physical vapor deposition, inert gas and/or reactive gas can be delivered into the chamber to bias the target and the wafer carrier plate, respectively, and the wafer carried by the wafer carrier plate is heated.
The inert gas in the cavity forms ionized inert gas under the action of the high-voltage electric field, and the ionized inert gas is attracted by the bias voltage on the target material to bombard the target material. Target atoms or molecules sputtered from the target are attracted by the bias on the wafer carrier plate and deposit on the surface of the heated wafer to form a thin film on the surface of the wafer.
After a period of use, the deposited film is formed on the inner surface of the chamber, so that the chamber needs to be periodically cleaned to avoid the deposited film from falling off during the process and contaminating the wafer. In addition, oxides or other contaminants may form on the surface of the target, thus also requiring periodic cleaning of the target. Generally, plasma ions are used to strike the target in the chamber through a burn-in (burn-in) process to remove oxides or other contaminants from the target surface.
When the cavity and the target are cleaned, the wafer bearing plate and the wafer in the cavity need to be taken out, or the wafer bearing plate is isolated, so that the wafer bearing plate and the wafer are prevented from being polluted in the cleaning process.
Disclosure of Invention
Generally, a substrate processing chamber typically requires cleaning after a period of use to remove deposited films and oxides or nitrides from the target within the chamber. Particulates generated during cleaning contaminate the carrier platter, thus requiring isolation of the carrier platter from contaminants. The utility model provides a shielding mechanism and a substrate processing chamber capable of reducing dust pollution, wherein a driving arm drives a shielding plate to move between a storage position and a shielding position along a guide unit, so that the pollution of particles generated during the cleaning of a cavity or a target material to a bearing plate can be avoided.
An object of the present utility model is to provide a substrate processing chamber capable of reducing dust pollution, which mainly comprises a reaction chamber, a carrying plate, a receiving chamber and a shielding mechanism, wherein the receiving chamber is connected with the reaction chamber. The shielding mechanism comprises a guide unit, a connecting seat, a shielding plate, a driving arm, a bushing and a bias power supply, wherein the driving arm is connected with and drives the shielding plate and the connecting seat to move between the accommodating cavity and the reaction cavity along the guide unit.
When the reaction cavity is cleaned, the driving arm drives the connecting seat and the shielding plate to move into the reaction cavity, and the shielding plate shields the bearing disc in the reaction space, so that plasma used in the cleaning process or pollution generated by the plasma is prevented from contacting the bearing disc and/or a substrate borne by the bearing disc. When the deposition process is performed, the driving arm drives the connecting seat and the shielding plate to move into the accommodating cavity, and performs film deposition on the substrate in the reaction cavity.
Particles may be generated during the displacement of the connecting seat along the guiding unit, and when the particles diffuse into the accommodating space of the reaction cavity, the carrying tray and the substrate carried by the carrying tray will be polluted, and the quality of the film deposited on the surface of the substrate will be affected. In order to avoid the above situation, the present utility model further proposes to cover the guiding unit and the connecting seat with the bushing, and to support the particles generated when the connecting seat is displaced relative to the guiding unit through the bushing.
An object of the present utility model is to provide a substrate processing chamber capable of reducing dust pollution, in which a liner surrounding a guide unit and a connection base has conductive characteristics and is biased by a bias power supply. Particles generated during the displacement of the connecting seat along the guiding unit are usually charged and may be attracted by the bias on the liner, so as to prevent the particles from diffusing from the isolation space of the liner to the accommodating space of the reaction chamber.
An object of the present utility model is to provide a substrate processing chamber capable of reducing dust pollution, wherein a guiding unit and a connecting seat are disposed in an isolation space of a liner, and the isolation space is in fluid connection with an air pumping unit. The air extraction unit is used for extracting the air and particles in the isolation space, and the air pressure in the isolation space is slightly smaller than the air pressure in the accommodating space, so that the particles are prevented from being diffused into the accommodating space from the isolation space to cause pollution.
An object of the present utility model is to provide a substrate processing chamber capable of reducing dust pollution, wherein the number of the guiding units is two, and the guiding units are respectively connected to two sides of the shielding plate. By using two guide units, the shielding plate can be carried and driven more stably, and the shielding plate with thicker thickness and heavier weight can be used. The use of a heavier shield prevents deformation of the shield due to high temperatures during cleaning of the chamber and prevents plasma or contamination during cleaning from contacting the carrier plate or substrate via the deformed shield.
In addition, two guide units can be further respectively coated by the two bushings so as to prevent particles generated when the driving arm drives the shielding plate to displace from being diffused into the accommodating space of the reaction cavity. The distance between the two guide units and the two bushings is larger than the diameters of the bearing plate and the substrate, so that the displacement of the bearing plate is prevented from being disturbed and the progress of the deposition process is prevented from being influenced.
In an embodiment of the utility model, the driving arm may be a folding mechanical arm, and includes a first driving arm and a second driving arm, where the first driving arm is connected to the second driving arm through a joint shaft, and the shielding plate may be driven by the first driving arm and the second driving arm to move along the guiding unit between the reaction cavity and the receiving cavity. In different embodiments, the driving arm may also be a telescopic mechanical arm or a scissor mechanical arm, so as to achieve the purpose of driving the shielding plate to displace.
In order to achieve the above object, the present utility model provides a substrate processing chamber capable of reducing dust pollution, comprising: a reaction cavity, which comprises a containing space; one end of the baffle piece is connected with the reaction cavity, and the other end of the baffle piece forms an opening; the bearing plate is positioned in the accommodating space and is used for bearing at least one substrate; the accommodating cavity is connected with the reaction cavity and comprises an accommodating space which is in fluid connection with the accommodating space; and a shielding mechanism comprising: at least one guiding unit extending the accommodating space from the accommodating space; at least one connecting seat connected with the guiding unit; a shielding plate connected with the connecting seat; at least one driving arm connected to the shielding plate or the connecting seat and used for driving the shielding plate and the connecting seat to displace between the storage space and the accommodating space along the guiding unit, wherein the displacement direction of the shielding plate is parallel to the guiding unit; at least one bushing made of a conductive material and having an isolation space, wherein the guiding unit and the connecting seat are located in the isolation space; and a bias power supply electrically connected to the bushing and configured to form a bias voltage on the bushing.
The present utility model provides another substrate processing chamber capable of reducing dust pollution, comprising: a reaction cavity, which comprises a containing space; one end of the baffle piece is connected with the reaction cavity, and the other end of the baffle piece forms an opening; the bearing plate is positioned in the accommodating space and is used for bearing at least one substrate; the accommodating cavity is connected with the reaction cavity and comprises an accommodating space which is in fluid connection with the accommodating space; and a shielding mechanism comprising: at least one guiding unit extending the accommodating space from the accommodating space; at least one connecting seat connected with the guiding unit; a shielding plate connected with the connecting seat; at least one driving arm connected to the shielding plate or the connecting seat and used for driving the shielding plate and the connecting seat to displace between the storage space and the accommodating space along the guiding unit, wherein the displacement direction of the shielding plate is parallel to the guiding unit; at least one bushing having an isolation space, wherein the guide unit and the connection seat are located in the isolation space; and at least one air extraction unit connected to the isolation space and used for extracting the air in the isolation space.
The utility model provides a shielding mechanism, which is suitable for a substrate processing chamber and comprises: at least one guiding unit; at least one connecting seat connected with the guiding unit; a shielding plate connected with the connecting seat; at least one driving arm connected to the shielding plate or the connecting seat; the driving unit is connected with the driving arm, and drives the shielding plate and the connecting seat to displace along the guiding unit through the driving arm, wherein the displacement direction of the shielding plate is parallel to the guiding unit; at least one bushing made of a conductive material and having an isolation space, wherein the guiding unit and the connecting seat are located in the isolation space; and a bias power supply electrically connected to the bushing and configured to form a bias voltage on the bushing.
The present utility model provides another shielding mechanism suitable for a substrate processing chamber, comprising: at least one guiding unit; at least one connecting seat connected with the guiding unit; a shielding plate connected with the connecting seat; at least one driving arm connected to the shielding plate or the connecting seat; the driving unit is connected with the driving arm, and drives the shielding plate and the connecting seat to displace along the guiding unit through the driving arm, wherein the displacement direction of the shielding plate is parallel to the guiding unit; at least one bushing having an isolation space, wherein the guide unit and the connection seat are located in the isolation space; and at least one air extraction unit connected to the isolation space and used for extracting the air in the isolation space.
The substrate processing chamber capable of reducing dust pollution comprises a driving unit, wherein the driving arm comprises at least one first driving arm and at least one second driving arm, the driving unit is connected with the second driving arm through the first driving arm, and the shielding plate is driven to move between the storage space and the accommodating space through the first driving arm and the second driving arm.
The substrate processing chamber capable of reducing dust pollution comprises at least one position sensing unit which is arranged in the accommodating cavity or the reaction cavity and is used for sensing the position of the shielding plate.
The substrate processing chamber capable of reducing dust pollution and the shielding mechanism comprise a filtering unit positioned between the air pumping unit and the isolation space, wherein the air pumping unit pumps out gas in the isolation space through the filtering unit.
The beneficial effects of the utility model are as follows: the novel shielding mechanism and the substrate processing chamber with the shielding mechanism are provided, and the shielding part is driven to move between a storage position and a shielding position along the driving rod body mainly through the driving rod body, so that particles generated during cleaning of a cavity or a target material can be prevented from polluting the bearing plate.
Drawings
FIG. 1 is a schematic side cross-sectional view of one embodiment of a substrate processing chamber of the present utility model operating in a shielded state to reduce dust contamination.
FIG. 2 is a schematic side cross-sectional view of one embodiment of a substrate processing chamber of the present utility model operating in a housed state to reduce dust contamination.
FIG. 3 is a perspective view of one embodiment of a shutter mechanism of a substrate processing chamber that reduces dust contamination in accordance with the present utility model.
FIG. 4 is a top perspective view of one embodiment of a substrate processing chamber of the present utility model operating in a stowed condition to reduce dust contamination.
FIG. 5 is a top perspective view of one embodiment of a substrate processing chamber of the present utility model operating in a shielded state to reduce dust contamination.
FIG. 6 is a schematic side cross-sectional view of a further embodiment of the substrate processing chamber of the present utility model operating in a shielded state to reduce dust contamination.
Reference numerals illustrate:
10-a substrate processing chamber that reduces dust contamination; 11-reaction chamber; 111-stop; 112-opening; 12-accommodating space; 121-reaction space; 123-cleaning the space; 13-a carrier tray; 14-a storage space; 15-a receiving cavity; 151-a position sensing unit; 161-target; 163-substrate; 17-shielding mechanism; 171-a guiding unit; 172-bias power supply; 173-a connection base; 174-an air extraction unit; 1741-a filtration unit; 175-a shielding plate; 177-drive arm; 1771-first drive arm; 1773-a second drive arm; 178-bushings; 1781-isolated space; 179 drive unit
Detailed Description
Referring to fig. 1 and 2, schematic side cross-sectional views of an embodiment of a substrate processing chamber of the present utility model capable of reducing dust contamination operating in a shielded state and a housed state, respectively. As shown in the figure, the substrate processing chamber 10 capable of reducing dust pollution mainly comprises a reaction chamber 11, a carrying tray 13, a receiving chamber 15 and a shielding mechanism 17, wherein the reaction chamber 11 is connected with the receiving chamber 15, and the carrying tray 13 is disposed in the reaction chamber 11.
The reaction chamber 11 has a receiving space 12 for receiving a carrier plate 13. The accommodating cavity 15 is connected with the reaction cavity 11 and has an accommodating space 14, wherein the accommodating space 14 is fluidly connected with the accommodating space 12 and is used for accommodating the shielding plate 175 of the shielding mechanism 17.
The carrying tray 13 is disposed in the accommodating space 12 of the reaction chamber 11 and is used for carrying at least one substrate 163. Taking the substrate processing chamber 10 capable of reducing dust pollution as an example of a physical vapor deposition chamber, a target 161 is disposed in the reaction chamber 11, wherein the target 161 faces the substrate 163 and the carrier plate 13.
Referring to fig. 3, the shielding mechanism 17 includes at least one guiding unit 171, at least one connecting seat 173, a shielding plate 175, a driving arm 177, a bushing 178 and a bias power source 172, wherein the connecting seat 173 connects the shielding plate 175 and the guiding unit 171, and the driving arm 177 connects the shielding plate 175 or the connecting seat 173 and drives the shielding plate 175 and the connecting seat 173 to displace relative to the guiding unit 171, for example, drives the shielding plate 175 to displace along the guiding unit 171 and the connecting seat 173 between the accommodating space 14 and the accommodating space 12.
In an embodiment of the present utility model, the guiding unit 171 may be a rod, wherein the guiding unit 171 extends from the accommodating space 14 of the accommodating cavity 15 to the accommodating space 12 of the reaction cavity 11, for example, one wall surface of the accommodating cavity 15 faces one wall surface of the reaction cavity 11, and the guiding unit 171 extends from the wall surface of the accommodating cavity 15 to the facing wall surface of the reaction cavity 11.
The connection seat 173 is disposed on the guiding unit 171 and is displaceable along the guiding unit 171. For example, the connection seat 173 may include at least one through hole, wherein the guiding unit 171 passes through the through hole of the connection seat 173, such that the displacement directions of the connection seat 173 and the shielding plate 175 are parallel to the guiding unit 171. In various embodiments, the guiding unit 171 may be a sliding rail, and the connecting seat 173 is a sliding seat connected to the guiding unit 171. The guiding unit 171 is a rod or a rail, which is only an embodiment of the present utility model, and is not intended to limit the scope of the present utility model.
In practical applications, the driving arm 177 may be connected to a driving unit 179, and the driving arm 177 is driven by the driving unit 179 to drive the shielding plate 175 to move along the guiding unit 171 in the accommodating space 14 and the accommodating space 12, for example, the driving unit 179 may be a motor or a stepping motor, and may be connected to the accommodating cavity 15 through a magnetic fluid shaft seal.
In an embodiment of the utility model, the driving arm 177 may include a first driving arm 1771 and a second driving arm 1773, for example, the driving arm 177 may be a folding mechanical arm, wherein one end of the first driving arm 1771 is connected to the driving unit 179, and the other end is connected to one end of the second driving arm 1773 through an articulated shaft or a rotating shaft. The other end of the second driving arm 1773 is connected to the shielding plate 175 or the connecting seat 173, and the driving unit 179 drives the first driving arm 1771 and the second driving arm 1773 to drive the shielding plate 175 to displace.
The driving arm 177 is a folding mechanical arm, and the first driving arm 1771 and the second driving arm 1773 are only an embodiment of the utility model, and are not limiting to the scope of the utility model. In another embodiment of the present utility model, the driving arm 177 may be a telescopic mechanical arm or a scissor mechanical arm, and may also drive the shielding plate 175 to move along the guiding unit 171 between the accommodating space 14 and the accommodating space 12.
The substrate processing chamber 10 of the present utility model, which is capable of reducing dust contamination, is operable in two states, a stowed state and a blocking state, respectively. The driving arm 177 may drive the connection base 173 and the shielding plate 175 to move along the guiding unit 171 to the accommodating space 14 of the accommodating cavity 15, so that the substrate processing chamber 10 capable of reducing dust pollution is operated in an accommodating state, as shown in fig. 2 and 4, wherein the shielding plate 175 is not present between the target 161 and the substrate 163 and the carrier plate 13.
The carrier plate 13 and the substrate 163 may then be driven to approach the target 161, and the gas, such as inert gas, passing through the accommodating space 12 impinges on the target 161 to deposit a thin film on the surface of the substrate 163.
In an embodiment of the present utility model, the accommodating space 12 of the reaction chamber 11 may be provided with a baffle member 111, wherein one end of the baffle member 111 is connected to the reaction chamber 11, and the other end of the baffle member 111 forms an opening 112. When the carrier plate 13 approaches the target 161, the reaction chamber 11, the carrier plate 13 and the baffle 111 enter or contact the opening 112 formed by the baffle 111, wherein the reaction chamber 11, the carrier plate 13 and the baffle 111 partition a reaction space 121 in the accommodating space 12, so as to prevent deposition films from being formed on the surfaces of the reaction chamber 11 and the carrier plate 13 outside the reaction space 121.
In addition, the driving arm 177 may drive the connection seat 173 and the shielding plate 175 to move along the guiding unit 171 to the accommodating space 12 of the reaction chamber 11, so that the substrate processing chamber 10 capable of reducing dust pollution is operated in a shielding state, as shown in fig. 1 and 5. The shielding plate 175 is located between the target 161 and the substrate 163 and the carrier plate 13, and is used to isolate the target 161 and the substrate 163 from the carrier plate 13.
The shielding plate 175 may divide a cleaning space 123 within the accommodating space 12, wherein the cleaning space 123 partially overlaps or approximates to the region of the reaction space 121. The cleaning space 123 is used for performing a burn-in process to clean the target 161 and the reaction chamber 11 and/or the baffle 111 in the cleaning space 123 and remove oxide, nitride or other contaminants on the surface of the target 161 and deposited films on the surface of the reaction chamber 11 and/or the baffle 111.
During cleaning of the substrate processing chamber 10 that reduces dust contamination, the carrier plate 13 and/or the substrate 163 may be shielded or isolated by the shielding plate 175 to prevent contamination or deposition of materials on the surfaces of the carrier plate 13 and/or the substrate 163 during cleaning.
The shielding plate 175 of the present utility model is generally plate-shaped, such as a circular plate, but not limited thereto, wherein the area of the shielding plate 175 is larger than the area of the opening 112 and/or the carrier disk 13 formed by the barrier 111.
In an embodiment of the utility model, the number of the guiding units 171 and the connecting seats 173 of the shielding mechanism 17 may be one, wherein the guiding units 171 are connected to the side portions of the shielding plate 175 through the connecting seats 173. The guiding unit 171 does not overlap or interfere with the opening 112 of the stopper 111, the substrate 163 and/or the carrier 13, so as to avoid affecting the lifting of the carrier 13 and the deposition process.
In another embodiment of the present utility model, as shown in fig. 3 to 5, the number of the guiding units 171 and the connecting seats 173 may be two, wherein the two guiding units 171 are respectively connected to two sides of the shielding plate 175 through the connecting seats 173. Furthermore, the two guiding units 171 do not overlap or interfere with the opening 112 of the stopper 111, the substrate 163 and/or the carrier plate 13, wherein the vertical distance between the two guiding units 171 is larger than the maximum length, e.g. diameter, of the opening 112 of the stopper 111, the substrate 163 and/or the carrier plate 13. The guide unit 171 does not affect the lifting of the carrier plate 13 and the progress of the deposition process.
Specifically, when the number of the guide units 171 and the connection seats 173 is two or more, the shielding plate 175 can be more stably supported and driven to displace. Furthermore, the use of two guide units 171 and a connector 173 will facilitate the loading of thicker or heavier shielding plates 175. The thicker shield 175 prevents high temperature deformation during cleaning of the substrate processing chamber 10 that reduces dust contamination and prevents plasma during cleaning from contacting the underlying carrier plate 13 or substrate 163 through the deformed shield 175.
The bushing 178 of the shielding mechanism 17 is located in the accommodating space 12 and the accommodating space 14, and is used for covering the guiding unit 171 and the connecting seat 173. Specifically, the liner 178 may be elongated and extend from a wall surface of the receiving chamber 15 to a wall surface facing the reaction chamber 11.
The bushing 178 has an isolation space 1781, wherein the guiding unit 171 and the connecting seat 173 are located in the isolation space 1781. Through the arrangement of the bushing 178, particles generated during the displacement of the connecting seat 173 along the guiding unit 171 can be prevented from falling into the accommodating space 12 and/or the accommodating space 14, so as to maintain the cleanliness of the accommodating space 12 of the reaction chamber 11. For example, the cross-section of the bushing 178 resembles a U, and the top of the bushing 178 is provided with an elongated space such that the connector 173 is displaced along the space.
In the embodiment of the present utility model, as shown in fig. 1 to 5, the bushing 178 is made of a conductive material, wherein the bushing 178 is electrically connected to the bias power source 172, and a bias voltage is formed on the bushing 178 by the bias power source 172, for example, the bias power source 172 may be a dc bias voltage or an ac bias voltage. Specifically, when the connection seat 173 is displaced along the guide unit 171, charged particles may be generated due to friction. The present utility model can prevent particles in the isolation space 1781 of the liner 178 from diffusing into the accommodating space 12 of the reaction chamber 11 by adsorbing charged particles by the bias formed on the liner 178.
In another embodiment of the present utility model, as shown in fig. 6, the isolation space 1781 of the liner 178 is fluidly connected to at least one pumping unit 174, and the gas in the isolation space 1781 of the liner 178 is pumped out by the pumping unit 174, so that the air pressure in the isolation space 1781 of the liner 178 is smaller than the accommodating space 12 of the reaction chamber 11, so as to avoid the scattered particles from being diffused from the isolation space 1781 of the liner 178 to the accommodating space 12 of the reaction chamber 11. In addition, the air pumping unit 174 may also pump out particles in the isolation space 1781, wherein a filtering unit 1741 may be disposed between the air pumping unit 174 and the isolation space 1781, the air pumping unit 174 pumps out gas and/or particles in the isolation space 1781 through the filtering unit 1741, and the filtering unit 1741 gathers and filters the particles pumped out from the isolation space 1781.
In an embodiment of the present utility model, at least one position sensing unit 151 may be further disposed on the accommodating cavity 15, wherein the position sensing unit 151 faces the accommodating space 14 and is used for sensing whether the shielding plate 175 enters the accommodating space 14. The position sensing unit 151 may be a light sensing unit, for example.
If the shielding plate 175 does not leave the receiving space 12 of the reaction chamber 11, the carrier plate 13 is displaced toward the target 161, which may cause the carrier plate 13 to collide with the shielding plate 175, resulting in damage to the carrier plate 13 and/or the shielding plate 175. In practical applications, it may be set that the carrier plate 13 can only approach the target 161 after the position sensing unit 151 senses that the shielding plate 175 completely enters the accommodating cavity 15, so as to avoid collision between the carrier plate 13 and the shielding plate 175.
In another embodiment of the present utility model, the position sensing unit 151 may also be disposed on the reaction chamber 11 and face the accommodating space 12 of the reaction chamber 11, wherein the position sensing unit 151 is configured to sense whether the shielding plate 175 is still in the accommodating space 12. Specifically, the position sensing unit 151 may be configured to sense the position of the shielding plate 175, for example, to confirm that the shielding plate 175 is completely inserted into the receiving chamber 15 and/or that the shielding plate 175 is not present in the reaction chamber 11, and the position or type of the position sensing unit 151 is not limited to the scope of the present utility model.
The utility model has the advantages that:
the novel shielding mechanism and the substrate processing chamber with the shielding mechanism are provided, and the shielding part is driven to move between a storage position and a shielding position along the driving rod body mainly through the driving rod body, so that particles generated during cleaning of a cavity or a target material can be prevented from polluting the bearing plate.
The foregoing description is only a preferred embodiment of the present utility model and is not intended to limit the scope of the utility model, i.e., all equivalent variations and modifications in shape, construction, characteristics and spirit as defined in the claims should be embraced by the claims.
Claims (3)
1. A substrate processing chamber capable of reducing dust contamination, comprising:
a reaction cavity, which comprises a containing space;
one end of the baffle piece is connected with the reaction cavity, and the other end of the baffle piece forms an opening;
the bearing plate is positioned in the accommodating space and is used for bearing at least one substrate;
the accommodating cavity is connected with the reaction cavity and comprises an accommodating space which is in fluid connection with the accommodating space; a kind of electronic device with high-pressure air-conditioning system
A shielding mechanism comprising:
at least one guiding unit extending from the accommodating space to the accommodating space;
at least one connecting seat connected with the guiding unit;
a shielding plate connected with the connecting seat;
at least one driving arm connected to the shielding plate or the connecting seat and used for driving the shielding plate and the connecting seat to displace between the accommodating space and the accommodating space along the guiding unit, wherein the displacement direction of the shielding plate is parallel to the guiding unit;
at least one bushing made of a conductive material and having an isolation space, wherein the guide unit and the connecting seat are located in the isolation space; a kind of electronic device with high-pressure air-conditioning system
And a bias power supply electrically connected to the bushing and configured to form a bias voltage on the bushing.
2. The substrate processing chamber of claim 1, comprising a drive unit, wherein the drive arm comprises at least a first drive arm and at least a second drive arm, wherein the drive unit is coupled to the second drive arm via the first drive arm and drives the shutter plate to move between the receiving space and the receiving space via the first drive arm and the second drive arm.
3. The substrate processing chamber of claim 1, comprising at least one position sensing unit disposed in the receiving chamber or the reaction chamber and configured to sense a position of the shielding plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121052414.0U CN218969345U (en) | 2021-05-17 | 2021-05-17 | Substrate processing chamber capable of reducing dust pollution |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121052414.0U CN218969345U (en) | 2021-05-17 | 2021-05-17 | Substrate processing chamber capable of reducing dust pollution |
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| Publication Number | Publication Date |
|---|---|
| CN218969345U true CN218969345U (en) | 2023-05-05 |
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| CN202121052414.0U Active CN218969345U (en) | 2021-05-17 | 2021-05-17 | Substrate processing chamber capable of reducing dust pollution |
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