CN217183681U - heat sink - Google Patents

Abstract

The present application discloses a radiator, which is used for heat dissipation of a handheld electronic device such as a mobile phone, and includes: a housing component, a cooling component and a power supply component; The shell assembly is formed with a shell heat dissipation side; the cooling assembly is provided with a cooling part and a heat dissipation unit, the cooling part is used to cool the heat dissipation side of the shell, and the heat dissipation unit is used to accelerate the heat dissipation of the cooling part; the heat dissipation unit includes a heat dissipation part, a fan Parts and air guide parts, the heat dissipation unit has an air inlet part of the heat dissipation unit and an air outlet part of the heat dissipation unit; The air outlet part of the body; the fan part is used to drive the air flow through the heat dissipation unit, and make the air flow enter from the air inlet part of the casing and discharge from the air outlet part of the casing; the power supply component is electrically connected with the cooling component to provide electricity to the cooling component .

Description

heat sink

technical field

The present application relates to the field of 3C electronic accessories, in particular to a radiator.

Background technique

Handheld electronic products, such as mobile phones, will generate a large amount of heat during high-load operation. Take game play as an example. During game play, the CPU and GPU of the mobile phone are under high load, and the mobile phone generates a lot of heat in a short period of time. Maintaining a high load state, the mobile phone cannot be cooled in time, and the CPU and GPU of the mobile phone may run at a reduced frequency, and the reduced frequency operation may cause the mobile phone to freeze, affecting the mobile phone experience.

Utility model content

In order to overcome the problems in the related art, the present application provides a radiator, the radiator is provided with a heat dissipation unit, which can dissipate heat from its refrigerating component, so as to improve the cooling effect of the refrigerating component on the heat dissipation side of the casing.

In order to solve the above-mentioned technical problems, the technical scheme adopted in this application is as follows:

A radiator is proposed, which is used for heat dissipation of hand-held electronic devices such as mobile phones, and includes: a casing component, a cooling component and a power supply component; the casing component is provided with a connecting unit, and the connecting unit is used for disposing the radiator on the object to be radiated, and The shell assembly is formed with a heat dissipation side of the shell, and the heat dissipation side of the shell is used for cooling the object to be dissipated; the cooling assembly is provided with a cooling part and a heat dissipation unit, the cooling part is used for cooling the heat dissipation side of the shell, and the heat dissipation unit is used for Accelerates the heat dissipation of the cooling component; the heat dissipation unit includes a heat dissipation component, a fan component and an air guide component. The air part, the air outlet part of the casing corresponding to the air outlet part of the heat dissipation unit; the fan component is used to drive the air flow through the heat dissipation unit, and make the air flow enter from the air inlet part of the casing and discharge from the air outlet part of the casing; the power supply assembly and cooling The components are electrically connected to provide electrical energy to the cooling components.

Preferably, the cooling assembly is provided with a heat-conducting sheet and a semiconductor cooling sheet, and the semiconductor cooling sheet is used as the cooling component; the heat-conducting sheet is arranged on the housing assembly, the side of the heat-conducting sheet facing outward is the heat-dissipating side, and the other side of the heat-conducting sheet is the cooling side. One side is thermally conductively connected to the cooling side of the semiconductor refrigerating sheet, and the heating side of the semiconductor refrigerating sheet is thermally conductively connected to the heat dissipating member; the air guiding member has an air inlet portion of the air guiding member and an air outlet portion of the air guiding member, and the air inlet portion of the air guiding member As the air intake part of the heat dissipation unit; the heat dissipation component is formed with a number of heat dissipation channels, and the heat dissipation channel has a heat dissipation part air intake part and a heat dissipation part air outlet; The air outlet part of the casing is butted, and the air inlet part of the heat sink is butted with the air outlet part of the air guide.

Preferably, the air guide member is formed with an air guide member cavity, and the fan member is mounted on the air guide member and arranged in the air guide member cavity.

Preferably, the heat dissipation component includes a heat dissipation base plate and a plurality of heat dissipation fins formed at the lower end of the heat dissipation base plate, and the heat dissipation grooves between the heat dissipation fins serve as the heat dissipation channels.

Preferably, the air guide member includes a front air guide shell and an air guide bottom case that are snap-fitted and installed; an opening is provided on the outer periphery of the air guide member as an air inlet portion of the air guide member, and an upper end surface of the wind guide front case is provided with an opening. The opening is used as the air outlet of the air guide; the front shell of the air guide is installed on the housing assembly, and the upper end of the front shell of the air guide abuts the end of the heat dissipation fin away from the heat dissipation bottom plate, so that the bottom of the heat dissipation groove The end opening serves as the air inlet portion of the heat sink, and the outer opening of the heat sink serves as the air outlet portion of the heat sink.

Preferably, the heat dissipation fins cover the openings provided on the upper end surface of the wind guide front casing.

Preferably, the fan component includes a fan blade, and the fan blade is a turbine fan blade, so as to drive the air flow to the outer periphery of the fan blade to enter and be discharged from the axial direction of the fan blade.

Preferably, the casing assembly includes a front casing, and the outer side of the front casing serves as the heat dissipation side of the casing; the casing assembly is configured with a clamping member as a connecting unit, and the clamping member includes a first clamping member and a second clamping member, At least the first clamping member is movably arranged on the housing, and an elastic member is provided between the housing assembly and the elastic member, and the elastic member is used for driving the first clamping member to approach the second clamping member based on the housing assembly.

Preferably, the power supply assembly includes a power supply control component and a battery compartment detachably connected to the housing component; the power supply control component is electrically connected to the heat dissipation component, and a display component is provided on the outer periphery of the housing component, and the display component is controlled by The power supply control part is used to display the status information of the radiator; the battery compartment is provided with an energy storage component, and the energy storage component installed in the battery compartment of the shell assembly is electrically connected with the power supply control component.

Preferably, the battery compartment is clamped to the casing slot provided by the casing assembly through the compartment body clip provided therein, so that the battery compartment can be detachably installed on the casing assembly; the battery compartment is provided with power supply contacts, corresponding to Ground, the power supply control part is provided with a power taking probe, which contacts with the power taking probe cell through the power supply contact, so that the energy storage part and the power supply control part are electrically connected.

The technical solution provided by the present application may include the following beneficial effects: a radiator is provided for heat dissipation of a handheld electronic device such as a mobile phone, comprising: a casing assembly, a cooling assembly and a power supply assembly; the casing assembly is provided with a connecting unit, and the connecting unit It is used for disposing the radiator on the object to be dissipated, and the shell assembly is formed with a heat dissipation side of the shell, and the heat dissipation side of the shell is used to cool the object to be dissipated; the cooling assembly is provided with a cooling part and a heat dissipation unit, and the cooling part is used for Cool the heat dissipation side of the housing, and the heat dissipation unit is used to accelerate the heat dissipation of the cooling component; the heat dissipation unit includes a heat dissipation part, a fan part and an air guide part, and the heat dissipation unit has an air inlet part of the heat dissipation unit and an air outlet part of the heat dissipation unit. The housing air inlet portion corresponding to the air inlet portion of the cooling unit, and the housing air outlet portion corresponding to the air outlet portion of the cooling unit; the fan component is used to drive the air flow through the cooling unit, and make the air flow from the air inlet portion of the housing to enter, It is discharged from the air outlet of the casing; the power supply component is electrically connected with the cooling component, and is used for providing electrical energy to the cooling component. The radiator is provided with a heat dissipation unit, which can dissipate heat from the cooling component, so as to improve the cooling effect of the cooling component on the heat dissipation side of the housing.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not limiting of the present application.

Description of drawings

The above and other objects, features and advantages of the present application will become more apparent from the more detailed description of the exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the exemplary embodiments of the present application. same parts.

FIG. 1 is a schematic diagram 1 of the overall structure shown in Embodiment 1 of the present application.

FIG. 2 is a schematic diagram 2 of the overall structure shown in Embodiment 1 of the present application.

FIG. 3 is a schematic diagram 3 of the overall structure shown in Embodiment 1 of the present application.

FIG. 4 is a schematic cross-sectional view at B-B in FIG. 3 according to Embodiment 1 of the present application.

FIG. 5 is an exploded schematic diagram of the overall structure shown in Embodiment 1 of the present application.

FIG. 6 is a schematic diagram of the assembly of the clamping component shown in Embodiment 1 of the present application.

FIG. 7 is a schematic diagram of the assembly of the semiconductor refrigeration chip shown in Example 1 of the present application.

FIG. 8 is a schematic diagram of the explosion of the semiconductor refrigeration chip shown in Example 1 of the present application.

FIG. 9 is a schematic diagram of the battery compartment shown in Embodiment 1 of the present application.

Description of reference numerals

Detailed ways

The following describes in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to be used to explain the present application, but should not be construed as a limitation to the present application.

In this application, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrally connected; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The present application will be further described in detail below through specific embodiments in conjunction with the accompanying drawings.

Example 1

Referring to FIG. 1 to FIG. 9, a radiator is used for heat dissipation of hand-held electronic devices such as mobile phones, and includes: a casing assembly 100, a cooling assembly and a power supply assembly 300; the casing assembly 100 is provided with a connecting unit, and the connecting unit uses In order to dispose the radiator on the object to be dissipated, the housing assembly 100 is formed with a heat dissipation side 102 of the shell, and the heat dissipation side 102 of the shell is used to cool the object to be dissipated; the cooling assembly is provided with a cooling component and a heat dissipation unit, and the cooling component It is used to cool down the heat dissipation side 102 of the housing, and the heat dissipation unit is used to accelerate the heat dissipation of the cooling component; the heat dissipation unit includes a heat dissipation part 207, a fan part 213 and an air guide part 214, and the heat dissipation unit has an air inlet part of the heat dissipation unit and an air outlet part of the heat dissipation unit , the housing assembly 100 is provided with a housing air inlet portion 103 corresponding to the air inlet portion of the heat dissipation unit, and a housing air outlet portion 104 corresponding to the air outlet portion of the heat dissipation unit; the fan component 213 is used to drive the air flow through the heat dissipation unit, and The airflow is entered from the housing air inlet part 103 and discharged from the housing air outlet part 104; the power supply component 300 is electrically connected with the cooling component for providing electrical energy to the cooling component.

Specifically, the cooling component is provided with a heat-conducting sheet 202 and a semiconductor cooling sheet 203; in this embodiment, in order to make the heat-conducting sheet 202 and the semiconductor cooling sheet 203 fully contact to improve the heat conduction effect, between the heat-conducting sheet 202 and the semiconductor cooling sheet 203 A thermally conductive silicone grease sheet 201 is provided; a semiconductor refrigeration sheet 203 is used as the cooling component; The side is thermally conductively connected to the cooling side of the semiconductor refrigeration sheet 203, and the heating side of the semiconductor refrigeration sheet 203 is thermally conductively connected to the heat dissipation member 207; The air inlet part 215 of the air element is used as the air inlet part of the heat dissipation unit; the heat dissipation part 207 is formed with a number of heat dissipation channels 210, and the heat dissipation channel 210 has the air intake part 211 of the heat dissipation part and the air outlet part 212 of the heat dissipation part; The air part 212 is connected to the housing air outlet 104 as the air outlet part of the heat dissipation unit, and the air inlet part 211 of the heat sink is connected to the air outlet part 216 of the air guide. The heat dissipation airflow is formed into an independent air duct, so as to prevent the hot air from affecting other electronic components in the casing, or causing the casing to heat up and affecting the use experience.

Wherein, the air guide member 214 is formed with an air guide member cavity, and the fan member 213 is mounted on the air guide member 214 and arranged in the air guide member cavity. Different from the fact that the fan part 213 is directly installed on the heat dissipation part 207, the advantage of installing the fan part 213 on the air guide part 214 is that the vibration of the fan is not directly transmitted to the heat conduction sheet 202, and the air guide part 214 can play the role of shock absorption. .

Regarding the heat dissipation component 207 , the heat dissipation component 207 includes a heat dissipation base plate 208 and a plurality of heat dissipation fins 209 formed at the lower end of the heat dissipation base plate 208 , and the heat dissipation grooves between the heat dissipation fins 209 serve as the heat dissipation channels 210 .

Specifically, the air guide member 214 includes a front air guide shell and an air guide bottom case that are snap-fitted and installed; the outer periphery of the air guide member 214 is provided with an opening as the air inlet portion 215 of the air guide member. The upper end surface is provided with an opening as the air outlet portion 216 of the air guide; the front shell of the air guide is mounted on the housing assembly 100 , and the upper end of the front shell of the air guide abuts on the end of the heat dissipation fin 209 away from the heat dissipation bottom plate 208 , so that the opening at the bottom end of the heat dissipation groove is used as the air inlet portion 211 of the heat dissipation member, and the outer opening of the heat dissipation groove is used as the air outlet portion 212 of the heat dissipation member.

In order to reduce or avoid air leakage at the connection between the air outlet portion 216 of the air guide and the air inlet portion 211 of the heat sink, the air leakage not only affects other components in the casing, but also reduces the air pressure and flow rate of the cooling airflow, which affects the cooling effect. The heat dissipation fins 209 cover the opening provided on the upper end surface of the wind guide front casing.

More specifically, the fan component 213 includes a fan blade, and the fan blade is a turbine fan blade, so as to drive the airflow to the outer circumference of the fan blade to enter, and to be discharged from the axial direction of the fan blade.

On the other hand, as an example, the case assembly 100 includes a front case, and the outer side of the front case serves as the heat dissipation side 102 of the case; the case assembly 100 is configured with a clamping member as a connecting unit, and the clamping member includes a first clamping member 105 and the second clamping member 106, at least the first clamping member 105 is movably arranged in the casing, and an elastic member 110 is provided between the casing assembly 100, and the elastic member 110 is used to drive the first clamping member 105 to be based on the casing The body assembly 100 is proximate the second clamping member 106 .

Meanwhile, the power supply assembly 300 includes not only a power receiving interface, but also a battery compartment 302 in this application. The power receiving interface may be, but is not limited to, a USB-C interface, so that the heat sink can be used independently from an external power supply. , the electromagnetic compartment is designed to be replaceable, which can satisfy the user to quickly replace the battery compartment 302, and spare multiple battery compartments 302, which can improve the use experience. The battery compartment 302 of the casing assembly 100; the power supply control part 301 is electrically connected to the heat dissipation assembly, the outer periphery of the casing assembly 100 is provided with a display part 109, and the display part 109 is controlled by the power supply control part 301 for displaying the heat dissipation The battery compartment 302 is provided with an energy storage component 303 , and the energy storage component 303 installed in the battery compartment 302 of the housing assembly 100 is electrically connected to the power supply control component 301 .

In order to facilitate the disassembly of the battery compartment 302 and the electrical connection between the battery compartment 302 and the power supply control component 301 , the battery compartment 302 is clamped to the casing slot 107 provided in the casing assembly 100 through the compartment body snap 304 provided thereon, so that the The battery compartment 302 is detachably mounted on the housing assembly 100; the battery compartment 302 is provided with a power supply contact 305, correspondingly, the power supply control part 301 is provided with a power supply probe 108, and the power supply contact 305 is connected with the power supply probe 108 The cells are in contact, so that the energy storage component 303 is electrically connected to the power supply control component 301 .

In the description of this specification, reference is made to the description of the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. It is intended that a particular feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above content is a further detailed description of the present application in conjunction with specific embodiments, and it cannot be considered that the specific implementation of the present application is limited to these descriptions. For those of ordinary skill in the technical field to which the present application pertains, some simple deductions or substitutions can also be made without departing from the concept of the present application.

Claims (10)

1. A radiator for heat dissipation of a handheld electronic device, characterized in that, comprising: a housing assembly, a cooling assembly and a power supply assembly; The housing assembly is provided with a connecting unit, and the connecting unit is used for arranging the radiator on the object to be dissipated, and the shell assembly is formed with a heat dissipating side of the shell, and the heat dissipating side of the shell is used for cooling the object to be dissipated; The cooling component is provided with a cooling component and a cooling unit, the cooling component is used to cool the heat dissipation side of the shell, and the cooling unit is used to accelerate the heat dissipation of the cooling component; The heat dissipation unit includes a heat dissipation part, a fan part and an air guide part, the air guide part is formed with an air guide part cavity, the fan part is installed in the air guide part cavity of the air guide part, and the heat dissipation unit has a heat dissipation unit air inlet part and a heat dissipation unit The air outlet part, the housing assembly is provided with a housing air inlet part corresponding to the air inlet part of the cooling unit, and a housing air outlet part corresponding to the air outlet part of the cooling unit; The fan part is used to drive the air flow through the heat dissipation unit, and make the air flow enter from the air inlet part of the casing and discharge it from the air outlet part of the casing; The power supply component is electrically connected with the cooling component, and is used for providing electrical energy to the cooling component. 2. The radiator according to claim 1, wherein the cooling assembly is provided with a heat conducting sheet and a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is used as the refrigeration component; The heat-conducting sheet is arranged on the housing assembly, the outer side of the heat-conducting sheet serves as the heat-dissipating side, the other side of the heat-conducting sheet is thermally conductively connected to the cooling side of the semiconductor refrigeration sheet, and the heating side of the semiconductor cooling sheet is thermally conductively connected to the heat-dissipating component ; The air guide member has an air inlet portion of the air guide member and an air outlet portion of the air guide member, and the air inlet portion of the air guide member serves as the air inlet portion of the heat dissipation unit; The heat-dissipating component is formed with a plurality of heat-dissipating flow channels, and the heat-dissipating flow channel has an air inlet part of the heat-dissipating part and an air-outlet part of the heat-dissipating part; The air outlet part of the heat sink is connected with the air outlet part of the housing as the air outlet part of the heat dissipation unit, and the air inlet part of the heat sink is butted with the air outlet part of the air guide. 3 . The radiator according to claim 2 , wherein the air guide member is formed with an air guide member cavity, and the fan member is mounted on the air guide member and arranged in the air guide member cavity. 4 . 4 . The heat sink according to claim 2 , wherein the heat dissipation component comprises a heat dissipation base plate and a plurality of heat dissipation fins formed at the lower end of the heat dissipation base plate, and the heat dissipation grooves between the heat dissipation fins serve as the heat dissipation channels. 5 . 5 . The radiator according to claim 4 , wherein the air guiding component comprises a front air guiding case and an air guiding bottom case that are snap-fitted and installed; 5 . The outer periphery of the air guide member is provided with an opening as the air inlet portion of the air guide member, and the upper end surface of the air guide front shell is provided with an opening as the air outlet portion of the air guide member; The front case of the air guide is installed on the housing assembly, and the upper end of the front case of the air guide is abutted against the end of the heat dissipation fins away from the heat dissipation bottom plate, so that the bottom end of the heat dissipation groove is opened as the air intake part of the heat dissipation element. The outer opening of the heat dissipation groove serves as the air outlet of the heat dissipation member. 6 . The radiator according to claim 5 , wherein the heat dissipation fins cover the openings provided on the upper end surface of the wind-guiding front case. 7 . 7 . The radiator according to claim 5 , wherein the fan component comprises a fan blade, and the fan blade is a turbine fan blade, so as to drive the airflow to the outer circumference of the fan blade to enter, and is driven by the fan blade. 8 . Axial discharge of leaves. 8 . The radiator according to claim 1 , wherein the casing assembly comprises a front casing, and the outer side of the front casing serves as the heat dissipation side of the casing; 8 . The housing assembly is configured with a clamping member as a connecting unit, the clamping member includes a first clamping member and a second clamping member, at least the first clamping member is movably arranged on the casing, and is provided with an elastic force between the casing assembly and the casing assembly. The elastic member is used to urge the first clamping member to approach the second clamping member based on the housing assembly. 9. The radiator according to claim 1, wherein the power supply assembly comprises a power supply control component and a battery compartment detachably connected to the housing assembly; The power supply control component is electrically connected with the heat dissipation component, the outer periphery of the housing component is provided with a display component, and the display component is controlled by the power supply control component for displaying status information of the radiator; The battery compartment is provided with an energy storage component, and the energy storage component installed in the battery compartment of the housing assembly is electrically connected with the power supply control component. 10 . The radiator according to claim 9 , wherein the battery compartment is clamped to the casing slot provided in the casing assembly through the compartment body clip provided thereon, so that the battery compartment can be detachably installed in the casing assembly. 11 . shell assembly; The battery compartment is provided with a power supply contact. Correspondingly, the power supply control part is provided with a power supply probe, and the power supply contact is in contact with the cell of the power supply probe, so that the energy storage part and the power supply control part are electrically connected.

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