CN217473966U - Wafer level packaging gluing device - Google Patents
Wafer level packaging gluing device Download PDFInfo
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- CN217473966U CN217473966U CN202221324284.6U CN202221324284U CN217473966U CN 217473966 U CN217473966 U CN 217473966U CN 202221324284 U CN202221324284 U CN 202221324284U CN 217473966 U CN217473966 U CN 217473966U
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Abstract
The utility model relates to a rubber coating technical field especially relates to a wafer level encapsulation rubber coating device, and it includes nozzle, recoverer, arranges gluey jar, supplies to glue jar and first three-way valve. The recoverer is internally provided with a containing cavity, the recoverer is provided with an air inlet, a glue sucking port and a discharge port which are communicated with the containing cavity, the air inlet and the discharge port are respectively arranged on two opposite wall surfaces of the recoverer, the glue sucking port is arranged at the wall surface where the air inlet and the discharge port are not arranged, and the air inlet is communicated with a pipeline for conveying compressed air. The glue discharging tank is used for collecting glue liquid reflowed by the nozzle, and the discharging port is communicated with the glue discharging tank. The glue supply tank can supply glue liquid to the nozzle. The first three-way valve is provided with a first port, a second port and a third port, the first port is communicated with the nozzle, the second port is communicated with the glue supply tank, and the third port is communicated with the glue suction port. The wafer-level packaging gluing device can prevent glue at the nozzle from dripping, and avoids the situation that the glue drips on a wafer accidentally to cause the improvement of the rejection rate.
Description
Technical Field
The utility model relates to a rubber coating technical field especially relates to a wafer level encapsulation rubber coating device.
Background
In the manufacturing process of the CMOS image sensor chip, the low-cost integration of small and medium cameras in various handheld devices is realized by adopting the camera module manufactured by wafer level packaging and integration technology. The proportion of the photoresist area in the whole operation flow reaches 40-50%, the gluing operation is very important in the photoresist area operation, and the situation that glue liquid drops on a wafer due to the glue liquid residue in a glue spraying nozzle in the gluing operation process often occurs. When the glue coating thickness of the wafer is only 31 +/-4 mu m and the uniformity needs to be maintained at less than 5%, the glue solution at the nozzle is easy to drip, so that the uniformity of the wafer is not up to the standard, and the rejection rate is high.
Therefore, a wafer level package glue coating apparatus is needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer level encapsulation rubber coating device can prevent that the glue solution of nozzle department from dripping, avoids having the unexpected drippage of glue solution on the wafer, causes the improvement of rejection rate.
To achieve the purpose, the utility model adopts the following technical proposal:
a wafer level package gluing device comprises:
a nozzle;
the recoverer is internally provided with an accommodating cavity, the recoverer is provided with an air inlet, a glue absorbing port and a discharge port which are communicated with the accommodating cavity, the air inlet and the discharge port are respectively arranged on two opposite wall surfaces of the recoverer, the glue absorbing port is arranged on the wall surface which is not provided with the air inlet and the discharge port, and the air inlet is communicated with a pipeline for conveying compressed air;
the glue discharging tank is used for collecting glue solution reflowing from the nozzle, and the discharge port is communicated with the glue discharging tank;
the glue supply tank can provide the glue solution to the nozzle;
the glue supply device comprises a first three-way valve, wherein a first port, a second port and a third port are formed in the first three-way valve, the first port is communicated with a nozzle, the second port is communicated with a glue supply tank, and the third port is communicated with a glue suction port.
As a preferred scheme of the wafer level packaging and gluing device, an air outlet is formed in the upper portion of the glue discharging tank.
As a preferred scheme of wafer level encapsulation rubber coating device, still include first pipeline and needle valve, first pipeline is used for the intercommunication the second mouth with supply gluey jar, the needle valve sets up on the first pipeline.
As a preferred scheme of the wafer level packaging gluing device, the wafer level packaging gluing device further comprises a filter, wherein the filter is arranged on the first pipeline and located on the upstream of the needle valve.
As a preferred scheme of the wafer-level packaging and gluing device, a liquid discharge port is formed in the glue supply tank, and one end of the first pipeline penetrates through the liquid discharge port and is positioned below the liquid level of the glue solution.
As a preferred scheme of the wafer level packaging and gluing device, the top surface of the glue supply tank is also provided with a gas inlet, and the gas inlet can be communicated with a pipeline for inputting compressed inert gas.
As a preferred scheme of the wafer level packaging gluing device, the wafer level packaging gluing device further comprises a second three-way valve, wherein the second three-way valve is provided with a fourth port, a fifth port and a sixth port, the fourth port is communicated with the gas inlet, the fifth port is communicated with a pipeline for inputting the compressed inert gas, and the sixth port is communicated with a gas exhaust pipeline.
As a preferable scheme of the wafer-level packaging glue-coating device, the air inlet and the discharge port are respectively arranged on two opposite side walls of the recoverer, and the glue-absorbing port is arranged on the top surface of the recoverer.
As a preferred scheme of the wafer level packaging and gluing device, the air inlet is arranged close to the top surface of the accommodating cavity, the discharge port is arranged close to the bottom surface of the accommodating cavity, and the glue suction port is arranged close to the air inlet.
As a preferred scheme of the wafer-level packaging gluing device, the wafer-level packaging gluing device further comprises a first liquid level sensor, wherein the first liquid level sensor is used for detecting the liquid level position of the glue solution in the glue supply tank; and/or the presence of a gas in the atmosphere,
the wafer level packaging and gluing device further comprises a second liquid level sensor, and the second liquid level sensor is used for detecting the liquid level position of the glue liquid in the glue discharging tank.
The utility model has the advantages that:
the utility model provides a wafer level encapsulation rubber coating device, including nozzle, recoverer, row glue jar, confession glue jar and first three-way valve. The recoverer is internally provided with a containing cavity, the recoverer is provided with an air inlet, a glue sucking port and a discharge port which are communicated with the containing cavity, the air inlet and the discharge port are respectively arranged on two opposite wall surfaces of the recoverer, the glue sucking port is arranged at the wall surface where the air inlet and the discharge port are not arranged, and the air inlet is communicated with a pipeline for conveying compressed air. The glue discharging tank is used for collecting glue liquid reflowed by the nozzle, and the discharging port is communicated with the glue discharging tank. The glue supply tank can supply glue liquid to the nozzle. The first three-way valve is provided with a first port, a second port and a third port, the first port is communicated with the nozzle, the second port is communicated with the glue supply tank, and the third port is communicated with the glue suction port.
When glue starts to be sprayed, the first opening of the first three-way valve is communicated with the second opening, the glue solution can flow through the first three-way valve from the glue supply tank to reach the nozzle, after the glue spraying is finished, the first opening of the first three-way valve is communicated with the third opening, compressed air enters the accommodating cavity from the air inlet and flows towards the opposite discharge port, the airflow of the compressed air forms a low-pressure area at the glue suction opening, the glue solution is sucked into the accommodating cavity from the glue suction opening, and the glue solution in the nozzle retracts. By controlling the communication time of the first port and the third port of the first three-way valve, the glue solution in the nozzle can be ensured to retract to a safe area, namely, no glue solution exists in the bent pipe section of the nozzle, and the glue solution in the nozzle cannot be thrown out even the position of the nozzle is moved subsequently. Therefore, the wafer-level packaging gluing device can prevent glue at the nozzle from dripping, and avoids the situation that the glue accidentally drips on a wafer to improve the rejection rate.
Drawings
Fig. 1 is a schematic structural diagram of a wafer level package glue spreading device according to an embodiment of the present invention;
FIG. 2 is a schematic view of the nozzle with the glue solution unrecycled;
FIG. 3 is a schematic diagram of the semi-recovery of the glue solution in the nozzle;
FIG. 4 is a schematic view of the completed recovery of glue in the nozzle;
fig. 5 is a schematic diagram of a recoverer according to an embodiment of the present invention.
In fig. 1, 4, 5:
1. a nozzle; 101. bending the pipe section;
2. a recoverer; 201. an air inlet; 202. a glue sucking port; 203. a discharge port;
3. a glue discharging tank; 4. a glue supply tank; 5. a first three-way valve; 6. a needle valve; 7. a filter; 8. a first pipeline; 9. a second three-way valve; 10. a stop valve;
800. and (5) glue solution.
In fig. 2:
101', a pipe bending section; 800' and glue solution.
In fig. 3:
101', a pipe bending section; 800' and glue solution.
Detailed Description
The technical solution of the present invention will be further explained with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements relevant to the present invention are shown in the drawings.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.
The proportion of the photoresist area in the whole operation flow reaches 40% to 50%, the glue coating operation is used as an important ring in the photoresist area operation, and the conditions that glue liquid in a nozzle for spraying glue in the glue coating operation process is remained and the glue liquid drops on a wafer often occur. When the glue coating thickness of the wafer is only 31 +/-4 mu m and the uniformity needs to be maintained at less than 5%, the glue solution at the nozzle is easy to drip, so that the uniformity of the wafer is not up to the standard, and the rejection rate is high. As shown in fig. 2, when the glue solution 800 ' is not recovered from the nozzle, the glue solution 800 ' easily flows out from the straight pipe section and the liquid drops easily drop at the lower edge of the straight pipe section below the bend section 101 '. If the glue 800 "is recovered only by the needle valve on the supply line, the recoverable amount is limited and only a semi-recovered state as shown in fig. 3 can be achieved, and since the level of the glue 800" is still at the lower edge of the elbow 101 ", there is still a possibility that the glue 800" may drip during the movement of the nozzle.
Therefore, the embodiment provides a wafer-level packaging and gluing device, which can realize a complete recovery state of the glue solution 800 as shown in fig. 4, and the liquid level is above the elbow section 101, so that the situation that the glue solution 800 accidentally drops on a wafer to cause waste products can be completely avoided.
As shown in fig. 1, the wafer level package glue spreading apparatus includes a nozzle 1, a recoverer 2, a glue discharging tank 3, a glue supplying tank 4, and a first three-way valve 5. Wherein, be provided with the holding chamber in the recoverer 2, set up all with the income gas port 201 of holding chamber intercommunication, inhale gluey mouth 202 and discharge port 203 on the recoverer 2, go into gas port 201 and discharge port 203 and set up respectively on two relative walls of recoverer 2, inhale gluey mouth 202 and set up in the wall department that does not set up into gas port 201 and discharge port 203, go into gas port 201 and the pipeline intercommunication of carrying compressed air. The glue discharging tank 3 is used for collecting glue solution 800 returned by the nozzle 1, and the discharge port 203 is communicated with the glue discharging tank 3. The glue supply tank 4 can supply the glue solution 800 to the nozzle 1. The first three-way valve 5 is provided with a first port, a second port and a third port, the first port is communicated with the nozzle 1, the second port is communicated with the glue supply tank 4, and the third port is communicated with the glue suction port 202.
When glue spraying is started, the first port and the second port of the first three-way valve 5 are communicated, glue solution 800 can flow through the first three-way valve 5 from the glue supply tank 4 to reach the nozzle 1, and after glue spraying is finished, the first port and the third port of the first three-way valve 5 are communicated. As shown in fig. 5, compressed air enters the accommodating chamber from the air inlet 201 and flows toward the opposite discharge port 203, the air flow of the compressed air forms a low-pressure area at the glue suction port 202, and the glue solution 800 is sucked into the accommodating chamber from the glue suction port 202, so as to drive the glue solution 800 in the nozzle 1 to retract.
By controlling the communication time between the first port and the third port of the first three-way valve 5, the glue solution 800 in the nozzle 1 can be ensured to retract to a safe area, that is, the glue solution 800 is not in the elbow section 101 of the nozzle 1, and the glue solution 800 in the nozzle 1 cannot be thrown out even if the position of the nozzle 1 is moved subsequently. Then the first port and the third port of the first three-way valve 5 are controlled to be disconnected and communicated, compressed air is continuously blown into the accommodating cavity, and the glue solution 800 in the accommodating cavity can be completely discharged into the liquid discharge tank.
It can know that this wafer level encapsulation rubber coating device can prevent that glue solution 800 of nozzle 1 department from dripping, avoids having glue solution 800 accident to drip on the wafer, causes the improvement of rejection rate.
As shown in fig. 5, it is preferable that the air inlet 201 and the discharge outlet 203 are respectively provided on two opposite side walls of the recovery unit 2, and the glue suction port 202 is provided on the top surface of the recovery unit 2. Preferably, the top surface that income gas port 201 is close to the holding chamber sets up, and the discharge port 203 is close to the bottom surface setting of holding chamber, inhales gluey mouth 202 and is close to the setting of income gas port 201 to guarantee to inhale gluey mouth 202 and be located the low-pressure area that compressed air's air current caused, and the glue solution 800 that inhales the holding chamber can be discharged from discharge port 203 smoothly, be unlikely to store up in the holding chamber, also can not block and fill in gas port 201.
It can be known that the gas vent has been seted up on the upper portion of binder removal jar 3 to make compressed air can release away from the gas vent, glue solution 800 persists on binder removal jar 3.
Preferably, the wafer level packaging gluing device further comprises a first pipeline 8 and a needle valve 6, wherein the first pipeline 8 is used for communicating the second port with the glue supply tank 4, and the needle valve 6 is arranged on the first pipeline 8. The glue solution 800 enters the nozzle 1 through the needle valve 6 and the first three-way valve 5 for injection, and the needle valve 6 can control the flow of the sprayed glue.
Preferably, the wafer level packaging gluing device further comprises a filter 7, wherein the filter 7 is arranged on the first pipeline 8 and is located at the upstream of the needle valve 6. The filter 7 can filter out impurities in the glue solution 800 to prevent the impurities from blocking the needle valve 6 or the nozzle 1.
Preferably, a liquid outlet is formed in the glue supply tank 4, and one end of the first pipeline 8 passes through the liquid outlet and is located below the liquid level of the glue solution 800, so that the glue solution 800 can be smoothly input to the nozzle 1.
Preferably, the top surface of the glue supply tank 4 is further provided with a gas inlet, and the gas inlet can be communicated with a pipeline for inputting compressed inert gas. That is, when the glue spraying starts, the glue solution 800 can be pressed into the first pipe 8 by using the compressed inert gas.
Preferably, the wafer level package glue spreading apparatus further comprises a second three-way valve 9, the second three-way valve 9 has a fourth port, a fifth port and a sixth port, the fourth port is communicated with the gas inlet, the fifth port is communicated with a pipeline for inputting compressed inert gas, and the sixth port is communicated with the gas exhaust pipeline. The glue spraying starting time can be controlled through the second three-way valve 9. Optionally, the compressed inert gas is compressed nitrogen.
Preferably, the wafer level package glue spreading device further comprises a first liquid level sensor, and the first liquid level sensor is used for detecting the liquid level position of the glue solution 800 in the glue supply tank 4, so as to timely supplement the glue solution 800 in the glue supply tank 4. The wafer level packaging gluing device further comprises a second liquid level sensor, and the second liquid level sensor is used for detecting the liquid level position of the glue solution 800 in the glue discharging tank 3 so as to discharge the glue solution 800 in the glue discharging tank 3 in time.
When supplying to glue jar 4 and wasing or glue solution 800 quality is not good, need discharge and supply to glue the interior liquid of jar 4, optionally, this wafer level encapsulation rubber coating device still includes second pipeline and stop valve 10, and the second pipeline is used for communicateing filter 7 and row and glues jar 3, and stop valve 10 sets up on the second pipeline, and the liquid accessible second pipeline that supplies in the glue jar 4 gets into row and glues jar 3.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A wafer level packaging gluing device is characterized by comprising:
a nozzle (1);
the recoverer (2) is internally provided with an accommodating cavity, the recoverer (2) is provided with an air inlet (201), a glue absorbing port (202) and a discharge port (203) which are communicated with the accommodating cavity, the air inlet (201) and the discharge port (203) are respectively arranged on two opposite wall surfaces of the recoverer (2), the glue absorbing port (202) is arranged on the wall surface where the air inlet (201) and the discharge port (203) are not arranged, and the air inlet (201) is communicated with a pipeline for conveying compressed air;
the glue discharging tank (3), the glue discharging tank (3) is used for collecting glue liquid (800) flowing back from the nozzle (1), and the discharge port (203) is communicated with the glue discharging tank (3);
a glue supply tank (4), wherein the glue supply tank (4) can supply the glue solution (800) to the nozzle (1);
the glue feeding device comprises a first three-way valve (5), wherein a first port, a second port and a third port are arranged on the first three-way valve (5), the first port is communicated with a nozzle (1), the second port is communicated with a glue feeding tank (4), and the third port is communicated with a glue sucking port (202).
2. The wafer level package gluing device as claimed in claim 1, wherein the upper part of the glue discharging tank (3) is provided with an air outlet.
3. The wafer-level packaging gluing device according to claim 1, further comprising a first pipeline (8) and a needle valve (6), wherein the first pipeline (8) is used for communicating the second port with the glue supply tank (4), and the needle valve (6) is arranged on the first pipeline (8).
4. Wafer level packaging gluing device according to claim 3, characterized in that it further comprises a filter (7), said filter (7) being arranged on said first duct (8) and upstream of said needle valve (6).
5. The wafer-level packaging gluing device according to claim 3, wherein a liquid outlet is formed in the glue supply tank (4), and one end of the first pipeline (8) passes through the liquid outlet and is positioned below the liquid level of the glue solution (800).
6. The wafer level package gluing device according to claim 1, wherein the glue supply tank (4) further comprises a gas inlet on the top surface, and the gas inlet can be communicated with a pipeline for inputting compressed inert gas.
7. The wafer-level package gluing device according to claim 6, further comprising a second three-way valve (9), wherein the second three-way valve (9) has a fourth port, a fifth port and a sixth port, the fourth port is communicated with the gas inlet, the fifth port is communicated with the pipeline for inputting the compressed inert gas, and the sixth port is communicated with a gas exhaust pipeline.
8. The wafer-level packaging gluing device according to claim 1, wherein the air inlet (201) and the discharge outlet (203) are respectively arranged on two opposite side walls of the recoverer (2), and the glue suction port (202) is arranged on the top surface of the recoverer (2).
9. The wafer level package gluing device as recited in claim 8, wherein the air inlet (201) is disposed near a top surface of the accommodating cavity, the discharge port (203) is disposed near a bottom surface of the accommodating cavity, and the glue suction port (202) is disposed near the air inlet (201).
10. The wafer-level package gluing device according to claim 1, further comprising a first liquid level sensor for detecting a liquid level position of the glue solution (800) in the glue supply tank (4); and/or the presence of a gas in the gas,
the wafer level packaging gluing device further comprises a second liquid level sensor, and the second liquid level sensor is used for detecting the liquid level position of the glue solution (800) in the glue discharging tank (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221324284.6U CN217473966U (en) | 2022-05-30 | 2022-05-30 | Wafer level packaging gluing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221324284.6U CN217473966U (en) | 2022-05-30 | 2022-05-30 | Wafer level packaging gluing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217473966U true CN217473966U (en) | 2022-09-23 |
Family
ID=83313008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221324284.6U Active CN217473966U (en) | 2022-05-30 | 2022-05-30 | Wafer level packaging gluing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217473966U (en) |
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2022
- 2022-05-30 CN CN202221324284.6U patent/CN217473966U/en active Active
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