CN218941413U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
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- CN218941413U CN218941413U CN202222437340.3U CN202222437340U CN218941413U CN 218941413 U CN218941413 U CN 218941413U CN 202222437340 U CN202222437340 U CN 202222437340U CN 218941413 U CN218941413 U CN 218941413U
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- pspi
- patch
- circuit board
- flexible circuit
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Abstract
The utility model discloses a flexible circuit board, which comprises a flexible substrate, wherein the flexible substrate comprises a patch part, a bending part and a supporting part, the patch part is used for mounting and attaching an electric circuit element, PSPI films are respectively attached to the patch part and the bending part, and a PI film is attached to the supporting part; the flexible circuit board provided by the utility model has the characteristic of low processing cost, and the PSPI film is adhered to the bending part and the patch part, so that the thickness of the bending part is reduced, the thinning processing of the bending part is simplified, and the operation of coating photosensitive ink on the patch part is canceled due to the special photosensitive characteristic of the PSPI film, thereby simplifying the processing steps and being beneficial to the reduction of the processing cost.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a flexible circuit board.
Background
The main current structure of the flexible circuit board (FPC) is that polyimide or polyester film is used as a base material, after circuit conductor layers are formed on two sides of the base material, a cover film (CVL) is attached to the circuit conductor layers for insulation protection, the existing cover film is generally a PI cover film (namely a polyimide film), the processing period of the PI cover film is long, the thickness of the PI cover film is large, thinning processing is required for a region needing bending on the FPC, and a window is usually opened at the position of the PI cover film corresponding to the bending region; the region where the electrical circuit element needs to be mounted on the FPC is manufactured by using photosensitive ink, so that the processing steps are complicated, and the processing cost is high.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: a flexible circuit board with low processing cost is provided.
In order to solve the technical problems, the utility model adopts the following technical scheme: the flexible circuit board comprises a flexible substrate, wherein the flexible substrate comprises a patch part, a bending part and a supporting part, the patch part is used for mounting and attaching an electric circuit element, PSPI films are respectively attached to the patch part and the bending part, and PI films are attached to the supporting part.
Further, the patch part is connected with the bending part.
Further, the PSPI film on the patch portion is connected to the PSPI film on the folded portion.
Further, the PSPI film on the patch portion is spaced from the PSPI film on the folded portion.
Further, the thickness of the PSPI film is 10-15 μm.
Further, the PSPI film has a thickness of 10-12 μm.
Further, the thickness of the PSPI film was 11. Mu.m.
Furthermore, one side of the bending part is adhered with the PSPI film, and the other side of the bending part is provided with a window.
Further, a copper foil layer is arranged in the window.
The utility model has the beneficial effects that: the flexible circuit board provided by the utility model has the characteristic of low processing cost, and the PSPI film is adhered to the bending part and the patch part, so that the thickness of the bending part is reduced, the thinning processing of the bending part is simplified, and the operation of coating photosensitive ink on the patch part is canceled due to the special photosensitive characteristic of the PSPI film, thereby simplifying the processing steps and being beneficial to the reduction of the processing cost.
Drawings
FIG. 1 is a top view of a flexible circuit board according to a first embodiment of the utility model;
fig. 2 is a schematic cross-sectional structure of a flexible circuit board according to a first embodiment of the utility model.
Description of the reference numerals:
1. a flexible substrate; 11. a substrate body; 12. a line conductor layer; 2. a support part; 3. a bending part; 4. a patch part; 5. a PI film; 6. PSPI film; 7. windowing; 8. and a copper foil layer.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 and 2, a flexible circuit board includes a flexible substrate 1, the flexible substrate 1 includes a patch portion 4, a bending portion 3, and a supporting portion 2, the patch portion 4 is used for mounting an electrical circuit element, the patch portion 4 and the bending portion 3 are all coated with a PSPI film 6, and the supporting portion 2 is coated with a PI film 5.
From the above description, the beneficial effects of the utility model are as follows: the PSPI film 6 (Photo Sensitive PI, also called photosensitive polyimide) is attached to the bending part 3 and the patch part 4, so that the thickness of the bending part 3 is reduced, the thinning processing of the bending part 3 is simplified, the operation of coating photosensitive ink on the patch part 4 is canceled due to the special photosensitive characteristic of the PSPI film 6, the processing steps are simplified, and the reduction of the processing cost is facilitated.
Further, the patch part 4 is connected to the bending part 3.
Further, the PSPI film 6 on the patch part 4 is connected to the PSPI film 6 on the folded part 3.
Further, the PSPI film 6 on the patch part 4 is spaced from the PSPI film 6 on the folded part 3.
As can be seen from the above description, the patch portion 4 is disposed to be connected with the bending portion 3, so as to facilitate the adhesion of the PSPI film 6, and the PSPI film 6 can be formed between the bending portion 3 and the patch portion 4 through one forming process, without separately forming the PSPI film 6 with respect to the bending portion 3 and the patch portion 4.
Further, the thickness of the PSPI film 6 is 10-15 μm.
Further, the thickness of the PSPI film 6 is 10-12 μm.
Further, the thickness of the PSPI film 6 is 11. Mu.m.
From the above description, it is known that the thickness of the PSPI film 6 can be set according to practical application requirements.
Furthermore, one side of the bending part 3 is adhered with the PSPI film 6, and the other side is provided with a window 7.
As is clear from the above description, the window 7 can reduce the thickness of the bending portion 3, so as to facilitate bending.
Further, a copper foil layer 8 is disposed in the window 7.
As is clear from the above description, the copper foil layer 8 can support the bending portion 3, and reduce the risk of wrinkling of the bending portion 3.
Example 1
Referring to fig. 1 and 2, a first embodiment of the utility model is as follows: the flexible circuit board comprises a flexible substrate 1, wherein the flexible substrate 1 comprises a patch part 4, a bending part 3 and a supporting part 2, the patch part 4 is used for mounting and attaching an electric circuit element, the patch part 4 and the bending part 3 are respectively attached with a PSPI film 6, and the supporting part 2 is attached with a PI film 5; a PSPI film 6 (Photo Sensitive PI, also called photosensitive polyimide) is attached to the bending portion 3 and the patch portion 4; specifically, because the material cost of the PSPI film 6 is higher, in this embodiment, the PSPI film 6 is only attached to the bending portion 3 and the patch portion 4, and for the support portion 2 with a larger area, the conventional PI film 5 is used for attaching, so that the reduction of the production cost is facilitated; in detail, referring to fig. 2, the flexible substrate 1 includes a substrate body 11 and circuit conductor layers 12 formed on two sides of the substrate body 11, wherein the substrate body 11 is made of polyimide or polyester film, and the circuit conductor layers 12 are made of copper.
Preferably, the patch part 4 is connected with the bending part 3; in this embodiment, the PSPI film 6 on the patch portion 4 and the PSPI film 6 on the bending portion 3 may be connected, so that the PSPI film 6 is convenient to be adhered to, and the PSPI film 6 can be formed on the bending portion 3 and the patch portion 4 through one forming process, so that the PSPI film 6 does not need to be formed separately on the bending portion 3 and the patch portion 4, thereby simplifying the production process and facilitating the reduction of the production cost; in addition, in other embodiments, the PSPI film 6 on the patch part 4 is spaced apart from the PSPI film 6 on the folded part 3.
In this embodiment, the PSPI film 6 is formed on the bending portion 3 and the patch portion 4 by a silk screen process; alternatively, the thickness of the PSPI film 6 is 10-15 μm, and specifically, the thickness of the PSPI film 6 may be set according to practical application requirements; the thickness of the PSPI film 6 is preferably 10-12 μm; in particular, in this embodiment, the PSPI film 6 has a thickness of 11 μm.
In this embodiment, one side of the bending portion 3 is adhered with the PSPI film 6, and the other side is provided with a window 7, where the window 7 can reduce the thickness of the bending portion 3, so as to facilitate bending; specifically, the copper foil layer 8 is arranged in the window 7, and the copper foil layer 8 can support the bending part 3, so that the risk of wrinkling of the bending part 3 is reduced.
In summary, the flexible circuit board provided by the utility model has the characteristic of low processing cost, and the PSPI film is adhered to the bending part and the patch part, so that the thickness of the bending part is reduced, the thinning processing of the bending part is simplified, and the operation of coating photosensitive ink on the patch part is canceled due to the special photosensitive characteristic of the PSPI film, the processing steps are simplified, and the reduction of the processing cost is facilitated; the patch part is connected with the bending part, so that the PSPI film is convenient to attach, the PSPI film can be formed on the bending part and the patch part through one forming process, and the PSPI film is not required to be formed on the bending part and the patch part independently.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (9)
1. The flexible circuit board comprises a flexible substrate, and is characterized in that the flexible substrate comprises a patch part, a bending part and a supporting part, wherein the patch part is used for mounting and attaching an electric circuit element, PSPI films are attached to the patch part and the bending part, and PI films are attached to the supporting part.
2. The flexible circuit board of claim 1, wherein the patch portion is connected to the bend portion.
3. The flexible circuit board of claim 2 wherein the PSPI film on the patch portion is connected to the PSPI film on the flex portion.
4. The flexible circuit board of claim 2 wherein the PSPI film on the patch portion is spaced apart from the PSPI film on the flex portion.
5. The flexible circuit board of claim 1 wherein the PSPI film has a thickness of 10-15 μm.
6. The flexible circuit board of claim 5 wherein the PSPI film has a thickness of 10-12 μm.
7. The flexible circuit board of claim 6, wherein the PSPI film has a thickness of 11 μιη.
8. The flexible circuit board of claim 1, wherein one side of the bending portion is covered with the PSPI film, and the other side is provided with a window.
9. The flexible circuit board of claim 8 wherein a copper foil layer is disposed within the fenestration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222437340.3U CN218941413U (en) | 2022-09-14 | 2022-09-14 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222437340.3U CN218941413U (en) | 2022-09-14 | 2022-09-14 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218941413U true CN218941413U (en) | 2023-04-28 |
Family
ID=86093350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222437340.3U Active CN218941413U (en) | 2022-09-14 | 2022-09-14 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218941413U (en) |
-
2022
- 2022-09-14 CN CN202222437340.3U patent/CN218941413U/en active Active
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