CN218772011U - Low-noise amplifier and quantum measurement and control system - Google Patents
Low-noise amplifier and quantum measurement and control system Download PDFInfo
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- CN218772011U CN218772011U CN202222823106.4U CN202222823106U CN218772011U CN 218772011 U CN218772011 U CN 218772011U CN 202222823106 U CN202222823106 U CN 202222823106U CN 218772011 U CN218772011 U CN 218772011U
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Abstract
The application provides a low noise amplifier and quantum system of observing and controling belongs to the low noise amplifier field, especially the quantum measurement field, include: a metal base; the PCB is fixed on the metal base and is provided with a multi-stage signal amplification circuit; the metal cover plate is covered above the PCB and is detachably connected with the metal base; the PCB comprises a PCB board, a metal cover plate and a plurality of first grooves, wherein one surface of the metal cover plate, which faces the PCB board, is provided with a plurality of first grooves which are isolated from each other, and each first groove is used for accommodating one stage of the signal amplifying circuit. The method and the device can reduce the spatial coupling and interference of the microwave signals in the low-noise amplifier.
Description
Technical Field
The application belongs to the field of low-noise amplifiers, particularly relates to the field of quantum measurement, and particularly relates to a low-noise amplifier and a quantum measurement and control system.
Background
The low noise amplifier is an amplifier with a very low noise coefficient, and is generally used as a high frequency or intermediate frequency preamplifier of various radio receivers and an amplifying circuit of a high-sensitivity electronic detection device. In the occasion of amplifying weak signals, compared with a common amplifier, the low-noise amplifier has weaker interference of self noise on the signals, and can improve the signal-to-noise ratio of output signals.
In a quantum computer, reading the state of a quantum bit on a quantum processor is based on the principle of dispersion frequency shift, and by applying a very weak detection signal to an optical field, the number of photons in the optical field is low enough to reduce the influence of the optical field and the detection signal on the quantum bit to a negligible degree, thereby realizing the nondestructive reading of the quantum bit by the optical field. However, since the detection signal is very weak, the microwave signal output by the qubit is also very weak, and in order to enable the microwave detection device at room temperature to measure the microwave signal, the microwave signal output by the qubit needs to be amplified by using a multi-stage low-noise amplifier; the frequency of the microwave signal output by the qubit is very high and is in a gigahertz frequency band, and the working frequency band of the low-noise amplifier is also in the gigahertz frequency band.
In the existing low noise amplifier working in a high frequency band, when microwave signals are transmitted between multistage amplification circuits, spatial coupling occurs, so that electromagnetic interference is serious, the noise coefficient of the low noise amplifier can be increased, the signal-to-noise ratio of output signals is reduced, and reading of the microwave signals output by qubits is further influenced.
Therefore, it is necessary to provide a new low noise amplifier to solve the problem of electromagnetic interference in the multi-stage amplifying circuit.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a low-noise amplifier and a quantum measurement and control system, so that the defect of serious electromagnetic interference among multistage amplification circuits in the prior art is overcome, and the spatial coupling and interference of microwave signals transmitted in the low-noise amplifier are reduced.
The technical scheme of the application is as follows:
an aspect of the present application provides a low noise amplifier, including:
a metal base;
the PCB is fixed on the metal base and is provided with a multi-stage signal amplification circuit;
the metal cover plate is covered above the PCB and is detachably connected with the metal base;
the PCB comprises a PCB board, a metal cover plate and a plurality of first grooves, wherein one surface of the metal cover plate, which faces the PCB board, is provided with a plurality of first grooves which are isolated from each other, and each first groove is used for accommodating one stage of the signal amplifying circuit.
In the low noise amplifier, preferably, the metal base includes a first metal plate and second metal plates located on two opposite sides of the first metal plate and fixed perpendicular to the first metal plate; wherein, the PCB board is fixed on the first metal plate.
In the above low noise amplifier, preferably, the second metal plate is provided with a first through hole, the first through hole is used for fixing a signal connector, and the signal connector is electrically connected to the signal amplifying circuit.
Preferably, in the low noise amplifier as described above, a second groove is formed in a surface of the first metal plate facing the PCB along an extending direction of the signal amplification circuit, and the second groove is used for accommodating a power circuit for providing a power signal for the signal amplification circuit.
In the above low noise amplifier, preferably, a third groove communicated with the second groove is formed in the first metal plate in a direction perpendicular to the second groove, and the third groove extends to the edge of the first metal plate.
The low noise amplifier as described above, preferably, further comprises an integrated connector, and the integrated connector is received in the third groove.
Preferably, the metal cover plate and the PCB plate are provided with a plurality of second through holes at corresponding positions, and the metal base is provided with a first threaded hole at a position corresponding to the second through hole on a surface facing the PCB plate.
In the above low noise amplifier, preferably, a plurality of second threaded holes are formed in a surface of the metal base, which is away from the PCB.
As described above for the low noise amplifier, preferably, the material of each of the metal base and the metal cover includes oxygen-free copper.
The application also provides a quantum measurement and control system, which comprises a measurement device and a quantum processor which are connected through a measurement line, wherein the measurement line is provided with any one of the low-noise amplifiers.
Compared with the prior art, the method has the following beneficial effects:
the low-noise amplifier comprises a metal base and a metal cover plate which are detachably connected, wherein a multi-stage signal amplification circuit PCB is fixedly arranged on the metal base, and the multi-stage signal amplification circuits are sequentially connected; the metal cover plate covers the upper portion of the PCB, a plurality of first grooves which are mutually isolated are formed in one surface, facing the PCB, of the metal cover plate, and each first groove is used for containing one stage of the signal amplification circuit, so that mutual isolation among all stages of the signal amplification circuits is guaranteed, and spatial coupling and interference of microwave signals are reduced.
Drawings
Fig. 1 is a schematic structural diagram 1 of a low noise amplifier according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a low noise amplifier according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram 1 of a metal base according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a metal base according to an embodiment of the present disclosure 2;
fig. 5 is a schematic assembly structure diagram of a low noise amplifier according to an embodiment of the present disclosure;
fig. 6 is a schematic bottom structure diagram of a metal base according to an embodiment of the present application.
Description of the reference numerals:
1-metal base, 2-PCB board, 3-metal cover board, 4-signal connector, 5-integrated connector,
11-a first metal plate, 12-a second metal plate, 13-a first threaded hole, 14-a second threaded hole, 23-a second through hole, 31-a first groove,
111-second recess, 112-third recess, 121-first via.
Detailed Description
The following detailed description is merely illustrative and is not intended to limit the embodiments and/or the application or uses of the embodiments. Furthermore, there is no intention to be bound by any expressed or implied information presented in the preceding "background" or "detailed description" sections.
To further clarify the objects, aspects and advantages of embodiments of the present application, one or more embodiments are now described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a more thorough understanding of one or more embodiments. It may be evident, however, that one or more embodiments may be practiced without these specific details in various instances, and that the various embodiments are incorporated by reference into each other without departing from the scope of the present disclosure.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be implemented in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In a quantum computer, the state of reading a quantum bit is based on the principle of dispersion frequency shift, and a very weak detection signal is applied to an optical field, so that the number of photons in the optical field is low enough, the influence of the optical field and the detection signal on the quantum bit is reduced to a negligible degree, and the non-destructive reading of the optical field on the quantum bit is further realized. The detection signal is very weak, the microwave signal output by the qubit is also very weak, and the signal power is generally reduced to below-100 dBm; commercial instruments at room temperature can measure microwave signals of about-20 dBm, so that a low-noise amplifier is required to amplify microwave signals output by qubits, and a cascade of multi-stage low-noise amplifiers is required to amplify the microwave signals. In addition, the frequency of the microwave signal output by the qubit is very high, and is in a gigahertz frequency band, and the working frequency band of the low-noise amplifier is also in a gigahertz frequency band, which may cause electromagnetic interference between the multistage low-noise amplifiers, increase the noise coefficient of the low-noise amplifier itself, reduce the signal-to-noise ratio of the output signal, and affect the measurement of the microwave signal output by the qubit.
Referring to fig. 1 and 2, an embodiment of the present application provides a low noise amplifier, which includes a metal base 1; the PCB 2 is fixed on the metal base 1, and a multi-stage signal amplifying circuit is arranged on the PCB 2; the metal cover plate 3 is covered above the PCB 2 and is detachably connected with the metal base 1; one surface of the metal cover plate 3 facing the PCB 2 is provided with a plurality of first grooves 31 isolated from each other, and each first groove 31 is used for accommodating one stage of the signal amplification circuit.
As shown in fig. 3 and 4, as an implementation manner of the embodiment of the present application, the metal base 1 includes a first metal plate 11, and second metal plates 12 located on two opposite sides of the first metal plate 11 and fixed perpendicular to the first metal plate 11; wherein, the PCB board 2 is fixed on the first metal plate 11; the second metal plate 12 is provided with a first through hole 121, the first through hole 121 is used for fixing the signal connector 4, and the signal connector 4 is electrically connected with the signal amplifying circuit.
The metal base 1 is in a U shape, and the first metal plate 11 in the middle is a planar support plate for fixing the PCB 2. The two opposite sides of the first metal plate 11 are fixedly connected with a second metal plate 12, the second metal plates 12 on the two sides are provided with first through holes 121 for fixing the signal connectors 4, and the signal connectors 4 on the two sides are used as signal input ports and signal output ports to be electrically connected with a first-stage signal amplifying circuit and a last-stage signal amplifying circuit on the PCB respectively. The first metal plate 11 and the second metal plate 12 are vertically connected, and can be integrally formed in a machining mode in specific implementation, so that the structure is compact, the metal cover plate 3 is convenient to assemble, and the sealing performance is high.
As shown in fig. 3, as an implementation manner of the embodiment of the present application, a second groove 111 is formed on one surface of the first metal plate 11 facing the PCB 2 along an extending direction of the signal amplifying circuit, and the second groove 111 is used for accommodating a power circuit for providing a power signal for the signal amplifying circuit. The multi-stage signal amplifying circuit on the PCB 2 is a circuit unit formed by active devices, and the power circuit providing power for the active devices is disposed on a surface of the PCB 2 away from the signal amplifying circuit and is accommodated in the second groove 111, so as to reduce electromagnetic interference between the power circuit and the signal amplifying circuit.
Referring to fig. 3 and 4, a third groove 112 communicated with the second groove 111 is formed in the first metal plate 11 in a direction perpendicular to the second groove 111, and the third groove 112 extends to the edge of the first metal plate 11. The third recess 112 is used for accommodating the integrated connector 5. A third groove 112 is formed in the first metal plate 11 along a direction from the vertical direction to the edge of the second groove 111, and is used for accommodating the integrated connector 5. The integrated connector 5 is connected with an external power supply and provides a power supply signal for the active element of the signal amplifying circuit through the power supply circuit, so that the normal work of the signal amplifying circuit is ensured.
As shown in fig. 5, as an implementation manner of the embodiment of the present application, a plurality of second through holes 23 are respectively formed in corresponding positions on the metal cover plate 3 and the PCB 2, and a first threaded hole 13 is formed in a position, corresponding to the second through hole 23, of one surface of the metal base 1 facing the PCB 2. The metal cover plate 3 and the metal base 1 are detachably connected through fixing modes such as screws or bolts, longer bolts or screws are adopted to penetrate through the PCB 2, the metal cover plate 3 and the metal base 1 are assembled, meanwhile, the PCB 2 is fixed on the metal base 1, and assembly is convenient.
In addition, as shown in fig. 6, a plurality of second threaded holes 14 are formed in a surface of the metal base 1 away from the PCB 2 for fixing the low noise amplifier. The low noise amplifier is usually assembled and then fixed in the measuring line via the second threaded hole 14.
As an implementation manner of the embodiment of the present application, the material of the metal base 1 and the metal cover plate 3 both include oxygen-free copper. The low-noise amplifier is applied to a quantum measurement circuit, the working environment is an extremely low temperature environment in a dilution refrigerator, and the requirement on heat dissipation performance is high. The metal base 1 and the metal cover plate 3 are made of oxygen-free copper, have good heat conduction characteristics, and can timely transfer heat generated by the low-noise amplifier during working to a refrigerating plate of a dilution refrigerator, so that the heat is prevented from being transferred to a quantum processor, and the performance of quantum bits on the quantum processor is influenced.
Based on the same application concept, the embodiment of the application provides a quantum measurement and control system which comprises a measurement device and a quantum processor which are connected through a measurement line, wherein any one of the low noise amplifiers is arranged on the measurement line.
The construction, features and functions of the present application have been described in detail and illustrated in the drawings, the present application is not limited to the embodiments, but rather the invention is intended to cover all modifications, equivalents and equivalents falling within the spirit and scope of the present application.
Claims (10)
1. A low noise amplifier, comprising:
a metal base;
the PCB is fixed on the metal base and is provided with a multi-stage signal amplification circuit;
the metal cover plate is covered above the PCB and is detachably connected with the metal base;
the PCB comprises a PCB board, a metal cover plate and a plurality of first grooves, wherein one surface of the metal cover plate, which faces the PCB board, is provided with a plurality of first grooves which are isolated from each other, and each first groove is used for accommodating one stage of the signal amplifying circuit.
2. The low noise amplifier according to claim 1, wherein the metal base includes a first metal plate, and second metal plates disposed on opposite sides of the first metal plate and fixed perpendicular to the first metal plate; the PCB is fixed on the first metal plate.
3. The lna of claim 2, wherein the second metal plate has a first through hole for fixing a signal connector, and the signal connector is electrically connected to the signal amplifier circuit.
4. The lna of claim 2, wherein the first metal plate has a second groove along the extension direction of the signal amplifier circuit on a surface facing the PCB, and the second groove is configured to accommodate a power circuit for providing a power signal to the signal amplifier circuit.
5. The LNA of claim 4, wherein the first metal plate is provided with a third groove in a direction perpendicular to the second groove, the third groove communicating with the second groove, and the third groove extends to the edge of the first metal plate.
6. The low noise amplifier of claim 5, further comprising an integrated connector received in the third recess.
7. The LNA of claim 1, wherein the metal cover plate and the PCB are provided with a plurality of second through holes at corresponding positions, and one surface of the metal base facing the PCB is provided with first threaded holes at corresponding positions of the second through holes.
8. The LNA of claim 1, wherein one side of the metal base, which is far away from the PCB board, is provided with a plurality of second threaded holes.
9. The low noise amplifier of claim 1, wherein the material of the metal base and the metal cover each comprises oxygen free copper.
10. A quantum measurement and control system comprising a measurement device and a quantum processor connected by a measurement line on which a low noise amplifier according to any one of claims 1 to 9 is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222823106.4U CN218772011U (en) | 2022-10-25 | 2022-10-25 | Low-noise amplifier and quantum measurement and control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222823106.4U CN218772011U (en) | 2022-10-25 | 2022-10-25 | Low-noise amplifier and quantum measurement and control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218772011U true CN218772011U (en) | 2023-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222823106.4U Active CN218772011U (en) | 2022-10-25 | 2022-10-25 | Low-noise amplifier and quantum measurement and control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218772011U (en) |
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2022
- 2022-10-25 CN CN202222823106.4U patent/CN218772011U/en active Active
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