CN115688929B - Signal processing device, quantum control system and quantum computer - Google Patents
Signal processing device, quantum control system and quantum computer Download PDFInfo
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Abstract
The application belongs to the field of quanta, and discloses a signal processing device, a quanta control system and a quanta computer, which comprises a metal shell, wherein a plurality of first cavities and second cavities which are airtight and mutually isolated are arranged in the metal shell, a first PCB (printed Circuit Board) is arranged in the first cavities, and a second PCB is arranged in the second cavities; the first PCB is integrated with a first signal amplification link with an adjustable attenuation value, and the first signal amplification link is used for processing a microwave signal carrying encoded information and outputting the microwave signal to the quantum processor; the second PCB is integrated with a second signal amplification link comprising a plurality of signal amplification paths which are gated by a switch, and the second signal amplification link is used for processing the microwave signals carrying quantum state information and output by the quantum processor; wherein the gain of each signal amplification path is different. The application flexibility of the signal amplification link can be improved.
Description
Technical Field
The application belongs to the field of quanta, and particularly relates to a signal processing device, a quantum control system and a quantum computer.
Background
The quantum computation is a novel computation mode for regulating and controlling basic information units to perform computation according to quantum mechanics rules. The basic information unit of the classical computation is a classical bit, the basic information unit of the quantum computation is a qubit, the classical bit can only be in one state, namely 0 or 1, and the state of the qubit can be in a superposition state of multiple possibilities based on the quantum mechanical state superposition principle, so that the computation efficiency of the quantum computation is far higher than that of the classical computation.
In a quantum computer, a quantum processor is integrated with multi-bit quantum bits, the quantum processor needs to work in an extremely low-temperature environment to obtain excellent working performance, and if the working environment is too high in temperature, the evolution of a quantum state is very difficult to control and read. The quantum processor is usually arranged on the lowest temperature layer of the dilution refrigerator, a signal source device is arranged outside the dilution refrigerator to output a microwave signal for controlling and reading the quantum processor, and a measuring device is arranged to carry out the microwave signal output by the quantum processor, wherein the signal source device, the measuring device and the quantum processor are connected by adopting a measurement and control circuit. Considering the loss of the microwave signal when the microwave signal is transmitted in the measurement and control circuit, the signal amplifier is required to amplify the microwave signal output by the signal source and then transmit the microwave signal to the quantum processor through the measurement and control circuit, and the microwave signal output by the quantum processor is a weak signal, so that the measurement equipment at room temperature can measure the microwave signal, and the signal amplifier is also required to amplify the microwave signal carrying quantum state information and output by the quantum processor transmitted in the measurement and control circuit, and transmit the amplified microwave signal to the measurement equipment for measurement.
The quantum processor is integrated with a plurality of quantum bits, the calculation tasks executed by each quantum bit are diversified, the microwave signal power for controlling and reading different quantum bits is different and needs to be flexibly set according to the requirements of the quantum bits, meanwhile, the microwave signal power output by different quantum bits is also different, the power interval span is larger, the gain of a signal amplifier in the prior art is fixed, and the gain of a signal amplifying link built by the signal amplifier is fixed. Therefore, when the power range of the microwave signal output by the signal source is limited, the power of the microwave signal amplified by the signal amplifying link is limited, and the flexible selection requirement of the microwave signal power for controlling and reading the quantum processor cannot be met; and the span of the power interval of the microwave signal amplified by the signal amplifying link is large, and the measuring range of the measuring equipment is limited and cannot be measured.
Disclosure of Invention
The purpose of the application is to provide a signal processing device, a quantum control system and a quantum computer, which make up for the defects that the power range of a microwave signal which is output by a signal amplification link and used for controlling and reading a quantum processor is limited, and a measuring device cannot measure the microwave signal amplified by the signal amplification link because the gain of the signal amplification link is fixed in the prior art, and improve the application flexibility of the signal amplification link.
The technical scheme of the application is as follows:
an aspect of the present application provides a signal processing device, including a metal casing, a plurality of first cavities and second cavities that are sealed and isolated from each other are provided in the metal casing, a first PCB board is provided in the first cavities, and a second PCB board is provided in the second cavities;
the first PCB is integrated with a first signal amplification link with an adjustable attenuation value, and the first signal amplification link is used for processing a microwave signal carrying encoded information and outputting the microwave signal to the quantum processor;
the second PCB is integrated with a second signal amplification link comprising a plurality of signal amplification paths which are gated by a switch, and the second signal amplification link is used for processing the microwave signals carrying quantum state information and output by the quantum processor; wherein the gain of each signal amplification path is different.
In the signal processing device, preferably, the first PCB is further integrated with a first signal mixing module, and the first signal mixing module performs mixing processing on the received intermediate frequency signal and outputs the mixed microwave signal to the first signal amplifying link, where the intermediate frequency signal carries the encoded information.
In the signal processing apparatus as described above, preferably, the first signal amplifying link includes a plurality of stages of signal amplifying modules and a plurality of signal attenuating modules connected in series in order;
the first end of each signal attenuation module is connected with the output end of the first signal mixing module or the output end of the previous stage signal amplification module, and the second end of each signal attenuation module is connected with the input end of the next stage signal amplification module;
wherein the attenuation value of the signal attenuation module is adjustable.
In the signal processing apparatus as described above, preferably, the signal attenuation module includes a first attenuation unit and a second attenuation unit connected in series at a first end;
the second end of the first attenuation unit is connected with the output end of the first signal mixing module or the output end of the previous-stage signal amplifying module;
the second end of the second attenuation unit is connected with the input end of the next-stage signal amplification module;
wherein the attenuation value of the first attenuation unit is adjustable.
In the signal processing device, preferably, the first PCB is further integrated with a first switch module, a fixed end of the first switch module is connected to an output end of the first signal amplifying link, and a movable end of the first switch module is connected to a signal output port or a test port.
In the signal processing device, preferably, a second signal mixing module is further integrated on the second PCB, a first end of the second signal mixing module is connected to an output end of the second signal amplifying link, and a second end of the second signal mixing module outputs an intermediate frequency signal carrying quantum state information after mixing.
In the signal processing device as described above, preferably, the second PCB is further integrated with a power detection module, and the power detection module controls the switch to connect a signal amplifying path to the signal output port according to the power of the microwave signal received by the signal input port.
In the signal processing device as described above, preferably, the second signal amplifying link includes a plurality of stages of signal amplifying modules and a plurality of second switch modules connected in series in sequence; the second switch module is used for communicating the power detection module with the signal output port; or (b)
The input ends are used for communicating the power detection module with the signal amplification modules; or (b)
The input end and the output end are used for communicating the adjacent signal amplifying modules; or (b)
And the signal amplifying module is used for connecting the output end of each signal amplifying module with the signal output port.
The signal processing apparatus as described above, preferably, the second switching module includes a first switching unit, a second switching unit, and a third switching unit;
the first switch unit is used for communicating the power detection module with the input end of the first-stage signal amplification module or communicating the power detection module with the third switch unit;
the second switch unit is used for communicating the output end of the signal amplification module of the previous stage with the input end of the signal amplification module of the next stage or communicating the output end of the signal amplification module of the previous stage with the third switch unit;
the third switch unit is used for communicating the output end of the signal amplifying module of the last stage with the signal output port or communicating the first switch unit with the signal output port or communicating the second switch unit with the signal output port.
In the signal processing device as described above, it is preferable that the first switch unit, the second switch unit, and the third switch unit each include a plurality of single pole multiple throw switches.
The signal processing device as described above preferably further comprises a plurality of partitions located in the first cavity and the second cavity, the partitions being used for isolating the signal amplification modules at each stage.
Preferably, the signal processing device as described above, the partition includes one or more of a long-strip-shaped partition, a U-shaped partition, an L-shaped partition, a Y-shaped partition, a trapezoid partition, an arc partition, and a combined partition, wherein the combined partition is a partition formed by combining at least two of the long-strip-shaped partition, the U-shaped partition, the L-shaped partition, the Y-shaped partition, the trapezoid partition, and the arc partition.
Another aspect of the present application provides a quantum control system comprising any one of the signal processing devices described above.
In still another aspect, the present application provides a quantum computer, including the above-mentioned quantum control system and a quantum processor, where the quantum processor receives a microwave signal carrying encoded information output by the quantum control system to perform a quantum operation, and outputs a microwave signal carrying quantum state information after the operation to the quantum control system.
Compared with the prior art, the application has the following beneficial effects:
the application provides a signal processing device, which comprises a metal shell, wherein a plurality of first cavities and second cavities which are airtight and mutually isolated are arranged in the metal shell, a first PCB (printed Circuit Board) is arranged in the first cavities, and a second PCB is arranged in the second cavities; the first PCB is integrated with a first signal amplification link with an adjustable attenuation value, and the first signal amplification link is used for processing a microwave signal carrying encoded information and outputting the microwave signal to the quantum processor; the second PCB is integrated with a second signal amplification link comprising a plurality of signal amplification paths which are gated by a switch, and the second signal amplification link is used for processing the microwave signals carrying quantum state information and output by the quantum processor; wherein the gain of each signal amplification path is different. The microwave signals carrying the coding information and output by the signal source are amplified by adopting a first signal amplification link with adjustable attenuation values, so that the power parameters of the amplified microwave signals can be ensured to be adjustable, and the power requirements of each qubit on the quantum processor on the control signals and the measurement signals can be matched; and the signal amplification paths of various gains are adopted to amplify the microwave signals carrying quantum state information and output by the quantum processor, so that the variation range of the power values of the processed microwave signals is ensured to be smaller, and the measurement of the measuring equipment is facilitated.
In addition, a first cavity and a second cavity which are isolated from each other are arranged by adopting a metal shell and are respectively used for accommodating a first PCB board integrating the first signal amplifying link and a second PCB board accommodating the second signal amplifying link, so that isolation between the first amplifying link and the second amplifying link is ensured, and crosstalk between microwave signals is avoided.
Drawings
Fig. 1 is a schematic diagram of a measurement circuit of a quantum processor according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a signal processing device according to an embodiment of the present application;
fig. 3 is a schematic circuit diagram of a first signal amplifying link according to an embodiment of the present application;
fig. 4 is a schematic circuit diagram of a second signal amplifying link according to an embodiment of the present application;
fig. 5 is a circuit of a first signal amplifying link including a first signal mixing module according to an embodiment of the present application;
fig. 6 is a schematic diagram of a component circuit of a first signal amplifying link according to an embodiment of the present application;
fig. 7 is a schematic diagram of a component circuit of a signal attenuation module according to an embodiment of the present application;
fig. 8 is a schematic diagram 1 of a test circuit of a first signal amplifying link according to an embodiment of the present application;
fig. 9 is a schematic diagram 2 of a test circuit of a first signal amplifying link according to an embodiment of the present application;
Fig. 10 is a schematic circuit diagram of a second signal amplifying link including a second signal mixing module according to an embodiment of the present application;
fig. 11 is a schematic circuit diagram of a second signal amplifying link including a power detection module according to an embodiment of the present application;
fig. 12 is a schematic diagram of a component circuit of a power detection module according to an embodiment of the present application;
fig. 13 is a schematic diagram of a component circuit of a second signal amplifying link according to an embodiment of the present application;
fig. 14 is a schematic diagram 1 of a component circuit of a second switch module according to an embodiment of the present application;
fig. 15 is a schematic diagram 2 of a component circuit of a second switch module according to an embodiment of the present application;
fig. 16 is a schematic structural view of a partition according to an embodiment of the present disclosure.
Reference numerals illustrate:
1-a signal processing device, 2-refrigeration equipment, 3-a measurement and control system and 4-a quantum processor;
11-a metal shell, 12-a first cavity, 13-a first PCB, 14-a second cavity and 15-a second PCB;
121-U-shaped partition, 122-strip-shaped partition, 141-combined partition, 131-first signal amplification link, 132-first signal mixing module, 133-first switch module, 151-second signal amplification link, 152-second signal mixing module, 153-power detection module;
1311-a signal amplification module, 1312-a signal attenuation module, 1512-a second switching module; 1520-first switching unit, 1521-second switching unit, 1522-third switching unit, 1531-coupler, 1532-detector, 1533-comparator.
Detailed Description
The following detailed description is merely illustrative and is not intended to limit the embodiments and/or the application or uses of the embodiments. Furthermore, there is no intention to be bound by any expressed or implied information presented in the preceding background or brief summary or the detailed description section.
For purposes of clarity, technical solutions, and advantages of embodiments of the present application, one or more embodiments will now be described with reference to the drawings, wherein like reference numerals are used to refer to like components throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a more thorough understanding of one or more embodiments. It may be evident, however, that one or more embodiments may be practiced without these specific details, and that such embodiments may be incorporated by reference herein without departing from the scope of the claims.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The measuring circuit schematic diagram of the quantum processor 4 shown in fig. 1 comprises the quantum processor 4 positioned in the lowest temperature area of the refrigerating equipment 2, a measurement and control system 3 positioned outside the dilution refrigerating machine, wherein the measurement and control system 3 comprises a signal source for providing control signals and measurement signals for the quantum processor and a measuring equipment for measuring microwave signals output by the quantum processor 4, and the quantum processor 4 and the measurement and control system 3 are connected by a test circuit, and the temperature of the lowest temperature area is as low as millikelvin (for example, 10 mK).
The quantum processor 4 integrates a plurality of qubits for executing quantum computation, the qubits are very sensitive to the influence of environmental noise, so that very weak microwave signals are generally adopted for controlling and nondestructively reading the qubits, the power of the microwave signals carrying quantum state information output by the qubits is very low and is as low as-100 dBm, and a plurality of signal amplifier devices are arranged in a test circuit for amplifying the microwave signals output by the qubits, so that the measuring equipment 3 in a room temperature environment can conveniently measure.
Considering the loss of the microwave signal when the microwave signal is transmitted in the measurement and control circuit, the signal amplifier is required to amplify the microwave signal output by the signal source and then transmit the microwave signal to the quantum processor through the measurement and control circuit, and the microwave signal output by the quantum processor is a weak signal, so that the measurement equipment at room temperature can measure the microwave signal, and the signal amplifier is also required to amplify the microwave signal carrying quantum state information and output by the quantum processor transmitted in the measurement and control circuit, and transmit the amplified microwave signal to the measurement equipment for measurement.
In addition, the calculation task executed by the qubit on the quantum processor 4 is diversified, the power of the microwave signal which is output to the quantum processor and does not pass through the qubit and the power of the microwave signal which is output by different qubits on the quantum processor are different, the power variation range of the microwave signal is large, and the microwave signal needs to be amplified by adopting a signal amplifying link with adjustable power.
Referring to fig. 2, fig. 3, and fig. 4, as an implementation manner of an embodiment of the present application, the present embodiment proposes a signal processing apparatus, including a metal housing 11, where a plurality of first cavities 12 and second cavities 14 that are sealed and isolated from each other are disposed in the metal housing 11, a first PCB 13 is disposed in the first cavities 12, and a second PCB 15 is disposed in the second cavities 14; the first PCB 13 is integrated with a first signal amplifying link 131 with an adjustable attenuation value, and the first signal amplifying link 131 is configured to process a microwave signal carrying encoded information and output the processed microwave signal to a quantum processor; a second signal amplification link 151 including a plurality of signal amplification paths gated by a switch is integrated on the second PCB 15, and the second signal amplification link 151 is used for processing the microwave signal carrying quantum state information output by the quantum processor; wherein the gain of each signal amplification path is different.
Specifically, the first signal amplifying link 131 is disposed at the front end of the quantum processor, and is configured to amplify the microwave signal output from the signal source to the quantum processor, and the second signal amplifying link 151 is disposed at the rear end of the quantum processor, and is configured to amplify the microwave signal output from the quantum processor to be transmitted to the measurement device.
As shown in fig. 3, the signal source outputs a microwave signal for controlling and measuring the qubit on the quantum processor, the measurement and control effects are determined by the encoded information carried in the microwave signal, and the microwave signal is amplified by the first signal amplifying link 131 and then transmitted to the quantum processor. The first signal amplifying link 131 not only has a signal amplifying effect of fixed gain, but also has a signal attenuating effect with adjustable attenuation value, and the attenuation value in the link is flexibly adjusted by combining the gain value of the first signal amplifying link 131 and the power value of the input microwave signal, so that the power of the microwave signal output to the quantum processor can be ensured to be matched with the power requirements of each quantum bit on the quantum processor on the control signal and the measurement signal, and the application flexibility of the signal amplifying link is improved.
As shown in fig. 4, the second signal amplifying link 151 includes a plurality of signal amplifying paths, and the gain of each signal amplifying path is different, so that according to the power of the microwave signal carrying quantum state information output by the quantum processor, one signal amplifying path with a proper gain is connected through a switch to amplify the microwave signal; for example, when the power of the input microwave signal is higher, a signal amplification path with lower gain is communicated through a switch to amplify the microwave signal; when the power of an input microwave signal is lower, a signal amplification path with higher gain is communicated through a switch to amplify the microwave signal; the variation range of the power value of the microwave signal amplified by the second signal amplifying link 151 is ensured to be smaller, the measurement of the measuring equipment is facilitated, and the flexibility and the applicability of the measuring equipment to measuring the microwave signal with larger power interval span output by the quantum processor are improved.
In fig. 4, 4 signal amplification paths are illustrated, wherein a signal amplification device for amplifying a microwave signal is not provided on the lowermost signal amplification path, and it can be understood that the gain of the signal amplification path is 0. In addition, the number of signal amplifying devices and specific gain values set on the signal amplifying paths are only examples, and need to be set in combination with the power parameters of the microwave signals output by the quantum processor and the measurement range of the measurement device, which is not described in detail in this embodiment. It should be noted that the switch combination in fig. 4 is only an example, and the switch is not limited to a single pole multi-throw switch, but may be other switch combinations.
In addition, the first signal amplifying link 131 and the second signal amplifying link 151 each include a signal amplifying device, and the amplified microwave signals have higher power, so as to avoid mutual crosstalk of the microwave signals, a metal housing 11 is provided, and a plurality of first cavities 12 and second cavities 14 are provided in the metal housing 11, and the cavities are isolated from each other; the metal shell 11 comprises a shell and a cover plate, and the cover plate is arranged on the shell to ensure the sealing of each cavity; the first cavity 12 is configured to accommodate the first PCB 13 integrated with the first signal amplifying link 131, and the second cavity 14 is configured to accommodate the second PCB 15 integrated with the second signal amplifying link 151, so that not only can the influence of environmental noise outside the metal housing 11 on the first signal amplifying link 131 and the second signal amplifying link 151 be shielded, but also signal crosstalk between the signal amplifying links inside the metal housing 11 can be avoided.
As shown in fig. 2, a plurality of signal connectors are disposed on two sidewalls of the metal housing 11 along the length extension direction of the first PCB 13 and the second PCB 15, and each signal connector is electrically connected to a signal input port and a signal output port of the first signal amplifying link 131 and the second signal amplifying link 151, for transmitting microwave signals.
As shown in fig. 5, as an implementation manner of the embodiment of the present application, a first signal mixing module 132 is further integrated on the first PCB, where the first signal mixing module 132 performs mixing processing on the received intermediate frequency signal, and outputs the mixed microwave signal to the first signal amplifying link 131, where the intermediate frequency signal carries the encoded information. The operating frequency band of quantum processors is relatively high, typically gigahertz, e.g., 4GHz-8GHz. Therefore, the frequency of the microwave signal for controlling and reading the quantum processor is gigahertz, and the microwave signal is obtained by mixing the intermediate frequency signal by adopting a mixing technology. Specifically, the input end of the first signal mixing module 132 is configured to receive the intermediate frequency signal to be mixed and the local oscillator signal, and output the mixed microwave signal to the first signal amplifying link 131. The first signal mixing module 132 may operate according to IQ mixing or secondary frequency conversion.
As shown in fig. 6, as an implementation manner of the embodiment of the present application, the first signal amplifying link 131 includes a plurality of signal amplifying modules 1311 and a plurality of signal attenuating modules 1312 connected in series in sequence; a first end of each signal attenuation module 1312 is connected to an output end of the first signal mixing module 132 or to an output end of the previous stage signal amplification module 1311, and a second end of the signal attenuation module 1312 is connected to an input end of the next stage signal amplification module 1311; wherein the attenuation value of the signal attenuation module 1312 is adjustable.
In order to ensure the amplification effect on the microwave signal, the first signal amplifying link 131 adopts a plurality of stages of signal amplifying modules 1311 which are sequentially connected in series, and a signal attenuation module 1312 is arranged in front of the input end of each stage of signal amplifying module 1311; the output end of the first signal mixing module 132 is connected to the first stage signal amplifying module 1311 through a signal attenuation module 1312; the signal amplifying module 1311 amplifies the microwave signal in the circuit, the signal attenuating module 1312 attenuates the power of the microwave signal transmitted in the circuit, the attenuation value of the signal attenuating module 1312 is adjustable, and the power parameter of the microwave signal output by the first signal amplifying link 131 is adjustable by combining the gain of the signal amplifying module 1311, and the power parameter is flexibly adjusted according to the power requirement of the microwave signal for controlling and testing the quantum processor.
In addition, the number of signal amplifying modules 1311 in the circuit corresponds to the number of signal attenuating modules 1312, and the specific number is determined according to the power requirement of the microwave signal transmitted to the quantum processor, which is not described in detail in this embodiment.
As shown in fig. 7, as an implementation manner of the embodiment of the present application, the signal attenuation module 1312 includes a first attenuation unit and a second attenuation unit, where first ends are connected in series; the second end of the first attenuation unit is connected to the output end of the first signal mixing module 132 or the output end of the previous stage signal amplifying module 1311; the second end of the second attenuation unit is connected with the input end of the next-stage signal amplification module 1311; wherein the attenuation value of the first attenuation unit is adjustable. In combination with the power requirements of the quantum processor on the received microwave signal, the adjustable range is usually about 30dB, the attenuation value of the second attenuation unit 32 is a fixed value, and is usually between 3dB and 5 dB. By the cooperation of the adjustable attenuation and the fixed attenuation, the power adjustment in a larger range is realized.
As shown in fig. 8, as an implementation manner of the embodiment of the present application, a first switch module 133 is further integrated on the first PCB, a fixed end of the first switch module 133 is connected to the output end 131 of the first signal amplifying link, and a movable end of the first switch module 133 is connected to a signal output port or a test port. The first signal amplifying link 131 outputs the amplified microwave signal to the quantum measurement and control circuit, and tests whether the power of the processed microwave signal meets the requirement of the quantum processor or not through the measuring device. Specifically, the first switch module 133 is used for switching ports, the stationary end of the first switch module 133 is connected with the first signal amplifying link 131 to receive the amplified microwave signal, the first switch module 133 has a plurality of movable ends, and the movable ends are respectively connected with the signal output port and the test port, wherein the test port is connected with the measuring device. By switching the first switch module 133, the test of the microwave signal output by the first signal amplifying link 131 can be realized or the microwave signal is output to the quantum processor through the quantum measurement and control circuit.
In addition, referring to fig. 8 and fig. 9, the embodiment of the present application further provides a signal testing circuit, which includes a plurality of the first signal amplifying links 131 of the above embodiments, and a single-pole multi-throw switch, wherein the fixed end of the single-pole multi-throw switch is connected to the testing port, and the movable end of the single-pole multi-throw switch is connected to the movable ends of the plurality of first switch modules 133. The first signal amplification link 131 of the present application is applied to the field of quantum computation, and a quantum processor is integrated with a plurality of qubits, so that a plurality of first signal amplification links 131 of this embodiment are required, and a signal test circuit is adopted to test the power of microwave signals processed by a plurality of first signal amplification links 131.
As shown in fig. 10, as an implementation manner of the embodiment of the present application, a second signal mixing module 152 is further integrated on the second PCB, a first end of the second signal mixing module 152 is connected to an output end of the second signal amplifying link 151, and a second end of the second signal mixing module 152 outputs the mixed intermediate frequency signal carrying quantum state information. The second signal amplifying link 151 of this embodiment is configured to amplify the microwave signal output by the quantum processor, and since the working frequency of the quantum processor 4 is usually between 4GHz and 8GHz, the frequency of the output microwave signal is also between 4GHz and 8GHz, and the second signal mixing module 152 is disposed at a position of the second signal amplifying link 151 near the signal output port, and performs down-conversion processing on the microwave signal after power adjustment, and processes the microwave signal with high frequency into an intermediate frequency signal that can be measured by the measuring device. In addition, when the second signal mixing module 152 adopts the IQ mixing principle or the secondary frequency conversion principle, a local oscillation signal needs to be applied to the second signal mixing module 152.
As shown in fig. 11, as an implementation manner of the embodiment of the present application, a power detection module 153 is further integrated on the second PCB, and the power detection module 153 controls the switch to communicate a signal amplifying path to the signal output port according to the power of the microwave signal received by the signal input port. One end of the power detection module 153 is connected to the signal input port, and is used for measuring the power of the microwave signal received by the signal input port, the other end of the power detection module 153 is connected to the signal amplification paths through a switch, and the switch is selectively controlled to be communicated with one signal amplification path in the second signal amplification link 151 according to the measured power value.
As shown in fig. 12, as an implementation manner of the embodiment of the present application, the power detection module 153 includes a coupler 1531, a detector 1532, and a comparator 1533 connected in series in sequence; the other end of the coupler 1531 is coupled with the signal input port; the other end of the comparator 1533 outputs a power detection signal. Specifically, the microwave signal received by the signal input port is coupled through the coupler 1531, the coupled signal is transmitted to the detector 1532 for processing, the processed signal is transmitted to the comparator 1533 for comparison, the compared power detection signal is output, and the switch is controlled to be connected according to the compared power detection signal.
As shown in fig. 13, as an implementation manner of the embodiment of the present application, the second signal amplifying link 151 includes a plurality of stages of signal amplifying modules 1311 and a plurality of second switch modules 1512 connected in series in sequence; the second switch module 1512 is configured to communicate the power detection module 153 with the signal output port; or an input terminal for communicating the power detection module 153 with each of the signal amplification modules 1311; or for communicating an input and an output of adjacent signal amplification modules 1311; or for communicating the output of each of the signal amplification modules 1311 with the signal output port.
In the present embodiment, a multi-stage signal amplification module 1311 is employed to connect with a plurality of second switch modules 1512. Signal amplification branches comprising a different number of signal amplification modules 1311 are implemented by connection of the second switch module 1512. Specifically, a second switch module 1512 is disposed between the power detection module 153 and the input end of the first stage signal amplification module 1311, and is used for switching between the first stage signal amplification module 1311 and the signal output port, when the second switch module 1512 is connected to the signal output end, the gain of the signal amplification branch is 0, and when the second switch module 1512 is connected to the first stage signal amplification module 1311, the gain of the signal amplification branch is determined by the gain of the first stage signal amplification module 1311.
In addition, a second switch module 1512 is also disposed between two adjacent signal amplifying modules 1311, and is configured to switch between two adjacent signal amplifying modules 1311 and a signal output port, where when the second switch module 1512 communicates with the signal output port, the gain of the signal amplifying branch is the gain of the previous stage signal amplifying module 1311; it should be noted that, at this time, the switch module between the power detection module 153 and the first stage signal amplification module 1311 needs to be connected to the previous stage signal amplification module 1311; when the second switch module 1512 communicates with the next stage signal amplifying module 1311, the gain of the signal amplifying branch is determined by the gains of the first stage signal amplifying module 1311 and the first stage signal amplifying module 1311.
In addition, a second switching module 1512 is also disposed at the output end and the signal output port of the last stage signal amplifying module 1311, for switching between the previous stage signal amplifying module 1311, the last stage signal amplifying module 1311, and the second switching module 1512 connected to the power detecting module 153. When the second switch module 1512 communicates with the last stage of signal amplification module 1311, the gain of the signal amplification branch is determined by the sum of the gains of all signal amplification modules 1311 in the branch; it should be added that at this time, the signal amplification modules 1311 of the previous stages need to be connected through the second switch module 1512. When this second switch module 1512 communicates with the signal amplification module 1311 of the previous stage, the gain of that signal amplification branch is determined by the sum of the gains of the signal amplification modules 1311 that communicate with the previous stages in the branch. When the second switch module 1512 is connected to the switch module of the power detection module 153, the gain of the signal amplifying branch is 0.
For example, as shown in fig. 13, the second switch modules 1512 are connected, and each signal amplification module 1311 in the entire signal amplification branch participates in signal amplification, where the gain of the signal amplification branch is the sum of the gains of all the signal amplification modules 1311. Other combinations of the second switch modules 1512 are determined by the signal amplification modules 1311 in the signal amplification branches that participate in signal amplification, with reference to the combinations described above. By combining the second switch modules 1512, signal amplification branches including different numbers of signal amplification modules 1311 may be implemented, thereby implementing signal amplification branches of different gains.
Further, fig. 13 illustrates a second signal amplification link 151 including three signal amplification modules 1311. It is conceivable that the second signal amplifying link 151 may further include other signal amplifying modules 1311, and the second switch module 1512 is disposed between adjacent signal amplifying modules 1311, which is not described in detail in this embodiment.
It should be added that, the first signal amplifying link 131 and the second signal amplifying link 151 each include a signal amplifying module 1311, where the signal amplifying module 1311 may select a low noise amplifier when implemented, and for the model and the performance parameter of the low noise amplifier, the model and the performance parameter of the low noise amplifier are respectively determined according to the microwave signal that controls and measures the quantum processor and the performance parameter of the microwave signal output by the quantum processor.
As shown in fig. 14, the second switching modules 1512 are specifically defined according to the positions and connection relations of the respective second switching modules 1512 in the second signal amplifying link 151, specifically, a first switching unit 1520 between the power detecting module 153 and the first stage signal amplifying module 1311, a second switching unit 1521 between the adjacent two stage signal amplifying modules 1311, and a third switching unit 1522 between the last stage signal amplifying module 1311 and the signal output port. The first switch unit 1520 is configured to communicate the power detection module 153 with an input end of the first-stage signal amplification module 1311 or to communicate the power detection module 153 with the second switch unit 1521; the second switch unit 1521 is configured to connect the output end of the signal amplification module 1311 of the previous stage with the input end of the signal amplification module 1311 of the next stage or connect the output end of the signal amplification module 1311 of the previous stage with the third switch unit 1522; the third switch unit 1522 is configured to communicate the output end of the signal amplifying module 1311 of the last stage with the signal output port, or is configured to communicate the first switch unit 1520 with the signal output port, or is configured to communicate the second switch unit 1521 with the signal output port.
It should be added that, for the communication functions of the first switch unit 1520, the second switch unit 1521, and the third switch unit 1522, which are determined according to the second signal amplifying link 151 illustrated in fig. 14, when the second switch module 1512 in the second signal amplifying link 151 adopts other combinations, the communication functions of the first switch unit 1520, the second switch unit 1521, and the third switch unit 1522 need to be redefined.
In addition, fig. 13 and 14 illustrate the second signal amplifying link 151 including three signal amplifying modules 1311, and when the second signal amplifying link 151 further includes other number of signal amplifying modules 1311, the communication functions of the first switch unit 1520, the second switch unit 1521, and the third switch unit 1522 also need to be determined again, for example, the second signal amplifying link 151 including four signal amplifying modules 1311 illustrated in fig. 15. It can be found, however, that the communication functions are the same for a plurality of second switch units 1521 located between adjacent two signal amplifying modules 1311, and that the same circuit configuration is set when the second signal amplifying link 151 includes a greater number of signal amplifying modules 1311.
The combination of the signal amplification module 1311 and the second switch module 1512 shown in fig. 13, 14 and 15 is only one embodiment, and other combinations that can realize the communication between the plurality of signal amplification modules 1311 are all within the scope of the present application.
As shown in fig. 11, fig. 13, fig. 14, and fig. 15, as an implementation of the embodiment of the present application, the first switch unit 1520, the second switch unit 1521, and the third switch unit 1522 each include a plurality of single pole multiple throw switches. The single-pole multi-throw switch is adopted, and the movable end of the single-pole multi-throw switch is switched to be communicated with other switches or the signal amplification module 1311, so that the switching of multiple signal amplification branches in the second signal amplification link 151 is realized.
As shown in fig. 16, as an implementation manner of the embodiment of the present application, the signal processing apparatus further includes a plurality of partitions located in the first cavity 12 and the second cavity 14, where the partitions are used to isolate the signal amplifying modules 1311 at each stage. The first signal amplifying link 131 on the first PCB 13 and the second signal amplifying link 151 on the second PCB 15 each include a plurality of signal amplifying modules 1311, and the first cavity 12 and the second cavity 14 are divided into a plurality of isolation cavities by arranging a plurality of partitions in the first cavity 12 and the second cavity 14, each isolation cavity is used for accommodating the first-stage signal amplifying module 1311, so that each stage signal amplifying module 1311 is sealed and isolated in the first cavity 12 or the second cavity 14, mutual crosstalk between multiple microwave signals transmitted by the signal amplifying module 1311 is avoided, and precision of the microwave signals is improved.
As shown in fig. 16, the partition includes one or more of a long-strip partition 122, a U-shaped partition 121, an L-shaped partition, a Y-shaped partition, a trapezoid partition, an arc partition, and a combined partition 141, wherein the combined partition 141 is a partition formed by combining at least two of the long-strip partition 122, the U-shaped partition 121, the L-shaped partition, the Y-shaped partition, the trapezoid partition, and the arc partition.
In a specific selection, a partition with a suitable shape may be selected according to the arrangement situation of the signal amplifying elements in the first signal amplifying link and the second signal amplifying link integrated on the specific first PCB 13 and the second PCB 15, and as shown in fig. 16, for example: one specific mode is as follows: an elongated partition 122 and two U-shaped partitions 121 are disposed within the first cavity 12; three combined partitions 141 and one elongated partition 122 are disposed in the second cavity 14.
Based on the same application conception, the embodiment of the application also provides a quantum control system, which comprises any one of the signal processing devices. The quantum processor is integrated with a plurality of quantum bits, and as the number of the quantum bits is increased, the number of required signal processing devices is correspondingly increased, and the plurality of signal processing devices are integrated in the quantum control system, so that the quantum processor is ensured to execute quantum computing tasks.
Based on the same application conception, the embodiment of the application also provides a quantum computer which comprises the quantum control system and a quantum processor, wherein the quantum processor receives the microwave signal carrying the coding information output by the quantum control system to execute quantum operation, and outputs the microwave signal carrying the quantum state information after operation to the quantum control system.
The foregoing detailed description of the construction, features and advantages of the present application will be presented in terms of embodiments illustrated in the drawings, wherein the foregoing description is merely illustrative of preferred embodiments of the application, and the scope of the application is not limited to the embodiments illustrated in the drawings.
Claims (14)
1. The signal processing device comprises a metal shell, wherein a plurality of first cavities and second cavities which are airtight and isolated from each other are arranged in the metal shell, a first PCB (printed Circuit Board) is arranged in the first cavities, and a second PCB is arranged in the second cavities;
the first PCB is integrated with a first signal amplification link comprising a plurality of multistage signal amplification modules and a plurality of signal attenuation modules with adjustable attenuation values, wherein the multistage signal amplification modules and the first signal amplification link are sequentially connected in series, and the first signal amplification link is used for processing a microwave signal carrying encoded information and outputting the microwave signal to the quantum processor;
The second PCB is integrated with a second signal amplification link comprising a plurality of signal amplification paths which are gated by a switch, each signal amplification path at least comprises a signal amplification module, and the second signal amplification link is used for processing the microwave signals carrying quantum state information and output by the quantum processor; wherein the gain of each signal amplification path is different.
2. The signal processing device of claim 1, wherein the first PCB further includes a first signal mixing module, the first signal mixing module performs mixing processing on the received intermediate frequency signal, and outputs the mixed microwave signal to the first signal amplifying link, wherein the intermediate frequency signal carries the encoded information.
3. The signal processing device according to claim 2, wherein,
the first end of each signal attenuation module is connected with the output end of the first signal mixing module or the output end of the previous stage signal amplification module, and the second end of the signal attenuation module is connected with the input end of the next stage signal amplification module.
4. A signal processing apparatus according to claim 3, wherein the signal attenuation module comprises a first attenuation unit and a second attenuation unit connected in series at a first end;
The second end of the first attenuation unit is connected with the output end of the first signal mixing module or the output end of the previous-stage signal amplifying module;
the second end of the second attenuation unit is connected with the input end of the next-stage signal amplification module;
wherein the attenuation value of the first attenuation unit is adjustable.
5. The signal processing device of claim 1, wherein a first switch module is further integrated on the first PCB, a stationary end of the first switch module is connected to an output end of the first signal amplifying link, and a movable end of the first switch module is connected to a signal output port or a test port.
6. The signal processing device according to claim 1, wherein a second signal mixing module is further integrated on the second PCB, a first end of the second signal mixing module is connected to an output end of the second signal amplifying link, and a second end of the second signal mixing module outputs the mixed intermediate frequency signal carrying quantum state information.
7. The signal processing device of claim 1, wherein a power detection module is further integrated on the second PCB, and the power detection module controls the switch to communicate a signal amplification path to the signal output port according to the power of the microwave signal received by the signal input port.
8. The signal processing device of claim 7, wherein the second signal amplifying link comprises a plurality of stages of signal amplifying modules and a plurality of second switch modules connected in series in sequence; the second switch module is used for communicating the power detection module with the signal output port; or (b)
The input ends are used for communicating the power detection module with the signal amplification modules; or (b)
The input end and the output end are used for communicating the adjacent signal amplifying modules; or (b)
And the signal amplifying module is used for connecting the output end of each signal amplifying module with the signal output port.
9. The signal processing device of claim 8, wherein the second switching module comprises a first switching unit, a second switching unit, and a third switching unit;
the first switch unit is used for communicating the power detection module with the input end of the first-stage signal amplification module or communicating the power detection module with the third switch unit;
the second switch unit is used for communicating the output end of the signal amplification module of the previous stage with the input end of the signal amplification module of the next stage or communicating the output end of the signal amplification module of the previous stage with the third switch unit;
The third switch unit is used for communicating the output end of the signal amplifying module of the last stage with the signal output port or communicating the first switch unit with the signal output port or communicating the second switch unit with the signal output port.
10. The signal processing device of claim 9, wherein the first switch unit, the second switch unit, and the third switch unit each comprise a number of single pole, multi throw switches.
11. The signal processing apparatus of any one of claims 3 or 8, further comprising a plurality of partitions located in the first cavity and the second cavity, the partitions being configured to isolate the signal amplification modules at each stage.
12. The signal processing device of claim 11, wherein the partition comprises one or more of a strip partition, a U-partition, an L-partition, a Y-partition, a trapezoid partition, an arc partition, and a combination partition, wherein the combination partition is a partition formed by combining at least two of a strip partition, a U-partition, an L-partition, a Y-partition, a trapezoid partition, and an arc partition.
13. A quantum control system comprising the signal processing apparatus of any one of claims 1-12.
14. A quantum computer, comprising the quantum control system of claim 13 and a quantum processor, wherein the quantum processor receives the microwave signal carrying the encoded information output by the quantum control system to perform quantum operation, and outputs the microwave signal carrying the quantum state information after operation to the quantum control system.
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| US20220263483A1 (en) * | 2019-07-09 | 2022-08-18 | Millimeter Wave Systems, LLC | Cryogenic parametric amplifier control apparatus |
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| CN216697326U (en) * | 2021-12-29 | 2022-06-07 | 合肥本源量子计算科技有限责任公司 | Quantum control system and quantum computer |
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