CN218822752U

CN218822752U - Etching apparatus and etching system

Info

Publication number: CN218822752U
Application number: CN202223178167.6U
Authority: CN
Inventors: 刘志伟; 李健鹏; 吴侃
Original assignee: Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
Current assignee: Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
Priority date: 2022-11-24
Filing date: 2022-11-24
Publication date: 2023-04-07
Anticipated expiration: 2032-11-24

Abstract

The application discloses an etching device and an etching system, wherein the etching device comprises a cavity, a cathode assembly, a support rod, a first corrugated pipe, a cathode lifting assembly, a first vibration sensor and a display device, the cathode assembly is positioned in the cavity and is connected with the bottom of the cavity through the first corrugated pipe, the support rod is connected with the cathode assembly and penetrates through the first corrugated pipe to extend out of the cavity, and the cathode lifting assembly is positioned outside the cavity and is connected with the support rod and used for driving the cathode assembly to lift in the cavity through the support rod; the first vibration sensor is arranged on the cathode lifting assembly and used for detecting vibration of the cathode lifting assembly. According to the application, the etching device and the etching system can accurately detect the vibration condition of the cathode lifting assembly, so that a worker can timely process the cathode lifting assembly when the vibration is too large.

Description

Etching apparatus and etching system

Technical Field

The application relates to the technical field of semiconductor manufacturing, in particular to an etching device and an etching system.

Background

In an etching device (such as a sputtering etching device), when each wafer (wafer) enters and exits from a cavity, the wafer is carried by a cathode assembly to move up and down, and the cathode assembly is connected with the cavity through a corrugated pipe and is pushed by a cathode lifting assembly to move. Due to the fact that the corrugated pipe has certain resistance or due to the fact that the cathode lifting assembly is arranged, the cathode assembly can shake in the moving process, shaking of the cathode assembly can cause the etching device to be down, and even wafer fragments can be caused in serious conditions.

At present, a commonly adopted preventive measure for this problem is to manually sense the magnitude and the rising speed of the vibration before each PM (preventive maintenance) and record each time. Because the judgment is made manually, the judgment standard is inconsistent, and the judgment error may occur because everyone does not have a quantification standard for the vibration.

Improvements are therefore needed to at least partially address the above problems.

SUMMERY OF THE UTILITY MODEL

In the summary section a series of concepts in a simplified form is introduced, which will be described in further detail in the detailed description section. The inventive content does not imply any attempt to define the essential features and essential features of the claimed solution, nor is it implied to be intended to define the scope of the claimed solution.

In order to at least partially solve the above problems, according to a first aspect of the present invention, there is provided an etching apparatus comprising a chamber, a cathode assembly, a support rod, a first bellows, a cathode elevating assembly, a first vibration sensor;

the cathode assembly is positioned in the cavity and is connected with the bottom of the cavity through the first corrugated pipe, the support rod is connected with the cathode assembly and penetrates through the first corrugated pipe to extend out of the cavity, and the cathode lifting assembly is positioned outside the cavity and is connected with the support rod and used for driving the cathode assembly to lift in the cavity through the support rod;

the first vibration sensor is arranged on the cathode lifting assembly and used for detecting the vibration of the cathode lifting assembly.

Exemplarily, the cathode lifting assembly comprises a first cylinder, a second cylinder and a first connecting frame, the first cylinder and the second cylinder are fixedly connected with the first connecting frame, the first connecting frame is fixedly connected with the supporting rod, and an output shaft rod of the first cylinder and an output shaft rod of the second cylinder are both fixedly connected with the bottom of the chamber;

the first vibration sensor is disposed on one or more of the first cylinder, the second cylinder, and the first link.

Illustratively, the vibration sensor is adhesively secured to one or more of the first cylinder, the second cylinder, and the first attachment bracket.

Illustratively, the first vibration sensor is a piezoelectric vibration sensor, an eddy current vibration sensor, an inductive vibration sensor, a capacitive vibration sensor, a resistive vibration sensor, or an optoelectronic vibration sensor.

Exemplarily, the etching apparatus further comprises a lifting pin, a second connecting frame, a second bellows and a third cylinder, wherein a through hole matched with the lifting pin is formed in the cathode assembly, the lifting pin is inserted into the through hole and connected with the second connecting frame, the second connecting frame is connected with the bottom of the chamber through the second bellows, and an output shaft rod of the third cylinder penetrates through the second bellows to be connected with the second connecting frame.

Exemplarily, the etching apparatus further comprises a second vibration sensor disposed on the third cylinder for detecting a vibration of the third cylinder.

Illustratively, the second vibration sensor is adhesively fixed to the third cylinder.

Illustratively, the second vibration sensor is a piezoelectric vibration sensor, an eddy current vibration sensor, an inductive vibration sensor, a capacitive vibration sensor, a resistive vibration sensor, or an optoelectronic vibration sensor.

Exemplarily, the etching apparatus further comprises a display device and/or an alarm device;

the display device is connected with the first vibration sensor and/or the second vibration sensor and is used for displaying the detection result of the first vibration sensor and/or the second vibration sensor;

the alarm device is connected with the first vibration sensor and/or the second vibration sensor and used for sending alarm information when the detection result of the first vibration sensor exceeds a first preset range and/or when the detection result of the second vibration sensor exceeds a second preset range.

Illustratively, the display device includes: the device comprises a first interface board, a first control signal board, a second interface board, a second control signal board and an analog signal board;

the first interface board is used for connecting the first vibration sensor and the first control signal board;

the first control signal board is used for receiving a first output signal of the first vibration sensor through the first interface board;

the second interface board is used for connecting the second vibration sensor and the second control signal board;

the second control signal board is used for receiving a second output signal of the second vibration sensor through the second interface board;

the analog signal board with first control signal board with the second control signal board is connected, just the analog signal board includes the display screen, the analog signal board is used for passing through the display screen is right first output signal with the second output signal shows.

Illustratively, the alarm device comprises a controller and an alarm unit connected with the controller, wherein the alarm unit comprises a loudspeaker and/or an indicator light.

According to a second aspect of the present invention, there is provided an etching system, comprising:

the etching apparatus, the plant automation system, and the fault detection and classification system as described above;

the equipment automation system is connected with the etching device and the fault detection and classification system and is used for acquiring a detection result of the first vibration sensor and sending the detection result to the fault detection and classification system;

the fault detection and classification system is used for displaying the detection result of the first vibration sensor.

According to the utility model discloses an etching device and etching system through set up vibration sensor on wafer lifting unit, can accurately detect negative pole lifting unit's vibration condition to can carry out more accurate analysis to its vibration condition, so that in time handle when the vibration is too big, ensure the safety of wafer and the steady operation of device.

Drawings

The following drawings of the present application are included to provide an understanding of the present application. The drawings illustrate embodiments of the application and their description, serve to explain the principles and apparatus of the application. In the drawings, there is shown in the drawings,

FIG. 1 is a schematic cross-sectional view of an etching apparatus according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional view of an etching apparatus according to an embodiment of the present application.

Description of reference numerals:

100-chamber, 200-cathode assembly, 300-first bellows, 400-support rod, 500-cathode elevating assembly, 510-first cylinder, 511-output shaft, 520-second cylinder, 521-output shaft, 530-first connecting frame, 540-screw, 550-screw, 600-first vibration sensor, 710-elevating pin, 720-second connecting frame, 730-second bellows, 740-third cylinder, 741-output shaft, 800-second vibration sensor.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art, that the present application may be practiced without one or more of these specific details. In other instances, well-known features of the art have not been described in order to avoid obscuring the present application.

It is to be understood that the present application is capable of implementation in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

Spatial relational terms such as "under," "below," "under," "above," "over," and the like may be used herein for convenience in describing the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

Embodiments of the invention are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the application. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the present application should not be limited to the particular shapes shown herein, but are to include deviations in shapes that result, for example, from manufacturing. Thus, the illustrations shown in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a device and are not intended to limit the scope of the present application.

An etching apparatus according to an embodiment of the present application, which may be a sputter etching apparatus, including a chamber 100, a cathode assembly 200, a support rod 400, a first bellows 300, a cathode elevating assembly 500, and a first vibration sensor 600, is exemplarily illustrated with reference to fig. 1 and 2.

The chamber 100 is a vacuum chamber. Which may be coupled to and in fluid communication with a vacuum system including a throttle valve and a vacuum pump for evacuating the chamber 100. The pressure within the chamber 100 may be controlled by adjusting a throttle valve and/or a vacuum pump. The chamber 100 may also be connected to and in fluid communication with a gas supply, which may be used to supply one or more process gases, such as argon, into the chamber 100 for the etching process.

A cathode assembly 200 is disposed in the chamber 100 and is used to carry a wafer. The cathode assembly 200 may include an electrostatic chuck and a cathode. The cathode assembly 200 is connected to the bottom of the chamber 100 by a first bellows 300. The first bellows 300 is used to provide a flexible seal so that no vacuum loss occurs in the chamber 100 when the cathode assembly 200 is lifted and lowered in the chamber 100. The support rod 400 is connected to the cathode assembly 200 and extends out of the chamber 100 through the first bellows 300, and the cathode lifting assembly 500 is located outside the chamber 100 and connected to the support rod 400, for driving the cathode assembly 200 to lift in the chamber 100 by the support rod 400 and driving the wafer thereon to lift when the cathode assembly 200 is lifted.

In the embodiment of the present application, the cathode elevating assembly 500 includes a first cylinder 510, a second cylinder 520, and a first link frame 530. The first cylinder 510 and the second cylinder 520 are fixedly connected to the first connecting frame 530, and specifically, the first cylinder 510 and the second cylinder 520 may be fixedly connected to the first connecting frame 530 by a screw 540 and a screw 550, respectively. The first connecting frame 530 is fixedly connected to the supporting rod 400, for example, by a screw connection or other suitable means. The output shaft 511 of the first cylinder 510 and the output shaft 521 of the second cylinder 520 are both fixedly connected to the bottom of the chamber 100. It should be noted that the output shaft 511 of the first cylinder 510 and the output shaft 521 of the second cylinder 520 are not connected to the connecting plate, and through holes with a diameter larger than that of the output shaft 511 and the output shaft 521 may be provided on the connecting plate, so that the output shaft 511 and the output shaft 521 can pass through the through holes. Output shaft 511 and output shaft 521 are parallel to support bar 400. The first cylinder 510 and the second cylinder 520 are used for operating synchronously to drive the first connecting frame 530 to move up and down, and the cathode assembly 200 is driven by the support rod 400 to lift up and down in the chamber 100 when the first connecting frame 530 moves up and down. In other embodiments, the cathode lifting assembly 500 may be a ball screw transmission structure or other suitable structure capable of driving the support rod 400 to lift the cathode assembly 200 in the chamber 100.

The first vibration sensor 600 is disposed on the cathode elevating assembly 500 for detecting vibration of the cathode elevating assembly 500. The first vibration sensor 600 may be a piezoelectric vibration sensor, an eddy current vibration sensor, an inductive vibration sensor, a capacitive vibration sensor, a resistive vibration sensor, or a photoelectric vibration sensor, which may be flexibly selected by a person skilled in the art as needed.

In the present embodiment, the first vibration sensor 600 is bonded to the second cylinder 520. In other embodiments, one or more of the first vibration sensors 600 may be bonded or fixed to one or more of the first cylinder 510, the second cylinder 520, and the first connecting frame 530 by other suitable fixing methods, as long as they can detect the vibration of the cathode lifting assembly 500. Through the setting of first vibration sensor 600, can accurately detect the vibration condition of negative pole lifting unit 500 to in time handle when the vibration is too big, the safety of guarantee wafer and the steady operation of device.

In the embodiment of the present application, the etching apparatus further includes a display device, and the display device is connected to the first vibration sensor 600 and is configured to display a detection result of the first vibration sensor 600. Specifically, the display device may display the detection result of the first vibration sensor 600 in a form of a numerical value or a graph, so that the vibration condition of the cathode lifting assembly 500 (i.e., the cathode assembly 200) is visualized, and a worker can visually know the vibration condition, and timely control the device to stop working and perform corresponding inspection processing when the vibration condition is too large, so as to control the vibration within a reasonable range, thereby ensuring the safety of the wafer and the stable operation of the device. The display device may include a first interface board (interface board), a first control signal board (controller IO), and an analog signal board (AI/O board). The first interface board is used for connecting the first vibration sensor 600 and the first control signal board, the first control signal board is used for receiving the first output signal of the first vibration sensor 600 through the first interface board, the analog signal board is connected with the first control signal board, the analog signal board comprises a display screen, and the analog signal board is used for displaying the first output signal through the display screen. In the embodiment of the present application, the first output signal may be a voltage signal, and the first vibration actuator may output a voltage at a preset time interval, and the larger the vibration is, the larger the output voltage is. The module signal board can be provided with a control device such as a single chip microcomputer, and the control device can control a display screen to display the voltage in a numerical value or a graph mode. The larger the vibration is, the larger the variation in the voltage value displayed on the display screen is, and the larger the fluctuation of the voltage curve in the graph displayed on the screen is, so that the worker can intuitively understand the vibration condition through the display screen. In the embodiment of the application, the first interface board, the first control signal board and the analog signal board can be the existing circuit board in the etching device, so that the cost can be effectively reduced. In other embodiments, the display device may be a display device such as an oscilloscope or a voltmeter that can display the output signal of the first vibration sensor 600.

In some embodiments, the display device described above may be replaced with an alarm device. The alarm device is connected with the first vibration sensor 600 and used for sending alarm information when the detection result of the first vibration sensor 600 exceeds a first preset range so as to remind a worker to process in time. Specifically, the alarm device may include a controller and an alarm unit connected to the controller, and the controller may be a single chip microcomputer or other suitable device with calculation processing capability, and is configured to determine whether a detection result of the first vibration sensor 600 (for example, a voltage output by the first vibration sensor 600) exceeds a first preset range, which is a range in which the detection result of the first vibration sensor 600 is located when the vibration of the cathode lifting assembly 500 is within a reasonable range, and may be preset in the controller by a person skilled in the art. The alarm unit may include a speaker and/or an indicator light, and the controller may control the speaker and/or the indicator light to emit sound alarm information and/or light alarm information when it is determined that the detection result of the first vibration sensor 600 is out of the first preset range (i.e., when the vibration of the cathode lifting assembly 500 is out of the reasonable range). In some embodiments, the etching apparatus may be provided with the above-mentioned display device and the alarm device at the same time.

Fig. 2 shows a schematic cross-sectional view of an etching apparatus (i.e., the etching apparatus in fig. 1) in another cross-sectional direction in an embodiment of the present application, wherein the cathode lifting assembly 500 is not shown in fig. 2. Referring to fig. 2, in the embodiment of the present application, the etching apparatus further includes a lift pin 710, a second link frame 720, a second bellows 730, and a third cylinder 740. The lift pins 710, the second coupling frame 720, and the second bellows 730 are disposed in the chamber 100. The cathode assembly 200 is provided with a through hole matching with the lift pin 710, the through hole penetrates through the cathode assembly 200, the upper end of the through hole is positioned below the wafer, and the lift pin 710 is inserted into the through hole and connected with the second connecting frame 720. The second coupling frame 720 is coupled to the bottom of the chamber 100 by a second bellows 730. An output shaft 741 of the third cylinder 740 passes through the second bellows 730 to be connected to the second connecting frame 720. The third cylinder 740 is used for driving the second connecting frame 720 to move up and down in the chamber 100 through the output shaft 742, and the second connecting frame 720 drives the lifting pin 710 to move up and down in the through hole, so as to drive the wafer to lift. Because the second bellows 730 has a certain resistance, the third cylinder 740 may also shake when the lifting pin 710 is driven by the second connecting frame 720 to move up and down, and the shaking may cause the etching apparatus to malfunction, and may even cause wafer fragments in severe cases.

In the present embodiment, the etching apparatus further includes a second vibration sensor 800. The second vibration sensor 800 is disposed on the third cylinder 740, and specifically, the second vibration sensor 800 is adhesively fixed on the third cylinder 740 and is configured to detect vibration of the third cylinder 740. The second vibration sensor 800 is a piezoelectric vibration sensor, an eddy current vibration sensor, an inductive vibration sensor, a capacitive vibration sensor, a resistive vibration sensor, or a photoelectric vibration sensor, and those skilled in the art can flexibly select the vibration sensor according to the need. Through the arrangement of the second vibration sensor 800, the vibration condition of the third cylinder 740 (the second connecting frame 720 and the lifting pin 710) can be accurately detected, so that the vibration can be timely processed when the vibration is too large, and the safety of the wafer and the stable operation of the device can be guaranteed. In some embodiments, only the first vibration sensor 600 may be provided without the second vibration sensor 800 within the etching apparatus.

In the embodiment of the present application, the display device is connected to the second vibration sensor 800, and is configured to display a detection result of the second vibration sensor 800. The display device further includes: the second interface board is used for connecting the second vibration sensor 800 and the second control signal board, the second control signal board is used for receiving a second output signal of the second vibration sensor 800 through the second interface board, and the analog signal board is connected with the second control signal board and used for displaying the second output signal through the display screen. In the embodiment of the present application, the second output signal may be a voltage signal, and the second vibration actuator may output a voltage at a preset time interval, and the larger the vibration is, the larger the output voltage is. The module signal board can be provided with a control device such as a single chip microcomputer, and the control device can control a display screen to display the voltage in a numerical value or a graph mode. In the embodiment of the application, the analog signal plate can be connected with the plurality of vibration sensors through the plurality of interface boards and the plurality of control signal plates so as to simultaneously display the detection results of the plurality of vibration sensors. In some embodiments, the display device may be configured to be connected to only one of the first vibration sensor 600 and the second vibration sensor 800 to display the detection result of the first vibration sensor 600 or the detection result of the second vibration sensor 800.

In some embodiments, when the display device is replaced with the alarm device described above, the alarm device may be connected to the second vibration sensor 800 on the basis of being connected to the first vibration sensor 600, and is configured to send out alarm information when the detection result of the second vibration sensor 800 exceeds a second preset range, so as to remind a worker to perform processing in time. The second preset range is a range in which the detection result of the second vibration sensor 800 is located when the vibration of the third cylinder 740 is in a reasonable range, and may be preset in the controller by a person skilled in the art. The controller in the alarm device may control the speaker and/or the indicator light to emit sound alarm information and/or light alarm information when determining that the detection result of the second vibration sensor 800 exceeds the second preset range (i.e., when the vibration of the third cylinder 740 exceeds the reasonable range). In some embodiments, an alarm device may be connected to only one of the first vibration sensor 600 and the second vibration sensor 800 to give an alarm message when the detection result of the first vibration sensor 600 is out of a first preset range, or to give an alarm message when the detection result of the second vibration sensor 800 is out of a second preset range. In some embodiments, the etching apparatus may be provided with the above-mentioned display device and the alarm device at the same time.

The present application further provides an etching system, which includes the etching apparatus, an Equipment Automation system (EAP), and a Fault Detection and Classification system (FDC) as described above.

In the embodiment of the present application, the equipment automation system is connected to the etching apparatus and the fault detection and classification system, and is configured to obtain the detection results of the first vibration sensor 600 and the second vibration sensor 800 (and the SVID (system manufacturer identification code) of the control signal board corresponding to the detection results) and send the detection results to the fault detection and classification system. The fault detection and classification system is used for displaying the detection results of the first vibration sensor 600 and the second vibration sensor 800 so that workers can intuitively know the vibration conditions. The fault detection and classification system may include a processor, a memory, a communication module, a display, an input/output device, etc., which may display the detection results of the first vibration sensor 600 and the second vibration sensor 800 through the display thereof. In some embodiments, the plant automation system may only obtain the detection result of the first vibration sensor 600 (or the detection result of the second vibration sensor 800) and send it to the fault detection and classification system. The failure detection and classification system displays the detection result of the first vibration sensor 600 (or the detection result of the second vibration sensor 800).

In some embodiments, a suitable range (e.g., a suitable voltage range) of the detection results may be set in the fault detection and classification system, and when the detection results of the one or more vibration sensors are out of the range, the fault detection and classification system sends an alarm signal to the plant automation system, and the plant automation system controls the corresponding etching apparatus to stop operating after receiving the alarm signal. Therefore, the etching system can realize real-time detection of the vibration condition and control the etching device to stop working at the first time when the abnormal vibration is detected so as to ensure the safety of the wafer and the device.

Although the example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the above-described example embodiments are merely illustrative and are not intended to limit the scope of the present application thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.

In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

Similarly, it should be appreciated that in the description of exemplary embodiments of the present application, various features of the present application are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the application and aiding in the understanding of one or more of the various inventive aspects. However, the method of the present application should not be construed to reflect the intent: this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this application.

It will be understood by those skilled in the art that all of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where such features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

It should be noted that the above-mentioned embodiments illustrate rather than limit the application, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. The etching device is characterized by comprising a chamber, a cathode assembly, a support rod, a first corrugated pipe, a cathode lifting assembly and a first vibration sensor;

2. The etching apparatus according to claim 1,

the cathode lifting assembly comprises a first air cylinder, a second air cylinder and a first connecting frame, the first air cylinder and the second air cylinder are fixedly connected with the first connecting frame, the first connecting frame is fixedly connected with the supporting rod, and an output shaft lever of the first air cylinder and an output shaft lever of the second air cylinder are fixedly connected with the bottom of the cavity;

3. The etching apparatus according to claim 2,

the vibration sensor is bonded and fixed on one or more of the first cylinder, the second cylinder and the first connecting frame.

4. The etching apparatus according to claim 1,

the first vibration sensor is a piezoelectric vibration sensor, an eddy current type vibration sensor, an inductive vibration sensor, a capacitive vibration sensor, a resistive vibration sensor or a photoelectric vibration sensor.

5. The etching apparatus according to any one of claims 1 to 4,

the etching device further comprises a lifting pin, a second connecting frame, a second corrugated pipe and a third air cylinder, wherein a through hole matched with the lifting pin is formed in the cathode assembly, the lifting pin is inserted into the through hole and connected with the second connecting frame, the second connecting frame is connected with the bottom of the cavity through the second corrugated pipe, and an output shaft rod of the third air cylinder penetrates through the second corrugated pipe and is connected with the second connecting frame.

6. The etching apparatus according to claim 5,

the etching device further comprises a second vibration sensor, wherein the second vibration sensor is arranged on the third cylinder and used for detecting the vibration of the third cylinder.

7. The etching apparatus according to claim 6,

and the second vibration sensor is fixedly bonded on the third cylinder.

8. The etching apparatus according to claim 6,

the second vibration sensor is a piezoelectric vibration sensor, an eddy current type vibration sensor, an inductive vibration sensor, a capacitive vibration sensor, a resistive vibration sensor or a photoelectric vibration sensor.

9. The etching apparatus according to claim 6,

the etching device further comprises a display device and/or an alarm device;

10. The etching apparatus according to claim 9,

the display device includes: the system comprises a first interface board, a first control signal board, a second interface board, a second control signal board and an analog signal board;

11. The etching apparatus according to claim 9,

the alarm device comprises a controller and an alarm unit connected with the controller, wherein the alarm unit comprises a loudspeaker and/or an indicator light.

12. An etching system, comprising:

the etching apparatus, the plant automation system, and the fault detection and classification system as claimed in any one of claims 1 to 11;