CN218888913U - Small-size fragment of brick power module structure - Google Patents
Small-size fragment of brick power module structure Download PDFInfo
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- CN218888913U CN218888913U CN202222838914.8U CN202222838914U CN218888913U CN 218888913 U CN218888913 U CN 218888913U CN 202222838914 U CN202222838914 U CN 202222838914U CN 218888913 U CN218888913 U CN 218888913U
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- radiator
- circuit board
- power module
- pin
- boss
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Abstract
The utility model discloses a small-size fragment of brick power module structure belongs to power module technical field. It includes radiator and circuit board, the corner department of radiator is provided with the boss that is higher than its bottom surface, the bottom fixedly connected with pin of boss, the edge of circuit board is seted up with the corresponding installation draw-in groove of pin, the radiator is glued with the circuit board through high heat conduction heat bonding and is connected, and when the radiator was connected with the circuit board, the pin was located installation draw-in groove. The utility model discloses an with the equipment mode of radiator pin, boss and PCB circuit board draw-in groove, the uniformity of height when can improving radiator installation PCB circuit board can guarantee the safe distance of PCB circuit board components and parts and radiator again to increase the effective usable floor area of PCB circuit board, low cost assembles simply moreover, and the operation of being convenient for can the wide application in all kinds of small-size fragment of brick power.
Description
Technical Field
The utility model relates to a small-size fragment of brick power module structure belongs to power module technical field.
Background
The power module has the outstanding advantages of small size, high power and the like, and the size of the power module is similar to that of a brick, so the power module is called a brick power supply. The small-sized brick power supply is one of the large-power and widely-used small-sized brick power supply modules;
at present, because the product power design demand of a small-sized brick power supply is increasingly greater, the density of components is increasingly higher, and the demand of volume miniaturization is increasingly inclined, the heat generated during corresponding work is also increased, in order to solve the heat dissipation problem, heat dissipation is carried out or transmitted to a heat dissipation device of a client through a heat radiator, so that the surface of a heat dissipation device is ensured to have enough flatness, the heat dissipation device can be effectively attached to the heat dissipation device of the client, and the safety distance between the heat radiator and the components is ensured, otherwise, the heat dissipation capacity of a power supply module is greatly reduced, and the safety distance between the components and the heat radiator cannot be ensured, so that the work efficiency and the service life of the power supply module are reduced; the traditional radiator adopts a screw fixing installation mode, so that the material cost and the production cost are increased, and the occupied space of the screws on the PCB is larger, so that the effective use area of the PCB is reduced.
Disclosure of Invention
The utility model discloses the technical problem that will solve lies in: the utility model provides a small-size fragment of brick power module structure, it has solved the uniformity problem of present power module fin equipment height and components and parts safe distance to and the effective usable floor area problem that traditional screw fixation mode reduced the PCB circuit board, and greatly reduced material cost and manufacturing cost.
The utility model discloses the technical problem that will solve takes following technical scheme to realize:
the utility model provides a small-size fragment of brick power module structure, includes radiator and circuit board, the corner department of radiator is provided with the boss that is higher than its bottom surface, the bottom fixedly connected with pin of boss, the edge of circuit board is seted up and is glued with the corresponding installation slot of pin, the radiator is glued with the circuit board through high heat conduction heat and is connected, when the radiator is connected with the circuit board, the pin is located installation slot.
As a preferred example, the boss, the pin and the mounting slot are all provided with three.
As a preferred example, the bosses are formed by bending on the heat sink.
As a preferred example, the height of the boss surface to the outer surface of the heat sink is uniform.
The utility model has the advantages that: the utility model discloses an with the equipment mode of radiator pin, boss and PCB circuit board draw-in groove, the uniformity of height when can improving radiator installation PCB circuit board can guarantee the safe distance of PCB circuit board components and parts and radiator again to increase the effective usable floor area of PCB circuit board, low cost assembles simply moreover, and the operation of being convenient for can the wide application in all kinds of small-size fragment of brick powers.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the heat sink of the present invention;
fig. 3 is an assembly effect diagram of the present invention.
In the figure: the heat radiator comprises a heat radiator 1, a boss 2, pins 3, a PCB 4, an installation clamping groove 41, high-heat-conductivity bonding glue 5 and a circuit board component 6.
Detailed Description
In order to understand the technical means, creation features, achievement purposes and functions of the present invention easily, the present invention will be further explained by combining with the specific drawings.
As shown in fig. 1-3, a small brick power module structure comprises a heat sink 1, a PCB 4, and a high thermal conductivity adhesive 5; three corners of the bottom surface of the radiator 1 are bent into a certain height and shape according to the height of the PCB circuit board component 6, namely bosses 2 higher than the bottom surface are formed at the three corners, the heights of the surfaces of the bosses 2 and the outer surface of the radiator 1 are consistent, the height consistency of the radiator 1 when the PCB circuit board 4 is installed is further improved, and the safety distance between the PCB circuit board component 6 and the radiator 1 is effectively ensured; the bosses 2 at the three corners are provided with pins 3, and the three corners of the PCB 4 are also provided with mounting slots 41; the pins 3 are inserted into the PCB mounting clamping grooves 41, the bosses 2 of the radiator 1 are clamped on the top surface of the PCB 4, and the high-heat-conductivity bonding glue 5 is arranged between the components 6 on the top surface of the PCB 4 and the radiating fins; the PCB 4 and the radiator 1 are fixed together through the bosses 2, the pins 3, the high-heat-conductivity adhesive 5 on the radiator 1 and the mounting clamping grooves 41 on the PCB 4.
This power module structure passes through boss 2 on the radiator 1, pin 3, draw-in groove 41 and high heat conduction adhesive 5 on the PCB circuit board 4, with PCB circuit board 4 and radiator 1 fixed together, convenient operation during the equipment, and PCB circuit board 4 generates heat the high heat conduction adhesive 5 of some between device and the radiator, this high heat conduction adhesive 5 chooses for use the model sold in the market, glue like the N-Sil series that moral gathering group sells, together fixed PCB circuit board 4 and radiator 1, strengthen power module's radiating effect simultaneously, improve power module's life.
The working principle is as follows: during the assembly, firstly, high heat conduction adhesive 5 is applied to the top surface heating component 6 of the PCB 4, then the pin 3 of the radiator 1 is correspondingly inserted into the mounting clamping groove 41 of the PCB 4, the assembly can be completed by pressing to the end, and the operation is convenient and fast.
The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A small-size fragment of brick power module structure, includes radiator (1) and circuit board (4), its characterized in that: the corner of radiator (1) is provided with boss (2) that are higher than its bottom surface, the bottom fixedly connected with pin (3) of boss (2), the edge of circuit board (4) is seted up with corresponding installation draw-in groove (41) of pin (3), radiator (1) is connected through high heat conduction bonding glue (5) with circuit board (4), when radiator (1) is connected with circuit board (4), pin (3) are located installation draw-in groove (41).
2. The structure of a compact brick power module as defined in claim 1, wherein: the bosses (2), the pins (3) and the mounting clamping grooves (41) are all three.
3. A compact brick power module construction as claimed in claim 2, wherein: the boss (2) is formed by bending the radiator (1).
4. A compact brick power module construction as claimed in claim 3, characterized in that: the height from the surface of the boss (2) to the outer surface of the radiator (1) is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222838914.8U CN218888913U (en) | 2022-10-27 | 2022-10-27 | Small-size fragment of brick power module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222838914.8U CN218888913U (en) | 2022-10-27 | 2022-10-27 | Small-size fragment of brick power module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218888913U true CN218888913U (en) | 2023-04-18 |
Family
ID=85944448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222838914.8U Active CN218888913U (en) | 2022-10-27 | 2022-10-27 | Small-size fragment of brick power module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218888913U (en) |
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2022
- 2022-10-27 CN CN202222838914.8U patent/CN218888913U/en active Active
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