CN216290848U - Low-noise amplifier, quantum measurement and control system and quantum computer - Google Patents
Low-noise amplifier, quantum measurement and control system and quantum computer Download PDFInfo
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- CN216290848U CN216290848U CN202122391199.3U CN202122391199U CN216290848U CN 216290848 U CN216290848 U CN 216290848U CN 202122391199 U CN202122391199 U CN 202122391199U CN 216290848 U CN216290848 U CN 216290848U
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Abstract
The utility model provides a low noise amplifier, a quantum measurement and control system and a quantum computer, wherein the low noise amplifier comprises: a metal body having a first chamber and a second chamber; a first PCB board with an amplifying circuit, disposed in the first chamber; and the second PCB with a power supply circuit is arranged in the second chamber, and the power supply circuit is used for supplying power to the amplifying circuit. According to the technical scheme, the first PCB with the amplifying circuit and the second PCB with the power circuit are respectively arranged in the first cavity and the second cavity of the metal main body, so that electromagnetic interference of the power circuit to the amplifying circuit is avoided, the noise coefficient of the low-noise amplifier is reduced, the signal-to-noise ratio of an output signal is improved, the performance of the low-noise amplifier is improved, and the amplification of microwave signals emitted by the qubit reading cavity can be met.
Description
Technical Field
The utility model belongs to the technical field of quantum chip testing, and particularly relates to a low-noise amplifier, a quantum measurement and control system and a quantum computer.
Background
The low noise amplifier is an amplifier with a very low noise coefficient, and is generally used as a high frequency or intermediate frequency preamplifier of various radio receivers and an amplifying circuit of a high-sensitivity electronic detection device. In the occasion of amplifying weak signals, compared with a common amplifier, the low-noise amplifier has weaker interference of self noise on the signals, and can improve the signal-to-noise ratio of output signals.
In a quantum computer, the state of reading a quantum bit is based on the principle of dispersion frequency shift, and a very weak detection signal is applied to an optical field, so that the number of photons in the optical field is low enough, the influence of the optical field and the detection signal on the quantum bit is reduced to a negligible degree, and the non-destructive reading of the optical field on the quantum bit is further realized. However, since the detection signal is very weak, in order to enable the microwave detection device at room temperature to measure the outgoing detection signal, it is necessary to amplify the microwave signal outgoing from the qubit reading cavity using a low noise amplifier.
In the existing low-noise amplifier, electromagnetic interference exists in the amplifying circuit by a power supply circuit, the noise coefficient of the low-noise amplifier can be increased, the signal-to-noise ratio of an output signal is reduced, and the reading of a microwave signal is further influenced.
Therefore, it is necessary to provide a new low noise amplifier to solve the problem of electromagnetic interference of the power circuit to the amplifying circuit.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a low-noise amplifier, a quantum measurement and control system and a quantum computer, which are used for solving the problem that a power supply circuit in the prior art has electromagnetic interference on an amplifying circuit, so that the low-noise amplifier can amplify microwave signals emitted from a quantum bit reading cavity.
To achieve the above object, in a first aspect, the present invention provides a low noise amplifier comprising:
a metal body having a first chamber and a second chamber;
a first PCB board with an amplifying circuit, disposed in the first chamber;
and the second PCB with a power supply circuit is arranged in the second chamber, and the power supply circuit is used for supplying power to the amplifying circuit.
Optionally, the amplifying circuit includes a first-stage amplifying chip, a second-stage amplifying chip and a third-stage amplifying chip, the input end of the first-stage amplifying chip is the input end of the amplifying circuit, and the output end of the third-stage amplifying chip is the output end of the amplifying circuit.
Optionally, the metal body includes a metal division bar disposed in the first chamber;
the metal parting bead will the first cavity separates for three third subchambers, just first order enlargies the chip, second level enlargies the chip and the third level enlargies the chip and sets up respectively in three in the third subchamber.
Optionally, a groove for passing the routing between the adjacent third sub-chambers is formed in the edge of the metal division bar contacting the first PCB.
Optionally, the power circuit includes a voltage conversion chip, an input end of the voltage conversion chip is connected to an external power source, and an output end of the voltage conversion chip is connected to power terminals of the first-stage amplification chip, the second-stage amplification chip, and the third-stage amplification chip, respectively.
Optionally, the power circuit further includes a first connection element, and the input end of the voltage conversion chip is connected to an external power source through the first connection element.
Optionally, the low noise amplifier further includes three second connecting members, one end of each of the three second connecting members is connected to the output end of the voltage conversion chip, and the other end of each of the three second connecting members is connected to the power ends of the first-stage amplification chip, the second-stage amplification chip, and the third-stage amplification chip, respectively.
Optionally, the metal body includes a metal frame and a metal partition plate separating the metal frame to form the first chamber and the second chamber;
and the metal partition plate is provided with a through hole for embedding the second connecting piece.
Optionally, the first PCB and the second PCB are oppositely disposed on two sides of the metal partition plate, and both are fixed on the metal partition plate.
Optionally, the metal main body further includes a metal sealing element, the metal sealing element includes a first metal cover plate and a second metal cover plate, the first metal cover plate, the frame body and the metal partition plate form the first chamber, and the second metal cover plate, the metal frame body and the metal partition plate form the second chamber.
Optionally, a groove matched with the metal parting strip in size is formed in the first metal cover plate, and the groove is matched with the metal parting strip to seal the first cavity.
Optionally, an electrostatic protection device is disposed at an input end of the voltage conversion chip.
Optionally, the input end and the output end of the amplifying circuit are provided with electrostatic protection devices.
Optionally, the low noise amplifier further includes two high frequency connectors, and the two high frequency connectors are respectively connected to the input end and the output end of the amplifying circuit, and are used for realizing connection of the microwave path.
In a second aspect, the utility model provides a quantum measurement and control system, which includes the low noise amplifier provided in the first aspect of the utility model.
In a third aspect, the utility model provides a quantum computer, comprising the quantum measurement and control system provided in the second aspect of the utility model
Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:
according to the low-noise amplifier provided by the utility model, the first PCB with the amplifying circuit and the second PCB with the power circuit are respectively arranged in the first cavity and the second cavity of the metal main body, so that the second PCB with the power circuit and the first PCB with the amplifying circuit are both in an electromagnetic shielding environment, the electromagnetic interference of the power circuit to the amplifying circuit is avoided, the noise coefficient of the low-noise amplifier is reduced, the signal-to-noise ratio of an output signal is improved, the performance of the low-noise amplifier is improved, and the amplification of a microwave signal emitted by the qubit reading cavity can be met.
According to the quantum measurement and control system, due to the fact that the low-noise amplifier provided by the utility model is arranged, the low-noise amplifier has a low noise coefficient, and weak signals output from the quantum bit reading cavity can be detected by microwave detection equipment at room temperature after being amplified.
The quantum computer provided by the utility model can detect weak microwave signals emitted from the quantum bit reading cavity by the quantum measurement and control system provided by the utility model, so that the state of the quantum bit can be read out.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a low noise amplifier according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of the metal body of the low noise amplifier shown in FIG. 1;
fig. 3 is a schematic top view of the metal body shown in fig. 2.
Wherein the reference numerals of figures 1 to 3 are as follows:
1-a metal body; 11-a first chamber; 111-a third sub-chamber; 12-a second chamber; 13-a metal frame; 131-a first via; 14-a metal separator; 141-a second via; 15-metal parting strips; 16-a metal seal; 161-a first metal cover plate; 162-a second metal cover plate; 2-a first PCB board; 3-a second PCB board; 4-high frequency connector.
Detailed Description
The core idea of the utility model is to provide a low noise amplifier with a power circuit and an amplifying circuit arranged in different chambers, so as to avoid electromagnetic interference of the power circuit to the amplifying circuit, reduce the noise coefficient of the low noise amplifier, increase the signal-to-noise ratio of an output signal, enable the low noise amplifier to amplify a weak input signal without introducing or only introducing small extra noise, and further enable the low noise amplifier to satisfy the amplification of microwave signals emitted from a qubit reading cavity in a quantum computer.
To achieve the above idea, the present invention provides a low noise amplifier, comprising: a metal body having a first chamber and a second chamber; a first PCB board with an amplifying circuit, disposed in the first chamber; and the second PCB with a power supply circuit is arranged in the second chamber, and the power supply circuit is used for supplying power to the amplifying circuit. The first PCB with the amplifying circuit and the second PCB with the power circuit are arranged in the first cavity and the second cavity of the metal main body respectively, so that the second PCB with the power circuit and the first PCB with the amplifying circuit are both in an electromagnetic shielding environment, electromagnetic interference of the power circuit to the amplifying circuit is avoided, the noise coefficient of the low-noise amplifier is reduced, the signal-to-noise ratio of an output signal is improved, and the performance of the low-noise amplifier is improved.
The low noise amplifier, the quantum measurement and control system and the quantum computer provided by the utility model are further described in detail with reference to fig. 1 to 3 and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Fig. 1 is a schematic structural diagram of a low noise amplifier according to an embodiment of the utility model. The low noise amplifier of the present embodiment includes: a metal body 1, a first PCB 2 and a second PCB 3.
The metal main body 1 is provided with a first cavity 11 and a second cavity 12, specifically, referring to fig. 2, fig. 2 is a schematic structural diagram of the metal main body of the embodiment, the metal main body 1 includes a metal frame body 13 and a metal partition plate 14, the metal frame body 13 encloses a cavity with a rectangular transverse section, the metal partition plate 14 is arranged inside the cavity to divide the cavity into the first cavity 11 and the second cavity 12, the metal partition plate 14 and the metal frame body 13 are integrally formed, the processing and the assembly are more convenient, and the electromagnetic shielding effect is better.
With reference to fig. 1 and fig. 2, in the present embodiment, the metal main body 1 further includes a metal sealing member 16, the metal sealing member 16 includes a first metal cover plate 161 and a second metal cover plate 162, the first metal cover plate 161 is used for forming the first chamber 11 with the metal frame 13 and the metal partition 14, and the second metal cover plate 162 is used for forming the second chamber 12 with the metal frame 13 and the metal partition 14. In other embodiments, other forms of metal seals may be used, without limitation. The first metal cover 161 and the metal frame 13 are fixed and connected by screws, and similarly, the second metal cover 162 and the metal frame 13 are fixed and connected by screws.
The first PCB 2 is disposed in the first chamber 11, and the first PCB 1 is provided with an amplifying circuit thereon.
Specifically, the amplifying circuit comprises a first-stage amplifying chip, a second-stage amplifying chip and a third-stage amplifying chip which are cascaded, and the first-stage amplifying chip, the second-stage amplifying chip and the third-stage amplifying chip are all provided with an input end, an output end and a power supply end. The first-stage amplification chip, the second-stage amplification chip and the third-stage amplification chip are all low-noise amplifier chips.
The first-stage amplification chip, the second-stage amplification chip and the third-stage amplification chip are sequentially arranged on the first PCB 2 along the axial direction of the metal main body 1.
The input end of the first-stage amplification chip is the input end of the amplification circuit, the output end of the first-stage amplification chip is connected with the input end of the second-stage amplification chip, the output end of the second-stage amplification chip is connected with the input end of the third-stage amplification chip, and the output end of the third-stage amplification chip is the output end of the amplification circuit.
More specifically, referring to fig. 1 and 2, the low noise amplifier further includes two high frequency connectors 4, the high frequency connectors 4 are disposed at two ends of the low noise amplifier, a first through hole 131 for the high frequency connector 4 to pass through is disposed on the metal frame 13, the two high frequency connectors 4 are respectively connected to the input end and the output end of the amplifying circuit, and the high frequency connectors 4 are used for realizing connection of microwave paths. The high-frequency connector 4 used in this embodiment belongs to the prior art, and the specific structure is not described herein.
The weak microwave signals can be amplified by the three-stage amplification chip in sequence, so that the low-noise amplifier has higher gain.
Referring to fig. 1, the metal main body 1 further includes metal spacers 15 disposed in the first cavity 11, two metal spacers 15 are perpendicular to the axial direction of the metal main body 1, and are respectively disposed between the first-stage amplification chip and the second-stage amplification chip, and between the second-stage amplification chip and the third-stage amplification chip, two metal spacers 15 separate the first cavity 11 into three third sub-cavities 111, and the metal spacers 15 separate the first-stage amplification chip, the second-stage amplification chip, and the third-stage amplification chip into three third sub-cavities 111.
Specifically, the radial cross section of the metal division bar 15 is a rectangle, the metal division bar 15 has a certain width, and one side surface of the metal division bar 15 is in contact with the first PCB 2, so that electromagnetic shielding of the three third sub-chambers 111 can be ensured, electromagnetic radiation between amplification chips at different levels is shielded, the noise coefficient of the low noise amplifier is reduced, and the performance of the low noise amplifier is improved.
More, the edge of the metal division bar 15 contacting the first PCB board 2 is provided with a first groove for passing the wire between the adjacent third sub-chambers 111.
More, a second groove (not shown) matched with the metal spacing strip 15 in size is arranged on the first metal cover plate 161, and is matched with the metal spacing strip 15 to realize the sealing of the first chamber 11, so that the electromagnetic shielding effect is better and the installation is convenient.
An attenuator is arranged between the first-stage amplification chip and the second-stage amplification chip, an attenuator is also arranged between the second-stage amplification chip and the third-stage amplification chip, and the attenuator is used for attenuating noise signals in transmission signals so as to improve the signal-to-noise ratio of output signals and reduce the noise coefficient of the low-noise amplifier.
The power supply ends of the first-stage amplification chip, the second-stage amplification chip and the third-stage amplification chip are all connected to the second PCB 3.
The second PCB board 3 is provided with a power circuit for supplying power to the amplifying circuit, and the output end of the power circuit is connected with the power ends of the first-stage amplifying chip, the second-stage amplifying chip and the third-stage amplifying chip.
Specifically, the power circuit includes a voltage conversion chip, an input end of the voltage conversion chip is connected to an external power source, and an output end of the voltage conversion chip is connected to power terminals of the first-stage amplification chip, the second-stage amplification chip, and the third-stage amplification chip. The voltage conversion chip can adopt a low dropout regulator (LDO) so that the output voltage of the power circuit can be adjusted.
A hole (not shown) is formed in the metal frame 1 at one end of the low noise amplifier, the hole is communicated to the second chamber 12, and the hole is used for connecting the external power supply with the input end of the voltage conversion chip on the second PCB 3.
More, the input end of the voltage conversion chip is connected with an external power supply through a first connecting piece, the first connecting piece is embedded into the hole, the hole can be plugged while the electric connection is realized, and the electromagnetic shielding of the second chamber 12 is realized; for example, the first connection element may be a feedthrough capacitor.
More, the low noise amplifier further comprises three second connecting pieces, one ends of the three second connecting pieces are connected with the voltage conversion chip, and the other ends of the three second connecting pieces are respectively connected with power supply ends of the first-stage amplification chip, the second-stage amplification chip and the third-stage amplification chip.
Referring to fig. 3, fig. 3 is a schematic top view of the metal main body of the present embodiment, three second through holes 141 are disposed on the metal partition 14, and the positions of the second through holes 141 correspond to the three third sub-chambers 111. The three second through holes 141 are used for embedding the second connecting member. In this embodiment, the second connecting member may adopt a feedthrough capacitor, and in other embodiments, the power circuit and the amplifying circuit may also be connected in other manners, which is not limited herein.
Preferably, the first PCB 2 and the second PCB 3 are disposed on two sides of the metal partition 14 and fixed on the metal partition 14, and the first PCB 2 and the second PCB 3 are disposed on the metal partition 14, so that the volume of the lna can be reduced to the greatest extent, the space utilization rate is very important for the quantum computer, and the space utilization rate in the quantum computer can be improved by the lna with a smaller volume, thereby realizing quantum computation with higher bit number.
More, amplifier circuit's input and output all are provided with electrostatic protection device, power supply circuit's input also is provided with electrostatic protection device, and electrostatic protection device can avoid amplifier circuit and power supply circuit to receive electrostatic discharge's influence.
In summary, the present invention provides a low noise amplifier, which includes: a metal body having a first chamber and a second chamber; a first PCB board with an amplifying circuit, disposed in the first chamber; and the second PCB with a power supply circuit is arranged in the second chamber, and the power supply circuit is used for supplying power to the amplifying circuit. According to the low-noise amplifier provided by the utility model, the first PCB with the amplifying circuit and the second PCB with the power circuit are respectively arranged in the first cavity and the second cavity of the metal main body, so that the second PCB with the power circuit and the first PCB with the amplifying circuit are both in an electromagnetic shielding environment, the electromagnetic interference of the power circuit to the amplifying circuit is avoided, the noise coefficient of the low-noise amplifier is reduced, the signal-to-noise ratio of an output signal is improved, the performance of the low-noise amplifier is improved, and the low-noise amplifier can amplify microwave signals emitted from a qubit reading cavity in a quantum computer.
Based on the same conception, the utility model also provides a quantum measurement and control system, which is provided with the low-noise amplifier provided by the utility model, and because the low-noise amplifier has lower noise coefficient and higher gain, the weak signal output from the quantum bit reading cavity can be detected by microwave detection equipment at room temperature after being amplified.
Based on the same invention concept, the utility model also provides a quantum computer, which is provided with the quantum measurement and control system provided by the utility model, and can detect weak microwave signals emitted from the quantum bit reading cavity, so that the state of the quantum bit can be read out.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (16)
1. A low noise amplifier, comprising:
a metal body having a first chamber and a second chamber;
a first PCB board with an amplifying circuit, disposed in the first chamber;
and the second PCB with a power supply circuit is arranged in the second chamber, and the power supply circuit is used for supplying power to the amplifying circuit.
2. The low noise amplifier according to claim 1, wherein the amplifying circuit comprises a first stage amplifying chip, a second stage amplifying chip and a third stage amplifying chip which are cascaded, an input terminal of the first stage amplifying chip is an input terminal of the amplifying circuit, and an output terminal of the third stage amplifying chip is an output terminal of the amplifying circuit.
3. The low noise amplifier of claim 2, wherein the metal body comprises a metal spacer disposed in the first chamber;
the metal parting bead will the first cavity separates for three third subchambers, just first order enlargies the chip, second level enlargies the chip and the third level enlargies the chip and sets up respectively in three in the third subchamber.
4. The low noise amplifier of claim 3, wherein the edge of the metal division bar contacting the first PCB board is provided with a groove for passing the trace between the adjacent third sub-chambers.
5. The low noise amplifier according to claim 3, wherein the power circuit comprises a voltage conversion chip, an input terminal of the voltage conversion chip is connected to an external power source, and an output terminal of the voltage conversion chip is connected to power source terminals of the first-stage amplification chip, the second-stage amplification chip, and the third-stage amplification chip, respectively.
6. The low noise amplifier of claim 5, wherein the power circuit further comprises a first connection through which the input terminal of the voltage conversion chip is connected to an external power source.
7. The low noise amplifier according to claim 5, further comprising three second connecting members, wherein one end of each of the three second connecting members is connected to the output terminal of the voltage converting chip, and the other ends of the three second connecting members are respectively connected to the power terminals of the first-stage amplifying chip, the second-stage amplifying chip, and the third-stage amplifying chip.
8. The low noise amplifier of claim 7, wherein the metal body comprises a metal frame and a metal partition separating the metal frame to form the first chamber and the second chamber;
and the metal partition plate is provided with a through hole for embedding the second connecting piece.
9. The low noise amplifier of claim 8, wherein the first PCB and the second PCB are oppositely disposed on both sides of the metal spacer and are fixed to the metal spacer.
10. The lna of claim 8, wherein the metal body further comprises a metal seal, the metal seal comprising a first metal cover plate and a second metal cover plate, the first metal cover plate forming the first chamber with the metal frame and the metal partition, the second metal cover plate forming the second chamber with the metal frame and the metal partition.
11. The low noise amplifier of claim 10, wherein the first metal cover plate is provided with a groove matching the size of the metal spacer, and the groove and the metal spacer cooperate to seal the first chamber.
12. The low noise amplifier according to claim 5, wherein an electrostatic protection device is provided at an input terminal of the voltage conversion chip.
13. The low noise amplifier according to claim 2, wherein an input terminal and an output terminal of the amplifying circuit are provided with electrostatic protection devices.
14. The low noise amplifier according to claim 1, further comprising two high frequency connectors connected to the input and output terminals of the amplifying circuit, respectively, for connection of microwave paths.
15. A quantum measurement and control system comprising the low noise amplifier according to any one of claims 1 to 14.
16. A quantum computer comprising the quantum measurement and control system of claim 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122391199.3U CN216290848U (en) | 2021-09-29 | 2021-09-29 | Low-noise amplifier, quantum measurement and control system and quantum computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122391199.3U CN216290848U (en) | 2021-09-29 | 2021-09-29 | Low-noise amplifier, quantum measurement and control system and quantum computer |
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| Publication Number | Publication Date |
|---|---|
| CN216290848U true CN216290848U (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122391199.3U Active CN216290848U (en) | 2021-09-29 | 2021-09-29 | Low-noise amplifier, quantum measurement and control system and quantum computer |
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| Country | Link |
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| CN (1) | CN216290848U (en) |
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- 2021-09-29 CN CN202122391199.3U patent/CN216290848U/en active Active
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