TWI782532B - Shielding device and substrate processing chamber with shielding device - Google Patents

Shielding device and substrate processing chamber with shielding device Download PDF

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TWI782532B
TWI782532B TW110117769A TW110117769A TWI782532B TW I782532 B TWI782532 B TW I782532B TW 110117769 A TW110117769 A TW 110117769A TW 110117769 A TW110117769 A TW 110117769A TW I782532 B TWI782532 B TW I782532B
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driving arm
shielding plate
connecting seat
space
plate
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TW110117769A
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Chinese (zh)
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TW202246573A (en
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林俊成
沈祐德
郭大豪
鄭啓鴻
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天虹科技股份有限公司
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Abstract

The present invention provides a substrate processing chamber with a shielding device, which includes a reaction cavity, a substrate holder, a storing cavity and a shielding device, wherein the reaction cavity is connected to the storing cavity, and the substrate holder is located in the reaction cavity. The shielding device includes at least one guiding unit, at least one connecting seat, a shielding plate, and at least one driving arm that is connected to and drives the shielding plate to move between the storing cavity and the reaction cavity, wherein the shielding plate displaces along the guiding unit. During the deposition process, the driving arm will drive the shielding plate to move into the storing cavity. During the cleaning process, the driving arm will drive the shielding plate to move into the reaction cavity to avoid contamination of the substrate holder during the cleaning processing.

Description

遮擋構件及具有遮擋構件的基板處理腔室 Shielding member and substrate processing chamber with shielding member

本發明有關於一種遮擋構件及具有遮擋構件的基板處理腔室,主要透過遮擋構件隔離反應腔室的反應空間及承載盤,以避免在清潔處理腔室的過程中汙染承載盤。 The invention relates to a shielding member and a substrate processing chamber with the shielding member. The shielding member is used to isolate the reaction space of the reaction chamber and the carrier plate to avoid contamination of the carrier plate during the process of cleaning the processing chamber.

化學氣相沉積(CVD)、物理氣相沉積(PVD)及原子層沉積(ALD)皆是常用的薄膜沉積設備,並普遍被使用在積體電路、發光二極體及顯示器等製程中。 Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD) and Atomic Layer Deposition (ALD) are commonly used thin film deposition equipment, and are widely used in the manufacturing processes of integrated circuits, light-emitting diodes and displays.

沉積設備主要包括一腔體及一晶圓承載盤,其中晶圓承載盤位於腔體內,並用以承載至少一晶圓。以物理氣相沉積為例,腔體內需要設置一靶材,其中靶材面對晶圓承載盤上的晶圓。在進行物理氣相沉積時,可將惰性氣體及/或反應氣體輸送至腔體內,分別對靶材及晶圓承載盤施加偏壓,並透過晶圓承載盤加熱承載的晶圓。 The deposition equipment mainly includes a cavity and a wafer carrier, wherein the wafer carrier is located in the cavity and is used to carry at least one wafer. Taking physical vapor deposition as an example, a target needs to be set in the chamber, wherein the target faces the wafer on the wafer carrier. During physical vapor deposition, the inert gas and/or reaction gas can be delivered into the chamber to apply bias voltage to the target material and the wafer carrier plate respectively, and heat the wafer carried by the wafer carrier plate.

腔體內的惰性氣體因為高壓電場的作用,形成離子化的惰性氣體,離子化的惰性氣體會受到靶材上的偏壓吸引而轟擊靶材。從靶材濺出的靶材原子或分子受到晶圓承載盤上的偏壓吸引,並沉積在加熱的晶圓的表面,以在晶圓的表面形成薄膜。 The inert gas in the cavity forms ionized inert gas due to the action of high-voltage electric field, and the ionized inert gas will be attracted by the bias voltage on the target and bombard the target. Target atoms or molecules sputtered from the target are attracted by the bias voltage on the wafer carrier plate and deposited on the surface of the heated wafer to form a thin film on the surface of the wafer.

在經過一段時間的使用後,腔體的內表面會形成沉積薄膜,因此需要週期性的清潔腔體,以避免沉積薄膜在製程中掉落,進而汙染晶圓。此外靶材的表面亦可能形成氧化物或其他汙染物,因此同樣需要週期性的清潔靶材。一般而言,通常會透過預燒(burn-in)製程,以電漿離子撞擊腔體內的靶材,以去除靶材表面的氧化物或其他汙染物。 After a period of use, a deposited film will be formed on the inner surface of the chamber, so the chamber needs to be cleaned periodically to prevent the deposited film from falling during the process and contaminating the wafer. In addition, oxides or other pollutants may also be formed on the surface of the target, so the target needs to be cleaned periodically. Generally speaking, a burn-in process is usually used to impinge the target in the cavity with plasma ions to remove oxides or other pollutants on the surface of the target.

在進行上述清潔腔體及靶材時,需要將腔體內的晶圓承載盤及晶圓取出,或者隔離晶圓承載盤,以避免清潔過程中汙染晶圓承載盤及晶圓。 When cleaning the cavity and the target, it is necessary to take out the wafer carrier and the wafer in the cavity, or isolate the wafer carrier to avoid contamination of the wafer carrier and the wafer during the cleaning process.

一般而言,基板處理腔室在經過一段時間的使用後,通常需要進行清潔,以去除腔室內沉積的薄膜及靶材上的氧化物或氮化物。在清潔的過程中產生的微粒會汙染承載盤,因此需要隔離承載盤及汙染物。本發明提出一種遮擋構件及具有遮擋構件的基板處理腔室,主要透過驅動臂帶動遮擋板沿著導引單元在一收納位置及一遮擋位置之間位移,可避免清潔腔體或靶材時產生的微粒汙染承載盤。 Generally speaking, after a period of use, the substrate processing chamber usually needs to be cleaned to remove the film deposited in the chamber and the oxide or nitride on the target. Particles generated during the cleaning process will contaminate the susceptor, so it is necessary to isolate the susceptor from the contaminants. The present invention proposes a shielding member and a substrate processing chamber with the shielding member. The shielding plate is mainly driven by the driving arm to move along the guide unit between a storage position and a shielding position, which can avoid the occurrence of cleaning the cavity or the target. Particles contaminate the carrier tray.

本發明的一目的,在於提供一種具有遮擋構件的基板處理腔室,主要包括一反應腔體、一承載盤、一收納腔體及一遮擋構件,其中收納腔體連接反應腔體。遮擋構件包括一導引單元、一連接座、一遮擋板及一驅動臂,其中驅動臂連接並帶動遮擋板或連接座沿著導引單元在收納腔體及反應腔體之間位移。 An object of the present invention is to provide a substrate processing chamber with a shielding member, which mainly includes a reaction chamber, a carrier plate, a storage chamber and a shielding member, wherein the storage chamber is connected to the reaction chamber. The shielding member includes a guide unit, a connecting seat, a shielding plate and a driving arm, wherein the driving arm is connected to drive the shielding plate or the connecting seat to move along the guiding unit between the storage chamber and the reaction chamber.

在清潔反應腔體時,驅動臂會帶動遮擋板位移至反應腔體內,並遮擋容置空間內的承載盤,以避免清潔過程中使用的電漿或產生的污染接 觸承載盤及/或其承載的基板。在進行沉積製程時,驅動臂會帶動遮擋板位移至收納腔體內,並對反應腔體內的基板進行薄膜沉積。 When cleaning the reaction chamber, the driving arm will drive the shielding plate to move into the reaction chamber, and shield the carrier plate in the accommodating space, so as to avoid the plasma used in the cleaning process or the pollution produced. Contact the carrier and/or the substrate it carries. During the deposition process, the driving arm will drive the shielding plate to move into the storage chamber, and deposit the thin film on the substrate in the reaction chamber.

本發明的一目的,在於提供一種具有遮擋構件的基板處理腔室,其中導引單元的數量為兩個,並分別連接遮擋板的兩側。透過兩個導引單元的使用,可更穩定的承載及驅動遮擋板,並可使用厚度較厚及重量較重的遮擋板。使用較厚重的遮擋板,可避免在清潔腔體的過程中因為高溫造成遮擋板變形,並可防止清潔過程中使用的電漿或產生的污染經由變形的遮擋板接觸承載盤或基板。 An object of the present invention is to provide a substrate processing chamber with a shielding member, wherein the number of guide units is two, and are respectively connected to two sides of the shielding plate. Through the use of two guide units, the shielding plate can be carried and driven more stably, and a thicker and heavier shielding plate can be used. Using a thicker baffle plate can avoid the deformation of the baffle plate due to high temperature during the cleaning process, and prevent the plasma used in the cleaning process or the pollution generated from contacting the carrier plate or the substrate through the deformed baffle plate.

此外可進一步透過兩個襯套分別包覆兩個導引單元,以防止驅動臂驅動遮擋板位移時產生的微粒擴散到反應腔體的容置空間。兩個導引單元及兩個襯套之間的間距大於承載盤及基板的直徑,以避免干擾承載盤的位移及影響沉積製程的進行。 In addition, the two guide units can be further covered by two bushings, so as to prevent particles generated when the driving arm drives the shutter plate to displace from diffusing into the accommodating space of the reaction chamber. The distance between the two guiding units and the two bushings is greater than the diameters of the carrier disc and the substrate, so as to avoid disturbing the displacement of the carrier disc and affecting the progress of the deposition process.

在本發明一實施例中,驅動臂可以是折疊式機械手臂,並包括一第一驅動臂及一第二驅動臂,其中第一驅動臂透過一關節軸連接第二驅動臂,並可透過第一驅動臂及第二驅動臂驅動遮擋板沿著導引單元在反應腔體及收納腔體之間位移。在不同實施例中,驅動臂亦可為伸縮式機械手臂或者是剪刀式機械手臂,同樣可以達到驅動遮擋板位移的目的。 In one embodiment of the present invention, the driving arm may be a folding mechanical arm, and includes a first driving arm and a second driving arm, wherein the first driving arm is connected to the second driving arm through a joint shaft, and can be connected through the second driving arm. The first driving arm and the second driving arm drive the shielding plate to move along the guiding unit between the reaction cavity and the storage cavity. In different embodiments, the driving arm can also be a telescopic mechanical arm or a scissor-type mechanical arm, which can also achieve the purpose of driving the displacement of the shielding plate.

為了達到上述的目的,本發明提出一種基板處理腔室,包括:一反應腔體,包括一容置空間;一承載盤,位於容置空間內,並用以承載至少一基板;一收納腔體,連接反應腔體,其中收納腔體包括一收納空間,流體連接容置空間;及一遮擋構件,包括:至少一導引單元,由收納空間延伸容置空間;至少一連接座,連接導引單元;一遮擋板,連接連接座; 及至少一驅動臂,連接遮擋板或連接座,並用以驅動遮擋板及連接座沿著導引單元在收納空間及容置空間之間位移,其中遮擋板的位移方向與導引單元平行。 In order to achieve the above object, the present invention proposes a substrate processing chamber, comprising: a reaction chamber including an accommodating space; a carrier plate located in the accommodating space and used to carry at least one substrate; a receiving chamber, Connect the reaction cavity, wherein the storage cavity includes a storage space, which is fluidly connected to the storage space; and a shielding member, including: at least one guide unit, extending the storage space from the storage space; at least one connecting seat, connected to the guide unit ; a baffle plate, connected to the connecting seat; and at least one driving arm, connected to the shielding plate or the connecting seat, and used to drive the shielding plate and the connecting seat to move along the guide unit between the storage space and the accommodating space, wherein the displacement direction of the shielding plate is parallel to the guide unit.

本發明提出一種遮擋構件,適用於一基板處理腔室,包括:至少一導引單元;至少一連接座,連接導引單元;一遮擋板,連接連接座;及至少一驅動臂,連接遮擋板或連接座,並用以帶動遮擋板沿著導引單元位移,其中遮擋板的位移方向與導引單元平行。 The present invention proposes a shielding component suitable for a substrate processing chamber, comprising: at least one guiding unit; at least one connecting seat connected to the guiding unit; a shielding plate connected to the connecting seat; and at least one driving arm connected to the shielding plate or a connecting seat, and used to drive the shielding plate to move along the guide unit, wherein the displacement direction of the shielding plate is parallel to the guide unit.

所述的基板處理腔室及遮擋構件,其中驅動臂包括至少一第一驅動臂及至少一第二驅動臂,第一驅動臂透過第二驅動臂連接遮擋板。 In the substrate processing chamber and the shielding member, the driving arm includes at least one first driving arm and at least one second driving arm, and the first driving arm is connected to the shielding plate through the second driving arm.

所述的基板處理腔室及遮擋構件,包括一驅動單元連接第一驅動臂,並經由第一驅動臂及第二驅動臂驅動遮擋板在收納空間及容置空間位移。 The substrate processing chamber and the shielding member include a drive unit connected to the first driving arm, and drives the shielding plate to move in the accommodation space and the accommodation space through the first driving arm and the second driving arm.

所述的基板處理腔室,包括至少一位置感測單元設置於收納腔體或反應腔體,並用以感測遮擋板的位置。 The substrate processing chamber includes at least one position sensing unit disposed in the storage chamber or the reaction chamber, and used to sense the position of the shielding plate.

所述的基板處理腔室,包括一靶材設置在容置空間內並面對承載盤,位移至容置空間的遮擋板位於靶材及承載盤之間。 The substrate processing chamber includes a target disposed in the accommodating space and facing the carrying tray, and a shielding plate displaced to the accommodating space is located between the target and the carrying tray.

所述的基板處理腔室及遮擋構件,包括至少一襯套位於容置空間及收納空間內,襯套包括一隔離空間,而導引單元及連接座位於襯套的隔離空間內。 The substrate processing chamber and the shielding member include at least one bushing located in the accommodating space and the receiving space, the bushing includes an isolation space, and the guide unit and the connecting seat are located in the isolation space of the bushing.

10:基板處理腔室 10: Substrate processing chamber

11:反應腔體 11: Reaction chamber

111:擋件 111: block

112:開口 112: opening

12:容置空間 12:Accommodating space

121:反應空間 121: Reaction space

123:清潔空間 123:Clean space

13:承載盤 13: carrying plate

14:收納空間 14: storage space

15:收納腔體 15: Storage cavity

151:位置感測單元 151: Position sensing unit

161:靶材 161: target

163:基板 163: Substrate

17:遮擋構件 17: Blocking components

171:導引單元 171: Guide unit

173:連接座 173: Connection seat

175:遮擋板 175: baffle plate

177:驅動臂 177: drive arm

1771:第一驅動臂 1771: First drive arm

1773:第二驅動臂 1773: Second drive arm

178:襯套 178: Bushing

1781:隔離空間 1781: Isolation Space

179:驅動單元 179: drive unit

[圖1]為本發明基板處理腔室操作在遮擋狀態一實施例的側面剖面示意圖。 [ FIG. 1 ] is a schematic side sectional view of an embodiment of the substrate processing chamber of the present invention operating in a shielded state.

[圖2]為本發明基板處理腔室操作在收納狀態一實施例的側面剖面示意圖。 [ FIG. 2 ] is a schematic side sectional view of an embodiment of the substrate processing chamber of the present invention operating in a storage state.

[圖3]為本發明基板處理腔室的遮擋構件一實施例的立體剖面示意圖。 [ FIG. 3 ] is a perspective cross-sectional schematic view of an embodiment of the shielding member of the substrate processing chamber of the present invention.

[圖4]為本發明基板處理腔室操作在收納狀態一實施例的頂部透視圖。 [ FIG. 4 ] is a top perspective view of an embodiment of the substrate processing chamber of the present invention operating in a storage state.

[圖5]為本發明基板處理腔室操作在遮擋狀態一實施例的頂部透視圖。 [ FIG. 5 ] is a top perspective view of an embodiment of the substrate processing chamber of the present invention operating in a shielded state.

請參閱圖1及圖2,分別為本發明基板處理腔室操作在遮擋狀態及收納狀態一實施例的側面剖面示意圖。如圖所示,基板處理腔室10主要包括一反應腔體11、一承載盤13、一收納腔體15及一遮擋構件17,其中反應腔體11連接收納腔體15,而承載盤13則設置在反應腔體11內。 Please refer to FIG. 1 and FIG. 2 , which are schematic side cross-sectional views of an embodiment of a substrate processing chamber of the present invention operating in a shielding state and a storage state, respectively. As shown in the figure, the substrate processing chamber 10 mainly includes a reaction chamber 11, a carrier plate 13, a storage cavity 15 and a shielding member 17, wherein the reaction chamber 11 is connected to the storage cavity 15, and the carrier plate 13 is Set in the reaction chamber 11.

反應腔體11內具有一容置空間12,用以容置承載盤13。收納腔體15連接反應腔體11,並具有一收納空間14,其中收納空間14流體連接容置空間12,並用以收納遮擋構件17的遮擋板175。 The reaction chamber 11 has an accommodating space 12 for accommodating a carrier plate 13 . The storage chamber 15 is connected to the reaction chamber 11 and has a storage space 14 , wherein the storage space 14 is fluidly connected to the storage space 12 and is used for accommodating the shielding plate 175 of the shielding member 17 .

承載盤13位於反應腔體11的容置空間12內,並用以承載至少一基板163。以基板處理腔室10為物理氣相沉積腔體為例,反應腔體11內設置一靶材161,其中靶材161面對基板163及承載盤13。 The carrier plate 13 is located in the accommodating space 12 of the reaction chamber 11 and is used for carrying at least one substrate 163 . Taking the substrate processing chamber 10 as a physical vapor deposition chamber as an example, a target 161 is disposed in the reaction chamber 11 , wherein the target 161 faces the substrate 163 and the carrier plate 13 .

請配合參閱圖3,遮擋構件17包括至少一導引單元171、至少一連接座173、一遮擋板175及一驅動臂177,其中連接座173連接遮擋板175及導引單元171,而驅動臂177則連接遮擋板175或連接座173,並用以驅動遮擋板175及連接座173相對於導引單元171位移,例如驅動遮擋板175沿著導引單元171及連接座173在收納空間14及容置空間12之間位移。 Please refer to FIG. 3, the blocking member 17 includes at least one guiding unit 171, at least one connecting seat 173, a blocking plate 175 and a driving arm 177, wherein the connecting seat 173 connects the blocking plate 175 and the guiding unit 171, and the driving arm 177 is connected to the shielding plate 175 or the connecting seat 173, and is used to drive the shielding plate 175 and the connecting seat 173 to move relative to the guide unit 171. Set the displacement between the spaces 12.

在本發明一實施例中,導引單元171可為一桿體,其中導引單元171由收納腔體15的收納空間14延伸至反應腔體11的容置空間12,例如收納腔體15的一個牆面面對反應腔體11的一個牆面,而導引單元171由收納腔體15的牆面延伸至反應腔體11相面對的牆面。 In one embodiment of the present invention, the guide unit 171 can be a rod body, wherein the guide unit 171 extends from the storage space 14 of the storage cavity 15 to the storage space 12 of the reaction cavity 11, for example, the storage cavity 15 One wall faces a wall of the reaction chamber 11 , and the guiding unit 171 extends from the wall of the storage chamber 15 to the opposite wall of the reaction chamber 11 .

連接座173設置於導引單元171上,並可沿著導引單元171位移。例如連接座173可包括至少一穿孔,其中導引單元171穿過連接座173的穿孔,使得連接座173及遮擋板175的位移方向平行導引單元171。在不同實施例中,導引單元171可為滑軌,而連接座173則是連接導引單元171的滑座。導引單元171為桿體或滑軌僅為本發明一實施例,並非本發明權利範圍的限制。 The connecting seat 173 is disposed on the guiding unit 171 and can be displaced along the guiding unit 171 . For example, the connecting base 173 may include at least one through hole, wherein the guiding unit 171 passes through the through hole of the connecting base 173 , so that the displacement directions of the connecting base 173 and the shielding plate 175 are parallel to the guiding unit 171 . In different embodiments, the guiding unit 171 can be a sliding rail, and the connecting seat 173 is a sliding seat connected to the guiding unit 171 . The fact that the guide unit 171 is a rod or a sliding rail is only an embodiment of the present invention, and is not a limitation of the scope of the present invention.

在實際應用時,驅動臂177可連接一驅動單元179,並透過驅動單元179帶動導驅動臂177驅動遮擋板175沿著導引單元171在收納空間14及容置空間12位移,例如驅動單元179可為馬達或步進馬達,並可經由一磁流體軸封連接收納腔體15。 In actual application, the driving arm 177 can be connected to a driving unit 179, and the driving arm 177 is driven by the driving unit 179 to drive the shielding plate 175 to move along the guiding unit 171 in the storage space 14 and the storage space 12, such as the driving unit 179 It can be a motor or a stepping motor, and can be connected to the storage cavity 15 through a magnetic fluid shaft seal.

在本發明一實施例中,驅動臂177可包括一第一驅動臂1771及一第二驅動臂1773,例如驅動臂177可為一折疊式機械手臂,其中第一驅動臂1771的一端連接驅動單元179,而另一端則透過關節軸或轉軸連接第二驅動 臂1773的一端。第二驅動臂1773的另一端則連接遮擋板175或連接座173,並透過驅動單元179驅動第一驅動臂1771及第二驅動臂1773帶動遮擋板175位移。 In one embodiment of the present invention, the driving arm 177 may include a first driving arm 1771 and a second driving arm 1773, for example, the driving arm 177 may be a folding mechanical arm, wherein one end of the first driving arm 1771 is connected to the driving unit 179, and the other end is connected to the second drive through the joint shaft or the rotating shaft One end of the arm 1773. The other end of the second driving arm 1773 is connected to the shielding plate 175 or the connecting seat 173 , and drives the first driving arm 1771 and the second driving arm 1773 through the driving unit 179 to drive the shielding plate 175 to move.

驅動臂177為折疊式機械手臂,並包括第一驅動臂1771及第二驅動臂1773僅為本發明一實施例,而非本發明權利範圍的限制。在本發明另一實施例中,驅動臂177亦可以是伸縮式機械手臂或剪刀式機械手臂,同樣可以驅動遮擋板175沿著導引單元171在收納空間14及容置空間12之間位移。 The driving arm 177 is a folding robot arm, and including the first driving arm 1771 and the second driving arm 1773 is only an embodiment of the present invention, rather than limiting the scope of the present invention. In another embodiment of the present invention, the driving arm 177 can also be a telescopic robot arm or a scissor-type robot arm, which can also drive the shielding plate 175 to move along the guide unit 171 between the storage space 14 and the storage space 12 .

本發明的基板處理腔室10可操作在兩種狀態,分別是收納狀態及遮擋狀態。驅動臂177可驅動連接座173及遮擋板175沿著導引單元171移動至收納腔體15的收納空間14,使得基板處理腔室10操作在收納狀態,如圖2及圖4所示,其中靶材161與基板163及承載盤13之間不存在遮擋板175。 The substrate processing chamber 10 of the present invention can be operated in two states, which are a storage state and a shielding state. The driving arm 177 can drive the connecting seat 173 and the shielding plate 175 to move along the guide unit 171 to the storage space 14 of the storage cavity 15, so that the substrate processing chamber 10 operates in a storage state, as shown in FIGS. 2 and 4 , wherein There is no shielding plate 175 between the target 161 , the substrate 163 and the carrier plate 13 .

而後可驅動承載盤13及基板163朝靶材161的方向靠近,並透過容置空間12的氣體,例如惰性氣體,撞擊靶材161,以在基板163的表面沉積薄膜。 Then, the carrier plate 13 and the substrate 163 can be driven towards the target 161 , and the gas passing through the accommodating space 12 , such as an inert gas, hits the target 161 to deposit a thin film on the surface of the substrate 163 .

在本發明一實施例中,反應腔體11的容置空間12可設置一擋件111,其中擋件111的一端連接反應腔體11,而擋件111的另一端則形成一開口112。承載盤13朝靶材161靠近時,會進入或接觸擋件111形成的開口112,其中反應腔體11、承載盤13及擋件111會在容置空間12內區隔出一反應空間121,防止在反應空間121外的反應腔體11及承載盤13的表面形成沉積薄膜。 In an embodiment of the present invention, a blocking member 111 may be provided in the accommodating space 12 of the reaction chamber 11 , wherein one end of the blocking member 111 is connected to the reaction chamber 11 , and the other end of the blocking member 111 forms an opening 112 . When the carrier plate 13 approaches the target 161, it will enter or contact the opening 112 formed by the stopper 111, wherein the reaction chamber 11, the carrier plate 13 and the stopper 111 will define a reaction space 121 in the accommodation space 12, Prevent the deposition film from forming on the surfaces of the reaction chamber 11 and the carrier plate 13 outside the reaction space 121 .

此外,驅動臂177可驅動連接座173及遮擋板175沿著導引單元171移動至反應腔體11的容置空間12,使得基板處理腔室10操作在遮擋狀態, 如圖1及圖5所示。遮擋板175位於靶材161及基板163與承載盤13之間,並用以隔離靶材161及基板163與承載盤13。 In addition, the driving arm 177 can drive the connecting seat 173 and the shielding plate 175 to move along the guiding unit 171 to the accommodating space 12 of the reaction chamber 11, so that the substrate processing chamber 10 operates in a shielding state, As shown in Figure 1 and Figure 5. The shielding plate 175 is located between the target 161 , the substrate 163 and the carrier 13 , and is used to isolate the target 161 and the substrate 163 from the carrier 13 .

遮擋板175可在容置空間12內區隔一清潔空間123,其中清潔空間123與反應空間121的區域部分重疊或相近。清潔空間123用以進行預燒(burn-in)製程,以清潔靶材161及清潔空間123內的反應腔體11及/或擋件111,並去除靶材161表面的氧化物、氮化物或其他汙染物,及反應腔體11及/或擋件111表面的沉積薄膜。 The shielding plate 175 can partition a clean space 123 in the accommodating space 12 , wherein the clean space 123 and the reaction space 121 partially overlap or are close to each other. The clean space 123 is used to perform a burn-in process to clean the target 161 and the reaction chamber 11 and/or the stopper 111 in the clean space 123, and remove oxides, nitrides or oxides on the surface of the target 161. Other pollutants, and the deposited film on the surface of the reaction chamber 11 and/or the baffle 111 .

在清潔基板處理腔室10的過程中,承載盤13及/或基板163會被遮擋板175遮擋或隔離,以避免清潔過程中產生的物質汙染或沉積在承載盤13及/或基板163的表面。 During the process of cleaning the substrate processing chamber 10, the susceptor 13 and/or the substrate 163 will be blocked or isolated by the shielding plate 175, so as to prevent contamination or deposition of substances generated during the cleaning process on the surface of the susceptor 13 and/or the substrate 163 .

本發明的遮擋板175通常為板狀,例如為圓板但不以此為限,其中遮擋板175的面積大於擋件111形成的開口112及/或承載盤13的面積。 The shielding plate 175 of the present invention is generally plate-shaped, such as a circular plate but not limited thereto, wherein the shielding plate 175 has an area larger than that of the opening 112 formed by the blocking member 111 and/or the carrying tray 13 .

在本發明一實施例中,遮擋構件17的導引單元171及連接座173的數量可為一個,其中導引單元171透過連接座173連接遮擋板175的側部。導引單元171不會與擋件111的開口112、基板163及/或承載盤13重疊或干涉,以避免影響承載盤13的升降及沉積製程的進行。 In an embodiment of the present invention, the number of the guiding unit 171 and the connecting seat 173 of the shielding member 17 may be one, wherein the guiding unit 171 is connected to the side of the shielding plate 175 through the connecting seat 173 . The guide unit 171 will not overlap or interfere with the opening 112 of the stopper 111 , the substrate 163 and/or the carrier plate 13 , so as to avoid affecting the lifting of the carrier plate 13 and the deposition process.

在本發明另一實施例中,如圖3至圖5所示,導引單元171及連接座173的數量可為兩個,其中兩個導引單元171分別透過連接座173連接遮擋板175的兩個側部。此外兩個導引單元171不會與擋件111的開口112、基板163及/或承載盤13重疊或干涉,其中兩個導引單元171之間的垂直距離會大於擋件111的開口112、基板163及/或承載盤13的最大長度,例如直徑。因此導引單元171不會影響承載盤13的升降及沉積製程的進行。 In another embodiment of the present invention, as shown in FIGS. 3 to 5 , the number of guiding units 171 and connecting seats 173 can be two, and the two guiding units 171 are respectively connected to the shielding plate 175 through the connecting seats 173. two sides. In addition, the two guiding units 171 will not overlap or interfere with the opening 112 of the blocking member 111, the substrate 163 and/or the carrier plate 13, and the vertical distance between the two guiding units 171 will be greater than the opening 112, The maximum length, such as diameter, of the substrate 163 and/or the susceptor 13 . Therefore, the guiding unit 171 will not affect the lifting of the susceptor 13 and the progress of the deposition process.

具體而言,導引單元171及連接座173的數量為兩個或兩個以上時,可以更穩定地承載及驅動遮擋板175位移。此外使用兩個導引單元171及連接座173,將有利於承載較厚或較重的遮擋板175。較厚重的遮擋板175可避免在清潔基板處理腔室10的過程中發生高溫變形,並可防止清潔過程中的電漿通過變形的遮擋板175接觸下方的承載盤13或基板163。 Specifically, when the number of the guiding unit 171 and the connecting seat 173 is two or more, the shielding plate 175 can be more stably supported and driven to displace. In addition, the use of two guide units 171 and the connecting seat 173 is beneficial for carrying a thicker or heavier shielding plate 175 . The thicker shielding plate 175 can avoid high temperature deformation during cleaning of the substrate processing chamber 10 , and prevent the plasma during cleaning from contacting the lower susceptor 13 or substrate 163 through the deformed shielding plate 175 .

在本發明一實施例中,遮擋構件17可包括至少一襯套178,其中襯套178位於容置空間12及收納空間14內,並用以包覆導引單元171及連接座173。具體而言,襯套178可為長條狀,並由收納腔體15的牆面延伸至反應腔體11相面對的牆面。 In an embodiment of the present invention, the shielding member 17 may include at least one bushing 178 , wherein the bushing 178 is located in the accommodating space 12 and the accommodating space 14 and used to cover the guiding unit 171 and the connecting seat 173 . Specifically, the liner 178 can be strip-shaped, and extends from the wall of the receiving chamber 15 to the opposite wall of the reaction chamber 11 .

襯套178具有一隔離空間1781,其中導引單元171及連接座173位於隔離空間1781內。透過襯套178的設置,可避免連接座173沿著導引單元171位移的過程中產生的微粒掉落到容置空間12及/或收納空間14內,以維持反應腔體11的容置空間12的潔淨度。例如襯套178的剖面類似U形,而襯套178的頂部設置有一長條狀的間隔,使得連接座173沿著間隔位移。 The bushing 178 has an isolation space 1781 , wherein the guide unit 171 and the connecting seat 173 are located in the isolation space 1781 . Through the arrangement of the bushing 178, the particles generated during the displacement of the connecting seat 173 along the guide unit 171 can be prevented from falling into the accommodating space 12 and/or the accommodating space 14, so as to maintain the accommodating space of the reaction chamber 11 12 for cleanliness. For example, the section of the bushing 178 is U-shaped, and the top of the bushing 178 is provided with a strip-shaped gap, so that the connecting seat 173 can be displaced along the gap.

在本發明一實施例中,可進一步在收納腔體15上設置至少一位置感測單元151,其中位置感測單元151朝向收納空間14,並用以感測遮擋板175是否進入收納空間14。例如位置感測單元151可以是光感測單元。 In an embodiment of the present invention, at least one position sensing unit 151 can be further disposed on the storage cavity 15 , wherein the position sensing unit 151 faces the storage space 14 and is used for sensing whether the shielding plate 175 enters the storage space 14 . For example, the position sensing unit 151 may be a light sensing unit.

若遮擋板175未離開反應腔體11的容置空間12,承載盤13便朝靶材161的方向位移,可能導致承載盤13碰撞遮擋板175,而造成承載盤13及/或遮擋板175的損壞。在實際應用時,可設定為只有位置感測單元151感測到遮擋板175完全進入收納腔體15後,承載盤13才能朝靶材161的方向靠近,以避免承載盤13及遮擋板175發生碰撞。 If the blocking plate 175 does not leave the accommodating space 12 of the reaction chamber 11, the carrier plate 13 will be displaced toward the target 161, which may cause the carrier plate 13 to collide with the blocking plate 175, causing the carrier plate 13 and/or the blocking plate 175 to break. damage. In practical application, it can be set that the carrier plate 13 can approach the target 161 only after the position sensing unit 151 senses that the shielding plate 175 has completely entered the storage cavity 15, so as to avoid the occurrence of damage to the carrier plate 13 and the shielding plate 175. collision.

在本發明另一實施例中,亦可將位置感測單元151設置在反應腔體11上,朝向反應腔體11的容置空間12,其中位置感測單元151用以感測遮擋板175是否還在容置空間12內。具體而言,位置感測單元151只要可以感測遮擋板175的位置,例如確認遮擋板175完全進入收納腔體15內及/或反應腔體11內不存在遮擋板175即可,位置感測單元151的設置位置或種類並非本發明權利範圍的限制。 In another embodiment of the present invention, the position sensing unit 151 can also be arranged on the reaction chamber 11, facing the accommodating space 12 of the reaction chamber 11, wherein the position sensing unit 151 is used to sense whether the blocking plate 175 is Still in the accommodating space 12 . Specifically, as long as the position sensing unit 151 can sense the position of the shielding plate 175, for example, confirming that the shielding plate 175 has completely entered the storage chamber 15 and/or that there is no shielding plate 175 in the reaction chamber 11, the position sensing The location or type of the unit 151 is not a limitation of the scope of rights of the present invention.

以上所述者,僅為本發明之一較佳實施例而已,並非用來限定本發明實施之範圍,即凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。 The above is only one of the preferred embodiments of the present invention, and is not used to limit the scope of the present invention, that is, all changes and equal changes made according to the shape, structure, characteristics and spirit described in the patent scope of the present invention Modifications should be included in the patent application scope of the present invention.

10:基板處理腔室 10: Substrate processing chamber

11:反應腔體 11: Reaction chamber

111:擋件 111: block

112:開口 112: opening

12:容置空間 12:Accommodating space

123:清潔空間 123:Clean space

13:承載盤 13: carrying plate

14:收納空間 14: storage space

15:收納腔體 15: Storage cavity

151:位置感測單元 151: Position sensing unit

161:靶材 161: target

163:基板 163: Substrate

171:導引單元 171: Guide unit

173:連接座 173: Connection seat

175:遮擋板 175: baffle plate

177:驅動臂 177: drive arm

178:襯套 178: Bushing

179:驅動單元 179: drive unit

Claims (8)

一種基板處理腔室,包括:一反應腔體,包括一容置空間;一承載盤,位於該容置空間內,並用以承載至少一基板;一收納腔體,連接該反應腔體,其中該收納腔體包括一收納空間,流體連接該容置空間;及一遮擋構件,包括:至少一導引單元,由該收納空間延伸該容置空間;至少一連接座,連接該導引單元;一遮擋板,連接該連接座,並經由該連接座連接該導引單元;至少一驅動臂,連接該遮擋板或該連接座,並用以驅動該遮擋板及該連接座沿著該導引單元在該收納空間及該容置空間之間位移,其中該遮擋板的位移方向與該導引單元平行;及至少一襯套,位於該容置空間及該收納空間內,該襯套包括一隔離空間,而該導引單元及該連接座位於該襯套的該隔離空間內。 A substrate processing chamber, comprising: a reaction chamber including an accommodating space; a carrier plate located in the accommodating space and used to carry at least one substrate; a receiving chamber connected to the reaction chamber, wherein the The storage cavity includes a storage space fluidly connected to the storage space; and a shielding member including: at least one guide unit extending from the storage space to the storage space; at least one connecting seat connected to the guide unit; The shielding plate is connected to the connecting seat, and is connected to the guide unit through the connecting seat; at least one driving arm is connected to the shielding plate or the connecting seat, and is used to drive the shielding plate and the connecting seat along the guiding unit. Displacement between the accommodation space and the accommodation space, wherein the displacement direction of the shielding plate is parallel to the guide unit; and at least one bushing, located in the accommodation space and the accommodation space, the bushing includes an isolation space , and the guiding unit and the connecting seat are located in the isolated space of the bushing. 如請求項1所述的基板處理腔室,其中該驅動臂包括至少一第一驅動臂及至少一第二驅動臂,該第一驅動臂透過該第二驅動臂連接該遮擋板。 The substrate processing chamber as claimed in claim 1, wherein the driving arm includes at least one first driving arm and at least one second driving arm, and the first driving arm is connected to the shielding plate through the second driving arm. 如請求項2所述的基板處理腔室,包括一驅動單元連接該第一驅動臂,並經由該第一驅動臂及該第二驅動臂驅動該遮擋板在該收納空間及該容置空間位移。 The substrate processing chamber according to claim 2, comprising a driving unit connected to the first driving arm, and driving the shielding plate to move between the storage space and the storage space through the first driving arm and the second driving arm . 如請求項1所述的基板處理腔室,包括至少一位置感測單元設置於該收納腔體或該反應腔體,並用以感測該遮擋板的位置。 The substrate processing chamber as claimed in claim 1 includes at least one position sensing unit disposed in the storage chamber or the reaction chamber, and configured to sense the position of the shielding plate. 如請求項1所述的基板處理腔室,包括一靶材設置在該容置空間內並面對該承載盤,位移至該容置空間的該遮擋板位於該靶材及該承載盤之間。 The substrate processing chamber according to claim 1, comprising a target disposed in the accommodating space and facing the carrier plate, the shielding plate displaced to the accommodating space is located between the target material and the carrier plate . 一種遮擋構件,適用於一基板處理腔室,包括:至少一導引單元;至少一連接座,連接該導引單元;一遮擋板,連接該連接座,並經由該連接座連接該導引單元;至少一驅動臂,連接該遮擋板或該連接座,並用以帶動該遮擋板沿著該導引單元位移,其中該遮擋板的位移方向與該導引單元平行;及至少一襯套,具有一隔離空間,而該導引單元及該連接座位於該襯套的該隔離空間內。 A shielding member suitable for a substrate processing chamber, comprising: at least one guiding unit; at least one connecting seat connected to the guiding unit; a shielding plate connected to the connecting seat and connected to the guiding unit via the connecting seat ; at least one driving arm, connected to the baffle plate or the connecting seat, and used to drive the baffle plate to displace along the guide unit, wherein the displacement direction of the baffle plate is parallel to the guide unit; and at least one bushing having An isolated space, and the guide unit and the connecting seat are located in the isolated space of the bushing. 如請求項6所述的遮擋構件,其中該驅動臂包括至少一第一驅動臂及至少一第二驅動臂,該第一驅動臂透過該第二驅動臂連接該遮擋板。 The shielding member as claimed in claim 6, wherein the driving arm includes at least one first driving arm and at least one second driving arm, and the first driving arm is connected to the shielding plate through the second driving arm. 如請求項7所述的遮擋構件,包括一驅動單元連接該第一驅動臂,並經由該第一驅動臂及該第二驅動臂驅動該遮擋板沿著該導引單元位移。 The shielding member as claimed in claim 7 includes a driving unit connected to the first driving arm, and drives the shielding plate to be displaced along the guiding unit via the first driving arm and the second driving arm.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101750639A (en) * 2008-12-15 2010-06-23 鸿富锦精密工业(深圳)有限公司 Optical coating device
TW201837210A (en) * 2016-05-10 2018-10-16 美商應用材料股份有限公司 Methods of depositing an evaporated source material on a substrate and deposition apparatus and method of operating the same

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