CN115799202B - Power module and apparatus - Google Patents
Power module and apparatus Download PDFInfo
- Publication number
- CN115799202B CN115799202B CN202211457981.3A CN202211457981A CN115799202B CN 115799202 B CN115799202 B CN 115799202B CN 202211457981 A CN202211457981 A CN 202211457981A CN 115799202 B CN115799202 B CN 115799202B
- Authority
- CN
- China
- Prior art keywords
- substrate
- power module
- pin
- pins
- clad layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 158
- 229920003023 plastic Polymers 0.000 claims description 20
- 239000004033 plastic Substances 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000003292 glue Substances 0.000 abstract description 10
- 230000008093 supporting effect Effects 0.000 abstract description 9
- 239000003381 stabilizer Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a power module and a device, wherein the power module comprises: the device comprises a substrate, a first connecting piece and a second connecting piece, wherein one end of the substrate is provided with a conductive connecting piece and at least one protrusion; the first pins are connected with the substrate at least through the conductive connecting pieces and are electrically connected, and one side surface of each first pin, which faces the substrate, is separated from the substrate at least through the protrusions. Wherein, set up a plurality of archs on the base plate, the one side surface of first pin towards the base plate and protruding looks butt, protruding plays the supporting role to first stabilizer blade, effectively avoids the removal of the relative position between base plate and the first pin, and then avoids the glue overflow phenomenon.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a power module and a device.
Background
In the related art, in the design of a power module (IPM), the surface of the DBC is usually a smooth surface, when the DBC is soldered to the frame, the volume of the solder paste is reduced when the solder paste is melted by passing through a reflow oven, and shrinkage tension is formed between the DBC and the frame, so that the DBC is easily moved toward the frame, and the glue overflow is serious in the subsequent injection molding process.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a power module, wherein a plurality of bulges are arranged on a substrate, one side surface of a first pin facing the substrate is abutted against the bulges, and the bulges play a supporting role on a first support leg, so that the relative position between the substrate and the first pin is effectively prevented from moving, and the phenomenon of glue overflow is further avoided.
The invention also provides equipment.
According to an embodiment of the first aspect of the present invention, a power module includes: the device comprises a substrate, a first connecting piece and a second connecting piece, wherein one end of the substrate is provided with a conductive connecting piece and at least one protrusion; the first pins are connected with the substrate at least through the conductive connecting pieces and are electrically connected, and one side surface of each first pin, which faces the substrate, is separated from the substrate at least through the protrusions.
According to the power module provided by the embodiment of the invention, the plurality of the bulges are arranged on the substrate, one side surface of the first pin, which faces the substrate, is abutted against the bulges, and the bulges play a supporting role on the first support leg, so that the relative position between the substrate and the first pin is effectively prevented from moving, and the phenomenon of glue overflow is further avoided.
According to some embodiments of the invention, a surface of the protrusion facing away from the substrate facing the first pin is in contact with the first pin.
According to some embodiments of the invention, the bump is integrally formed with the substrate, and the substrate is electrically connected to the substrate through the conductive connection and the bump.
According to some embodiments of the invention, the substrate comprises: the inner copper-clad layer, the ceramic layer and the outer copper-clad layer, the ceramic layer is arranged between the inner copper-clad layer and the outer copper-clad layer in a clamping mode, the inner copper-clad layer is connected with the first pin, and the bulge is arranged on the inner copper-clad layer.
According to some embodiments of the invention, the plurality of protrusions are arranged in an array on the inner copper-clad layer.
According to some embodiments of the invention, the thickness of each of the protrusions along the thickness direction of the substrate is D, wherein D satisfies: d is more than or equal to 30 mu m and less than or equal to 50 mu m.
According to some embodiments of the invention, at least one groove is formed on a surface of the first pin facing the substrate, and at least a portion of the conductive connection is located in the groove.
According to some embodiments of the invention, the number of protrusions is N, wherein N satisfies: n is more than or equal to 10 and less than or equal to 20.
According to some embodiments of the invention, the protrusion is one of rectangular parallelepiped, cylindrical, hemispherical, and conical in shape.
According to some embodiments of the invention, each of the first pins comprises: a body; one end of the connecting part is connected with the body, and the other end of the connecting part extends obliquely towards the substrate along the thickness direction of the substrate; and one end of the mounting part is connected with the other end of the connecting part, and one side surface of the mounting part facing the substrate is abutted with the protrusion.
According to some embodiments of the invention, the projected area of the mounting portion on the substrate is larger than the projected area of the projection on the substrate.
According to some embodiments of the invention, the conductive connection is solder paste.
According to some embodiments of the invention, a part of the first pins is located at one side of the substrate in the width direction, and another part of the first pins is located at least one end of the substrate in the length direction.
According to some embodiments of the invention, the power module further comprises: a plurality of second pins, wherein the second pins are positioned on the other side of the width direction of the substrate; the plurality of chips comprise at least one driving chip and at least one power chip, the driving chip is positioned on the second pin and is electrically connected with the corresponding second pin, and the power chip is positioned on the substrate and is electrically connected with the corresponding first pin; the plastic package body wraps the substrate and the chip, the free ends of the first pins and the second pins extend out of the plastic package body, and one surface of the substrate, which faces away from the chip, is completely wrapped in the plastic package body or one surface of the substrate, which faces away from the chip, is exposed outside flush with the plastic package body.
An apparatus according to an embodiment of the second aspect of the present invention includes the power module and a controller electrically connected to the power module.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a side view of a prior art power module;
FIG. 2 is a schematic diagram of one orientation of a power module according to an embodiment of the invention;
FIG. 3 is a schematic diagram of yet another orientation of a power module according to an embodiment of the invention;
fig. 4 is a cross-sectional view of a power module according to an embodiment of the present invention;
fig. 5 is a bottom view of a power module according to an embodiment of the invention;
FIG. 6 is a top view of a power module according to an embodiment of the invention;
FIG. 7 is a partial schematic diagram of a power module according to an embodiment of the invention;
FIG. 8 is a schematic view of a substrate according to an embodiment of the invention;
fig. 9 is a partial schematic view of a substrate according to an embodiment of the present invention.
Reference numerals:
the prior art comprises the following steps:
100' a power module; 10', a substrate; 20', a first pin;
the application comprises the following steps:
100. a power module;
10. a substrate; 11. a copper-clad layer is internally coated; 12. a ceramic layer; 13. a copper layer is covered outside; 14. a protrusion;
20. a first pin; 21. a body; 22. a connection part; 23. a mounting part; 24. a groove;
30. a second pin;
40. a driving chip;
50. a power chip.
Detailed Description
Embodiments of the present invention will be described in detail below, by way of example with reference to the accompanying drawings.
A power module 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 9, and an apparatus including the above power module 100 is also provided.
As shown in connection with fig. 1-6, a power module 100 includes: a substrate 10 and a plurality of first pins 20. One end of the substrate 10 is provided with a conductive connection and at least one protrusion 14; the first leads 20 are connected to the substrate 10 at least by conductive connectors and are electrically connected, and a side surface of the first leads 20 facing the substrate 10 is spaced apart from the substrate 10 at least by the bumps 14. Specifically, the substrate 10 is provided with a conductive connection member and at least one protrusion 14 on one end surface thereof, that is, at least one protrusion 14 and a conductive connection member are provided on a side surface of the substrate 10 adjacent thereto, and the protrusion 14 is effective to space one end of the first pin 20 from the substrate 10. The bump 14 may protrude from a side surface of the substrate 10 adjacent to the first pin 20 toward the first pin 20, and the conductive connection member is a member having conductive properties and adhesive properties, which enables the first pin 20 to be electrically connected to the substrate 10 while enabling the physical connection of the first pin 20 to the substrate 10.
As shown in fig. 2 and 3, a plurality of first pins 20 may be disposed at one side of the width direction of the substrate 10, and the plurality of first pins 20 may be arranged at intervals along the length direction of the substrate 10. And, when the substrate 10 is connected to the first pins 20, a conductive connection member may be placed between two surfaces of the bump 14 and one of the first pins 20 opposite to each other to pre-bond the bump 14 to one of the first pins 20, where the bump 14 can support one of the first pins 20 on the substrate 10, and then the conductive connection member is melted by a reflow oven, and becomes a liquid state after being melted, where at least a portion of the conductive connection member flows to the periphery of the bump 14, so that the thickness of the conductive connection member between the first pin 20 and the substrate 10 is reduced, and the connection between the first pin 20 and the substrate 10 is achieved after solidification. Since the protrusion 14 can limit the movement of the first lead 20 toward the substrate 10, the connection reliability of the first lead 20 and the substrate 10 is ensured, and meanwhile, the relative displacement between the first lead 20 and the substrate 10 is avoided, so that the actual distance between the first lead 20 and the substrate 10 is consistent with the design distance, and further, the glue overflow phenomenon in the injection molding process is avoided.
Through setting up at least one protruding 14 and conductive connection spare in the one end of base plate 10, and conductive connection spare and protruding 14 all are located between the one side surface of base plate 10 towards first pin 20 and first pin 20, first pin 20 passes through conductive connection spare and realizes being connected with the electricity of base plate 10, from this, compare with traditional power module 100, protruding 14 can play the supporting role to first pin 20, separates first pin 20 and base plate 10, can effectively avoid taking place relative displacement between first pin 20 and the base plate 10, and then the phenomenon of glue overflow appears in the time of avoiding moulding plastics the process.
In the prior art, as shown in fig. 1, the surface of the substrate 10 'is generally a smooth surface, and when the solder is melted by a reflow oven during the soldering with the first lead 20', the volume of the solder becomes smaller, and shrinkage tension is formed between the substrate 10 'and the first lead 20', which tends to cause the substrate 10 'to move in the direction of the first lead 20', and this causes serious glue overflow during the subsequent injection molding process. In the embodiment of the invention, the plurality of protrusions 14 are arranged on the substrate 10, the plurality of protrusions 14 play a role in supporting the first pins 50, and the protrusions 14 enable shrinkage tension to exist when the solder between the substrate 10 and the first pins 20 is melted, so that the movement of the relative positions of the substrate 10 and the first pins 20 can be effectively avoided, and further, the phenomenon of glue overflow during subsequent packaging is avoided.
Therefore, the plurality of protrusions 14 are disposed on the substrate 10, and the surface of the first lead 20 facing the substrate 10 is abutted against the protrusions 14, so that the protrusions 14 support the first leg 20, thereby effectively avoiding movement of the relative position between the substrate 10 and the first lead 20, and further avoiding glue overflow.
As shown in fig. 9 in conjunction with fig. 8, a side of the projection 14 away from a side surface of the substrate 10 facing the first pin 20 is in contact with the first pin 20. Specifically, after the conductive connection member becomes liquid, the conductive connection member may flow all around the bump 14, at which time a side surface of the bump 14 adjacent to the first pin 20 is in direct contact with the first pin 20, and the bump 14 still supports the first pin 20 on the substrate 10. Therefore, the first pins 20 can be electrically connected with the substrate 10, and the protrusions 14 can have a good supporting effect on the first pins 20, so that the first pins 20 are prevented from moving towards the substrate 10.
Wherein, the bump 14 and the substrate 10 are integrally formed, and the first pin 20 is electrically connected with the substrate 10 through the conductive connection member and the bump 14. For example, the projections 14 can be precisely obtained by etching, stamping, welding, or the like. With this arrangement, the number of assembling steps of the power module 100 can be reduced, and thus the assembling efficiency of the power module 100 can be improved.
As shown in fig. 4, the substrate 10 includes: the inner copper-clad layer 11, the ceramic layer 12 and the outer copper-clad layer 13, the ceramic layer 12 is sandwiched between the inner copper-clad layer 11 and the outer copper-clad layer 13, the inner copper-clad layer 11 is connected with the first pin 20, and a plurality of protrusions 14 are arranged on the inner copper-clad layer 11. Specifically, the substrate 10 includes an inner copper-clad layer 11, a ceramic layer 12, and an outer copper-clad layer 13, which are laminated. Specifically, the inner copper-clad layer 11 has good conductivity, so that effective electrical connection between the first pins 20 and other components and parts and the substrate 10 is ensured; the edge of the ceramic layer 12 exceeds the edges of the inner copper-clad layer 11 and the outer copper-clad layer 13, the ceramic layer 12 is an insulating layer, and a larger creepage distance is kept between the inner copper-clad layer 11 and the outer copper-clad layer 13; when the power module 100 works to generate heat, the heat can be transferred to the outer copper layer 13 through the first copper layer and the ceramic layer 12, and the outer copper layer 13 exchanges heat with the outside to realize heat dissipation of the power module 100. The substrate 10 has excellent thermal cycle characteristics, stable shape, good rigidity, high thermal conductivity, high reliability, and is a pollution-free, nuisance-free green product.
As shown in fig. 8 and 9, the plurality of bumps 14 are provided, and the plurality of bumps 14 are arranged in an array on the inner copper-clad layer 11. Specifically, the plurality of bumps 14 are arranged in an array on the entire surface of the inner copper-clad layer 11 on the substrate 10, so that the supporting force of the bumps 14 on the first pins 20 is more balanced. When the first pins 20 are connected with the substrate 10, the distribution of the conductive connection members between the first pins 20 and the substrate 10 is more uniform, so that the connection failure of the first pins 20 and the substrate 10 caused by insufficient connectivity of the conductive connection members at certain positions between the substrate 10 and the first pins 20 is prevented.
Wherein the shape of the protrusion 14 is one of rectangular parallelepiped, cylindrical, hemispherical, and conical. The above shape of the protrusion 14 can well support the first pin 20 due to the supporting effect of the protrusion 14 on the first pin 20, so that the movement of the relative position of the first pin 20 and the substrate 10 is effectively avoided. Specifically, the protrusion 14 has a rectangular parallelepiped shape so that the first pin 20 can be firmly connected with the substrate 10.
Further, the thickness of each projection 14 in the thickness direction of the substrate 10 is D, wherein D satisfies: d is more than or equal to 30 mu m and less than or equal to 50 mu m. Specifically, when D < 30 μm, the thickness of the bump 14 is too small, so that the gap between the substrate 10 and the first pin 20 is too small, resulting in a smaller volume of the conductive connection, which may reduce the connection reliability between the substrate 10 and the first pin 20, so that the first pin 20 and the substrate 10 are prone to connection failure. When D > 50 μm, the thickness of the bump 14 is too large, so that the distance between the first pin 20 and the substrate 10 is too large, which increases the amount of conductive connection and increases the cost of the power module 100. Therefore, the thickness of the protrusion 14 is 30 μm or less and D.ltoreq.50 μm, so that the consumption of the conductive connecting piece can be reduced, the first pin 20 and the substrate 10 can be reliably connected, the protrusion 14 can be ensured to play a supporting role on the first pin 20, the first pin 20 is prevented from moving towards the direction of the substrate 10, and glue overflow in the injection molding process is avoided.
As shown in fig. 7, at least one groove 24 is formed on a surface of the first lead 20 facing the substrate 10, and at least a portion of the conductive connection member is located in the groove 24. Specifically, the groove 24 is located on the first lead 20, and the groove 24 is located on a side of the first lead 20 facing the substrate 10, after the conductive connecting piece bonds the substrate 10 and the first lead 20, the conductive connecting piece is melted, at this time, part of the conductive connecting piece can flow into the groove 24 to prevent the conductive connecting piece from piling up around the protrusion 14, so that the conductive connecting piece around the protrusion 14 can be distributed more uniformly, and meanwhile, the contact area between the conductive connecting piece and the first lead 20 is increased, and further, the connection reliability between the first lead 20 and the substrate 10 is further enhanced.
According to the illustration of fig. 9, the number of projections 14 is N, where N satisfies: n is more than or equal to 0 and less than or equal to 20. Specifically, when N > 20, the number of the projections 14 is excessive, and the arrangement density of the projections 14 on the mounting portion 23 is excessive, which is unfavorable for processing of the projections 14; and because of the excessive density, fewer conductive connections can be accommodated between the bumps 14 and the substrate 10, the bumps 14 do not support the first pins 20 well on the substrate 10, resulting in an unreliable connection of the first pins 20 to the substrate 10. The number of the protrusions 14 is 18, when the conductive connection member becomes liquid, the space between two adjacent protrusions 14 can accommodate a proper amount of conductive connection member, so that the first pins 20 and the substrate 10 can be reliably connected, and the processing of the protrusions 14 is facilitated.
Referring to fig. 7, each first pin 20 includes: a body 21; a connecting portion 22, one end of the connecting portion 22 is connected to the body 21, and the other end of the connecting portion 22 extends obliquely toward the substrate 10 in the thickness direction of the substrate 10; and a mounting portion 23, one end of the mounting portion 23 is connected to the other end of the connecting portion 22, and a surface of the mounting portion 23 facing the substrate 10 is in contact with the projection 14. Specifically, each first pin 20 includes a body 21, a connecting portion 22, and a mounting portion 23, the body 21 being for connection with other devices; one end of the connecting portion 22 is connected to one side of the body 21 adjacent to the substrate 10, and the other end of the connecting portion 22 extends obliquely toward the substrate 10 and is connected to the mounting portion 23; the mounting portion 23 extends along the length direction of the substrate 10, so that the first pin 20 has a simple structure and is convenient to process.
Further, the projected area of the mounting portion 23 on the substrate 10 is larger than the projected area of the projection 14 on the substrate 10. Specifically, the present invention relates to a method for manufacturing a semiconductor device. The projected area of the mounting portion 23 on the substrate 10 may be larger than the projected area of the projection 14 on the substrate 10; alternatively, the projected area of the mounting portion 23 on the substrate 10 may be equal to the projected area of the projection 14 on the substrate 10; alternatively, the projected area of the mounting portion 23 on the substrate 10 may be smaller than the projected area of the projection 14 on the substrate 10, which is not limited herein.
Optionally, the conductive connecting member is solder paste. The solder paste is used as a connecting material, so that the first pins 20 can be connected with the substrate 10, and simultaneously, the conductive effect can be achieved, and the substrate 10 and the first pins 20 are electrically connected, so that the using function of the power module 100 is realized.
A part of the plurality of first pins 20 is located at one side of the substrate 10 in the width direction, and another part of the plurality of first pins 20 is located at least one end of the substrate 10 in the length direction. As shown in fig. 2 to 6, 10 first pins 20 and 8 first pins 20 are arranged at intervals along the length direction of the substrate 10, and 2 first pins 20 are respectively distributed at two ends of the substrate 10 in the length direction. Thus, the distribution of the first pins 20 can better realize the electrical connection with the chip, thereby realizing the function of the power module 100.
Further, the power module 100 further includes a plurality of second pins 30, a plurality of chips, and a plastic package. The plurality of second pins 30 are located at the other side of the width direction of the substrate 10. The plurality of chips includes at least one driving chip 40 and at least one power chip 50, the driving chip 40 is located on the second pins 30 and electrically connected with the corresponding second pins 30, and the power chip 50 is located on the substrate 10 and electrically connected with the corresponding first pins 20. The plastic package wraps the substrate 10 and the chip, and the free end of each first pin 20 and the free end of each second pin 30 extend out of the plastic package. Specifically, the second pins 30 are located at the other side of the width direction of the substrate 10 and are opposite to the plurality of first pins 20. The second pin 30 may be electrically connected to the driving chip 40 through a gold wire, a copper wire or a silver wire, and the driving chip 40 may be electrically connected to the gate of the power chip 50 through an aluminum wire, a gold wire or a copper wire to realize the function of the driving chip 40. The first pin 20 may be electrically connected to the emitter of the power chip 50 using an aluminum wire or an aluminum foil to realize the function of the power chip 50. The plastic package is wrapped on the periphery of the substrate 10, and protects the substrate 10 and the chip.
In the manufacturing process of the power module 100, a conductive connecting piece such as solder paste is printed on the substrate 10, then the first pin 20 and the second pin 30 are mounted on two sides of the substrate 10 in the width direction, the first pin 20 and the second pin 30 are pressed downwards to bond the first pin 20 and the second pin 30 with the conductive connecting piece, at this time, the first pin 20 contacts the bump 14, the solder paste is extruded and distributed around the bump 14, then reflow soldering is performed in a reflow oven, the conductive connecting piece becomes a liquid state and flows into the gaps and the grooves 24 between the bumps 14, then a plurality of chips are placed at corresponding positions of the substrate 10 and mounted, finally the whole is molded, and one ends of the first pin 20 and the second pin 30 extend out of the plastic package.
According to an alternative embodiment of the invention, the side of the substrate 10 facing away from the chip is completely enclosed in a plastic package. In this way, the whole substrate 10 is encapsulated in the plastic package body by plastic, the first pins can be flexibly arranged at different positions of the inner copper-clad layer 11, and the substrate 10 can be completely wrapped by the plastic package body, so that the safety and the sealing performance of the substrate 10 can be improved.
According to another alternative embodiment of the invention, the side of the substrate 10 facing away from the chip is exposed flush with the plastic package. In this way, the surface of the substrate 10 facing away from the chip is exposed to the outside, i.e. the copper-clad layer 13 may expose the plastic package body, so that the chip may dissipate heat through the copper-clad layer 13. Further, the copper-clad layer 13 can be attached to a radiator, and the radiator is used for radiating heat to the substrate, so that the chip has good heat radiation performance.
An apparatus according to an embodiment of the second aspect of the present invention comprises a power module 100 and a controller electrically connected to the power module 100.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (13)
1. A power module, comprising:
a substrate, the substrate comprising: the inner copper-clad layer is sandwiched between the inner copper-clad layer and the outer copper-clad layer, the inner copper-clad layer is provided with a plurality of conductive connecting pieces and a plurality of protrusions, and the protrusions are arranged on the inner copper-clad layer in an array manner;
the first pins are connected with the inner copper-clad layer at least through the conductive connecting piece and are electrically connected, and one side surface of each first pin, which faces the substrate, is separated from the substrate at least through a plurality of protrusions.
2. The power module of claim 1, wherein a side surface of the protrusion facing away from the substrate facing the first pin is in contact with the first pin.
3. The power module of claim 1, wherein the bump is an integral part of the substrate, and the first pin is electrically connected to the substrate through the conductive connection and the bump.
4. The power module of claim 1, wherein a thickness of each of the protrusions along a thickness direction of the substrate is D, wherein the D satisfies: d is more than or equal to 30 mu m and less than or equal to 50 mu m.
5. The power module of claim 1, wherein the first pin has at least one recess formed in a surface thereof facing the substrate, and wherein at least a portion of the conductive connection is located within the recess.
6. The power module of claim 1, wherein the number of protrusions is N, wherein N satisfies: n is more than or equal to 10 and less than or equal to 20.
7. The power module of claim 1, wherein the protrusion has one of a rectangular parallelepiped shape, a cylindrical shape, a hemispherical shape, and a conical shape.
8. The power module of claim 1, wherein each of the first pins comprises:
a body;
one end of the connecting part is connected with the body, and the other end of the connecting part extends obliquely towards the substrate along the thickness direction of the substrate;
and one end of the mounting part is connected with the other end of the connecting part, and one side surface of the mounting part facing the substrate is abutted with the protrusion.
9. The power module of claim 8, wherein an area of projection of the mounting portion on the substrate is greater than an area of projection of the protrusion on the substrate.
10. The power module of claim 1, wherein the conductive connection is solder paste.
11. The power module according to any one of claims 1 to 10, wherein a part of the plurality of first pins is located at one side in a width direction of the substrate, and another part of the plurality of first pins is located at least one end in a length direction of the substrate.
12. The power module of claim 11, further comprising:
a plurality of second pins, wherein the second pins are positioned on the other side of the width direction of the substrate;
the plurality of chips comprise at least one driving chip and at least one power chip, the driving chip is positioned on the second pin and is electrically connected with the corresponding second pin, and the power chip is positioned on the substrate and is electrically connected with the corresponding first pin;
the plastic package body wraps the substrate and the chip, the free ends of the first pins and the second pins extend out of the plastic package body, and one surface of the substrate, which faces away from the chip, is completely wrapped in the plastic package body or one surface of the substrate, which faces away from the chip, is exposed outside flush with the plastic package body.
13. An apparatus comprising the power module of any of claims 1-12 and a controller electrically connected to the power module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211457981.3A CN115799202B (en) | 2022-11-17 | 2022-11-17 | Power module and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211457981.3A CN115799202B (en) | 2022-11-17 | 2022-11-17 | Power module and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115799202A CN115799202A (en) | 2023-03-14 |
| CN115799202B true CN115799202B (en) | 2024-01-30 |
Family
ID=85439493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211457981.3A Active CN115799202B (en) | 2022-11-17 | 2022-11-17 | Power module and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115799202B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864272A (en) * | 1994-08-22 | 1996-03-08 | Nippondenso Co Ltd | Connector pin connector apparatus and assembling method therefor |
| KR20010037881A (en) * | 1999-10-20 | 2001-05-15 | 구자홍 | Intelligent Power Module structures |
| CN104112678A (en) * | 2013-07-15 | 2014-10-22 | 广东美的制冷设备有限公司 | Manufacturing method for intelligent power module |
| CN114975128A (en) * | 2021-02-25 | 2022-08-30 | 珠海零边界集成电路有限公司 | Intelligent power module and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101489325B1 (en) * | 2007-03-12 | 2015-02-06 | 페어차일드코리아반도체 주식회사 | Power module with stacked flip-chip and method of fabricating the same power module |
-
2022
- 2022-11-17 CN CN202211457981.3A patent/CN115799202B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864272A (en) * | 1994-08-22 | 1996-03-08 | Nippondenso Co Ltd | Connector pin connector apparatus and assembling method therefor |
| KR20010037881A (en) * | 1999-10-20 | 2001-05-15 | 구자홍 | Intelligent Power Module structures |
| CN104112678A (en) * | 2013-07-15 | 2014-10-22 | 广东美的制冷设备有限公司 | Manufacturing method for intelligent power module |
| CN114975128A (en) * | 2021-02-25 | 2022-08-30 | 珠海零边界集成电路有限公司 | Intelligent power module and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115799202A (en) | 2023-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9917031B2 (en) | Semiconductor device, and method for assembling semiconductor device | |
| US6951982B2 (en) | Packaged microelectronic component assemblies | |
| JP4634497B2 (en) | Power semiconductor module | |
| US8916958B2 (en) | Semiconductor package with multiple chips and substrate in metal cap | |
| JP6485257B2 (en) | Semiconductor device and manufacturing method of semiconductor device | |
| US20140252613A1 (en) | Semiconductor device | |
| US20070132073A1 (en) | Device and method for assembling a top and bottom exposed packaged semiconductor | |
| US20100134979A1 (en) | Power semiconductor apparatus | |
| CN110289248B (en) | SMD integration on QFN through 3D stacking solution | |
| CN110021590B (en) | Power chip integrated module, manufacturing method thereof and double-sided heat dissipation power module package | |
| US9585260B2 (en) | Electronic component module and manufacturing method thereof | |
| US7399657B2 (en) | Ball grid array packages with thermally conductive containers | |
| CN115985855B (en) | Power module and preparation method thereof | |
| JP2020526930A (en) | Power semiconductor module | |
| JP2001085603A (en) | Semiconductor device | |
| CN115799202B (en) | Power module and apparatus | |
| JP2023535473A (en) | Power modules, fabrication molds, and equipment | |
| US20120025358A1 (en) | Semiconductor element with semiconductor die and lead frames | |
| CN210956665U (en) | Intelligent power module and electronic equipment | |
| CN112490234A (en) | Intelligent power module and manufacturing method thereof | |
| CN218677141U (en) | Power module | |
| CN111681997A (en) | Power package module and electronic device | |
| CN115579346B (en) | Connection structure, packaging structure and manufacturing process of power module | |
| JP2004039700A (en) | Semiconductor power module | |
| KR102552424B1 (en) | Semiconductor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |