CN218919553U - Semiconductor laser module - Google Patents
Semiconductor laser module Download PDFInfo
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- CN218919553U CN218919553U CN202320140579.6U CN202320140579U CN218919553U CN 218919553 U CN218919553 U CN 218919553U CN 202320140579 U CN202320140579 U CN 202320140579U CN 218919553 U CN218919553 U CN 218919553U
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Abstract
The utility model provides a semiconductor laser module, which belongs to the field of lasers and comprises a laser module, a laser output optical fiber, a laser power wire, a housing, a heat dissipation copper block, a temperature sensor, a semiconductor refrigerating sheet, and a mounting plate, wherein a first wire passing hole for penetrating the laser output optical fiber is formed in the side wall of the housing, the mounting plate is arranged on the periphery of the opening in the bottom of the housing, the heat dissipation copper block is fixed in the housing, a mounting groove is formed in the heat dissipation copper block, the mounting groove is opposite to the first wire passing hole, a notch of the mounting groove is opened towards the bottom of the housing, the mounting groove is opened towards one side of the first wire passing hole, the temperature sensor and the laser module are arranged in the mounting groove, the semiconductor refrigerating sheet is arranged in the opening in the bottom of the housing, and the heat absorption side of the semiconductor refrigerating sheet is attached to the heat dissipation copper block. The utility model is used for improving the heat dissipation effect of the semiconductor laser module so as to prolong the service life of the laser.
Description
Technical Field
The utility model relates to the field of laser modules, in particular to a semiconductor laser module.
Background
Semiconductor laser modules, also known as "semiconductor laser modules", are a type of laser that matures earlier and progresses faster. In view of the wide wavelength range, simple manufacture, low cost, easy mass production, small volume, light weight, long service life, quick variety development and wide application range, the number of the materials is more than 300. The semiconductor laser module is widely applied to laser ranging, laser radar, ignition and detonation, detection instruments and the like, and forms a wide market.
The semiconductor laser module generates heat during operation, and if the heat generated during operation is not timely dissipated, the temperature of the working environment of the semiconductor laser module is increased, so that the working temperature of the semiconductor laser is increased. The output power of the semiconductor laser module is affected by the operating temperature, and as the operating temperature increases, both the average and maximum output power of the semiconductor laser module decrease. The decrease of the output power of the semiconductor laser module directly leads to the increase of the heating value of the device, which causes larger temperature rise, thus being more unfavorable for the normal operation of the semiconductor laser module.
The existing scheme mostly adopts a mode of adding cooling fins on the semiconductor laser module, and the self-heating cooling or forced air cooling is adopted, so that the cooling effect is poor when the heating value of the semiconductor laser module is large, the service life of the semiconductor laser module is possibly reduced, and the long-time stable operation requirement of the semiconductor laser module cannot be met. This is a disadvantage of the prior art.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a semiconductor laser module for improving the heat dissipation effect of the semiconductor laser module aiming at the defects in the prior art.
In order to solve the technical problems, the utility model provides a semiconductor laser module, which comprises a laser module, wherein the laser module is provided with a laser output optical fiber and a laser power line;
the semiconductor laser module further comprises a housing, a heat dissipation copper block and a temperature sensor;
the housing is of a cuboid structure with an open bottom;
a first wire passing hole for penetrating the laser output optical fiber is formed in one side wall of the housing;
a mounting plate is arranged on the periphery of the bottom opening of the housing;
the heat dissipation copper block is fixedly arranged in the housing;
the heat dissipation copper block is provided with a mounting groove;
the mounting groove is opposite to the first via hole;
the notch of the mounting groove is opened towards the bottom of the housing;
the mounting groove is arranged towards one side opening of the first wire through hole;
the temperature sensor and the laser module are arranged in the mounting groove;
the side of the heat dissipation copper block, which faces the bottom opening of the housing, is of a planar structure;
a semiconductor refrigerating sheet is arranged in the bottom opening of the housing;
the heat absorption side of the semiconductor refrigerating sheet is attached to the heat dissipation copper block.
Further, the heat dissipation copper block is fixedly arranged on the inner bottom wall of the housing.
Further, the bottom wall of the mounting groove and the bottom wall of the housing are provided with wire passing holes, the number and the positions of the wire passing holes on the bottom wall of the mounting groove are equal to those of the wire passing holes on the bottom wall of the housing, and the wire passing holes are opposite to those of the wire passing holes on the bottom wall of the housing and used for the signal output wire of the temperature sensor and the penetrating-out of the laser power wire.
Further, a second wire through hole, a third wire through hole, a fourth wire through hole and a fifth wire through hole are formed in the bottom wall of the housing, and are used for penetrating out an anode power line and a cathode power line of the laser output optical fiber and an anode signal line and a cathode signal line of a signal output line of the temperature sensor; four wire passing holes are formed in the bottom wall of the mounting groove, are opposite to the second wire passing hole, the third wire passing hole, the fourth wire passing hole and the fifth wire passing hole, and are matched with each other in position and used for penetrating corresponding cables.
Further, the semiconductor refrigerating sheet is embedded in the bottom opening of the housing.
Further, the mounting plate is provided with a mounting hole; the mounting plate and the housing adopt an integrated structure.
Further, the semiconductor laser module is provided with a heat sink which is arranged on one side of the mounting plate, which is away from the housing; the heat radiation side of the semiconductor refrigerating sheet is attached to the radiating sheet.
Further, both sides of the semiconductor refrigeration piece are coated with heat-conducting silicone grease; one side of the heat dissipation copper block, which is attached to the semiconductor refrigerating sheet, is coated with heat conduction silicone grease.
Further, a sixth wire through hole and a seventh wire through hole are formed in the other side wall of the housing; the first through line hole and the sixth through line hole are formed in two side walls of the housing, wherein the two side walls are opposite to each other; the seventh wire through hole and the sixth wire through hole are matched with the refrigeration piece positive power line and the refrigeration piece negative power line of the semiconductor refrigeration piece for one-to-one penetrating out of the refrigeration piece positive power line and the refrigeration piece negative power line.
Further, the tail ends of the positive power line and the negative power line of the refrigerating plate are provided with fast plugs of the power line of the refrigerating plate.
The utility model has the advantages that:
the semiconductor laser module comprises the housing with the bottom open, the heat dissipation copper block is arranged in the housing, the mounting groove is formed in the heat dissipation copper block, the temperature sensor and the laser module are integrated in the mounting groove, the semiconductor refrigerating sheet is embedded in the opening in the bottom of the housing, the heat absorption side of the semiconductor refrigerating sheet is attached to the heat dissipation copper block, the real-time monitoring of the working environment temperature of the laser module in the housing based on the temperature sensor is facilitated, the cooling chamber formed in the housing by controlling the semiconductor refrigerating sheet is facilitated to quickly cool the laser module, the heat dissipation effect of the semiconductor laser module is improved, the working temperature of the laser module is enabled to have monitoring capability, the stability of the working environment temperature of the laser module is facilitated to be maintained, and the service life of the laser is prolonged.
It will thus be seen that the utility model provides substantial features and advantages, and that the implementation thereof will be apparent.
Drawings
Fig. 1 is a schematic structural view of a semiconductor laser module according to an embodiment of the present utility model.
Fig. 2 is a schematic structural diagram of the semiconductor laser module of fig. 1 with the semiconductor cooling fin removed.
Fig. 3 is a schematic structural view of the housing in fig. 1 and 2.
Wherein:
1-housing, 1.1-mounting plate, 1.1.1-mounting hole, 1.2-first wire via, 1.3-second wire via, 1.4-third wire via, 1.5-fourth wire via, 1.6-fifth wire via, 1.7-sixth wire via, 1.8-seventh wire via; 2-radiating copper blocks and 2.1-mounting grooves; 3-semiconductor refrigerating sheets, 3.1-refrigerating sheet negative electrode power lines, 3.2-refrigerating sheet positive electrode power lines and 3.3-refrigerating sheet power line quick plugs; 4-temperature sensor, 4.1-positive electrode signal wire of sensor, 4.2-negative electrode signal wire of sensor, 4.3-fast plug of sensor signal wire; the fast plug comprises a 5-laser module, a 5.1-laser output optical fiber, a 5.2-laser positive power line, a 5.3-laser negative power line and a 5.4-laser power line fast plug.
Detailed Description
In order to make the technical scheme and advantages of the present utility model more clear, the technical scheme of the present utility model will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, a semiconductor laser module of the present utility model comprises a laser module 5 (i.e. a laser), the laser module 5 having a laser output optical fiber 5.1 and a laser power supply line.
The semiconductor laser module further comprises a housing 1, a heat dissipation copper block 2, a semiconductor refrigeration piece 3 and a temperature sensor 4.
The housing 1 has a cuboid structure with an open bottom. The side of the housing 1 with the opening is the bottom.
One side wall (hereinafter referred to as a "first side wall") of the housing 1 is provided with a first via hole 1.2 for passing through the laser output optical fiber 5.1.
A mounting plate 1.1 is arranged on the periphery of the bottom opening of the housing 1.
The housing 1 is distributed perpendicularly to the mounting plate 1.1 as a whole.
The mounting plate 1.1 is annular in shape as a whole. The mounting plate 1.1 and the housing 1 adopt an integrated structure.
The mounting plate 1.1 is provided with a mounting hole 1.1.1.
In particular, the number and positions of the mounting holes 1.1.1 can be set by a person skilled in the art according to the actual situation. In this embodiment, the mounting plate 1.1 is provided with four mounting holes 1.1.1, as shown in fig. 1, 2 and 3.
The heat dissipation copper block 2 is fixedly installed on the inner bottom wall of the housing 1.
The side of the heat dissipation copper block 2, which is open towards the bottom of the housing 1, is of a planar structure.
The heat dissipation copper block 2 is provided with a mounting groove 2.1.
In particular, the depth and shape of the mounting groove 2.1 can be set by those skilled in the art according to practical situations, and will not be described here.
The mounting groove 2.1 is located opposite the first via hole 1.2.
The notch of the mounting groove 2.1 is open towards the bottom of the housing 1.
The mounting groove 2.1 is arranged towards one side opening of the first via hole 1.2.
The temperature sensor 4 and the laser module 5 are integrated in the mounting groove 2.1 of the heat-dissipating copper block 2.
The temperature sensor 4 is used to collect the temperature of the working environment of the laser module 5.
The use of the heat dissipation copper block 2 is equivalent to increasing the heat dissipation area of the laser module 5, and contributes to improving the heat dissipation efficiency of the laser module 5.
The semiconductor refrigerating sheet 3 is arranged in the bottom opening of the housing 1, the heat absorption side of the semiconductor refrigerating sheet 3 is attached to the heat dissipation copper block 2, and the heat emission side of the semiconductor refrigerating sheet 3 and the mounting plate 1.1 are positioned on the same plane.
The laser module 5 is integrated in the mounting groove 2.1 of the heat dissipation copper block 2, and heat generated during operation of the laser module 5 can be quickly absorbed by the heat dissipation copper block 2. The heat absorption side of the semiconductor refrigerating sheet 3 is attached to the heat dissipation copper block 2, so that heat absorbed by the heat dissipation copper block 2 can be rapidly dissipated by the semiconductor refrigerating sheet 3, thereby facilitating rapid heat dissipation of the laser module 5 in the housing 1, and further facilitating improvement of the heat dissipation effect of the semiconductor laser module.
The semiconductor cooling fin 3 is embedded in the bottom opening of the casing 1, and even if the bottom opening of the casing 1 is directed vertically downward, the semiconductor cooling fin 3 does not fall from the bottom opening of the casing 1.
The heat-releasing side of the semiconductor cooling plate 3 is arranged flush with the end face of the mounting plate 1.1 facing away from the housing 1.
The bottom wall of the mounting groove 2.1 and the bottom wall of the housing 1 are respectively provided with a wire passing hole, the number of the wire passing holes on the bottom wall of the mounting groove 2.1 is equal to that of the wire passing holes on the bottom wall of the housing 1, and the positions of the wire passing holes are opposite to that of the wire passing holes on the bottom wall of the housing 1, and the wire passing holes are used for the signal output wire of the temperature sensor 4 and the penetrating-out of the laser power supply wire.
The laser power line is used for connecting the laser module 5 with a power supply.
The laser power line comprises a laser positive power line 5.2 and a laser negative power line 5.3.
When the power supply is used, the positive electrode power line 5.2 and the negative electrode power line 5.3 of the laser are correspondingly connected with the positive electrode power output end and the negative electrode power output end of the power supply.
In use, the laser module 5 emits laser light outwards through the laser output optical fibre 5.1.
The temperature signal collected by the temperature sensor 4 is output through a signal output line thereof. The signal output lines of the temperature sensor 4 comprise a sensor positive signal line 4.1 and a sensor negative signal line 4.2.
The bottom wall of the housing 1 is provided with a second wire passing hole 1.3, a third wire passing hole 1.4, a fourth wire passing hole 1.5 and a fifth wire passing hole 1.6 which are sequentially used for penetrating out a laser negative electrode power line 5.3, a laser positive electrode power line 5.2, a sensor positive electrode signal line 4.1 and a sensor negative electrode signal line 4.2.
Four wire passing holes are formed in the bottom wall of the mounting groove 2.1, are opposite to the second wire passing hole 1.3, the third wire passing hole 1.4, the fourth wire passing hole 1.5 and the fifth wire passing hole 1.6 in position, and are matched with the wire passing holes in opposite positions for penetrating out of corresponding cables. For example, the wire passing hole on the bottom wall of the mounting groove 2.1 matched with the second wire passing hole 1.3 is used for passing out the laser negative power wire 5.3, and the wire passing hole on the bottom wall of the mounting groove 2.1 matched with the third wire passing hole 1.4 is used for passing out the laser positive power wire 5.2.
Wherein, the side (heat absorption side) of the semiconductor refrigeration piece 3 attached to the heat dissipation copper block 2 is uniformly coated with heat conduction silicone grease, and the side of the heat dissipation copper block 2 attached to the semiconductor refrigeration piece 3 is also uniformly coated with heat conduction silicone grease.
The heat conduction silicone grease coated on the semiconductor refrigerating sheet 3 and the heat dissipation copper block 2 is beneficial to filling gaps between the semiconductor refrigerating sheet 3 and the heat dissipation copper block 2 through the fluidity of the silicone grease, and is beneficial to transferring heat through heat conduction, so that a good heat conduction effect is achieved.
A sixth via hole 1.7 and a seventh via hole 1.8 are arranged on the side wall of the housing 1 opposite to the first side wall. I.e. the first via 1.2 and the sixth via 1.7 and the seventh via 1.8 are located on two opposite side walls of the housing 1.
The power line of the semiconductor refrigeration piece 3 is used for connecting power to the refrigeration piece and comprises a refrigeration piece positive power line 3.2 and a refrigeration piece negative power line 3.1.
The seventh wire passing hole 1.8 and the sixth wire passing hole 1.7 are respectively matched with the refrigeration piece positive electrode power wire 3.2 and the refrigeration piece negative electrode power wire 3.1 for use. The sixth wire through hole 1.7 is used for penetrating out the negative electrode power wire 3.1 of the refrigerating sheet, and the seventh wire through hole 1.8 is used for penetrating out the positive electrode power wire 3.2 of the refrigerating sheet.
Illustratively, the free ends, i.e. the tail ends, of the refrigerating plate positive electrode power line 3.2 and the refrigerating plate negative electrode power line 3.1 are provided with refrigerating plate power line quick plugs 3.3, the free ends of the sensor positive electrode signal line 4.1 and the sensor negative electrode signal line 4.2 are provided with sensor signal line quick plugs 4.3, and the free ends of the laser positive electrode power line 5.2 and the laser negative electrode power line 5.3 are provided with laser power line quick plugs 5.4. The use of the cold-patch power line fast plug 3.3, the sensor signal line fast plug 4.3 and the laser power line fast plug 5.4 increases the convenience of wiring to a certain extent.
The semiconductor laser module is provided with a heat sink, which is mounted on the mounting board 1.1, and the heat-radiating side of the semiconductor cooling fin 3 is attached to the heat sink.
In specific implementation, the heat-conducting silicone grease can be uniformly coated on the heat-releasing side of the semiconductor refrigerating sheet 3, and then the whole semiconductor laser module is fixed on the heat-radiating sheet by using a screw through the mounting hole 1.1.1 on the mounting plate 1.1 by using the handheld housing. When in use, the radiating fin radiates the heat absorbed by the semiconductor refrigerating sheet 3 in real time.
It should be noted that, in order to simplify the structure of the drawings, the fin structure is not drawn in the drawings of the present utility model, and those skilled in the art can easily implement the fin structure based on the text descriptions of the present specification and the drawings of the present specification in combination with the prior art.
The utility model is helpful to monitor the internal environment temperature of the housing 1 in real time through the temperature sensor 4, and is helpful to form a cold chamber in the housing 1 for cooling the laser module 5 based on the temperature monitored by the temperature sensor 4 by controlling the semiconductor refrigerating sheet 3 to refrigerate, so that the working temperature of the laser module 5 has monitoring capability, and the working environment temperature of the laser module 5 can be kept stable, thereby being helpful to prolong the service life of the laser.
It should be noted that, the housing 1 of the present utility model is made of a nanoscale heat insulation material, which has a certain heat preservation function, so that a heat preservation cold room is formed in the housing 1 by controlling the refrigeration of the semiconductor refrigeration sheet 3 to cool the laser module 5, and the working environment temperature of the laser module 5 is further kept stable, thereby further helping to prolong the service life of the laser.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting thereof; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. A semiconductor laser module comprising a laser module (5), the laser module (5) having a laser output optical fiber (5.1) and a laser power line; the method is characterized in that:
the semiconductor laser module further comprises a housing (1), a heat dissipation copper block (2) and a temperature sensor (4);
the housing (1) is of a cuboid structure with an open bottom;
a first wire through hole (1.2) for penetrating the laser output optical fiber (5.1) is arranged on one side wall of the housing (1);
the periphery of the bottom opening of the housing (1) is provided with a mounting plate (1.1) in the circumferential direction;
the heat dissipation copper block (2) is fixedly arranged in the housing (1);
the heat dissipation copper block (2) is provided with a mounting groove (2.1);
the mounting groove (2.1) is opposite to the first wire through hole (1.2);
the notch of the mounting groove (2.1) is open towards the bottom of the housing (1);
the mounting groove (2.1) is arranged towards one side opening of the first wire through hole (1.2);
the temperature sensor (4) and the laser module (5) are arranged in the mounting groove (2.1);
the side of the heat dissipation copper block (2) facing the bottom opening of the housing (1) is of a plane structure;
a semiconductor refrigerating sheet (3) is arranged in the bottom opening of the housing (1);
the heat absorption side of the semiconductor refrigerating sheet (3) is attached to the heat dissipation copper block (2).
2. The semiconductor laser module of claim 1, wherein: the heat dissipation copper block (2) is fixedly arranged on the bottom wall of the inner side of the housing (1).
3. The semiconductor laser module according to claim 1 or 2, characterized in that: the bottom wall of the mounting groove (2.1) and the bottom wall of the housing (1) are provided with wire passing holes, the number of the wire passing holes on the bottom wall of the mounting groove (2.1) is equal to that of the wire passing holes on the bottom wall of the housing (1) and the positions of the wire passing holes are opposite, and the wire passing holes are used for the signal output wire of the temperature sensor (4) and the penetrating-out of the laser power supply wire.
4. A semiconductor laser module according to claim 3, characterized in that: the bottom wall of the housing (1) is provided with a second wire through hole (1.3), a third wire through hole (1.4), a fourth wire through hole (1.5) and a fifth wire through hole (1.6) which are used for penetrating out a positive electrode power line and a negative electrode power line of the laser output optical fiber and a positive electrode signal line and a negative electrode signal line of a signal output line of the temperature sensor (4); four wire passing holes are formed in the bottom wall of the mounting groove (2.1), are opposite to the second wire passing hole (1.3), the third wire passing hole (1.4), the fourth wire passing hole (1.5) and the fifth wire passing hole (1.6), and are matched with each other in position for use and are used for threading corresponding cables.
5. The semiconductor laser module of claim 1, wherein: the semiconductor refrigerating sheet (3) is embedded in the bottom opening of the housing (1), and the mounting plate (1.1) is provided with a mounting hole (1.1.1).
6. The semiconductor laser module of claim 1, wherein: the semiconductor laser module is provided with a radiating fin, and the radiating fin is arranged on one side of the mounting plate (1.1) which is away from the housing (1); the heat radiation side of the semiconductor refrigerating sheet (3) is attached to the radiating sheet.
7. The semiconductor laser module of claim 1 or 5, wherein: the mounting plate (1.1) and the housing (1) adopt an integrated structure.
8. The semiconductor laser module of claim 1, wherein: one side of the semiconductor refrigerating sheet (3) attached to the heat dissipation copper block (2) is coated with heat conduction silicone grease; and one side, which is attached to the semiconductor refrigerating sheet (3), of the heat dissipation copper block (2) is coated with heat conduction silicone grease.
9. The semiconductor laser module of claim 1, wherein: a sixth wire through hole (1.7) and a seventh wire through hole (1.8) are arranged on the other side wall of the housing (1); the first wire through hole (1.2) and the sixth wire through hole (1.7) and the seventh wire through hole (1.8) are positioned on two opposite side walls of the housing (1); the seventh wire passing hole (1.8) and the sixth wire passing hole (1.7) are matched with the refrigeration piece positive power line (3.2) and the refrigeration piece negative power line (3.1) of the semiconductor refrigeration piece (3) for one-to-one penetrating out of the refrigeration piece positive power line (3.2) and the refrigeration piece negative power line (3.1).
10. The semiconductor laser module of claim 9, wherein: the tail ends of the positive power line (3.2) and the negative power line (3.1) of the refrigerating plate are provided with fast plugs (3.3) of the power line of the refrigerating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320140579.6U CN218919553U (en) | 2023-01-17 | 2023-01-17 | Semiconductor laser module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320140579.6U CN218919553U (en) | 2023-01-17 | 2023-01-17 | Semiconductor laser module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218919553U true CN218919553U (en) | 2023-04-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320140579.6U Active CN218919553U (en) | 2023-01-17 | 2023-01-17 | Semiconductor laser module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218919553U (en) |
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2023
- 2023-01-17 CN CN202320140579.6U patent/CN218919553U/en active Active
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