CN220678915U - Device for exhausting gas and cleaning equipment - Google Patents
Device for exhausting gas and cleaning equipment Download PDFInfo
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- CN220678915U CN220678915U CN202322244713.XU CN202322244713U CN220678915U CN 220678915 U CN220678915 U CN 220678915U CN 202322244713 U CN202322244713 U CN 202322244713U CN 220678915 U CN220678915 U CN 220678915U
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- 238000004140 cleaning Methods 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 83
- 238000006243 chemical reaction Methods 0.000 claims abstract description 34
- 238000004891 communication Methods 0.000 claims description 7
- 238000013022 venting Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 44
- 239000002699 waste material Substances 0.000 description 36
- 239000002253 acid Substances 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 239000002912 waste gas Substances 0.000 description 8
- 238000007599 discharging Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 230000005494 condensation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 239000003595 mist Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The present utility model relates to a device for exhausting gas and a cleaning apparatus. The device for exhausting gas includes: a first bellows provided above the first reaction tank in an assembled state and provided with an opening on a bottom wall thereof so that gas in the first reaction tank can be discharged through the first bellows, wherein a first end of the first bellows in a length direction thereof in the assembled state and a second end opposite to the first end are different in height; a first liquid discharge passage provided at least at a lower one of the first end and the second end; and a first exhaust passage communicating with a top wall of the first bellows to exhaust gas to the atmosphere.
Description
Technical Field
The present utility model relates to the field of semiconductor manufacturing, and more particularly, to an apparatus for exhausting gas and a cleaning device including the same.
Background
As shown in fig. 1, in the prior art, a typical chain type cleaning machine illustrated in the drawing has a structural design for a chemical acid mist exhaust duct. Wherein the duct 101 and the bellows 102 constitute an exhaust structure, which is mounted above the tank 104. The chamber of the chain feeder tank 104 and the channel 103 provide a corresponding channel for the purpose of exhaust air, which is discharged after passing through the bellows 102 and the pipe 101.
However, the current prior art has a problem that the structure of the chemical acid mist exhaust structure in the current prior art is limited, and water drops, acid liquor and other waste liquid generated in the operation process of the equipment are possibly remained in the pipeline 101, so that the collection and the discharge cannot be performed. Furthermore, the waste liquid such as water droplets and acid liquid retained in the pipeline 101 may even flow back into the liquid supply tank 104, thereby affecting the quality of the product.
Disclosure of Invention
The present utility model aims to solve at least one of the above problems and disadvantages of the prior art, namely, at least to prevent the water droplets, acid solutions, etc. retained in the pipeline 101 from flowing back into the liquid supply tank 104, or to collect and drain the water droplets, acid solutions, etc. generated during the operation of the apparatus. The utility model belongs to a technology based on a chemical acid mist exhaust pipeline in a single-layer chain type cleaning machine.
In particular, the utility model proposes a device for exhausting a gas, comprising:
a first bellows provided above the first reaction tank in an assembled state and provided with an opening on a bottom wall thereof so that gas in the first reaction tank can be discharged through the first bellows, wherein a first end of the first bellows in a length direction thereof in the assembled state and a second end opposite to the first end are different in height;
a first liquid discharge passage provided at least at a lower one of the first end and the second end; and
and a first exhaust passage communicating with a top wall of the first bellows to exhaust gas to the atmosphere.
In the apparatus for exhausting gas disclosed in the present utility model, since the first bellows is different in height between the first end and the second end opposite to the first end in the length direction thereof in the assembled state, water droplets, acid liquid, and the like waste liquid generated during operation of the apparatus including the apparatus for exhausting gas can be collected, and further can be exhausted through the liquid exhaust passage provided at the lower one of the first end and the second end of the bellows, whereby such waste liquid is prevented from flowing back into the liquid supply tank, thereby ensuring a cleaning effect and thus ensuring yield of processed semiconductor wafers.
In an exemplary embodiment according to the utility model, the opening in the bottom wall of the first bellows is provided with a counter edge extending towards the inside of the bellows and/or the top wall of the first bellows in the mounted state has an inclination angle with respect to the horizontal. In this way, the condensed waste liquid can be collected in one place without flowing back to the liquid supply tank, so that it can be discharged by means of the liquid discharge outlet.
In an exemplary embodiment according to the present utility model, the tilt direction of the top wall of the first bellows is different from the tilt direction of the bottom wall of the first bellows. In this way, the waste liquid generated by condensation can be collected from different directions, so that the efficiency of collecting the waste liquid is improved on one hand, and the waste liquid is collected more fully on the other hand.
In one exemplary embodiment according to the present utility model, the first exhaust passage includes:
a first exhaust port in communication with the atmosphere; and
and a first connecting duct provided between the first exhaust port and the first bellows and communicating with the first exhaust port and the first bellows.
In this way, the waste gas condensed into waste liquid can be directly discharged into the atmosphere, thereby achieving the purpose of discharging the waste gas.
In an exemplary embodiment according to the present utility model, the apparatus further comprises:
a second bellows provided above the second reaction tank in an assembled state and provided with an opening on a bottom wall thereof so that gas in the second reaction tank can be discharged through the second bellows, wherein a third end in a length direction thereof in the assembled state and a fourth end opposite to the third end are different in height;
a second liquid discharge passage provided at least at a lower one of the third end and the fourth end; and
and a second exhaust passage communicating with a top wall of the second windbox to exhaust the gas to the atmosphere.
In the apparatus for exhausting gas disclosed in accordance with the present utility model, since the first bellows is different in height in the length direction of the first end and the second end opposite to the first end in the assembled state and the second bellows is different in height in the length direction of the third end and the fourth end opposite to the third end in the assembled state, waste liquid such as water drops, acid solutions, etc. generated during operation of the apparatus including the apparatus for exhausting gas can be collected, and can be exhausted through the liquid exhaust passage provided at the lower one of the first end and the second end of the first bellows or at the lower one of the third end and the fourth end of the second bellows, thereby preventing such waste liquid from flowing back into the liquid supply tank, thereby ensuring a cleaning effect and thus ensuring yield of processed semiconductor wafers.
In an exemplary embodiment according to the present utility model, a counter edge extending towards the inside of the bellows is provided at an opening in the bottom wall of the second bellows, and/or,
the top wall of the second bellows has an inclination angle with respect to the horizontal in the mounted state and/or the inclination direction of the top wall of the second bellows is different from the inclination direction of the bottom wall of the second bellows. In this way, the condensed waste liquid can be collected in one place without flowing back to the liquid supply tank, so that it can be discharged by means of the liquid discharge outlet. In addition, the waste liquid generated by condensation can be collected from different directions in this way, so that on one hand, the efficiency of collecting the waste liquid is improved, and on the other hand, the waste liquid is collected more fully.
In one exemplary embodiment according to the present utility model, the second exhaust passage includes:
a second exhaust port in communication with the atmosphere; and
and a second connecting duct provided between the second exhaust port and the second bellows and communicating with the second exhaust port and the second bellows.
In this way, the waste gas condensed into waste liquid can be directly discharged into the atmosphere, thereby achieving the purpose of discharging the waste gas.
In an exemplary embodiment according to the present utility model, the second reaction tank is disposed below the first reaction tank, and/or the second connection pipe is configured as a bent pipe to bypass the first reaction tank for exhaust. In this way, a multi-layer layout is enabled, further improving the arrangement efficiency of the cleaning apparatus.
In an exemplary embodiment according to the present utility model, the arrangement further comprises an overflow chamber lower than the bottom wall of the first windbox and/or the bottom wall of the second windbox and communicating with the first exhaust channel and/or the second exhaust channel.
Furthermore, a second aspect of the utility model provides a cleaning apparatus comprising a device for exhausting gas according to the first aspect of the utility model.
In summary, in the apparatus for exhausting gas according to the present utility model, since the first bellows is different in height between the first end and the second end opposite to the first end in the length direction in the assembled state, the water droplets, acid solutions, and other waste liquids generated during operation of the apparatus including the apparatus for exhausting gas can be collected, and further can be exhausted through the liquid exhaust passage provided at the lower one of the first end and the second end of the bellows, thereby preventing such waste liquids from flowing back into the liquid supply tank, thereby ensuring the cleaning effect and further ensuring the yield of the processed semiconductor wafers.
Drawings
Features, advantages, and other aspects of embodiments of the disclosure will become more apparent upon reference to the following detailed description, taken in conjunction with the accompanying drawings, wherein several embodiments of the disclosure are shown by way of illustration, and not limitation, in which:
fig. 1 shows a side view of a device for exhausting gas according to the prior art;
fig. 2A shows a front view of an apparatus for exhausting gas according to the present utility model;
fig. 2B shows a side view of the device for exhausting gas according to the utility model; and
fig. 2C shows a top view of the device for exhausting gas according to the utility model.
Detailed Description
The technical scheme of the utility model is further specifically described below through examples and with reference to the accompanying drawings. In the specification, the same or similar reference numerals denote the same or similar components. The following description of embodiments of the present utility model with reference to the accompanying drawings is intended to illustrate the general inventive concept and should not be taken as limiting the utility model.
The terms "comprising," including, "and similar terms used herein should be interpreted as open-ended terms, i.e., including, but not limited to," meaning that other elements may also be included. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment," and so forth.
As described above, the present utility model aims to solve at least one of the above problems and disadvantages of the prior art, and it is apparent from fig. 1 that fig. 1 shows a side view of an apparatus for exhausting gas according to the prior art, that is, at least capable of preventing water droplets, acid solution, etc. retained in a pipe 101 from flowing back into a liquid supply tank 104, or collecting and exhausting water droplets, acid solution, etc. waste liquid generated during operation of a device. The utility model belongs to a technology based on a chemical acid mist exhaust pipeline in a single-layer chain type cleaning machine.
In general terms, in view of the above problems, the present utility model proposes an apparatus for exhausting gas, the apparatus comprising: a first bellows provided above the first reaction tank in an assembled state and provided with an opening on a bottom wall thereof so that gas in the first reaction tank can be discharged through the first bellows, wherein a first end of the first bellows in a length direction thereof in the assembled state and a second end opposite to the first end are different in height; a first liquid discharge passage provided at least at a lower one of the first end and the second end; and a first exhaust passage communicating with a top wall of the first bellows to exhaust gas to the atmosphere. In the apparatus for exhausting gas disclosed in the present utility model, since the first bellows is different in height between the first end and the second end opposite to the first end in the length direction thereof in the assembled state, water droplets, acid liquid, and the like waste liquid generated during operation of the apparatus including the apparatus for exhausting gas can be collected, and further can be exhausted through the liquid exhaust passage provided at the lower one of the first end and the second end of the bellows, whereby such waste liquid is prevented from flowing back into the liquid supply tank, thereby ensuring a cleaning effect and thus ensuring yield of processed semiconductor wafers.
More preferably, in order to perform a multi-layered layout, in an exemplary embodiment according to the present utility model, the apparatus further comprises: a second bellows provided above the second reaction tank in an assembled state and provided with an opening on a bottom wall thereof so that gas in the second reaction tank can be discharged through the second bellows, wherein a third end in a length direction thereof in the assembled state and a fourth end opposite to the third end are different in height; a second liquid discharge passage provided at least at a lower one of the third end and the fourth end; and a second exhaust passage communicating with a top wall of the second windbox to exhaust the gas to the atmosphere. In the apparatus for exhausting gas disclosed in accordance with the present utility model, since the first bellows is different in height in the length direction of the first end and the second end opposite to the first end in the assembled state and the second bellows is different in height in the length direction of the third end and the fourth end opposite to the third end in the assembled state, waste liquid such as water drops, acid solutions, etc. generated during operation of the apparatus including the apparatus for exhausting gas can be collected, and can be exhausted through the liquid exhaust passage provided at the lower one of the first end and the second end of the first bellows or at the lower one of the third end and the fourth end of the second bellows, thereby preventing such waste liquid from flowing back into the liquid supply tank, thereby ensuring a cleaning effect and thus ensuring yield of processed semiconductor wafers.
The apparatus for exhausting gas according to the present utility model will be described with reference to fig. 2A to 2C. Wherein fig. 2A shows a front view of a device for exhausting gas according to the present utility model;
fig. 2B shows a side view of the device for exhausting gas according to the utility model; and fig. 2C shows a top view of the device for exhausting gas according to the present utility model.
Specifically, as can be seen from fig. 2A to 2C, the present utility model further optimizes the existing single-layer exhaust layout into a multi-layer layout, and as can be seen from fig. 2A and 2B, 201 is a reaction tank, and 202 is a pipe connection box; 203 and 206 are exhaust channels, 205 is a raffinate discharge channel, 204 is a bellows; the top structure of the bellows 204 is optimized, and the inclined structure is matched with a special spraying process, so that drip can be effectively prevented; an air outlet is arranged at the bottom of the air box 204, and the layout of the air outlet is optimized, so that the air exhaust is more stable; the newly-added liquid collection structure in the bottom of bellows 204 can effectively collect the dropping liquid that the reaction formed and comdenstion water etc. and the bellows both sides are equipped with fluid-discharge channel 205, and fluid-discharge channel 205 is through external hose, and dropping liquid after will collecting, comdenstion water etc. are discharged overflow cavity 207 department through the fluid-discharge channel, are discharged. In addition, the air exhaust channels 203 and 206 are optimized for adapting to the multi-layer layout, the air exhaust channel 203 is directly connected with the top for air exhaust, the air exhaust channel 206 is led out from the side face of the bellows through a bending pipeline and then is turned to the top for air exhaust, the layout of the bending pipeline of the air exhaust channel 206 is optimized, and residual liquid, condensed water and the like in the pipeline can be collected in the bellows 204 and then are discharged. The design can adapt to a single-layer or multi-layer exhaust system, the uniformity of the exhaust system is better, and the drip can be prevented from flowing back to the reaction tank, so that the drip, condensed water and the like generated by the reaction of the tank body can be effectively collected and discharged through the liquid discharge channel.
The following will be described in more detail with reference to the accompanying drawings. As shown in fig. 2A, the device for exhausting gas according to the present utility model includes: a first bellows 204 provided above the first reaction tank 201 in an assembled state and provided with an opening (as shown in fig. 2C) on a bottom wall of the first bellows 204 so that gas in the first reaction tank 201 can be discharged via the first bellows 204, wherein a first end (e.g., left end) of the first bellows 204 in a longitudinal direction thereof (i.e., a left-right direction shown in fig. 2A) and a second end (e.g., right end) opposite to the first end (e.g., left end) are different in height in an assembled state; a first liquid discharge passage 205, the first liquid discharge passage 205 being provided at least at a lower one of the first end (e.g., left end) and the second end (e.g., right end); and a first exhaust passage 203, the first exhaust passage 203 communicating with a top wall of the first bellows 204 to exhaust gas to the atmosphere. In the apparatus for exhausting gas disclosed in accordance with the present utility model, since the first bellows 204 is different in height between the first end and the second end opposite to the first end in the length direction thereof in the assembled state, water droplets, acid solutions, etc. generated during operation of the apparatus including the apparatus for exhausting gas can be collected, and thus can be exhausted through the liquid exhaust passage 205 provided at the lower one of the first end and the second end of the bellows, thereby preventing such waste liquid from flowing back into the liquid supply tank, thereby ensuring a cleaning effect and thus ensuring yield of processed semiconductor wafers.
In order to further adapt the multilayered layout of the cleaning device, it is preferable that the device can further optionally comprise a second bellows 204 (e.g. a lower bellows), which second bellows 204 is arranged above the second reaction tank 201 (e.g. a lower reaction tank) in the assembled state and on the bottom wall of which second bellows 204 an opening is arranged (see fig. 2C) so that the gas in the second reaction tank 201 can be discharged via the second bellows 204, wherein the second bellows 204 in the assembled state has a third end (e.g. a left end) in its length direction and a fourth end (e.g. a right end) opposite to the third end (e.g. a left end) which are different in height; a second liquid discharge passage 205, the second liquid discharge passage 205 being provided at least at a lower one of the third end (e.g., left end) and the fourth end (e.g., right end); and a second exhaust passage 206, the second exhaust passage 206 communicating with a top wall of the second bellows 204 to exhaust the gas to the atmosphere. In the apparatus for discharging gas disclosed in accordance with the present utility model, since the first bellows 204 is different in height in the length direction thereof (e.g., left end) and the second end opposite to the first end (e.g., left end) (e.g., right end) in the assembled state and the second bellows 204 is different in height in the length direction thereof (e.g., left end) and the fourth end opposite to the third end (e.g., left end) (e.g., right end), the liquid discharge passage 205, which is provided at the lower end of the first end (e.g., left end) and the second end (e.g., right end) of the first bellows 204 or at the lower end of the second bellows 204 (e.g., left end) and the fourth end (e.g., right end), is caused to be different in height, so that the apparatus including the apparatus for discharging gas can be operated, and thus the liquid discharge passage 205, which is not refluxed into the liquid supply tank 201, can be collected, and thus the semiconductor wafer cleaning effect can be ensured. Here, the second exhaust passage 206 of the lower reaction tank 201 is required to bypass the upper reaction tank 201, and thus the second exhaust passage 206 is designed to be bent.
In order to be able to prevent condensed waste liquid from flowing back to the liquid supply tank and to collect it in a location for discharge by means of a liquid discharge outlet, the opening in the bottom wall of the first bellows 204 is provided with a counter edge extending towards the inside of the bellows and/or the top wall of the first bellows 204 in the mounted state has an inclination angle with respect to the horizontal. Further, it is further preferable that the inclination direction of the top wall of the first bellows 204 is different from the inclination direction of the bottom wall of the first bellows 204. In this way, the waste liquid generated by condensation can be collected from different directions, so that the efficiency of collecting the waste liquid is improved on one hand, and the waste liquid is collected more fully on the other hand.
In more detail, the first exhaust passage 203 can include: a first exhaust port in communication with the atmosphere; and a first connection pipe provided between the first exhaust port and the first bellows and communicating with the first exhaust port and the first bellows. In this way, the waste gas condensed into waste liquid can be directly discharged into the atmosphere, thereby achieving the purpose of discharging the waste gas.
Accordingly, a reverse side extending toward the inside of the second bellows 204 is provided at an opening on the bottom wall of the second bellows 204, and/or the top wall of the second bellows 204 has an inclination angle with respect to the horizontal in the mounted state, and/or the inclination direction of the top wall of the second bellows 204 is different from the inclination direction of the bottom wall of the second bellows 204. In this way, the condensed waste liquid can be collected in one place so as to be discharged by means of the liquid discharge outlet without being returned to the liquid supply tank 201. In addition, the waste liquid generated by condensation can be collected from different directions in this way, so that on one hand, the efficiency of collecting the waste liquid is improved, and on the other hand, the waste liquid is collected more fully.
Accordingly, the second exhaust passage 206 includes: a second exhaust port in communication with the atmosphere; and a second connection pipe provided between the second exhaust port and the second bellows and communicating with the second exhaust port and the second bellows. In this way, the waste gas condensed into waste liquid can be directly discharged into the atmosphere, thereby achieving the purpose of discharging the waste gas.
Optionally, the second reaction tank 201 is disposed below the first reaction tank 201, and/or the second connection pipe 206 is configured as a bent pipe to bypass the first reaction tank 201 for exhaust. In this way, a multi-layer layout is enabled, further improving the arrangement efficiency of the cleaning apparatus. Preferably, the device further comprises an overflow cavity 207, said overflow cavity 207 being lower than the bottom wall of said first bellows 204 and/or the bottom wall of said second bellows 204 and communicating with said first exhaust channel 203 and/or said second exhaust channel 206.
Furthermore, a second aspect of the utility model provides a cleaning apparatus comprising a device for exhausting gas according to the first aspect of the utility model.
In summary, in the apparatus for exhausting gas according to the present utility model, since the first bellows is different in height between the first end and the second end opposite to the first end in the length direction in the assembled state, the water droplets, acid solutions, and other waste liquids generated during operation of the apparatus including the apparatus for exhausting gas can be collected, and further can be exhausted through the liquid exhaust passage provided at the lower one of the first end and the second end of the bellows, thereby preventing such waste liquids from flowing back into the liquid supply tank, thereby ensuring the cleaning effect and further ensuring the yield of the processed semiconductor wafers.
The above is merely an optional embodiment of the present disclosure, and is not intended to limit the embodiments of the present disclosure, and various modifications and variations may be possible to the embodiments of the present disclosure for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure are intended to be included within the scope of the embodiments of the present disclosure.
Although embodiments of the present disclosure have been described with reference to a number of specific embodiments, it should be understood that embodiments of the present disclosure are not limited to the specific embodiments disclosed. The embodiments of the disclosure are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Claims (10)
1. An apparatus for exhausting a gas, the apparatus comprising:
a first bellows provided above the first reaction tank in an assembled state and provided with an opening on a bottom wall thereof so that gas in the first reaction tank can be discharged through the first bellows, wherein a first end of the first bellows in a length direction thereof in the assembled state and a second end opposite to the first end are different in height;
a first liquid discharge passage provided at least at a lower one of the first end and the second end; and
and a first exhaust passage communicating with a top wall of the first bellows to exhaust gas to the atmosphere.
2. The device according to claim 1, characterized in that a counter edge extending towards the inside of the bellows is provided at an opening in the bottom wall of the first bellows and/or that the top wall of the first bellows in the mounted state has an inclination angle with respect to the horizontal.
3. The apparatus of claim 2, wherein the top wall of the first bellows is sloped in a different direction than the bottom wall of the first bellows.
4. The apparatus of claim 1, wherein the first exhaust passage comprises:
a first exhaust port in communication with the atmosphere; and
and a first connecting duct provided between the first exhaust port and the first bellows and communicating with the first exhaust port and the first bellows.
5. The apparatus of claim 1, wherein the apparatus further comprises:
a second bellows provided above the second reaction tank in an assembled state and provided with an opening on a bottom wall thereof so that gas in the second reaction tank can be discharged through the second bellows, wherein a third end in a length direction thereof in the assembled state and a fourth end opposite to the third end are different in height;
a second liquid discharge passage provided at least at a lower one of the third end and the fourth end; and
and a second exhaust passage communicating with a top wall of the second windbox to exhaust the gas to the atmosphere.
6. The device according to claim 5, wherein a counter edge extending towards the inside of the bellows is provided at an opening in the bottom wall of the second bellows, and/or,
the top wall of the second bellows has an inclination angle with respect to the horizontal in the mounted state and/or the inclination direction of the top wall of the second bellows is different from the inclination direction of the bottom wall of the second bellows.
7. The apparatus of claim 5, wherein the second exhaust passage comprises:
a second exhaust port in communication with the atmosphere; and
and a second connecting duct provided between the second exhaust port and the second bellows and communicating with the second exhaust port and the second bellows.
8. The apparatus of claim 7, wherein the second reaction tank is disposed below the first reaction tank and/or the second connecting conduit is configured as an elbow to bypass the first reaction tank for venting.
9. The apparatus of claim 5, further comprising an overflow cavity lower than the bottom wall of the first bellows and/or the bottom wall of the second bellows and in communication with the first exhaust passage and/or the second exhaust passage.
10. A cleaning apparatus, characterized in that it comprises a device for exhausting gas according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322244713.XU CN220678915U (en) | 2023-08-21 | 2023-08-21 | Device for exhausting gas and cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322244713.XU CN220678915U (en) | 2023-08-21 | 2023-08-21 | Device for exhausting gas and cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220678915U true CN220678915U (en) | 2024-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322244713.XU Active CN220678915U (en) | 2023-08-21 | 2023-08-21 | Device for exhausting gas and cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220678915U (en) |
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2023
- 2023-08-21 CN CN202322244713.XU patent/CN220678915U/en active Active
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