CN218677141U

CN218677141U - Power module

Info

Publication number: CN218677141U
Application number: CN202223076696.5U
Authority: CN
Inventors: 李正凯; 周文杰; 成章明; 刘剑; 谢地林
Original assignee: Hisense Home Appliances Group Co Ltd
Current assignee: Hisense Home Appliances Group Co Ltd
Priority date: 2022-11-17
Filing date: 2022-11-17
Publication date: 2023-03-21
Anticipated expiration: 2032-11-17

Abstract

The utility model discloses a power module, power module includes: includes a substrate and a plurality of first leads. The plurality of first pins comprise at least one first sub-pin, one end of the first sub-pin is provided with a conductive connecting piece and at least one protrusion, the conductive connecting piece and the protrusion are both positioned between the surface of one side, facing the substrate, of the first sub-pin and the substrate, the first sub-pin is connected with the substrate through the conductive connecting piece at least and is electrically connected, and the surface of one side, facing the substrate, of the first sub-pin is separated from the substrate through the protrusion at least. According to the utility model discloses a power module, the arch can play the supporting role to first sub pin, separates first sub pin and base plate, can effectively avoid taking place relative displacement between first sub pin and the base plate, and then appears overflowing gluey phenomenon when avoiding the process of moulding plastics.

Description

Power module

Technical Field

The utility model belongs to the technical field of the power module technique and specifically relates to a power module is related to.

Background

In the prior art, a DBC substrate in a power module is connected to a pin through solder paste. However, when the solder paste is soldered to the DBC substrate, the solder paste is melted by the reflow oven, and the thickness of the solder paste is reduced after the solder paste is melted, so that a shrinkage tension is formed between the leads and the DBC substrate, and the DBC substrate is moved toward the leads by the shrinkage tension, so that the actual distance between the DBC substrate and the leads is not consistent with the designed distance, and therefore, the glue overflow condition occurs during the injection molding process.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide a power module, which can effectively avoid the relative displacement between the first sub-pin and the substrate, and further avoid the glue overflow phenomenon during the injection molding process.

According to the utility model discloses power module, include: a substrate; the first pins comprise at least one first sub pin, one end of the first sub pin is provided with a conductive connecting piece and at least one protrusion, the conductive connecting piece and the protrusion are both positioned between one side surface, facing the substrate, of the first sub pin and the substrate, the first sub pin is at least connected with the substrate through the conductive connecting piece and is electrically connected, and the side surface, facing the substrate, of the first sub pin and the substrate are at least separated through the protrusion.

According to the utility model discloses a power module, one end through at first sub-pin sets up at least one arch and electrically conductive connecting piece, and electrically conductive connecting piece and arch all are located first sub-pin towards between a side surface of base plate and the base plate, first sub-pin passes through electrically conductive connecting piece to realize being connected with the electricity of base plate, therefore, compare with traditional power module, the arch can play the supporting role to first sub-pin, it is spaced apart first sub-pin and base plate, can effectively avoid taking place relative displacement between first sub-pin and the base plate, and then the excessive gluey phenomenon appears when avoiding moulding plastics the process.

According to some embodiments of the invention, the protruding side facing the side surface of the substrate away from the first sub-pin is in contact with the substrate.

According to some embodiments of the utility model, protruding with first sub pin is integrated into one piece, first sub pin passes through electrically conductive connecting piece with protruding with the electricity is realized to the base plate and is connected.

According to some embodiments of the invention, the conductive connecting piece is in contact with the protrusion.

According to some embodiments of the invention, each of the first sub-pins comprises: a body; one end of the connecting part is connected with the body, and the other end of the connecting part extends towards the substrate in an inclined manner along the thickness direction of the substrate; the installation department, the one end of installation department with connecting portion the other end links to each other, the installation department towards be equipped with on one side surface of base plate the arch, wherein, follow the thickness direction of base plate the thickness of installation department is greater than bellied thickness.

According to some embodiments of the utility model, the arch is a plurality of, and is a plurality of the arch is in be the array and arrange on the installation department.

According to the utility model discloses a some embodiments, follow substrate thickness direction, every bellied thickness is D, wherein, D satisfies: d is more than or equal to 30 mu m and less than or equal to 50 mu m.

According to some embodiments of the invention, at least one groove is formed on a side surface of the first sub-pin facing the substrate, and at least a portion of the conductive connecting member is located in the groove.

According to some embodiments of the present invention, the protrusion is a plurality of protrusions, and the protrusion is located on the outer peripheral side of the groove.

According to the utility model discloses a some embodiments, bellied quantity is N, wherein, N satisfies: n is more than or equal to 10 and less than or equal to 20.

According to some embodiments of the invention, each of the convex shapes is prism-shaped, hemisphere-shaped, truncated cone-shaped, or cone-shaped.

According to some embodiments of the invention, the conductive connection is solder paste.

According to some embodiments of the present invention, the first sub-pins are a plurality of, and a plurality of a part of the first sub-pins are located on one side of the width direction of the substrate, and a plurality of another part of the first sub-pins are located on at least one end of the length direction of the substrate.

According to some embodiments of the present invention, further comprising: the second pins are positioned on the other side of the width direction of the substrate; the plurality of chips comprise at least one driving chip and at least one power chip, the driving chip is positioned on the second pins and connected with the corresponding second pins, and the power chip is positioned on the substrate and electrically connected with the corresponding first pins; and the plastic package shell is arranged on the outer side of the substrate, and the free end of each first pin and the free end of each second pin extend out of the plastic package shell.

According to some embodiments of the utility model, the base plate is the pottery copper-clad plate, the pottery copper-clad plate includes first copper layer, ceramic layer and the second copper layer of arranging along thickness direction, first pin with power chip all with first copper layer electricity is connected.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic diagram of a first pin of a power module according to an embodiment of the invention;

fig. 2 is a side view of a first pin of a power module according to an embodiment of the invention;

FIG. 3 is an enlarged view of portion A circled in FIG. 2;

fig. 4 is a schematic diagram of a first pin and a second pin of a power module according to an embodiment of the invention;

fig. 5 is a schematic diagram of another angle of the first pin and the second pin of the power module according to an embodiment of the invention;

fig. 6 is a cross-sectional view of a power module according to an embodiment of the invention;

FIG. 7 is an enlarged view of the portion B encircled in FIG. 6;

fig. 8 is a schematic diagram of a power module according to an embodiment of the present invention, wherein the plastic casing is not shown;

fig. 9 is a top view of a power module according to an embodiment of the invention, wherein the plastic casing is not shown;

fig. 10 is a schematic diagram of a power module according to an embodiment of the invention.

Reference numerals:

100: a power module; 1: a substrate; 11: a first copper layer; 12: a ceramic layer; 13: a second copper layer;

2: a first pin; 21: a first sub-pin; 211: a body; 2111: a first connection section;

2112: a second connection section; 2113: a third connection section; 212: a connecting portion; 213: an installation part;

2131: a protrusion; 2132: a groove; 2133: a conductive connection member; 3: a second pin; 4: a chip;

41: a driving chip; 42: a power chip; 5: and (5) plastic packaging the shell.

Detailed Description

A power module 100 according to an embodiment of the present invention is described below with reference to fig. 1-10.

As shown in fig. 1 to 10, a power module 100 according to an embodiment of the present invention includes a substrate 1 and a plurality of first pins 2. In the description of the present invention, "a plurality" means two or more.

Specifically, the plurality of first pins 2 include at least one first sub-pin 21, one end of the first sub-pin 21 is provided with a conductive connector 2133 and at least one protrusion 2131, the conductive connector 2133 and the protrusion 2131 are both located between a surface of the first sub-pin 21 facing the substrate 1 and the substrate 1, the first sub-pin 21 is connected with the substrate 1 at least through the conductive connector 2133 and is electrically connected, and a surface of the first sub-pin 21 facing the substrate 1 is separated from the substrate 1 at least through the protrusion 2131.

For example, in the example of fig. 1 to 8, the plurality of first leads 2 may be disposed at one side in a width direction (e.g., a front-rear direction shown in fig. 8) of the substrate 1, and the plurality of first leads 2 are arranged at intervals in a length direction of the substrate 1. One side surface of each first sub-pin 21 adjacent to the substrate 1 is provided with a protrusion 2131 and a conductive connector 2133, and the protrusion 2131 can effectively space one end of the first sub-pin 21 away from the substrate 1. The protrusions 2131 may protrude from a surface of the first pin 2 adjacent to the substrate 1 in a direction toward the substrate 1, and the conductive connectors 2133 are conductive and adhesive components, so that the first sub-pin 21 can be electrically connected to the substrate 1 while the first sub-pin 21 can be physically connected to the substrate 1.

Specifically, when the first sub-pin 21 is connected to the substrate 1, the conductive connecting element 2133 may be placed between two opposing surfaces of the protrusion 2131 and the substrate 1, so as to pre-bond the protrusion 2131 and the substrate 1, and then the first sub-pin 21 and the substrate 1 are also pre-connected, at this time, the protrusion 2131 can support the first sub-pin 21 on the substrate 1, and then the conductive connecting element 2133 is melted by a reflow oven, and the conductive connecting element 2133 becomes liquid after being melted, at least a part of the conductive connecting element 2133 will flow to the periphery of the protrusion 2131, so that the thickness of the conductive connecting element 2133 between the first sub-pin 21 and the substrate 1 will be reduced, and the connection between the first sub-pin 21 and the substrate 1 is achieved after curing. Because the protrusion 2131 can limit the substrate 1 to move towards the first sub-pins 21, the connection reliability of the first sub-pins 21 and the substrate 1 is ensured, and meanwhile, the relative displacement between the first sub-pins 21 and the substrate 1 is avoided, so that the actual distance between the first sub-pins 21 and the substrate 1 is consistent with the design distance, and the glue overflow phenomenon in the injection molding process is avoided.

According to the utility model discloses a power module 100, one end through at first sub-pin 21 sets up at least one protruding 2131 and electrically conductive connecting piece 2133, and electrically conductive connecting piece 2133 and protruding 2131 all are located first sub-pin 21 towards between one side surface of base plate 1 and the base plate 1, first sub-pin 21 realizes being connected with base plate 1's electricity through electrically conductive connecting piece 2133, therefore, compare with traditional power module 100, protruding 2131 can play the supporting role to first sub-pin 21, separate first sub-pin 21 and base plate 1, can effectively avoid taking place relative displacement between first sub-pin 21 and the base plate 1, and then the glue overflow phenomenon appears when avoiding moulding plastics the process.

According to some embodiments of the present invention, one side of the protrusion 2131, which is away from one side surface of the first sub-pin 21 facing the substrate 1, is in contact with the substrate 1. Referring to fig. 7, after the conductive connecting members 2133 become liquid, the conductive connecting members 2133 may flow all around the protrusions 2131, and at this time, one side surface of the protrusions 2131 adjacent to the substrate 1 is in direct contact with the substrate 1, and the protrusions 2131 still support the first sub-pins 21 on the substrate 1. Therefore, the protrusions 2131 can better support the first sub-pins 21 while the first sub-pins 21 are electrically connected with the substrate 1, and the substrate 1 is prevented from moving towards the first sub-pins 21.

According to some embodiments of the present invention, as shown in fig. 1 and fig. 2, the protrusion 2131 and the first sub-pin 21 are integrally formed, and the first sub-pin 21 is electrically connected to the substrate 1 through the conductive connecting member 2133 and the protrusion 2131. For example, the protrusions 2131 may be precisely obtained by etching, punching, welding, or the like. With this arrangement, the number of steps of assembling the power module 100 can be reduced, and thus the assembling efficiency of the power module 100 can be improved.

According to some embodiments of the present invention, the conductive connector 2133 contacts the protrusion 2131. As shown in fig. 7, since the periphery of the protrusion 2131 has a gap, when the conductive connecting element 2133 is in a liquid state, the liquid conductive connecting element 2133 can flow around the protrusion 2131, so that the liquid conductive connecting element 2133 can surround the periphery of the protrusion 2131, so as to secure the connection between the first sub-pin 21 and the substrate 1.

According to some embodiments of the present invention, each of the first sub-pins 21 includes a body 211, a connection portion 212, and a mounting portion 213. One end of the connecting portion 212 is connected to the body 211, the other end of the connecting portion 212 extends obliquely toward the substrate 1 along the thickness direction of the substrate 1, one end of the mounting portion 213 is connected to the other end of the connecting portion 212, and a protrusion 2131 is disposed on a surface of the mounting portion 213 facing the substrate 1, wherein the thickness of the mounting portion 213 is greater than the thickness of the protrusion 2131 along the thickness direction of the substrate 1. For example, in the example of fig. 1, the body 211 includes a first connection section 2111, a second connection section 2112, and a third connection section 2113 connected to each other, the first connection section 2111 extends in the thickness direction of the substrate 1, the second connection section 2112 extends in the width direction of the substrate 1, the third connection section 2113 extends in the length direction of the substrate 1, the connection section 212 extends from the third connection section 2113 of the body 211 obliquely upward toward the substrate 1, one end of the connection section 212 far from the body 211 is connected to the mounting section 213, and the mounting section 213 extends in the length direction of the substrate 1, so that the first sub-pin 21 is simple in structure and convenient to process. Wherein, by making the thickness of the protrusion 2131 smaller than that of the mounting portion 213, the protrusion 2131 can space the first sub-lead 21 from the substrate 1 while ensuring the structural strength of the mounting portion 213.

Further, referring to fig. 1, a plurality of protrusions 2131 are provided, and the plurality of protrusions 2131 are arranged in an array on the mounting portion 213. For example, the plurality of protrusions 2131 are arranged in an array on the entire surface of the mounting portion 213, so that the supporting force of the protrusions 2131 on the first sub-leads 21 is more balanced. When the first sub-leads 21 are connected with the substrate 1, the distribution of the conductive connectors 2133 between the mounting portion 2131 and the substrate 1 is more uniform, and the connection failure of the first sub-leads 21 and the substrate 1 caused by insufficient connectivity of the conductive connectors 2133 at some positions between the substrate 1 and the mounting portion 2131 is prevented.

According to some embodiments of the present invention, the thickness of each protrusion 2131 in the thickness direction of the substrate 1 (e.g., up and down direction in fig. 1) is D, where D satisfies: d is more than or equal to 30 mu m and less than or equal to 50 mu m. As shown in fig. 1, 2 and 7, when D < 30 μm, the thickness of the protrusion 2131 is too small, so that the gap between the substrate 1 and the mounting portion 213 is too small, and the volume of the conductive connector 2133 is small, which may reduce the connection reliability between the substrate 1 and the mounting portion 213, and may cause a problem that the first lead 2 and the substrate 1 are easily connected to fail. When D > 50 μm, the thickness of the protrusion 2131 is too large, so that the distance between the mounting part 213 and the substrate 1 is too large, thereby increasing the amount of the conductive connecting member 2133 and increasing the cost of the power module 100. Therefore, the thickness of the protrusion 2131 is set to be not less than 30 μm and not more than D and not more than 50 μm, so that the usage amount of the conductive connecting piece 2133 can be reduced, the first sub-pins 21 can be reliably connected with the substrate 1, the protrusion 2131 can also be ensured to play a supporting role on the first sub-pins 21, the substrate 1 is prevented from moving towards the first sub-pins 21, and glue overflow in the injection molding process is avoided.

According to some embodiments of the present invention, at least one groove 2132 is formed on a surface of the first sub-pin 21 facing the substrate 1, and at least a portion of the conductive connecting member 2133 is located in the groove 2132. For example, in the example of fig. 1, the groove 2132 is located at the center of the plurality of protrusions 2131, i.e., at the middle of the mounting plate, and the groove 2132 may be a penetrating hole penetrating the mounting portion 213. After the conductive connecting pieces 2133 are used for bonding the protrusions 2131 with the substrate 1, the conductive connecting pieces 2133 are melted, and at this time, part of the conductive connecting pieces 2133 can flow into the grooves 2132, so that the conductive connecting pieces 2133 are prevented from being accumulated around the protrusions 2131, and therefore the conductive connecting pieces 2133 around the protrusions 2131 can be distributed more uniformly, meanwhile, the contact area between the conductive connecting pieces 2133 and the first sub-pins 21 is increased, and further the connection reliability between the first sub-pins 21 and the substrate 1 is further enhanced.

Further, the number of the protrusions 2131 is plural, and the plural protrusions 2131 are located on the outer peripheral side of the recess 2132. As shown in fig. 1, the protrusions 2131 are arranged in an array on the mounting portion 213, and the recess 2132 is located at the center of the plurality of protrusions 2131. Therefore, the supporting function of the protrusion 2131 on the first sub-pin 21 can be better exerted.

According to some embodiments of the utility model, referring to fig. 1, the quantity of protruding 2131 is N, wherein N satisfies: n is more than or equal to 10 and less than or equal to 20. When N < 10, the number of the protrusions 2131 is too small, the protrusions 2131 cannot support the first sub-pins 21 on the substrate 1 well, and the conductive connectors 2133 are difficult to be uniformly distributed between the protrusions 2131 and the substrate 1, which may result in an unreliable connection between the first sub-pins 21 and the substrate 1. When N > 20, the number of the protrusions 2131 is too large, and the arrangement density of the protrusions 2131 on the mounting portion 213 is too high, which is not favorable for processing the protrusions 2131. For example, in the example of fig. 2, the number of the protrusions 2131 is 16, when the conductive connecting members 2133 become liquid, the space between two adjacent protrusions 2131 can accommodate an appropriate amount of the conductive connecting members 2133, the first sub-pins 21 can be reliably connected with the substrate 1, and the processing of the protrusions 2131 is facilitated.

Alternatively, each protrusion 2131 may have a prismatic, hemispherical, truncated cone, or conical shape. Because the protrusion 2131 has a supporting effect on the first sub-pins 21, the shape of the protrusion 2131 can better support the first sub-pins 21, so that the relative position of the first sub-pins 21 and the substrate 1 is effectively prevented from moving. For example, in the example of fig. 1 to 3, the protrusion 2131 has a cylindrical shape, and an end surface of one end of the cylinder can completely fit into the substrate 1, so that the first sub-leads 21 can be firmly connected to the substrate 1.

Optionally, the conductive connecting piece 2133 is solder paste. The solder paste is used as a connecting material, which can connect the first sub-lead 21 with the substrate 1, and can also perform a conductive function, so that the substrate 1 and the first sub-lead 21 are electrically connected, thereby realizing the use function of the power module 100.

According to some embodiments of the present invention, the first sub-pins 21 are plural, a part of the plural first sub-pins 21 is located on one side of the width direction of the substrate 1, and another part of the plural first sub-pins 21 is located on at least one end of the length direction of the substrate 1. Referring to fig. 4 and 8, as shown in fig. 8, the number of the first sub-leads 21 is 6, 4 first sub-leads 21 are distributed in the middle of one side of the substrate 1 in the width direction, 4 first sub-leads 21 are arranged at intervals in the length direction of the substrate 1, and 2 first sub-leads 21 are distributed at both ends of the substrate 1 in the length direction. Thus, the distribution of the first sub-pins 21 can better achieve the electrical connection with the chip 4, thereby achieving the function of the power module 100.

Further, the power module 100 further includes a plurality of second pins 3, a plurality of chips 4, and a plastic package housing 5. The plurality of second leads 3 are located on the other side in the width direction of the substrate 1. The plurality of chips 4 include at least one driving chip 41 and at least one power chip 42, the driving chip 41 is located on the second pins 3 and electrically connected to the corresponding second pins 3, and the power chip 42 is located on the substrate 1 and electrically connected to the corresponding first pins 2. The plastic package shell 5 is arranged on the outer side of the substrate 1, and the free end of each first pin 2 and the free end of each second pin 3 extend out of the plastic package shell 5. As shown in fig. 4 and 8, the second leads 3 are located on the other side in the width direction of the substrate 1 and are opposite to the first sub-leads 21. The second pin 3 may be electrically connected to the driving chip 41 through a gold wire, a copper wire, or a silver wire, and the driving chip 41 may be electrically connected to the gate of the power chip 42 through an aluminum wire, a gold wire, or a copper wire, so as to implement the function of the driving chip 41. The first lead 2 may be electrically connected to the emitter of the power chip 42 by using an aluminum wire or an aluminum foil to implement the function of the power chip 42. The plastic package shell 5 wraps the periphery of the substrate 1 and plays a role in protecting the substrate 1 and the chip.

Specifically, in the manufacturing process of the power module 100, the conductive connecting element 2133, for example, solder paste, is printed on the substrate 1, then the first pins 2 and the second pins 3 are mounted on two sides of the substrate 1 in the width direction, the first pins 2 and the second pins 3 are pressed downward, so that the first pins 2 and the second pins 3 are bonded with the conductive connecting element 2133, at this time, the protrusions 2131 of the first sub-pins 21 are in contact with the copper layer of the substrate 1, the solder paste is extruded and distributed around the protrusions 2131, then reflow soldering is performed in a reflow furnace, the conductive connecting element 2131 changes into a liquid state and flows into gaps and grooves between the protrusions 2131, then the plurality of chips 4 are placed at corresponding positions of the substrate 1 and mounted, finally, plastic packaging is performed on the whole, and one ends of the first pins 2 and the second pins 3 extend out of the plastic packaging shell 5.

According to some embodiments of the utility model, base plate 1 is the ceramic copper-clad plate, and the ceramic copper-clad plate includes first copper layer 11, ceramic layer 12 and the second copper layer 13 of arranging along thickness direction, and first pin 2 and power chip 42 all link to each other with first copper layer 11. The ceramic copper-clad plate has excellent thermal cyclicity, stable shape, good rigidity, high thermal conductivity and high reliability, and is a pollution-free and nuisanceless green product. Wherein the first copper layer 11 has good electrical conductivity, thereby ensuring effective electrical connection of the first pin 2, the second pin 4 and the power chip 42 with the substrate 1. The surface of one side of the second copper layer 13, which is far away from the power chip 42, is flush with the bottom surface of the plastic package casing 5 and is exposed outside the plastic package casing 5, when the power chip 42 generates heat during operation, the heat can be transferred to the second copper layer 13 through the first copper layer 11 and the ceramic layer 12, and the second copper layer 13 exchanges heat with the outside to realize heat dissipation of the power module 100.

Other configurations and operations of the power module 100 according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description of the invention, the first feature being "on", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A power module, comprising:

a substrate;

the first pins comprise at least one first sub-pin, one end of the first sub-pin is provided with a conductive connecting piece and at least one protrusion, the conductive connecting piece and the protrusion are both positioned on one side surface, facing the substrate, of the first sub-pin and between the substrate, the first sub-pin is connected with the substrate through the conductive connecting piece at least and is electrically connected, and the side surface, facing the substrate, of the first sub-pin is separated from the substrate through the protrusion at least.

2. The power module of claim 1, wherein a side of the protrusion facing away from the one side surface of the first sub-pin facing the substrate is in contact with the substrate.

3. The power module of claim 1, wherein the protrusion is integrally formed with the first sub-lead, and the first sub-lead is electrically connected to the substrate through the conductive connection member and the protrusion.

4. The power module of claim 1, wherein the conductive connection is in contact with the bump.

5. The power module of claim 1, wherein each of the first sub-pins comprises:

a body;

one end of the connecting part is connected with the body, and the other end of the connecting part extends towards the substrate in an inclined manner along the thickness direction of the substrate;

the installation department, the one end of installation department with connecting portion the other end links to each other, the installation department towards be equipped with on one side surface of base plate the arch, wherein, follow the thickness direction of base plate the thickness of installation department is greater than bellied thickness.

6. The power module of claim 5, wherein the protrusion is a plurality of protrusions arranged in an array on the mounting portion.

7. The power module according to claim 1, wherein a thickness of each of the protrusions in a thickness direction of the substrate is D, wherein D satisfies: d is more than or equal to 30 mu m and less than or equal to 50 mu m.

8. The power module of claim 1, wherein a side surface of the first sub-lead facing the substrate has at least one recess formed therein, at least a portion of the conductive connector being located within the recess.

9. The power module according to claim 8, wherein the projection is plural, and the plural projections are located on an outer peripheral side of the recess.

10. The power module of claim 1, wherein the number of protrusions is N, wherein N satisfies: n is more than or equal to 10 and less than or equal to 20.

11. The power module of claim 1, wherein each of the protrusions is in the shape of a prism, a hemisphere, a truncated cone, or a cone.

12. The power module of claim 1, wherein the conductive connection is a solder paste.

13. The power module according to any one of claims 1 to 12, wherein the first sub-lead is plural, a part of the plural first sub-leads is located at one side in a width direction of the substrate, and another part of the plural first sub-leads is located at least one end in a length direction of the substrate.

14. The power module of claim 13, further comprising:

the second pins are positioned on the other side of the width direction of the substrate;

the plurality of chips comprise at least one driving chip and at least one power chip, the driving chip is positioned on the second pins and electrically connected with the corresponding second pins, and the power chip is positioned on the substrate and electrically connected with the corresponding first pins;

and the plastic package shell is arranged on the outer side of the substrate, and the free end of each first pin and the free end of each second pin extend out of the plastic package shell.

15. The power module of claim 14, wherein the substrate is a copper-clad ceramic plate, the copper-clad ceramic plate comprises a first copper layer, a ceramic layer and a second copper layer arranged along a thickness direction, and the first pin and the power chip are electrically connected with the first copper layer.