CN218664232U - Intelligent electronic substrate production line moves machine of carrying - Google Patents

Intelligent electronic substrate production line moves machine of carrying Download PDF

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Publication number
CN218664232U
CN218664232U CN202223370197.7U CN202223370197U CN218664232U CN 218664232 U CN218664232 U CN 218664232U CN 202223370197 U CN202223370197 U CN 202223370197U CN 218664232 U CN218664232 U CN 218664232U
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assembly line
jacking
base plate
gripper
intelligent electronic
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CN202223370197.7U
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Chinese (zh)
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林鹤
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Individual
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Abstract

The utility model relates to an electronic substrates production field especially indicates intelligent electronic substrates production line moves machine of carrying, should move the machine of carrying and include jacking piece. The lifting pieces are symmetrically arranged on the rack and can lift. The transfer mechanism comprises a gripper base plate, the gripper base plate can slide left and right and is arranged on a hood of the rack, telescopic gripper link plates are arranged on two sides of the gripper base plate, and a plurality of grippers are arranged on the gripper link plates. When the automatic lifting device is used, the substrate jig is conveyed to the two lifting pieces in a staggered mode through the A assembly line and the B assembly line to pause, the lifting pieces lift the substrate jig upwards, the substrate jig on the lifting pieces is grabbed through the grabbers on the transfer mechanism, and the substrate jig is conveyed to the wave-soldering assembly line through the moving transfer mechanism, so that the substrate jig of the A assembly line and the substrate jig of the B assembly line are alternately transferred and placed on the wave-soldering assembly line, the intelligent transfer blank between the assembly lines in the production process of the substrate jig is filled, the whole structure is simple, the operation is stable and reliable, and the automatic lifting device is strong in practicability and suitable for wide popularization.

Description

Intelligent electronic substrate production line moves machine of carrying
Technical Field
The utility model relates to an electron base plate production field especially indicates intelligent electron base plate production line moves machine of carrying.
Background
In a circuit substrate production and manufacturing enterprise in an electronic product, a special-shaped board inserting machine is arranged at the front end of a production line, manual insertion and initial inspection are carried out in the middle of the production line, and then a substrate flows into a crest welder; in order to improve the efficiency or produce various products simultaneously, one wave soldering corresponds to two or more A \ B plug-ins and an initial inspection assembly line, so that the substrate needs to be moved into the wave soldering assembly line manually before being gathered and flowing into the wave soldering, and the manual operation is easy to block a jig, low in efficiency and high in labor intensity.
Disclosure of Invention
Not enough that provides to above-mentioned background art, the utility model provides an intelligent electronic substrate production line moves machine of carrying.
The utility model adopts the following technical scheme:
intelligent electronic substrate production line moves machine of carrying, its characterized in that, should move the machine of carrying including:
the jacking pieces are symmetrically arranged on the rack and can lift relative to the rack;
the transfer mechanism is arranged on a hood of the rack and comprises a hand grip base plate, hand grip link plates and hand grips, the hand grip base plate can be arranged on the hood in a left-right sliding mode, the telescopic hand grip link plates are symmetrically arranged on two sides of the hand grip base plate, and a plurality of hand grips are arranged on the hand grip link plates;
the assembly line A and the assembly line B are symmetrically arranged on the rack and are respectively arranged on the upper sides of the two jacking pieces;
the wave-soldering assembly line is arranged between the assembly line A and the assembly line B; and the number of the first and second groups,
the controller is arranged on the rack; wherein the content of the first and second substances,
the controller is used for controlling the jacking piece, the transfer mechanism, the A assembly line, the B assembly line and the wave-soldering assembly line, the A assembly line and the B assembly line are used for conveying the substrate jig, the jacking piece is used for jacking the substrate jig on the A assembly line and the B assembly line upwards, and the transfer mechanism is used for transferring the substrate jig on the jacking piece to the wave-soldering assembly line.
As a further improvement, the assembly line a and the assembly line B are both composed of two conveying chains, the two conveying chains are respectively located on two sides of the jacking piece, and two sides of the substrate jig are respectively erected on the two conveying chains.
As a further improvement, the jacking piece is driven by a jacking cylinder, the jacking cylinder is fixedly connected to the jacking substrate through a fixing plate, and the jacking substrate is fixedly connected to the rack.
As a further improvement, a cylinder connecting plate is arranged on a piston of the jacking cylinder, the upper surface of the cylinder connecting plate is connected with the jacking piece, a first guide shaft is arranged on the lower surface of the cylinder connecting plate, a first linear bearing seat is arranged on the fixing plate, and when the jacking piece is lifted, the first guide shaft can slidably penetrate through the first linear bearing seat.
As a further improvement, a slide rail is arranged on the bottom surface of the hood, a synchronous belt is arranged in the slide rail, a sliding part is arranged on the upper surface of the gripper substrate and fixedly connected to the synchronous belt, and the synchronous belt is driven by a stepping motor arranged on the hood.
As a further improvement, the gripper linkage plate is driven by a gripper cylinder arranged on the bottom surface of the gripper base plate.
As a further improvement, a second guide shaft is arranged on the surface of one side, close to the hand grip base plate, of the hand grip link plate, a second linear bearing seat is arranged on the bottom surface of the hand grip base plate, and when the hand grip link plate stretches, the second guide shaft can slidably penetrate through the second linear bearing seat.
From the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages: when using, through A assembly line and the B assembly line is crisscross transports the base plate tool to two jacking piece tops and pauses, then the jacking piece makes progress the jacking with the base plate tool, snatch the base plate tool on the jacking piece through the tongs in the transfer mechanism, rethread transfer mechanism drives the base plate tool and removes and transport to the wave-soldering assembly line about moving, thereby shift the base plate tool of A assembly line and B assembly line in turn, place and send into the wave-soldering assembly line on and process in sending into the wave-soldering machine, the intelligent year blank that moves between assembly line has been filled up in base plate tool production process, overall structure is simple, the operation is reliable and stable, need not artifical transport, high efficiency, low in labor strength, the practicality is strong and is fit for extensively promoting.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic front view of the structure of the present invention.
Fig. 3 is a schematic perspective view of the jacking member and the frame.
Fig. 4 is a schematic perspective view of the jacking member, the jacking cylinder and the jacking base plate.
Fig. 5 is a schematic perspective view of the jacking member, the jacking cylinder, the first linear bearing seat and the first guide shaft.
Fig. 6 is a perspective view of the transfer mechanism and hood.
Fig. 7 is a schematic perspective view of the transfer mechanism.
Fig. 8 is a perspective view of another perspective view of the transfer mechanism.
Fig. 9 is a schematic front view of the substrate fixture lifted by the lifting member and the substrate fixture grabbed by the transferring mechanism.
Fig. 10 is a schematic front view of the substrate fixture moved by the transfer mechanism.
Fig. 11 is a schematic top view of the present invention installed on a production line.
Fig. 12 is a circuit control diagram of the present invention.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1 and 2, the intelligent electronic substrate production line transfer machine includes a jacking member 2, a transfer mechanism 3, a wave soldering assembly line 13, an a assembly line 11 and a B assembly line 12.
As shown in fig. 3, the a assembly line 11 and the B assembly line 12 are symmetrically disposed on the frame 1, and the a assembly line 11 and the B assembly line 12 are both used for conveying the substrate jig 5, specifically, the a assembly line 11 and the B assembly line 12 are both composed of two conveyor chains, and two sides of the substrate jig 5 are respectively erected on the two conveyor chains, so that the bottom surface of the substrate jig 5 can be exposed, and it is ensured that the substrate jig 5 can be smoothly lifted up by the following lifting member 2.
As shown in fig. 3 and 4, two 2 symmetries of jacking piece are located in the frame 1, just the A assembly line 11 and two 2 upsides of jacking piece are located respectively to B assembly line 12, wherein, jacking piece 2 can be relative 1 lift of frame is in order to be used for upwards jacking A assembly line 11 with base plate tool 5 on the B assembly line 12, specific speaking, jacking piece 2 is driven through jacking cylinder 21, wherein, be equipped with cylinder connecting plate 22 on jacking cylinder 21's the piston, this cylinder connecting plate 22 upper surface with jacking piece 2 links to each other, and jacking cylinder 21 passes through fixed plate 23 rigid coupling on jacking base plate 24, jacking base plate 24 rigid coupling in on the frame 1. As shown in fig. 9, when the substrate lifting device is used, the lifting cylinder 21 drives the cylinder connecting plate 22 to drive the lifting piece 2 to move upwards, so that the lifting piece 2 lifts the substrate jig 5 placed on the a assembly line 11 or the B assembly line 12 upwards.
Further, as shown in fig. 5, a first guide shaft 26 is disposed on the lower surface of the cylinder connecting plate 22, a first linear bearing 25 is disposed on the fixing plate 23, when the jacking member 2 is lifted, the first guide shaft 26 slidably penetrates through the first linear bearing 25, and the first linear bearing 25 is used for guiding the first guide shaft 26, so that the first guide shaft 26 and the jacking member 2 are prevented from being tilted in the lifting process, and the risk that the center of gravity of the substrate fixture 5 on the jacking member 2 is shifted and dropped in the jacking process is prevented. And the bottom of the first guide shaft 26 is provided with a stroke adjusting rod 27, the stroke adjusting rod 27 is positioned below the jacking cylinder 21, and the jacking cylinder 21 can be prevented from excessively moving upwards to the jacking piece 2 by utilizing the blocking and adjusting functions of the stroke adjusting rod 27.
As shown in fig. 6 and 10, the wave soldering assembly line 13 is located between the a assembly line 11 and the B assembly line 12, the transfer mechanism 3 is located on the aircraft bonnet 4 of the frame 1, just the transfer mechanism 3 is used for shifting the base plate jig 5 on the jacking piece 2 to on the wave soldering assembly line 13, wherein, the transfer mechanism 3 includes the tongs base plate 31, tongs chain plate 32 and tongs 33, but the locating of tongs base plate 31 horizontal slip is on the aircraft bonnet 4, specifically speaking, fixed slide rail 41 that is provided with through stationary blade 43 on the aircraft bonnet 4 bottom surface, sets up the hold-in range in this slide rail 41, the upper surface of tongs base plate 31 sets up sliding part 35, this sliding part 35 rigid coupling in on the hold-in range, just the hold-in range is through locating the step motor 42 drive on the aircraft bonnet 4. When the gripper base plate 31 is used, the stepping motor 42 drives the timing belt to move, so that the sliding part 35 drives the gripper base plate 31 to slide left and right along the slide rail 41. In addition, as shown in fig. 7, 8 and 9, the retractable gripper link plates 32 are symmetrically arranged on two sides of the gripper base plate 31, wherein the gripper link plates 32 are driven by gripper cylinders 34 arranged on the bottom surface of the gripper base plate 31, when the lifting member 2 lifts up one end of the base plate jig 5, the gripper cylinders 34 drive the gripper link plates 32 to retract, so that a plurality of grippers 33 arranged on the gripper link plates 32 are close to the base plate jig 5, the claws 331 of the grippers 33 are arranged below the base plate jig 5, then the lifting member 2 moves down and resets, the base plate jig 5 is arranged on the upper surface of the claws 331, the base plate jig 5 is stably lifted by the claws 331, then the grippers 33 drive the base plate jig 5 to move left and right along with the gripper base plate 31, the base plate jig 5 is moved to the wave soldering assembly line 13, finally the grippers 33 reset, the base plate jig 5 is loosened, and the base plate jig 5 is conveyed down from the wave soldering assembly line 13 and then sent to the wave soldering machine for processing.
In addition, as shown in fig. 8, a second guide shaft 37 is disposed on a side surface of the gripper link plate 32 close to the gripper base plate 31, a second linear bearing seat 36 is disposed on a bottom surface of the gripper base plate 31, when the gripper link plate 32 extends and contracts, the second guide shaft 37 slidably penetrates through the second linear bearing seat 36, and the second guide shaft 37 is guided by the second linear bearing seat 36, so that the second guide shaft 37 and the gripper link plate 32 are prevented from being skewed or shaken in the extending and contracting process, and the risk of substrate jig 5 grabbing errors caused by the fact that the grippers 33 on the gripper link plate 32 are skewed or shaken in the extending and contracting process is prevented.
In addition, as shown in fig. 12, the actions of the jacking piece 2, the transfer mechanism 3, the a assembly line 11, the B assembly line 12 and the wave soldering assembly line 13 are controlled by the controller arranged on the rack 1, the controller can be specifically a PLC controller, has the advantages of being timely, accurate and stable in operation, completely overcomes instability and inefficiency of manual operation, is used for controlling the operation of the wave soldering assembly line 13, the a assembly line 11 and the B assembly line 12, and the stretching of the gripper cylinder 34 and the jacking cylinder 21, the starting and stopping of the stepping motor 42 and full electric control enable the carrying process to be fast, soft and accurate, avoids vibration and displacement of elements, and the yield is high.
To sum up, the utility model discloses when using, through A assembly line 11 and B assembly line 12 staggeredly transports base plate tool 5 to two jacking pieces 2 top pause, then jacking piece 2 with base plate tool 5 jacking upwards, pick base plate tool 5 on jacking piece 2 through tongs 33 on the transfer mechanism 3, rethread transfer mechanism 3 drives and removes about base plate tool 5 and transport to wave-soldering assembly line 13, as shown in figure 11, shift base plate tool 5 of A assembly line 11 and B assembly line 12 in turn, place and send into wave-soldering machine on the wave-soldering assembly line 13 and process, the intelligent year blank that moves between assembly line has been filled in base plate tool 5 production process, overall structure is simple, the operation is reliable and stable, need not artifical transport, high efficiency, low in labor strength, therefore, the clothes hanger is strong and is suitable for extensive popularization.
The above-mentioned be the utility model discloses a concrete implementation way, nevertheless the utility model discloses a design concept is not limited to this, and the ordinary use of this design is right the utility model discloses carry out immaterial change, all should belong to the act of infringement the protection scope of the utility model.

Claims (7)

1. Intelligent electronic substrate production line moves machine of carrying, its characterized in that, should move the machine of carrying including:
the jacking pieces are symmetrically arranged on the rack and can lift relative to the rack;
the transfer mechanism is arranged on a hood of the rack and comprises a hand grip base plate, hand grip link plates and hand grips, the hand grip base plate can be arranged on the hood in a left-right sliding mode, the telescopic hand grip link plates are symmetrically arranged on two sides of the hand grip base plate, and a plurality of hand grips are arranged on the hand grip link plates;
the assembly line A and the assembly line B are symmetrically arranged on the rack and are respectively arranged on the upper sides of the two jacking pieces;
the wave-soldering assembly line is arranged between the assembly line A and the assembly line B; and the number of the first and second groups,
the controller is arranged on the rack; wherein the content of the first and second substances,
the controller is used for controlling the jacking piece, the transfer mechanism, the A assembly line, the B assembly line and the wave-soldering assembly line, the A assembly line and the B assembly line are used for conveying the substrate jig, the jacking piece is used for jacking the substrate jig on the A assembly line and the B assembly line upwards, and the transfer mechanism is used for transferring the substrate jig on the jacking piece to the wave-soldering assembly line.
2. The intelligent electronic substrate production line transfer machine of claim 1, wherein: the assembly line A and the assembly line B are composed of two conveying chains, the two conveying chains are respectively located on two sides of the jacking piece, and two sides of the substrate jig are respectively erected on the two conveying chains.
3. The intelligent electronic substrate production line transfer machine of claim 1, wherein: the jacking piece is driven by a jacking cylinder, the jacking cylinder is fixedly connected to the jacking base plate through a fixed plate, and the jacking base plate is fixedly connected to the rack.
4. The intelligent electronic substrate production line transfer machine of claim 3, wherein: the jacking device is characterized in that a cylinder connecting plate is arranged on a piston of the jacking cylinder, the upper surface of the cylinder connecting plate is connected with the jacking piece, a first guide shaft is arranged on the lower surface of the cylinder connecting plate, a first linear bearing seat is arranged on the fixed plate, and when the jacking piece goes up and down, the first guide shaft can slidably penetrate through the first linear bearing seat.
5. The intelligent electronic substrate production line transfer machine of claim 1, wherein: the novel mechanical hand is characterized in that a sliding rail is arranged on the bottom surface of the hood, a synchronous belt is arranged in the sliding rail, a sliding part is arranged on the upper surface of the hand grip substrate and fixedly connected to the synchronous belt, and the synchronous belt is driven by a stepping motor arranged on the hood.
6. The intelligent electronic substrate production line transfer machine of claim 1, wherein: the gripper linkage plate is driven by a gripper cylinder arranged on the bottom surface of the gripper base plate.
7. The intelligent electronic substrate production line transfer machine of claim 6, wherein: and a second guide shaft is arranged on the surface of one side, close to the gripper base plate, of the gripper link plate, a second linear bearing seat is arranged on the bottom surface of the gripper base plate, and the second guide shaft can slidably penetrate through the second linear bearing seat when the gripper link plate stretches and retracts.
CN202223370197.7U 2022-12-16 2022-12-16 Intelligent electronic substrate production line moves machine of carrying Active CN218664232U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223370197.7U CN218664232U (en) 2022-12-16 2022-12-16 Intelligent electronic substrate production line moves machine of carrying

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223370197.7U CN218664232U (en) 2022-12-16 2022-12-16 Intelligent electronic substrate production line moves machine of carrying

Publications (1)

Publication Number Publication Date
CN218664232U true CN218664232U (en) 2023-03-21

Family

ID=85550924

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223370197.7U Active CN218664232U (en) 2022-12-16 2022-12-16 Intelligent electronic substrate production line moves machine of carrying

Country Status (1)

Country Link
CN (1) CN218664232U (en)

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