CN218735663U

CN218735663U - Heat dissipation back splint, shell assembly and electronic equipment

Info

Publication number: CN218735663U
Application number: CN202222011318.2U
Authority: CN
Inventors: 陈逸明; 陈丘; 张旭东; 刘佳驹; 王英先
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-07-30
Filing date: 2022-07-30
Publication date: 2023-03-24
Anticipated expiration: 2032-07-30

Abstract

The application provides a heat dissipation back splint, housing assembly and electronic equipment, this heat dissipation back splint includes: the shell comprises a first shell part and a second shell part, wherein the first shell part and the second shell part are provided with accommodating cavities, the first shell part comprises a shell substrate and a peripheral component arranged around the edge of the shell substrate, the shell substrate is provided with a first opening, and the peripheral component is provided with a second opening; the connecting assembly is connected with the shell and used for fixing the heat dissipation back clip on the mobile terminal; the heat dissipation assembly is arranged in the accommodating cavity and comprises a first heat dissipation part, a second heat dissipation part and a fan, the first heat dissipation part is arranged at the position corresponding to the first opening, the second heat dissipation part is arranged at the position corresponding to the second opening, and the fan is used for dissipating heat of the first heat dissipation part and heat of the second heat dissipation part to the outside of the heat dissipation back clamp through the first opening and/or the second opening during working. The application provides a heat dissipation back splint can optimize the heat dispersion of heat dissipation back splint.

Description

Heat dissipation back splint, shell assembly and electronic equipment

Technical Field

The embodiment of the application relates to the field of electronic equipment, in particular to a heat dissipation back clamp, a shell assembly and electronic equipment.

Background

With the rapid development of electronic devices, many electronic devices not only have basic functions of calling and sending short messages, but also have other functions of games, photography, video and the like. Especially, when a user uses the electronic device to run a large game or play an ultra-clear video, the user's use requirement cannot be met only by natural heat dissipation of the electronic device, and therefore, a heat dissipation back clip is usually adopted to assist the electronic device in heat dissipation.

Meanwhile, due to the limitations of the camera module, the key positions and the like of the electronic equipment, the heat dissipation back clip is usually clamped in the middle of the electronic equipment. However, different types of electronic devices have different hot spot positions, and therefore, for an electronic device in which the hot spot position is not in the middle, the heat dissipation performance of the heat dissipation back clip is poor, and it is difficult to meet the user requirements.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a heat dissipation back splint, a shell assembly and electronic equipment, and the heat dissipation performance of the heat dissipation back splint can be optimized while the heat dissipation performance of the heat dissipation back splint is suitable for the electronic equipment of different types.

In a first aspect, a heat dissipation back clip is provided, comprising:

the shell comprises a first shell part and a second shell part, wherein the first shell part and the second shell part are provided with accommodating cavities, the first shell part comprises a shell substrate and a peripheral component arranged around the edge of the shell substrate, the shell substrate is provided with a first opening, and the peripheral component is provided with a second opening;

the connecting assembly is connected with the second shell part and used for fixing the heat dissipation back clip on the mobile terminal;

and the heat dissipation assembly is arranged in the accommodating cavity and comprises a first heat dissipation part, a second heat dissipation part and a fan, the first heat dissipation part is arranged at the position corresponding to the first opening, the second heat dissipation part is arranged at the position corresponding to the second opening, and the fan is used for dissipating the heat of the first heat dissipation part and the heat of the second heat dissipation part to the outside of the heat dissipation back clamp through the first opening and/or the second opening during working.

The heat dissipation back splint provided by the embodiment of the application can increase the heat dissipation path in the heat dissipation back splint by combining the first heat dissipation part with the second heat dissipation part, effectively increases the heat dissipation area under the condition of not increasing the wind resistance, and strengthens the heat dissipation of the mobile terminal. That is to say, because first heat dissipation part sets up in the position that first opening corresponds, the second heat dissipation part sets up in the position that the second opening corresponds, mobile terminal's heat can be through near heat-conduction transmission to first opening and second opening to utilize fan air inlet and first heat dissipation part and the heat transfer of second heat dissipation part, increase effective heat radiating area, improve mobile terminal's radiating efficiency. In addition, air is exhausted from two sides of the heat dissipation back splint, and the air sweeps around the heat source back shell of the mobile terminal to perform forced convection heat exchange, so that the heat exchange effect can be enhanced, and the heat dissipation back splint can be suitable for heat dissipation of electronic equipment of different types.

With reference to the first aspect, in certain implementations of the first aspect, the heat dissipation back clip further includes:

and the cold guide assembly is arranged on one side of the second shell part close to the mobile terminal, and one side of the cold guide assembly is in contact with the mobile terminal and is used for conducting heat generated by the mobile terminal to the heat dissipation assembly.

The heat dissipation back splint that this application embodiment provided can further strengthen mobile terminal's heat-conduction through setting up the cold subassembly of leading to improve mobile terminal's heat-sinking capability.

With reference to the first aspect, in certain implementations of the first aspect, the first heat sink piece is integrally formed with the second heat sink piece.

The heat dissipation back splint that this application embodiment provided, first heat dissipation part and second heat dissipation part are integrated into one piece, and the inside no air gap of integral type heat dissipation part also need not heat conduction interface material to fill, and consequently the last thermal resistance of heat conduction path is littleer, and the heat-sinking capability is stronger.

With reference to the first aspect, in certain implementations of the first aspect, the first heat sink piece and the second heat sink piece are connected by a thermally conductive interface material.

The heat dissipation back splint that this application embodiment provided is connected through heat conduction interface material between first heat dissipation part and the second heat dissipation part for mobile terminal's heat can be conducted to first heat dissipation part and second heat dissipation part in, thereby can increase effective heat radiating area, improves the radiating efficiency.

With reference to the first aspect, in certain implementations of the first aspect, the first heat sink piece and the second heat sink piece are connected by any one of screws, welding, riveting, and gluing.

With reference to the first aspect, in certain implementations of the first aspect, the heat dissipation assembly further includes a semiconductor cooling plate TEC, the TEC is disposed between the second heat dissipation component and the cooling conduction assembly, the TEC includes a cold side and a hot side,

the cold surface is contacted with the other side of the cold conduction assembly and is used for absorbing the heat conducted by the cold conduction assembly,

the hot side is in contact with the second heat sink piece for conducting heat absorbed by the cold side to the second heat sink piece.

The heat dissipation back splint that this application embodiment provided is through increasing the TEC, utilizes the Peltier effect of TEC to further conduct the heat of cold side to the hot side, conducts to second heat dissipation part by the hot side, further can conduct to first heat dissipation part, and the work through the fan at last transmits the heat outside the heat dissipation back splint. The heat absorbed by the heat source of the mobile terminal is quickly discharged out of the heat dissipation back clip after being transferred to the hot surface and the heat dissipation part, and when the heat of the hot surface is taken out, the temperature of the hot surface is reduced, so that the heat absorption capacity of the hot surface from the cold surface can be further accelerated, and the heat absorption capacity of the cold surface from the heat source of the mobile terminal is reversely improved. Through the process of accelerating the whole heat transfer, the heat dissipation efficiency of the mobile terminal is improved.

With reference to the first aspect, in certain implementations of the first aspect, a thermally conductive interface material is disposed between the cold face and the cold sink assembly, and/or a thermally conductive interface material is disposed between the hot face and the second heat sink component.

The heat dissipation back splint that this application embodiment provided through between cold face and the cold subassembly of leading, and/or set up heat conduction interface material between hot face and the second heat dissipation part, can further guarantee thermal conduction speed and conduction efficiency to more be favorable to mobile terminal's heat dissipation.

With reference to the first aspect, in certain implementations of the first aspect, the thermally conductive interface material includes any one of: heat conducting pad, heat conducting gel, heat conducting silicone grease and phase change interface material.

With reference to the first aspect, in certain implementations of the first aspect, the cold conduction assembly includes any one of: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride.

In a possible implementation manner, the cold-conducting component can comprise at least one graphene film layer/artificial graphite layer/natural graphite layer, and the thickness of each graphene layer/artificial graphite/natural graphite layer is less than or equal to 500 μm.

With reference to the first aspect, in certain implementations of the first aspect, the cold conducting assembly includes any one of a graphene film, artificial graphite, natural graphite, and other graphite heat conducting films, and a thermal conductivity of the graphene film/artificial graphite/natural graphite and other graphite heat conducting films is greater than or equal to 600W/mK.

The heat dissipation back splint that this application embodiment provided, lead cold subassembly can include any kind of graphite heat conduction membrane such as graphite alkene membrane, artifical graphite, natural graphite, the coefficient of heat conductivity of graphite heat conduction membrane can promote 2 times and above for the coefficient of heat conductivity of ordinary material, coefficient of heat conductivity is higher, the soaking effect of material is stronger more, consequently make mobile terminal's heat pass through graphite heat conduction membrane among the heat conduction subassembly can evenly distributed to more be favorable to mobile terminal's heat dissipation.

With reference to the first aspect, in certain implementations of the first aspect, the first heat sink member and/or the second heat sink member has a thermal conductivity greater than or equal to 15W/mK.

With reference to the first aspect, in certain implementations of the first aspect, the area of the first heat sink member covering the first opening accounts for greater than or equal to 10% of the area of the first opening.

With reference to the first aspect, in certain implementations of the first aspect, a minimum distance between an area of the fan proximate to the first heat sink member and the first heat sink member is greater than or equal to 0.2mm.

It can be understood that the first heat dissipation part can protrude from the first opening to serve as an appearance part, the minimum distance between the area of the fan close to the first heat dissipation part and the first heat dissipation part is larger than or equal to 0.2mm, so that a certain distance is ensured between the fan and the first heat dissipation part, the problem that the first heat dissipation part is deformed and scratched by blades of the fan after the first heat dissipation part is pressed can be solved, meanwhile, the effect that a hand stretches into the fan to be prevented is achieved, and the influence on the user experience is avoided. In addition, the problem of noise caused by the fact that the distance between the fan and the first heat dissipation part is too small can be avoided.

With reference to the first aspect, in certain implementations of the first aspect, the fan comprises any one of: centrifugal fan, axial fan, jet fan, piezoelectric fan, and flapping wing fan.

In some embodiments, the fan is an axial fan, and when the axial fan operates, air is vertically supplied and vertically discharged, and after the discharged air collides with the second heat dissipation component, the wind direction is forcibly changed to be discharged to the periphery, that is, when the axial fan operates, the heat generated by the mobile terminal can be dissipated to the outside of the heat dissipation back clip through the first opening and the second opening.

In some embodiments, the fan is a centrifugal fan, and compared with the axial fan for vertically feeding air and vertically discharging air, the characteristic of the centrifugal fan for vertically feeding air and horizontally discharging air reduces wind resistance caused by impact between the vertically discharged air and the second heat dissipation component. In addition, compared with an axial flow fan, the centrifugal fan has the advantages that the wind pressure is high, and the wind loss is small when resistance is met, so that the centrifugal fan has a better heat dissipation effect.

With reference to the first aspect, in certain implementations of the first aspect, the connection assembly fixes the mobile terminal by clamping or magnetic attraction.

The heat dissipation back splint that this application embodiment provided, coupling assembling can fix the heat dissipation back splint on mobile terminal through the mode of centre gripping or magnetism, that is to say, coupling assembling can fix the heat dissipation back splint at mobile terminal's middle part to can avoid handheld region, the user operation of being convenient for.

In a possible implementation manner, the connecting assembly may include a plastic housing and a soft rubber pad, and the soft rubber pad may be clamped on the mobile terminal, so that the heat dissipation back clip is fixed on the mobile terminal while avoiding damage to the surface of the mobile terminal.

With reference to the first aspect, in certain implementations of the first aspect, the first housing portion and the second housing portion cover to form the receiving cavity.

With reference to the first aspect, in certain implementations of the first aspect, the housing is a unitary structure.

It can be understood that the housing involved in the embodiments of the present application may be an integral structure, or may be a split structure. That is, the housing may be designed as an integral body, or the housing may be designed as a separate body including the first housing portion and the second housing portion, which is not limited in the present application.

Optionally, the heat dissipation back splint may further include a numerical control display module, and the numerical control display module may be disposed in the accommodating cavity. The digital control display module can be used for displaying the temperature of the contact surface of the heat dissipation back clamp and the mobile terminal, and the temperature can be the temperature monitored by a negative temperature coefficient NTC resistor on a circuit board close to the cold surface of the TEC. The temperature is converted into an electric signal through the NTC resistor, the electric signal is transmitted to the circuit board, the circuit board transmits temperature data to the numerical control display module, and the temperature is displayed through the numerical control display module.

In a possible implementation manner, a user can set the operation mode of the heat dissipation back clip to a high, medium, low and other gear modes according to the user's own needs. The high, medium and low performance gear modes set by the user for the heat dissipation back splint system can also be displayed through the numerical control display module.

In some embodiments, a surface of a side of the first housing portion away from the mobile terminal may be transparent, so that a user may directly observe a temperature of the heat dissipation back clip displayed on the numerical control display module, thereby enhancing a user experience.

In other embodiments, a hole is locally dug in the surface of one side of the first shell part, which is far away from the mobile terminal, and the position of the protrusion of the numerical control display module, so that the temperature is leaked from the numerical control display module to display, and thus, a user can directly observe the temperature of the heat dissipation back clip displayed on the numerical control display module, and the user experience is enhanced.

In a second aspect, there is provided a housing assembly comprising:

the protective sleeve is sleeved on the outer side of the mobile terminal;

the heat dissipation back clip is arranged on one side, away from the mobile terminal, of the protective sleeve;

the first heat conduction layer is arranged between the protective sleeve and the mobile terminal and used for conducting heat generated by the mobile terminal to the heat dissipation back clamp.

The casing subassembly that this application embodiment provided can overlap the outside of locating mobile terminal, and first heat-conducting layer sets up between protective sheath and mobile terminal, and first heat-conducting layer contacts with mobile terminal's heat source simultaneously, can conduct the heat to the heat dissipation back splint, dispels the heat to mobile terminal through the heat dissipation back splint to can alleviate the poor problem of mobile terminal radiating effect, improve mobile terminal's radiating effect.

With reference to the second aspect, in certain implementations of the second aspect, the protective sleeve is provided with an opening for receiving the heat-dissipating back clip.

The housing assembly that this application embodiment provided, the protective sheath can set up the opening, and the opening is used for holding the heat dissipation back splint to can make the heat dissipation back splint directly contact with first heat conduction layer, accelerate mobile terminal's heat conduction, and then improve mobile terminal's radiating efficiency.

With reference to the second aspect, in certain implementations of the second aspect, the protective sheath is provided with an opening, a second heat conducting layer is disposed in the opening, and the second heat conducting layer is located between the first heat conducting layer and the heat dissipation back clip and is used for conducting heat on the first heat conducting layer to the heat dissipation back clip.

With reference to the second aspect, in certain implementations of the second aspect, the first thermally conductive layer includes any one of: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride.

With reference to the second aspect, in certain implementations of the second aspect, the second thermally conductive layer includes any one of: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride.

In some embodiments, the first heat conducting layer is any one of a graphene film, artificial graphite, natural graphite, and other graphite heat conducting films, and the second heat conducting layer is made of a metal material (e.g., copper material, aluminum material, magnesium aluminum alloy, and the like).

The casing subassembly that this application embodiment provided, direct contact can not be directly between heat dissipation back splint and the first heat-conducting layer, sets up the second heat-conducting layer between heat dissipation back splint and the first heat-conducting layer, when mainly considering that first heat-conducting layer is graphite heat-conducting membranes such as graphite membrane, artificial graphite, natural graphite, graphite heat-conducting membrane is fragile material, through increasing second heat-conducting layer (for example, the metal material), has both protected first heat-conducting layer and has guaranteed that heat transfer path thermal resistance is little again.

With reference to the second aspect, in certain implementations of the second aspect, the first thermally conductive layer has a thermal conductivity greater than or equal to 15W/mK.

In some embodiments, the first thermally conductive layer and/or the second thermally conductive layer may comprise a graphene film/artificial graphite/natural graphite having a thermal conductivity greater than or equal to 600W/mK.

In a third aspect, an electronic device is provided, which includes: the heat dissipation back splint comprises a mobile terminal and the heat dissipation back splint described in the first aspect and any implementation manner of the first aspect, wherein the heat dissipation back splint is used for heat dissipation of the mobile terminal.

In a fourth aspect, an electronic device is provided, which includes: the mobile terminal and the housing assembly of any implementation manner of the second aspect and the second aspect, the housing assembly is used for heat dissipation of the mobile terminal.

Drawings

Fig. 1 is a schematic view of a heat dissipation back clip.

Fig. 2 is a schematic view of an overall structure of a heat dissipation back clip according to an embodiment of the present application.

Fig. 3 is a schematic view of a split structure of main components of a heat dissipation back clip according to an embodiment of the present application.

Fig. 4 is an exploded view of a heat dissipation back clip according to an embodiment of the present application.

Fig. 5 is a schematic cross-sectional view of a heat dissipation back clip according to an embodiment of the present disclosure.

Fig. 6 is a schematic cross-sectional view of another heat dissipation back clip according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of another heat dissipation back clip according to an embodiment of the present application.

Fig. 8 is a schematic cross-sectional view of another heat dissipation back clip according to an embodiment of the present application.

Fig. 9 is a schematic cross-sectional view of another heat dissipation back clip according to an embodiment of the present application.

Fig. 10 is a schematic cross-sectional view of another heat dissipation back clip according to an embodiment of the present application.

Fig. 11 is a schematic view of a housing assembly according to an embodiment of the present disclosure.

Fig. 12 is a schematic view of another housing assembly provided in the embodiments of the present application.

Fig. 13 is a schematic view of another housing assembly provided in embodiments of the present application.

Fig. 14 is a schematic diagram of an electronic device according to an embodiment of the present application.

Fig. 15 is a schematic view of another electronic device provided in an embodiment of the present application.

Fig. 16 is a schematic view of another electronic device provided in the embodiment of the present application.

Fig. 17 is a schematic view of another electronic device provided in an embodiment of the present application.

Reference numerals:

210-a housing; 211-a first housing portion; 212-second housing portion, 2111-housing base plate, 2112-peripheral components, 2113-first opening, 2114-second opening, 2115-power interface, 2121-snap, 2122-cavity, 2123-spring retaining boss; 220-connecting component, 221-plastic shell, 222-soft rubber cushion; 230-a heat dissipation assembly, 231-a first heat dissipation component, 232-a second heat dissipation component, 233-a fan, 234-a heat-conducting interface material, 235-a TEC, 236 a-a heat-conducting interface material, 236 b-a heat-conducting interface material, 237-a circuit board, 238-a power interface platelet, 239-a numerical control display module, 2311-a nut, 2321-a FPC, 2322-a spring, 2351-a cold surface and 2352-a hot surface; 240-cold conducting component, 241-metal layer, 242-first connecting adhesive layer, 243-graphene film layer, 244-second connecting adhesive layer and 245-silica gel cushion layer; 100-mobile terminal, 200-heat dissipation back splint, 300-protective sheath, 400-first heat conduction layer, 310-second heat conduction layer.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a", "an", and "the" are intended to include such expressions as "one or more" unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" means one, two or more. The first, second, and various numerical references are only used for convenience of description and are not intended to limit the scope of the embodiments of the present application. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. The sequence numbers of the following processes do not mean the sequence of execution, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiment of the present application. For example, in the embodiments of the present application, words such as "110", "210", "220" and the like are merely used for identification for convenience of description, and do not limit the order in which steps are performed.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. In this application, the words "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise. In the embodiment of the application, the descriptions of ' when 8230; ' 8230 '; ' in the case of ' 8230; ' 8230 '; ' if ' and ' if ' all refer to the corresponding treatment of the device under certain objective conditions, it is not time-critical and does not require any deterministic activity to be performed by the device, nor does it imply any other limitation.

It should be noted that the heat dissipation back clip and the housing assembly provided in the embodiments of the present application may be used for heat dissipation of a mobile terminal device, which may be a portable electronic device, such as a mobile phone, a tablet computer, a notebook computer, etc., including other functions, such as a personal digital assistant and/or a music player, and the present application is not limited thereto.

Fig. 1 is a schematic view illustrating a structure of a heat dissipation clip.

The heat dissipation back clip 10 is mainly used for heat dissipation of the mobile terminal 20. As shown in fig. 1, the heat sink clip 10 may include a cold conducting component 110, a heat dissipating component 120, a housing (not shown), and a connecting component (not shown). The connecting assembly is used for connecting the heat dissipation back clip 10 and the mobile terminal 20; the cold conducting assembly 110 may conduct heat for the mobile terminal 20 and conduct heat of the mobile terminal 20 to the heat dissipating assembly 120, and the cold conducting assembly 110 may include a silica gel pad 111, a copper foil 112 and a metal temperature equalizing sheet 113; the heat sink 120 is mainly used for dissipating heat of the mobile terminal 20 into the air, and the heat sink 120 may include a thermal grease 121, a semiconductor cooler (TEC) 122, a thermal grease 123, a fin 124, and a fan 125.

As can be seen from fig. 1, the cold conducting assembly 110 and the heat dissipating assembly 120 are stacked in the thickness direction of the mobile terminal. Specifically, the cold conduction component 110 may be in direct contact with the mobile terminal 20, and conduct heat generated by the mobile terminal 20 to the heat dissipation component 120, and the heat generated by the mobile terminal 20 is dissipated into the air by the heat dissipation component 120. The silicon pad 111 may directly contact with the mobile terminal 20, and conduct heat generated by the mobile terminal 20 to the heat dissipation assembly 120 through the copper foil 112 and the metal temperature equalizing sheet 113, and the heat dissipation assembly 120 dissipates the heat generated by the mobile terminal 20 to the air through the heat conductive silicone grease 121, the TEC 122, the heat conductive silicone grease 123, the fins 124, and the fan 125, so as to dissipate the heat of the mobile terminal 20.

The heat dissipation back clip 10 can dissipate heat of the mobile terminal 20 through the following two paths: the first path is to dissipate heat of the mobile terminal 20 through the thermal conduction of the TEC 122 in the heat dissipation back clip 10; the second path is that the wind blown by the fan 125 in the heat dissipation back clip 10 performs forced convection heat exchange with the back case near the heat source 210 of the mobile terminal, thereby dissipating heat of the mobile terminal 20.

It can be understood that, because the TEC is made by using the peltier effect of semiconductor materials, the peltier effect refers to a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. Therefore, when current flows through the TEC 122, one end of the TEC 122 may form the cold side 1222, the other end of the TEC 122 may form the hot side 1221, and the smaller the temperature difference between the cold and hot sides, the higher the TEC energy efficiency ratio. The cold side 1222 may directly exchange heat with the mobile terminal 20 through the heat conductive silicone grease 121 and the cold conductive member 110. At the same time, the cold side 1222 can conduct heat to the hot side 1221, and the hot side 1221 in turn conducts heat to the heat sink assembly 120 and ultimately to the fins 124. And the heat conducted from the TEC hot side 1221 to the fins 124 is carried away by the active heat dissipation of the fan 125, so that the cold side 1222 maintains a certain cooling capacity, and the cold side 1222 absorbs the heat from the mobile terminal heat source 210, thereby helping to cool the mobile terminal heat source 210. When the heat source 210 of the mobile terminal generates heat, the heat is transferred to the cold side 1222 of the TEC, and then is transferred from the cold side 1222 of the TEC to the hot side 1221 of the TEC, and the heat can be further conducted to the fin 124 by the contact between the fin 124 and the hot side 1221, and finally is transferred out of the heat dissipation back clip 10 by the operation of the fan 125. By providing the fan 125, the heat absorbed from the heat source 210 will be quickly exhausted from the heat sink clip 10 after being transferred to the hot side 1221 and the fins 124, and when the heat of the hot side 1221 is taken out, the temperature of the hot side 1221 drops, which further increases the heat absorption capability of the hot side 1221 from the cold side 1222, and conversely increases the heat absorption capability of the cold side 1222 from the heat source 210. By speeding up the overall process of thermal heat transfer, the efficiency of heat dissipation to the mobile terminal 20 is improved.

Therefore, when power is supplied to the heat-dissipating back clip 20, the TEC 122 can switch to have a hot side 1221 and a cold side 1222, and after the cold side 1222 absorbs heat generated by the heat source 210, the heat will be conducted to the hot side 1221 again, the hot side 1221 conducts heat to the fins 124, and then the fan 125 dissipates heat, i.e., the heat dissipation process from the heat source 210, the cold side 1222, the hot side 1221, the fins 124, and the fan 125 is performed.

It should be understood that the performance of the heat dissipation back splint is strongly related to the airflow speed and the effective heat dissipation area of the fins, i.e., the performance of the heat dissipation back splint is directly proportional to the airflow speed and the effective heat exchange area of the fins. Under the condition that the air speed of the air flow passing through the fins is kept unchanged, the effective heat exchange area of the fins is increased, and the heat dissipation performance of the heat dissipation back clip can be improved. Under the condition that the effective heat exchange area of the fins is kept unchanged, the performance of the fan is improved, and the heat dissipation performance of the heat dissipation back clip can also be improved.

The heat dispersion that the heat dissipation back splint improved the heat dissipation back splint through the effective heat transfer area of constantly increasing the fin at present, nevertheless when the effective heat transfer area of constantly increasing the fin, also can make the windage increase to reduced the heat convection coefficient (the air current wind speed promptly) between fin and air current, caused heat dispersion to worsen, and increase system noise. In addition, increasing the size of the fan to improve the performance of the fan increases the size of the heat dissipation back clip, which is not favorable for the light and thin design of the heat dissipation back clip.

The heat dissipation back splint is generally arranged in the middle of the mobile terminal, and because the heat source positions of different types of mobile terminals are different, for the mobile terminal with the heat source position not in the middle, the cold surface of the heat dissipation back splint cannot directly contact with the hot spot, and the heat dissipation effect is greatly reduced, so that how to solve the problem that the adaptability of the heat dissipation back splint to the heat dissipation of different mobile terminals is a key problem for optimizing the heat dissipation back splint.

The embodiment of the application provides a heat dissipation back splint, can be applicable to different types of mobile terminals when optimizing the heat dispersion of heat dissipation back splint under the condition that does not increase heat dissipation back splint volume and windage.

Fig. 2 is a schematic view of an overall structure of a heat dissipation back clip according to an embodiment of the present application. Fig. 3 is a schematic view of a split structure of main components of a heat dissipation back clip according to an embodiment of the present application. Fig. 4 is an exploded view of a heat dissipation clip according to an embodiment of the present application. The specific structure of the heat dissipation back clip 200 will be described in detail with reference to fig. 2 to 4.

The heat-dissipating back clip 200 includes a housing 210, and the housing 210 includes a first housing portion 211 and a second housing portion 212, and the first housing portion 211 and the second housing portion 212 are formed with receiving cavities. The first housing portion 211 includes a housing base plate 2111 and a peripheral component 2112 disposed around an edge of the housing base plate, the housing base plate 2111 being provided with a first opening 2113 and the peripheral component being provided with a second opening 2114. The first 2113 and/or second 2114 openings are adapted for heat exchange with the external environment.

It should be understood that the first housing portion 211 and the second housing portion 212 are merely exemplary and are not intended to limit the structure of the housing of the present application. The housing 210 provided in the embodiment of the present application may have a rectangular parallelepiped structure as shown in fig. 2 to 4, or may have a hemispherical structure, an ellipsoidal structure, or the like, which is not limited in the present application.

In some embodiments, the first housing portion 211 and the second housing portion 212 are closed to form a receiving cavity. Illustratively, the first housing portion 211 and the second housing portion 212 may be connected by a snap 2121. In this case, the first housing part 211 and the second housing part 212 may be of a split design.

In other embodiments, the housing 210 is a unitary structure, i.e., the first housing portion 211 is integrally formed with the second housing portion 212. That is, the first housing portion 211 is designed to be integrally formed with the second housing portion 212.

It should be noted that the first opening 2113 and/or the second opening 2114 are only exemplary, in this embodiment, the first opening 2113 may be disposed on a top surface of the heat dissipation back clip on a side away from the mobile terminal, and the second opening 2114 may be disposed on a side surface of the heat dissipation back clip. The number and shape of the first and/or second openings 2113 and 2114 are not limited in the embodiments of the present application, and it is understood that the first opening 2113 may include one or more openings, and the plurality of first openings may be arranged in a matrix shape; the second opening 2114 may include one or more second openings, and the plurality of second openings may be arranged in a matrix shape. For example, the shape of the first opening 2113 and/or the second opening 2114 may be designed as a square, a rectangle, a circle, a diamond, or the like, which is not limited in the present application.

In addition, the heat dissipation back clip provided by the present application may further include a third opening and a fourth opening, and the third opening and the fourth opening may be disposed on the first housing portion 211, or the third opening and the fourth opening may be disposed on the second housing portion 212, which is not limited in this application. Illustratively, the second housing portion 212 includes a second housing substrate and a second peripheral component disposed around an edge of the second housing substrate, the second peripheral component and the peripheral component 2112 may together form a side of the heat sink clip, and the second housing substrate may be provided with a third opening, and the second peripheral component may be provided with a fourth opening.

Optionally, a power interface 2115 is provided on the housing 210, and the power interface 2115 is connected to the power interface platelet 238. Specifically, the power interface 2115 may be disposed on the first housing portion 211 (as shown in fig. 4), and the power interface 2115 may also be disposed on the second housing portion 212, which is not limited in this application. The power interface 2115 may be electrically connected to a connecting wire to provide power to the heat sink clip. The types of power interfaces 2115 may include: the Micro USB interface, the USB type-c interface, the lighting interface and the like, so that electric connecting wires with different interface types can be used.

Optionally, the second housing portion 212 is provided with a cavity 2122 and a spring retaining boss 2123, which spring retaining boss 2123 may positionally define the contents of the interior of the second housing portion 212.

The heat dissipation back clip 200 further includes a connection assembly 220, and the connection assembly 220 is connected with the housing 210 for fixing the heat dissipation back clip 200 on the mobile terminal.

Optionally, the connecting assembly 220 may fix the heat dissipation back clip on the mobile terminal in a clamping or magnetic attraction manner, and in one embodiment, the connecting assembly 220 may fix the heat dissipation back clip in the middle of the mobile terminal, so as to avoid a handheld area and facilitate user operation. In another embodiment, the connection component 220 may be a device with magnetic attraction capability, which may be disposed on a side of the housing 210 close to the mobile terminal, and may fix the heat dissipation back clip 200 on the mobile terminal by using its own attraction capability.

Alternatively, the connection assembly 220 may include two connecting members that are disposed opposite each other and cooperate to hold the mobile terminal together or may be connected to the mobile terminal. It should be understood that the connection assembly 220 may include a plastic housing 221 and a soft rubber pad 222, and the soft rubber pad 222 may be clamped on the mobile terminal, so as to fix the heat dissipation back clip on the mobile terminal while avoiding damage to the surface of the mobile terminal.

The heat dissipation back clip 200 further includes a heat dissipation assembly 230, and the heat dissipation assembly 230 may include a first heat dissipation member 231, a second heat dissipation member 232, and a fan 233. The first heat dissipation member 231 is disposed at a position corresponding to the first opening 2113, the second heat dissipation member 232 is disposed at a position corresponding to the second opening 2114, the fan 233 may be disposed between the first heat dissipation member 231 and the second heat dissipation member 232, and the fan 233 is configured to dissipate heat of the first heat dissipation member 231 and heat of the second heat dissipation member 232 to the outside of the heat dissipation back clip 200 through the first opening 2113 and the second opening 2114 when operating.

In some embodiments, the first heat sink piece 231 and the second heat sink piece 232 are integrally formed. The first heat dissipation part 231 covers part of the air inlet of the fan 233, and heat of the mobile terminal can be transferred to the air inlet of the fan (i.e., the first opening 2113) through heat conduction, so that the heat dissipation area is increased, the space utilization rate of the heat dissipation part is improved, and meanwhile, the volume of the heat dissipation back clip is not increased. In addition, the integrated heat dissipation component is free of air gaps and does not need to be filled with heat conduction interface materials, so that the heat resistance on a heat conduction path is smaller, and the heat dissipation capacity is higher.

In other embodiments, the first heat sink member 231 and the second heat sink member 232 may be connected by a heat conducting interface material 234, so that the heat of the second heat sink member 232 is further transferred to the first heat sink member 231, thereby increasing the heat dissipation area, improving the space utilization of the heat sink member, and simultaneously not increasing the volume of the heat dissipation back clip.

In other embodiments, the first heat sink member 231 and the second heat sink member 232 may be formed separately, and the first heat sink member 231 and the second heat sink member 232 may be connected together by screws, welding, riveting, adhering, and the like, which is not limited in this application.

In addition, the first heat sink member 231 may protrude from the first opening 2113 as an exterior member and play a role of preventing a hand from being inserted into the touch fan 233 without increasing the overall thickness of the heat sink back clip.

In one possible implementation, the first heat sink member 231 and the second heat sink member 232 may be designed as fins as shown in fig. 4. The first heat sink member 231 may be designed as a bridge-type fin structure, and the second heat sink member 232 may include a substrate on which other devices, such as a digital control display module 239, may be disposed and fins. The first heat sink member 231 may be fixed to the base of the second heat sink member 323 by nuts 2311, and the fan 233 may also be fixed to the base of the second heat sink member 323 by nuts 2311.

Optionally, the first heat sink piece 231 and/or the second heat sink piece 232 have a thermal conductivity greater than or equal to 15W/mK. The thermal conductivity is a physical parameter that indicates the quality of the heat transfer performance of the material. The thermal conductivity is the heat transferred in watts/meter-degree (i.e., W/mK, where K can be replaced by C.) within 1 second (i.e., s) through a 1-square meter area for a 1-meter thick material with a temperature difference of 1 degree (i.e., K or C.) at a stable heat transfer condition.

Alternatively, the area of the first heat sink member 231 covering the first openings 2113 accounts for 10% or more of the area of the first openings 2113. That is, the area of the first opening 2113 should be greater than or equal to the area of the first heat sink member 231 covering the first opening 2113.

Optionally, a Flexible Printed Circuit (FPC) 2321 and a spring 2322 may be disposed on the substrate of the second heat sink member 232. The spring 2322 may be coupled with a spring stop boss 2123 for coupling the coupling assembly 220 to the mobile terminal via a spring return force. The FPC 2321 may connect the power interface platelet 238 and the circuit board 237, or connect the digital control display module 239 and the circuit board 237, for conducting signals between the circuit board 237 and related devices (for example, connecting the power interface platelet 238 and the digital control display module 239). Specifically, when the FPC 2321 is disposed between the power interface platelet 238 and the circuit board 237, the FPC 2321 may supply power to the circuit board 237, and transmit information such as USB data communication; when the FPC 2321 is disposed between the digital control display module 239 and the circuit board 237, the FPC 2321 may supply power to the digital control display module 239 and perform data transmission.

The fan 233 may include any one of: centrifugal fan, axial fan, jet fan, piezoelectric fan, flapping wing fan, and the like, but the present application is not limited thereto. In one possible implementation, the fan 233 may be sandwiched between the first heat sink piece 231 and the second heat sink piece 232 and may be mounted on the second heat sink piece 232 by a locking form. Since the heat-conducting interface material 234 is filled between the first heat sink member 231 and the second heat sink member 232, the heat transfer path is ensured to be smooth. In one embodiment, the fan 233 may exchange heat with the high-temperature first heat sink member 231 using low-temperature ambient air drawn in from the first opening 2113, and wind blown out from the second opening 2114 forcibly exchanges heat with the second heat sink member 232 by convection, bringing heat of the first heat sink member 231 and the second heat sink member 232 into the atmosphere. Meanwhile, part of blown air sweeps across the heat source position of the mobile terminal to carry out forced convection heat exchange. In another embodiment, the heat dissipation back clip can also exchange heat with the second heat dissipation part 232 through the low-temperature ambient air drawn in by the fan 233 through the second opening 2114, and the wind blown out from the first opening 2113 exchanges heat with the first heat dissipation part 231 by forced convection, so as to bring the heat of the first heat dissipation part 231 and the second heat dissipation part 232 into the atmosphere. Meanwhile, part of blown air sweeps across the heat source position of the mobile terminal to carry out forced convection heat exchange.

Alternatively, the minimum distance between the area of the fan 233 near the first heat sink member 231 and the first heat sink member 231 is greater than or equal to 0.2mm.

In some embodiments, the heat dissipation back clip 200 may further include a cold conduction assembly 240, the cold conduction assembly 240 is disposed near a side of the second housing portion 212 near the mobile terminal, and one side of the cold conduction assembly 240 contacts the mobile terminal for conducting heat generated by the mobile terminal to the heat dissipation assembly 230, and the heat dissipation assembly 230 dissipates the heat into the air. It is understood that one side of the cold-conducting assembly 240 may be in contact with the heat-dissipating assembly 230 located in the cavity 2122 and the other side may be in contact with the mobile terminal, thereby conducting heat of the mobile terminal to the heat-dissipating assembly 230.

Optionally, the heat dissipation assembly 230 may further include a semiconductor chilling plate TEC 235, the TEC 235 is disposed between the second heat dissipation member 232 and the cold-conducting assembly 240, the TEC 235 may include a cold side 2351 and a hot side 2352, the cold side 2351 is in contact with the other side of the cold-conducting assembly 240 for absorbing heat conducted by the cold-conducting assembly 240, and the hot side 2352 is in contact with the second heat dissipation member 232 for conducting heat absorbed by the cold side 2351 to the second heat dissipation member 232.

In some embodiments, a thermally conductive interface material 236b is disposed between the cold side 2351 and the cold sink assembly 240, and/or a thermally conductive interface material 236a is disposed between the hot side 2352 and the second heat sink piece 232.

Optionally, the thermal interface material may include any one of the following: heat conducting pad, heat conducting gel, heat conducting silicone grease and phase change interface material. That is, the thermal interface material 234, the thermal interface material 236a and the thermal interface material 236b may be any one of a thermal pad, a thermal gel, a thermal silicone grease and a phase change interface material, which is not limited in this application.

In a possible implementation manner, the heat dissipation back clip 200 may further include a circuit board 237, the circuit board 237 may be designed into a U-shaped structure, and the TEC 235 may be disposed in a groove of the U-shaped structure and electrically connected to the circuit board 237.

It is understood that the cold-conducting assembly 240 may include any of the following: copper material, aluminum material, magnesium aluminum alloy, graphene film, artificial graphite, natural graphite and boron nitride.

In some embodiments, the cold conducting assembly 340 may include any one of a graphene film, artificial graphite, natural graphite, and other graphite heat conducting films, and the graphene film/artificial graphite/natural graphite and other graphite heat conducting films have a thermal conductivity greater than or equal to 600W/mK.

It can be understood that when the cross section of the graphene film is observed through an electron microscope, the microscopic amplification structure inside the graphene film can be observed to be multiple laminated layers, and the laminated layers are staggered. In addition, the cross section of the artificial graphite is observed through an electron microscope, so that the artificial graphite is free from staggering among multiple layers and is relatively flat.

It can be understood that the cold-conducting component can comprise any one of graphite heat-conducting films such as graphene films, artificial graphite and natural graphite, the heat conductivity coefficient of the graphite heat-conducting film can be improved by 4 times and above relative to the heat conductivity coefficient of common materials, the higher the heat conductivity coefficient is, the stronger the soaking effect of the materials is, so that the heat of the mobile terminal can be uniformly distributed through the graphite heat-conducting film in the heat-conducting component, and the heat dissipation of the mobile terminal is facilitated.

As shown in fig. 4, in one possible implementation, the cold conducting assembly 240 may include a metal layer 241, a first connection glue layer 242, a graphene film layer 243, a second connection glue layer 244, and a silicone cushion layer 245. And along the thickness direction of the heat dissipation back splint, the metal layer 241, the first connection glue layer 242, the graphene film layer 243, the second connection glue layer 244 and the silica gel cushion layer 245 are stacked. The silica gel cushion layer 245 can be in direct contact with the mobile terminal, and can protect the mobile terminal; the first adhesive layer 242 is disposed between the metal layer 241 and the graphene film layer 243, and is used for connecting the metal layer 241 and the graphene film layer 243; the second connection glue layer 244 is disposed between the graphene film layer 243 and the silica gel cushion layer 245, and is used for connecting the graphene film layer 243 and the silica gel cushion layer 245. In another possible implementation, the cold conducting assembly 240 may include a graphene film layer 241, a first connection glue layer 242, a metal layer 243, a second connection glue layer 244, and a silicone cushion layer 245. And the graphene film layer 241, the first connection adhesive layer 242, the metal layer 243, the second connection adhesive layer 244, and the silicone cushion layer 245 are stacked along the thickness direction of the mobile terminal. The silica gel cushion layer 245 can be in direct contact with the mobile terminal, and can play a role in protecting the mobile terminal; the first connection adhesive layer 242 is disposed between the graphene film layer 241 and the metal layer 243 to connect the graphene film layer 241 and the metal layer 243, and the second connection adhesive layer 244 is disposed between the metal layer 243 and the silicone cushion layer 245 to connect the metal layer 243 and the silicone cushion layer 245.

It should be understood that the composition of the cold guiding assembly 240 in fig. 4 is only an exemplary illustration, and other heat conductive materials besides metal heat conductive materials, such as graphene, artificial graphite, natural graphite, boron nitride, etc., may be included in the cold guiding assembly 240. It should be noted that the cooling guide assembly 240 may include at least one graphene film layer/artificial graphite layer/natural graphite layer, and the thickness of each graphene layer/artificial graphite layer/natural graphite layer is less than or equal to 500 μm. In some embodiments, the thickness of a layer of graphene film/artificial graphite/natural graphite may be less than or equal to 200 μm.

Optionally, the heat sink clip 200 may also include a power interface platelet 238. When the power interface platelet 238 is powered on, the fan 233 can operate to remove heat generated by the mobile terminal. Meanwhile, after the TEC 235 is electrified, one side is a hot surface 2352, the other side is a cold surface 2351, and the hot surface 2352 can dissipate heat through the fan 233, so that the low temperature of the cold surface 2351 can be kept, and heat can be continuously taken away.

Optionally, the heat dissipation back clip 200 may further include a numerical control display module 239, and the numerical control display module 239 may be disposed in the accommodating cavity. The digital control display module 239 may be configured to display the temperature of the contact surface of the heat sink clip with the mobile terminal, which may be monitored by a Negative Temperature Coefficient (NTC) resistor on the circuit board near the TEC cold side 2351. That is, the NTC resistor converts the temperature into an electrical signal and transmits the electrical signal to the circuit board 237, the circuit board 237 transmits the temperature data to the numerical control display module 239, and the temperature is displayed by the numerical control display module 239.

In a possible implementation manner, a user can set the operation mode of the heat dissipation back clip to a high, medium, low and other gear modes according to the user's own needs. The high, medium and low performance gear modes set by the user for the heat dissipation back splint system can also be displayed through the numerical control display module 239.

In some embodiments, a surface of the first housing portion 211 on a side away from the mobile terminal may be transparent, so that a user may directly observe the temperature of the heat dissipation back clip displayed on the numerical control display module 239, thereby enhancing the user experience.

In other embodiments, the surface of the first housing portion 211 on the side away from the mobile terminal and the protruding position of the numerical control display module 239 are partially perforated to make the numerical control display module 239 leak and display the temperature, so that the user can directly observe the temperature of the heat dissipation back clip displayed on the numerical control display module 239, and the user experience is enhanced.

In summary, when power is supplied to the heat dissipation back clip 200, the TEC 235 may be switched to a state having a cold surface 2351 and a hot surface 2352, after the cold surface 2351 absorbs heat generated by the heat source of the mobile terminal, the heat is conducted to the hot surface 2352 again, the hot surface 2352 conducts the heat to the second heat dissipation member 232, the second heat dissipation member 232 conducts the heat to the first heat dissipation member 231, and then the fan 233 dissipates the heat, so that an external heat dissipation process from the mobile terminal heat source, the cold surface 2351, the hot surface 2352, the second heat dissipation member 232, the first heat dissipation member 231, and the fan 233 is realized.

The heat dissipation back splint provided by the embodiment of the application can increase the heat dissipation path in the heat dissipation back splint by combining the first heat dissipation part with the second heat dissipation part, effectively increases the heat dissipation area under the condition of not increasing the wind resistance, and strengthens the heat dissipation of the mobile terminal. That is to say, because first heat dissipation part covers and sets up in the position that first opening corresponds, and the second heat dissipation part sets up in the position that the second opening corresponds, mobile terminal's heat can be transmitted near first opening and second opening through heat-conduction to utilize fan air inlet and first heat dissipation part and the heat transfer of second heat dissipation part, increase effective heat radiating area, improve mobile terminal's radiating efficiency. In addition, air is exhausted from two sides of the heat dissipation back splint, and the air sweeps around the heat source back shell of the mobile terminal to perform forced convection heat exchange, so that the heat exchange effect can be enhanced, and the heat dissipation back splint can be suitable for heat dissipation of electronic equipment of different types.

The above-mentioned composition structure of the heat dissipation back clip is described in detail with reference to fig. 2 to 4, and a cross-sectional structure diagram of the heat dissipation back clip provided in the embodiment of the present application will be described below with reference to fig. 5 to 10, a cross-sectional structure diagram of the housing assembly provided in the embodiment of the present application will be described with reference to fig. 11 to 13, and a cross-sectional structure diagram of the electronic device provided in the embodiment of the present application will be described with reference to fig. 14 to 17.

Fig. 5 to 7 are schematic cross-sectional views of heat dissipation back clips according to embodiments of the present application.

The heat-dissipating back clip includes a housing 210, and as described above, the housing 210 includes a first housing portion 211 and a second housing portion 212, and the first housing portion 211 and the second housing portion 212 form an accommodating chamber. The first housing portion 211 includes a housing base plate 2111 and a peripheral component 2112 disposed around an edge of the housing base plate, the housing base plate 2111 being provided with a first opening 2113 and the peripheral component being provided with a second opening 2114. The first 2113 and/or second 2114 openings are adapted for heat exchange with the external environment.

In some embodiments, as shown in fig. 5, the first housing portion 211 and the second housing portion 212 cover to form a receiving cavity, i.e., the first housing portion 211 and the second housing portion 212 may be a split design.

In other embodiments, as shown in fig. 6, the housing 210 is a one-piece structure, i.e., the first housing portion 211 is integrally formed with the second housing portion 212.

The heat-dissipating back clip further includes a connecting assembly 220, and the connecting assembly 220 is connected to the housing 210 for fixing the heat-dissipating back clip to the mobile terminal.

The heat dissipation back clip further comprises a heat dissipation assembly 230, wherein the heat dissipation assembly 230 comprises a first heat dissipation member 231, a second heat dissipation member 232 and a fan 233, and the heat dissipation assembly 230 is located in a containing cavity formed by the first shell part 211 and the second shell part 212. The first heat dissipation member 231 is disposed at a position corresponding to the first opening 2113, the second heat dissipation member 232 is disposed at a position corresponding to the second opening 2114, the fan 233 may be disposed between the first heat dissipation member 231 and the second heat dissipation member 232, and the fan 233 is configured to dissipate heat of the first heat dissipation member 231 and heat of the second heat dissipation member 232 to the outside of the heat dissipation back clip 200 through the first opening 2113 and the second opening 2114 when operating.

Note that the area of the first heat sink member 231 covering the first openings 2113 accounts for 10% or more of the area of the first openings 2113.

In the heat dissipation back clip shown in fig. 5, the first heat dissipation member 231 and the second heat dissipation member 232 are connected by the heat conductive interface material 234, so that the heat of the second heat dissipation member 232 is further transferred to the first heat dissipation member 231, thereby increasing the heat dissipation area, improving the space utilization rate of the heat dissipation member, and simultaneously not increasing the volume of the heat dissipation back clip. In addition, the first heat sink member 231 may protrude from the first opening 2113 as an exterior member and play a role of preventing a hand from being inserted into the touch fan 233 without increasing the overall thickness of the heat sink back clip.

In some embodiments, the fan 233 may be an axial fan, as shown in fig. 5, when the axial fan operates, air is vertically supplied and discharged, and after the discharged air collides with the second heat dissipation component 232, the wind direction is forcibly changed to be discharged to the surrounding, that is, when the fan 233 operates, the heat generated by the mobile terminal can be dissipated to the outside of the heat dissipation back clip through the first opening 2113 and the second opening 2114. It can be understood that the axial flow fan has large air volume and small pressure compared with the centrifugal fan, that is, the axial flow fan has large air volume loss when meeting large air resistance conditions such as forcibly changing the wind direction.

In other embodiments, the fan 233 may be a centrifugal fan. More specifically, as shown in fig. 7, the fan 233 shown in fig. 7 may be a centrifugal fan without a volute, and the centrifugal fan without the volute has a small volume, and can supply air vertically and discharge air all around, so that the heat dissipation of the mobile terminal can be accelerated without increasing the weight of the heat dissipation back clip. In addition, the axial flow fan is replaced by the centrifugal fan, and compared with the vertical air inlet and vertical air outlet of the axial flow fan, the characteristic that the centrifugal fan vertically enters the air and horizontally outputs the air is reduced, and the wind resistance caused by the impact of the vertical air outlet and the second heat dissipation part is reduced. Compared with an axial flow fan, the centrifugal fan has the advantages that the wind pressure is high, and the wind loss is small when resistance is met, so that the centrifugal fan has a better heat dissipation effect.

In the heat sink back clip shown in fig. 5-7, a thermal interface material 236b is disposed between the cold side 2351 and the cold sink assembly 240, and/or a thermal interface material 236a is disposed between the hot side 2352 and the second heat sink piece 232.

Optionally, the thermally conductive interface material may include any of: heat conducting pad, heat conducting gel, heat conducting silicone grease and phase change interface material. That is, the thermal interface material 234, the thermal interface material 236a and the thermal interface material 236b may be any one of a thermal pad, a thermal gel, a thermal silicone grease and a phase change interface material, which is not limited in this application.

Optionally, the heat dissipation back clip may further include a cold conducting component 240, where the cold conducting component 240 is disposed near a side of the second housing portion 212 near the mobile terminal, and a side of the cold conducting component 240 contacts the mobile terminal, and is used for conducting heat generated by the mobile terminal to the heat dissipation component 230, and dissipating the heat into the air by the heat dissipation component 230.

The cold-conducting assembly 240 may include any of the following: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride. It is understood that other heat conductive materials besides metal heat conductive materials may be included in the cold guiding assembly 240, such as graphene film, artificial graphite, natural graphite, boron nitride, and the like.

It should be noted that the cooling assembly 240 may include at least one graphene film layer/artificial graphite/natural graphite, each graphene film layer/artificial graphite/natural graphite has a thickness of less than or equal to 500 μm, and the thermal conductivity of the graphene film/artificial graphite/natural graphite is greater than or equal to 600W/mK.

It can be understood that, when the cross section of the graphene film is observed through an electron microscope, the microscopic amplification structure inside the graphene film can be observed to be multiple laminated layers, and the laminated layers are staggered. In addition, the cross section of the artificial graphite is observed through an electron microscope, so that the artificial graphite is free from staggering among multiple layers and is relatively flat.

Considering that the heat conductive material in the current cold conduction assembly 240 is generally made of pure copper or 6 series aluminum, the thermal conductivity of the graphene film/artificial graphite/natural graphite can be improved by 2 times or more compared to the pure copper or 6 series aluminum material. The higher the thermal conductivity, the stronger the soaking effect of the material. Therefore, when any one of the graphite heat conduction films such as the graphene film, the artificial graphite, and the natural graphite is disposed in the cold guide assembly 240, the soaking effect of the graphite heat conduction film layer is good, and the heat of the mobile terminal can be uniformly distributed on the graphite heat conduction film layer.

It can be understood that any one of graphite heat conducting films such as graphene film, artificial graphite and natural graphite is arranged in the cold conducting assembly 240, when the cold conducting assembly 240 contacts with the mobile terminal, since the temperature equalizing effect of the graphite heat conducting film is good, the temperature difference between the central temperature and the temperature at two ends of the heat dissipation back clamp and the contact layer of the mobile terminal (for example, the silica gel cushion layer in the cold conducting assembly 240) can be reduced, that is, the problems of large temperature difference and poor temperature equalizing effect of the silica gel cushion layer can be solved. Meanwhile, when the cold conducting assembly 240 is in contact with the TEC cold face 2351, the graphite heat conducting film can also uniformly open the cold quantity of the TEC cold face 2351 and conduct the cold quantity to the silica gel soft cushion layer, thereby being more beneficial to heat dissipation of the mobile terminal.

It should be noted that, in the embodiment of the present application, by actually measuring the central temperature of the silica gel cushion layer of the first heat dissipation back clip and the second heat dissipation back clip, the first heat dissipation part 231 and the second heat dissipation part 232 are disposed in the first heat dissipation back clip, the second heat dissipation part 232 is disposed in the second heat dissipation back clip, and the central temperature of the silica gel cushion layer of the first heat dissipation back clip is lower than the central temperature of the silica gel cushion layer of the second heat dissipation back clip by more than 4 ℃. In addition, the temperature of the heat source of the mobile terminal when the first heat dissipation back clamp is used is lower than that of the heat source of the mobile terminal when the second heat dissipation back clamp is used by more than 2 ℃ through actually measuring the temperature of the heat source of the mobile terminal.

Therefore, the heat dissipation back splint that this application embodiment provided sets up first heat dissipation part through the increase, can make the central temperature income of silica gel cushion more than 4 ℃, to more than the mobile terminal heat source temperature income 2 ℃. Meanwhile, the first heat dissipation part can protrude from the first opening to serve as an appearance part and has the function of preventing hands from extending into the touch fan. In addition, through the combined use of the first heat dissipation part and the second heat dissipation part, the heat dissipation path in the heat dissipation back clip can be increased, the heat dissipation area is effectively increased under the condition that the wind resistance is not increased, and the heat dissipation of the mobile terminal is accelerated. That is to say, because first heat dissipation part covers part fan air intake, mobile terminal's heat can be through near heat-conduction transmission to fan air intake to utilize fan air and the heat transfer of first heat dissipation part, increase effective heat radiating area improves mobile terminal's radiating efficiency. In addition, air is exhausted from two sides of the heat dissipation back splint, and flows over the position near the heat source back shell of the mobile terminal to perform forced convection heat exchange, so that the heat exchange effect can be enhanced, and the heat dissipation back splint can be suitable for heat dissipation of electronic equipment of different types.

Fig. 8 to 10 are schematic cross-sectional views of heat dissipation back clips according to embodiments of the present application.

In some embodiments, as shown in fig. 8, the first housing portion 211 and the second housing portion 212 cover to form a receiving cavity, i.e., the first housing portion 211 and the second housing portion 212 may be a split design.

In other embodiments, as shown in fig. 9, the housing 210 is a one-piece structure, i.e., the first housing portion 211 is integrally formed with the second housing portion 212.

In the heat dissipation back clip shown in fig. 8, the first heat dissipation member 231 is integrally formed with the second heat dissipation member 232 (i.e., the heat dissipation member 2312 shown in fig. 8). Compared with the heat dissipation back splint in fig. 5, the integrated heat dissipation component has no air gap inside and does not need to be filled with a heat conduction interface material, so that the heat resistance on a heat conduction path is smaller, and the heat dissipation capacity is stronger.

In some embodiments, the fan 233 may be an axial fan, as shown in fig. 8, when the axial fan operates, air is vertically supplied and discharged, and after the discharged air collides with the second heat dissipation component 232, the wind direction is forcibly changed to be discharged to the surrounding, that is, when the fan 233 operates, the heat generated by the mobile terminal can be dissipated to the outside of the heat dissipation back clip through the first opening 2113 and the second opening 2114. It can be understood that the axial flow fan has a large air volume and a small pressure intensity compared with the centrifugal fan, that is, when the axial flow fan meets resistance, the loss of the air volume is also large.

In other embodiments, the fan 233 may be a centrifugal fan. More specifically, as shown in fig. 10, the fan 233 shown in fig. 10 may be a centrifugal fan without a volute, and the centrifugal fan without the volute has a small volume, and can supply air vertically and discharge air all around, so that the heat dissipation of the mobile terminal can be accelerated without increasing the weight of the heat dissipation back clip. In addition, the axial flow fan is replaced by the centrifugal fan, and compared with the vertical air inlet and vertical air outlet of the axial flow fan, the characteristic of the vertical air inlet and horizontal air outlet of the centrifugal fan reduces the wind resistance caused by the impact of the vertical air outlet and the second heat dissipation component. In addition, compared with an axial flow fan, the centrifugal fan has the advantages that the wind pressure is high, and the wind loss is small when resistance is met, so that the centrifugal fan has a better heat dissipation effect. In addition, compared with the heat dissipation back clip in fig. 5, the integrated heat dissipation component has no air gap inside and does not need to be filled with a heat conduction interface material, so that the heat resistance on a heat conduction path is smaller, and the heat dissipation capability is stronger.

In the heat sink back clip illustrated in fig. 8-10, a thermal interface material 236b is disposed between the cold side 2351 and the cold sink assembly 240, and/or a thermal interface material 236a is disposed between the hot side 2352 and the second heat sink piece 232.

Optionally, the heat dissipation back clip may further include a cold conducting assembly 240, the cold conducting assembly 240 is disposed near a side of the second housing portion 212 close to the mobile terminal, and one side of the cold conducting assembly 240 contacts the mobile terminal, and is used for conducting heat generated by the mobile terminal to the heat dissipation assembly 230, and dissipating the heat into the air by the heat dissipation assembly 230.

The cold-conducting assembly 240 may include any of the following: copper material, aluminum material, magnesium aluminum alloy, graphene film, artificial graphite, natural graphite and boron nitride. It is understood that other heat conductive materials besides metal heat conductive materials may be included in the cold guiding assembly 240, such as graphene film, artificial graphite, natural graphite, boron nitride, and the like.

It should be noted that the cold conducting assembly 240 may include at least one graphene film layer/artificial graphite layer/natural graphite layer, each graphene layer/artificial graphite layer/natural graphite layer has a thickness of less than or equal to 500 μm, and the graphene film/artificial graphite layer/natural graphite layer has a thermal conductivity of greater than or equal to 600W/mK.

Considering that the heat conductive material in the current cooling guide assembly 240 is generally made of pure copper or 6 series aluminum, the thermal conductivity of the graphene film/artificial graphite/natural graphite can be improved by 2 times or more compared to the pure copper or 6 series aluminum material. The higher the thermal conductivity, the stronger the soaking effect of the material. Therefore, when any one of the graphite heat conduction films such as the graphene film, the artificial graphite, and the natural graphite is disposed in the cooling guide assembly 240, the soaking effect of the graphite heat conduction film layer is good, and the heat of the mobile terminal can be uniformly distributed on the graphite heat conduction film layer.

Fig. 11 to 13 show schematic views of a housing assembly provided by an embodiment of the present application.

As shown in fig. 11, the housing assembly may include a protective sheath 300, a heat sink clip 200 as shown in any of fig. 2-10, and a first thermally conductive layer 400. Wherein, the protective cover 300 is sleeved on the outer side of the mobile terminal; the heat dissipation back clip 200 is disposed on a side of the protection cover 300 away from the mobile terminal; the first heat conducting layer 400 is disposed between the protective cover 300 and the mobile terminal, and the first heat conducting layer 400 is used for conducting heat generated by the mobile terminal to the heat dissipation back clip 200. In this case, the heat-dissipating back clip 200 may directly contact the protective cover 300 for dissipating heat generated from the mobile terminal into the air, thereby lowering the temperature of the mobile terminal.

Optionally, the first thermally conductive layer 400 may include a metallic material and a non-metallic material, and the metallic material may include: copper material, aluminum material and magnesium-aluminum alloy, and the non-metallic material can comprise graphene film and boron nitride. That is, the first thermally conductive layer 400 includes any of: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride. Wherein, the copper material can comprise pure copper T1, T2, T3, C1100, copper alloy and the like; the aluminum material may include 6-series aluminum, 5-series aluminum, aluminum alloy, etc.; the magnesium aluminum alloy may include AZ91D and the like.

Optionally, the thermal conductivity of the first thermally conductive layer 400 is greater than or equal to 15W/mK. In particular, when the first thermally conductive layer 400 is a graphene film/artificial graphite/natural graphite. The thermal conductivity of the first thermally conductive layer 400 may be greater than or equal to 600W/mK.

In some embodiments, as shown in fig. 12, the protective sleeve 300 is provided with an opening that can be used to receive the heat sink clip 200. In this case, the heat dissipation clip 200 may be directly connected to the first heat conduction layer 400 for dissipating heat generated from the mobile terminal to the air, thereby reducing the temperature of the mobile terminal.

It can be understood that when the first heat conduction layer is arranged between the protective sleeve and the mobile terminal, the first heat conduction layer can cover the heat source of the mobile terminal, so that the problem that the heat dissipation back clamp cannot cover the heat source of the mobile terminal, the heat dissipation effect is poor, and the heat dissipation effect of the mobile terminal is improved. That is to say, through jointly radiating back splint and metal material, perhaps jointly radiating back splint and non-metal material, can improve the temperature uniformity nature of mobile terminal shell, utilize radiating back splint also can take away the heat that mobile terminal produced simultaneously.

In other embodiments, as shown in fig. 13, the protective sheath 300 is provided with an opening in which the second heat conducting layer 310 is disposed, the second heat conducting layer 310 being located between the first heat conducting layer 400 and the heat dissipation back clip 200 for conducting heat on the first heat conducting layer 400 to the heat dissipation back clip 200. It is also understood that the material of the protective sheath 300 may be greater than or equal to class 2, and the portion of the protective sheath 300 attached to the heat dissipation back clip 200 (i.e., the second heat conduction layer 310) may be a high heat conduction material. The high thermal conductive material may include a metallic material and a non-metallic material. The metal material may include: copper materials (e.g., pure copper T1, T2, T3, C1100, copper alloys, etc.), aluminum materials (e.g., 6-series aluminum, 5-series aluminum, aluminum alloys, etc.), magnesium aluminum alloys (e.g., AZ91D, etc.), etc., which may include graphene films, artificial graphite, natural graphite, boron nitride, etc.; the remainder of the sleeve 300 may be a soft gel protective shell material, such as rubber, PC plastic, etc.

Optionally, the second heat conducting layer 310 comprises any of: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride. Wherein, the copper material can comprise pure copper T1, T2, T3, C1100, copper alloy and the like; the aluminum material may include 6-series aluminum, 5-series aluminum, aluminum alloy, etc.; the magnesium aluminum alloy may include AZ91D and the like.

Optionally, the thermal conductivity of the second thermally conductive layer 310 is greater than or equal to 15W/mK.

For example, the first heat conducting layer 400 may include any one of a graphene film, artificial graphite, natural graphite, and other graphite heat conducting films, and the second heat conducting layer 310 may be made of a metal material. In this case, the thermal conductivity of the first heat conducting layer 400 is greater than or equal to 600W/mK and the thermal conductivity of the second heat conducting layer 310 is greater than or equal to 15W/mK.

Compared with the housing assembly shown in fig. 12, in the housing assembly shown in fig. 13, the heat dissipation back clip is not directly contacted with the first heat conduction layer, the second heat conduction layer is arranged in the middle, mainly considering that the first heat conduction layer is any one of graphite heat conduction films such as graphene films, artificial graphite, natural graphite and the like, the graphite heat conduction film is a brittle material, and by adding the second heat conduction layer (for example, a metal material), the first heat conduction layer is protected, and the heat conduction path is ensured to have low thermal resistance.

Fig. 14 to 17 show schematic diagrams of electronic devices provided by an embodiment of the present application.

In some embodiments, as shown in fig. 14, the electronic device includes a mobile terminal 100 and a heat dissipation clip 200 as shown in any of fig. 2-10, which is in direct contact with the electronic device and may be used to dissipate heat from the mobile terminal 100.

In other embodiments, as shown in fig. 15, the electronic device includes the mobile terminal 100 and the housing assembly shown in fig. 11, and the housing assembly is sleeved on the mobile terminal 100 to dissipate heat of the mobile terminal 100. The temperature uniformity of the shell of the mobile terminal is improved by combining the heat dissipation back clamp and the first heat conduction layer in the shell assembly, heat is taken away by the heat dissipation back clamp in the shell assembly, and the problems that the cold surface cannot cover the position of a heat source of the mobile terminal and the heat dissipation effect is poor are solved.

In other embodiments, as shown in fig. 16, the electronic device includes the mobile terminal 100 and the housing assembly shown in fig. 12, and the housing assembly is sleeved on the mobile terminal 100 to dissipate heat of the mobile terminal 100.

In other embodiments, as shown in fig. 17, the electronic device includes the mobile terminal 100 and the housing assembly shown in fig. 13, and the housing assembly is sleeved on the mobile terminal 100 to dissipate heat of the mobile terminal 100.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat-dissipating back clip (200), comprising:

a housing (210), the housing (210) including a first housing portion (211) and a second housing portion (212), the first housing portion (211) and the second housing portion (212) forming a receiving cavity, the first housing portion (211) including a housing base plate (2111) and a peripheral component (2112) disposed around an edge of the housing base plate (2111), the housing base plate (2111) being provided with a first opening (2113), the peripheral component (2112) being provided with a second opening (2114);

the connecting assembly (220) is connected with the shell (210) and is used for fixing the heat dissipation back clip (200) on a mobile terminal;

the heat dissipation assembly (230) is arranged in the accommodating cavity, the heat dissipation assembly (230) comprises a first heat dissipation component (231), a second heat dissipation component (232) and a fan (233), the first heat dissipation component (231) is arranged at a position corresponding to the first opening (2113), the second heat dissipation component (232) is arranged at a position corresponding to the second opening (2114), and the fan (233) is used for dissipating heat of the first heat dissipation component (231) and heat of the second heat dissipation component (232) to the outside of the heat dissipation back clip (200) through the first opening (2113) and/or the second opening (2114) during work.

2. The heat dissipating back clip (200) of claim 1, wherein the heat dissipating back clip (200) further comprises:

and the cold guide assembly (240) is arranged on one side of the second shell part (212) close to the mobile terminal, and one side of the cold guide assembly (240) is in contact with the mobile terminal and is used for conducting heat generated by the mobile terminal to the heat dissipation assembly (230).

3. The heat sink clip (200) according to claim 1 or 2, wherein the first heat sink piece (231) is integrally formed with the second heat sink piece (232).

4. The heat sink clip (200) according to claim 1 or 2, wherein the first heat sink piece (231) and the second heat sink piece (232) are connected by a thermally conductive interface material.

5. The heat sink clip (200) according to claim 1 or 2, wherein the first heat sink piece (231) and the second heat sink piece (232) are connected by any one of screws, welding, riveting, and gluing.

6. The heat dissipating back clip (200) of claim 2, wherein the heat dissipating assembly (230) further comprises a semiconductor chilling plate TEC (235), the TEC (235) disposed between the second heat dissipating component (232) and the cold conducting assembly (240), the TEC (235) comprising a cold side (2351) and a hot side (2352),

the cold surface (2351) is in contact with the other side of the cold guide component (240) and is used for absorbing the heat conducted by the cold guide component (240),

the hot side (2352) is in contact with the second heat sink piece (232) for conducting heat absorbed by the cold side (2351) to the second heat sink piece (232).

7. The heat spreading back clip (200) of claim 6, wherein a thermally conductive interface material is disposed between the cold side (2351) and the cold directing assembly (240) and/or a thermally conductive interface material is disposed between the hot side (2352) and the second heat sink piece (232).

8. The heat spreading clip (200) of claim 4, wherein the thermally conductive interface material comprises any one of: heat conducting pad, heat conducting gel, heat conducting silicone grease and phase change interface material.

9. The heat spreading clip (200) of claim 7, wherein the thermally conductive interface material comprises any one of: heat conducting pad, heat conducting gel, heat conducting silicone grease and phase change interface material.

10. The clip (200) of claim 2, wherein the cold-conducting assembly (240) comprises any one of: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride.

11. The heat spreading clip (200) of claim 2, wherein the cold conducting assembly (240) comprises any one of a graphene film, an artificial graphite, and a natural graphite, each having a thermal conductivity greater than or equal to 600W/mK.

12. The heat sink clip (200) according to claim 1 or 2, wherein the thermal conductivity of the first heat sink piece (231) and/or the second heat sink piece (232) is greater than or equal to 15W/mK.

13. The heat sink clip (200) according to claim 1 or 2, wherein the area of the first heat sink member (231) covering the first opening (2113) is greater than or equal to 10% of the area of the first opening (2113).

14. The heat sink clip (200) according to claim 1 or 2, wherein the minimum distance between the area of the fan (233) close to the first heat sink piece (231) and the first heat sink piece (231) is greater than or equal to 0.2mm.

15. The heat dissipating back clip (200) of claim 1 or 2, wherein the fan (233) comprises any one of: centrifugal fan, axial fan, jet fan, piezoelectric fan, and flapping wing fan.

16. The heat-dissipating back clip (200) according to claim 1 or 2, wherein the connecting assembly (220) fixes the mobile terminal by clamping or magnetic attraction.

17. The heat-dissipating back clip (200) of claim 1 or 2, wherein the first housing portion (211) and the second housing portion (212) cover to form the receiving cavity.

18. The heat dissipating back clip (200) of claim 1 or 2, wherein the housing (210) is a unitary structure.

19. A housing assembly, comprising:

the protective sleeve (300) is sleeved on the outer side of the mobile terminal;

the heat sink clip (200) according to any of claims 1 to 18, the heat sink clip (200) being disposed on a side of the protective case (300) remote from the mobile terminal;

a first heat conducting layer (400), the first heat conducting layer (400) is arranged between the protective sheath (300) and the mobile terminal, and the first heat conducting layer (400) is used for conducting heat generated by the mobile terminal to the heat dissipation back clamp (200).

20. The housing assembly of claim 19,

the protective sleeve (300) is provided with an opening for accommodating the heat dissipation back clip (200).

21. The housing assembly of claim 19,

the protective sheath (300) is provided with an opening, a second heat conduction layer (310) is arranged in the opening, and the second heat conduction layer (310) is located between the first heat conduction layer (400) and the heat dissipation back clamp (200) and used for conducting heat on the first heat conduction layer (400) to the heat dissipation back clamp (200).

22. A housing assembly according to any one of claims 19 to 21, wherein said first heat conducting layer (400) comprises any one of: copper materials, aluminum materials, magnesium aluminum alloys, graphene films, artificial graphite, natural graphite and boron nitride.

23. The housing assembly of claim 21, wherein the second thermally conductive layer (310) comprises any one of: copper material, aluminum material, magnesium aluminum alloy, graphene film, artificial graphite, natural graphite and boron nitride.

24. A housing assembly according to any one of claims 19 to 21, characterized in that the thermal conductivity of the first heat conducting layer (400) is larger than or equal to 15W/mK.

25. The housing assembly of claim 21 wherein the thermal conductivity of the second thermally conductive layer (310) is greater than or equal to 15W/mK.

26. An electronic device, comprising:

a mobile terminal;

the heat dissipating back clip (200) of any of claims 1 to 18, the heat dissipating back clip (200) being for heat dissipation of the mobile terminal.

27. An electronic device, comprising:

a mobile terminal;

the housing assembly of any of claims 19 to 25, for heat dissipation of the mobile terminal.