CN218655721U

CN218655721U - Wafer spraying liquid medicine's resorption mechanism and wafer processingequipment

Info

Publication number: CN218655721U
Application number: CN202221385188.2U
Authority: CN
Inventors: 王田芳
Original assignee: Guangdong Yuehai Integrated Technology Co ltd
Current assignee: Guangdong Yuehai Integrated Technology Co ltd
Priority date: 2022-06-06
Filing date: 2022-06-06
Publication date: 2023-03-21
Anticipated expiration: 2032-06-06

Abstract

The utility model belongs to the technical field of semiconductor manufacturing, a resorption mechanism and wafer processingequipment of wafer spraying liquid medicine is disclosed. The suck-back mechanism for spraying the liquid medicine on the wafer comprises a shell, a gas channel and a liquid channel; the shell is used for containing liquid medicine; the gas channel comprises a gas inlet and a gas outlet, the gas inlet and the gas outlet are both communicated with the shell, the gas inlet and the gas outlet are connected to two opposite side surfaces of the shell, and the gas inlet and the gas outlet are both arranged at intervals with the bottom of the shell; the liquid channel comprises a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are communicated with the shell, the liquid inlet is arranged on the upper surface or the side surface of the shell, the liquid inlet is close to the air inlet, the air supply mechanism can blow air into the shell through the air inlet so that the liquid medicine can be sucked into the liquid inlet, and the liquid outlet is arranged at the bottom of the shell. The utility model discloses can realize the resorption and hold large-traffic, the liquid medicine of the same kind type, and resorption process gas-liquid separation, convenient to use.

Description

Wafer spraying liquid medicine suck-back mechanism and wafer processing device

Technical Field

The utility model relates to a semiconductor manufacturing technical field especially relates to a resorption mechanism and wafer processingequipment of wafer spraying liquid medicine.

Background

Wafers refer to silicon wafers used in the fabrication of silicon semiconductor circuits, and are typically cleaned with chemical solutions during the manufacturing process to improve the quality of the wafers. However, after spraying and cleaning, the liquid medicine residue exists in the nozzle, and the liquid medicine residue is easy to drip on the surface of the wafer, so that the performance of the wafer is influenced.

In order to prevent the residual liquid medicine from dropping to the surface of the wafer through the nozzle after the liquid medicine spraying operation of the wafer is completed, the prior solution is to use a suck-back valve to suck back the liquid medicine so as to prevent the liquid medicine from dropping. However, the back suction valve is limited by the size of the back suction cavity, and the containing capacity of the back suction valve cavity is limited, so that only small-flow back suction can be realized; in addition, for the same type of liquid medicine, each pipeline needs to be additionally provided with a suckback valve, the suckback valve can only realize the suckback with single flow, and the suckback valve is inconvenient to use for the liquid medicines with different flows and pipe diameters.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a resorption mechanism and wafer processingequipment of wafer spraying liquid medicine can realize the resorption and hold large-traffic, the liquid medicine of the same kind type, and resorption process gas-liquid separation, convenient to use.

To achieve the purpose, the utility model adopts the following technical proposal:

a suck-back mechanism for spraying liquid medicine on a wafer comprises:

a housing for containing the liquid medicine;

the gas channel comprises a gas inlet and a gas outlet, the gas inlet and the gas outlet are both communicated with the shell, the gas inlet and the gas outlet are connected to two opposite side surfaces of the shell, and the gas inlet and the gas outlet are both arranged at intervals with the bottom of the shell;

the liquid channel comprises a liquid inlet and a liquid discharging port, the liquid inlet and the liquid discharging port are communicated with the shell, the liquid inlet is arranged on the upper surface or the side face of the shell, the liquid inlet is close to the air inlet, the air supply mechanism can blow air into the shell through the air inlet, so that the liquid medicine can be sucked into the liquid inlet, and the liquid discharging port is arranged at the bottom of the shell.

Optionally, the liquid discharge port is disposed at an end of the bottom of the housing close to the gas discharge port, so that the liquid medicine can be discharged through the liquid discharge port.

Optionally, the axis of the air inlet and the axis of the air outlet are located on the same line.

Optionally, the housing, the gas channel and the liquid channel are made of a polytetrafluoroethylene material.

Optionally, the housing is disposed in a machine table, and the exhaust port is communicated with an exhaust outlet of the machine table or atmosphere.

Optionally, the liquid discharge port is communicated with a liquid discharge outlet of the machine table.

Optionally, the liquid inlet may be selectively communicated with a plurality of nozzles, so as to discharge the liquid medicine of the plurality of nozzles from the liquid outlet through the housing.

Optionally, the housing is rectangular.

Optionally, the gas channel and the liquid channel are fixed to the housing by connection or are integrally formed.

Another aspect of the present invention provides a wafer processing apparatus, which includes the above-mentioned suck-back mechanism for spraying the liquid medicine onto the wafer.

Has the advantages that:

the utility model provides a suck-back mechanism of wafer spraying liquid medicine, through setting up the casing in order to hold the liquid medicine, improve the holding capacity to the liquid medicine; the air inlet and the air outlet which are arranged at intervals with the bottom of the shell are used for conveying air, so that the pressure in the shell is reduced, the liquid inlet is close to the air inlet, the suction force of the liquid inlet can be improved, the liquid medicine enters the shell from the liquid inlet, and the liquid medicine is discharged out of the shell through the liquid outlet at the bottom of the shell; because the liquid medicine constantly enters and is discharged out of the shell, a certain accommodating space is always kept in the shell, the accommodating capacity of the liquid medicine is strong, and the liquid medicine is enough to accommodate the same liquid medicine with large flow. The utility model provides a resorption mechanism and wafer processingequipment of wafer spraying liquid medicine can realize the resorption and hold large-traffic, the liquid medicine of the same kind type, and resorption process gas-liquid separation, convenient to use.

Drawings

Fig. 1 is a schematic structural view of a suck-back mechanism for spraying a chemical liquid onto a wafer according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the connection position of the housing with the gas channel and the liquid channel according to the embodiment of the present invention;

fig. 3 is a schematic diagram of an exhaust port and an exhaust outlet connection provided by an embodiment of the present invention;

fig. 4 is a schematic view illustrating a connection between a liquid inlet and a nozzle provided in an embodiment of the present invention.

In the figure:

1. a housing;

21. an air inlet; 22. an exhaust port;

31. a liquid inlet; 32. a liquid discharge port;

4. a nozzle; 5. and an exhaust outlet.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The embodiment of the utility model provides a resorption mechanism of wafer spraying liquid medicine (hereinafter referred to as "resorption mechanism") for remaining liquid medicine when resorption spraying liquid medicine avoids remaining liquid medicine to drip on the wafer. As shown in fig. 1 and 2, the suck-back mechanism includes a housing 1, a gas passage, and a gas passage; the shell 1 is used for containing liquid medicine; the gas channel comprises a gas inlet 21 and a gas outlet 22, the gas inlet 21 and the gas outlet 22 are both communicated with the shell 1, the gas inlet 21 and the gas outlet 22 are connected to two opposite side surfaces of the shell 1, and the gas inlet 21 and the gas outlet 22 are both arranged at intervals with the bottom of the shell 1; the liquid channel comprises a liquid inlet 31 and a liquid outlet 32, the liquid inlet 31 and the liquid outlet 32 are both communicated with the shell 1, the liquid inlet 31 is arranged on the upper surface or the side surface of the shell 1, the liquid inlet 31 is close to the air inlet 21, the air supply mechanism can blow air into the shell 1 through the air inlet 21 so that the liquid inlet 31 can suck liquid medicine, and the liquid outlet 32 is arranged at the bottom of the shell 1.

This resorption mechanism has improved the holding capacity to the liquid medicine through setting up casing 1 in order to hold the liquid medicine, has avoided the liquid medicine resorption inconvenience that causes owing to the holding capacity is not enough, the not thorough problem of resorption. The air is conveyed through the air inlet 21 and the air outlet 22, the air enters the shell 1 from the air inlet 21 and is output from the air outlet 22, the pressure in the shell 1 is reduced due to the flowing of the air, and the liquid inlet 31 has the suck-back capacity. The liquid inlet 31 is arranged close to the air inlet 21 to improve the suction force to the liquid medicine, so that the liquid medicine enters the shell 1 from the liquid inlet 31 and is discharged out of the shell 1 through the liquid outlet 32. Preferably, the position of the loading port 31 may be determined according to the actual placement position and convenience of use.

Because the liquid medicine constantly enters and is discharged out of the shell 1, a certain containing space is always kept in the shell 1, the liquid medicine containing capacity is strong, and the liquid medicine containing space is enough to contain the same liquid medicine with large flow. In order to avoid the accidents caused by mixing different liquid medicines, the same liquid medicine can be sucked back into the same shell 1 during the sucking back. The back suction mechanism integrates the collection, the back suction and the discharge of the liquid medicine in the same mechanism, can realize the back suction and contain the liquid medicine with large flow and the same type, can realize the gas-liquid separation in the back suction process, and is convenient to use.

Optionally, the housing 1 is rectangular.

The casing 1 of rectangle is convenient for fixed mounting, and stability is strong, can place the space according to the reality and rationally set up the rectangle size to the rational utilization space.

Alternatively, as shown in fig. 1 to fig. 3, the housing 1 is disposed in the machine, and the exhaust port 22 is communicated with the exhaust outlet 5 of the machine or the atmosphere.

The machine is used for fixedly mounting and processing the wafer, and the exhaust port 22 is communicated with the exhaust outlet 5, so that the pressure intensity at the exhaust port 22 can be reduced, and the gas in the shell 1 can be conveniently exhausted. Preferably, the gas inlet 21 communicates with a gas supply mechanism to deliver compressed gas to the interior of the housing 1. The inside of the housing 1 is compressed gas, and the exhaust port 22 may be connected to the atmosphere, and may also perform an exhaust function. The arrangement of the exhaust port 22 enables the housing 1 to maintain a relatively stable low pressure state, which is convenient for realizing the suck-back of the liquid medicine.

Alternatively, the axis of the intake port 21 and the axis of the exhaust port 22 are located on the same line.

In order to facilitate the flow of the compressed gas inside the casing 1, the inlet port 21 and the outlet port 22 are provided on opposite sides of the casing 1, and the axes of the inlet port 21 and the outlet port 22 are aligned to open the gas passage. It can be understood that the air inlet 21 and the air outlet 22 are spaced from the bottom surface of the housing 1, so that the compressed air mainly flows above the inside of the housing 1, and the liquid medicine flows out of the bottom of the housing 1, thereby achieving a gas-liquid separation arrangement, and avoiding the use effect of the suck-back mechanism being affected by the blockage caused by the liquid medicine flowing into the air passage, the pressure rise in the housing 1, and the like.

Optionally, the liquid outlet 32 is communicated with a liquid outlet of the machine, and a liquid medicine collecting device is not required to be additionally arranged.

Alternatively, a liquid discharge port 32 is provided at an end of the bottom of the housing 1 near the exhaust port 22 to allow the liquid medicine to be discharged from the liquid discharge port 32.

Since the inlet port 21 is close to the inlet port 31, the chemical liquid entering the inlet port 31 is blown by the inlet port 21 to be deviated in the direction of the exhaust port 22, and thus the discharge port 32 is provided at a side close to the exhaust port 22 to facilitate the discharge of the chemical liquid.

Alternatively, as shown in fig. 1-4, the liquid inlet 31 can selectively communicate with the plurality of nozzles 4 to discharge the liquid medicine from the plurality of nozzles 4 through the housing 1 and the liquid outlet 32.

Preferably, a valve body, such as a two-way solenoid valve or a three-way solenoid valve, may be disposed between the liquid inlet 31 and the nozzles 4, so as to selectively communicate with one or more nozzles 4 according to actual conditions, thereby achieving the liquid medicine sucking function of the liquid inlet 31 to the plurality of nozzles 4, and reducing the number of sucking mechanisms.

Alternatively, the gas passage and the liquid passage are fixed to the housing 1 by connection or are formed integrally.

According to actual needs, the gas channel and the liquid channel can be integrally formed with the shell 1, so that the whole sealing performance of the suck-back mechanism is good; the gas channel and the liquid channel can be fixed with the shell 1 through connection, so that parts can be conveniently dismounted or replaced.

Optionally, the housing 1, the gas channel and the liquid channel are made of a teflon material.

The polytetrafluoroethylene has the characteristics of heat resistance and cold resistance, can be used for a long time at the temperature of-180-260 ℃, has the excellent performances of acid resistance and alkali resistance, resistance to various organic solvents and insolubility with most solvents, is used for manufacturing a resorption mechanism, and can ensure that the resorption mechanism has stronger applicability.

It can be understood that the sizes of all parts of the suck-back mechanism can be determined according to actual conditions, and the medicinal liquid suck-back function can be conveniently realized.

A wafer processing device comprises the suck-back mechanism for spraying the liquid medicine on the wafer.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A resorption mechanism of wafer spraying liquid medicine, its characterized in that includes:

a housing (1) for containing the liquid medicine;

the gas channel comprises a gas inlet (21) and a gas outlet (22), the gas inlet (21) and the gas outlet (22) are communicated with the shell (1), the gas inlet (21) and the gas outlet (22) are connected to two opposite side surfaces of the shell (1), and the gas inlet (21) and the gas outlet (22) are arranged at intervals with the bottom of the shell (1);

liquid channel, including inlet (31) and leakage fluid dram (32), inlet (31) with leakage fluid dram (32) all with casing (1) intercommunication, inlet (31) set up in on the upper surface or the side of casing (1), inlet (31) are close to air inlet (21), air feed mechanism can pass through air inlet (21) blow extremely in casing (1), so that inlet (31) can inhale the liquid medicine, leakage fluid dram (32) set up in the bottom of casing (1).

2. The mechanism as claimed in claim 1, wherein the liquid outlet (32) is disposed at an end of the bottom of the housing (1) near the exhaust port (22) so that the liquid medicine can be discharged from the liquid outlet (32).

3. The mechanism as claimed in claim 1, wherein the axis of the air inlet (21) and the axis of the air outlet (22) are located on the same straight line.

4. The mechanism as set forth in claim 1, wherein the housing (1), the gas passage and the liquid passage are made of teflon.

5. The mechanism of claim 1, wherein the housing (1) is disposed in a machine, and the exhaust port (22) is connected to an exhaust outlet (5) of the machine or the atmosphere.

6. The mechanism as claimed in claim 5, wherein the drain port (32) is connected to a drain outlet of the machine.

7. The wafer spraying chemical liquid suck-back mechanism according to claim 1, wherein the liquid inlet (31) is selectively communicated with a plurality of nozzles (4) to discharge the chemical liquid of the plurality of nozzles (4) from the liquid outlet (32) through the housing (1).

8. The mechanism of claim 1, wherein the housing (1) is rectangular.

9. The wafer spraying chemical liquid suck-back mechanism of claim 1, wherein the gas channel and the liquid channel are fixed to the housing (1) through connection or integrally formed.

10. A wafer processing apparatus, comprising a suck-back mechanism for spraying a chemical liquid onto a wafer according to any one of claims 1 to 9.