CN218646838U

CN218646838U - Semiconductor chip module AOI detection device

Info

Publication number: CN218646838U
Application number: CN202223003903.4U
Authority: CN
Inventors: 陈叶金
Original assignee: Suzhou Xinyecheng Intelligent Equipment Co ltd
Current assignee: Suzhou Xinyecheng Intelligent Equipment Co ltd
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-03-17
Anticipated expiration: 2032-11-11

Abstract

The utility model discloses a semiconductor chip module AOI detection device, including visual detection station, the reexamination detection station that the installation feeding precedence order is established ties in proper order, be equipped with the conveyer belt that carries out the semiconductor chip module in the visual detection station, the conveyer belt extends to in the reexamination detection station, be equipped with two first straight line slip tables with conveyer belt parallel arrangement in the visual detection station, two first straight line slip tables set up respectively in the both sides of conveyer belt, are equipped with the second straight line slip table between the removal end of two first straight line slip tables, the removal end of second straight line slip table is installed the mounting bracket, install the visual detection camera that carries out visual detection to the semiconductor chip module that carries on the conveyer belt on the mounting bracket; the reedication detects the worker station and is equipped with the reedication detection camera to lieing in the conveyer belt discharge end, the utility model discloses a thereby detect the percent of pass that the reedication has effectively improved the product.

Description

Semiconductor chip module AOI detection device

Technical Field

The utility model relates to a semiconductor chip technical field specifically is a semiconductor chip module AOI detection device.

Background

The AOI (Automated Optical Inspection abbreviation) is called automatic Optical Inspection in Chinese, and is equipment for detecting common defects encountered in welding production based on an Optical principle, the AOI is a novel emerging testing technology, but the AOI is developed rapidly, and a plurality of manufacturers provide AOI testing equipment.

Various different mounting errors and welding defects on the PCB are automatically detected by using a high-speed high-precision vision processing technology; the PCB can range from a fine-pitch high-density board to a low-density large-size board, and an online detection scheme can be provided so as to improve the production efficiency and the welding quality; by using AOI as a tool for reducing defects, errors are searched and eliminated early in the assembly process, so that good process control is realized; but is now available; the existing AOI detection device does not have a re-judging function at present, and directly flows into a blanking work station after the detection of an upstream detection work station is finished; when the detection result has an error, unqualified products are easy to appear and directly flow into a blanking station. Therefore, we improve this and propose a semiconductor chip module AOI inspection apparatus.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model relates to a semiconductor chip module AOI detection device, including visual detection station, the reexamination detection station that the installation feeding precedence order is established ties in proper order, be equipped with the conveyer belt that carries on the semiconductor chip module in the visual detection station, the conveyer belt extends to in the reexamination detection station, be equipped with two first straight line slip tables with conveyer belt parallel arrangement in the visual detection station, two first straight line slip tables set up respectively in the both sides of conveyer belt, are equipped with the second straight line slip table between the removal end of two first straight line slip tables, the removal end of second straight line slip table is installed the mounting bracket, install on the mounting bracket and carry out the visual detection camera of visual detection to the semiconductor chip module that is carried on the conveyer belt; and the re-judgment detection work station is provided with a re-judgment detection camera positioned at the discharge end of the conveying belt.

As a preferred technical scheme of the utility model, be equipped with on the conveyer belt and detect camera matched with chip clamping mechanism with visual detection camera, judge, chip clamping mechanism is used for the chip module to fix a position, clamping mechanism is including setting up the die clamping cylinder on the conveyer belt support body, die clamping cylinder's flexible end is equipped with the clamp plate that goes on pressing down to the chip module side, the clamp plate is equipped with the rubber layer with the one side of chip module side contact.

As a preferred technical scheme of the utility model, be equipped with the light screen that is located the reexamination detection camera below on the reexamination detection worker station, be equipped with the through-hole with the chip position size looks adaptation of semiconductor chip module on the light screen.

As the utility model discloses an optimal technical scheme still including setting up the material loading machine in visual detection worker station the place ahead, the material loading machine is used for sending into the semiconductor chip module on the conveyer belt.

As the utility model discloses an optimal technical scheme still detects the terminal unloader in worker station including setting up at the reexamination, the unloader is used for carrying out the unloading to the semiconductor chip module after detecting.

The utility model has the advantages that:

the semiconductor chip module AOI detection device conveys a semiconductor chip module to the lower part of a visual detection camera through a conveying belt, then presses and clamps the side edge of the semiconductor chip module under the clamping action of a clamping cylinder in a chip clamping mechanism, thereby realizing the positioning work of the semiconductor chip module, then drives the visual detection camera to move in the X direction and the Y direction through a first linear sliding table and a second linear sliding table so as to realize the scanning detection of the semiconductor chip module, the semiconductor chip module after the scanning detection of the semiconductor chip module enters a re-judgment detection work station again, then the re-judgment detection camera carries out re-detection, and the semiconductor chip module is a qualified product after the re-judgment detection camera is qualified, otherwise, the semiconductor chip module is an unqualified product.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:

fig. 1 is a schematic structural view of a semiconductor chip module AOI inspection apparatus of the present invention;

fig. 2 is a schematic structural diagram of a conveyor belt of the semiconductor chip module AOI inspection apparatus of the present invention;

fig. 3 is a schematic structural diagram of a light shielding plate of the semiconductor chip module AOI detection apparatus of the present invention.

In the figure: 1. a visual inspection station; 2. a re-judgment detection work station; 3. a conveyor belt; 4. a first linear sliding table; 5. a second linear sliding table; 6. a mounting frame; 7. a visual inspection camera; 8. a re-judgment detection camera; 9. a chip clamping mechanism; 10. a clamping cylinder; 11. pressing a plate; 12. a visor; 13. a through hole; 14. a feeding machine; 15. and (5) blanking.

Detailed Description

The preferred embodiments of the present invention will be described hereinafter with reference to the accompanying drawings, and it should be understood that the preferred embodiments described herein are merely for purposes of illustration and explanation, and are not intended to limit the present invention.

The embodiment is as follows: as shown in fig. 1, fig. 2 and fig. 3, the utility model relates to a semiconductor chip module group AOI detection device, including visual detection station 1, the reexamination detection station 2 that the installation feeding order is in series connection in proper order, be equipped with the conveyer belt 3 that carries out the semiconductor chip module group in the visual detection station 1, the conveyer belt 3 extends to the reexamination detection station 2 in, be equipped with two first linear sliding tables 4 with conveyer belt 3 parallel arrangement in the visual detection station 1, two first linear sliding tables 4 set up respectively in the both sides of conveyer belt 3, be equipped with second linear sliding table 5 between the removal end of two first linear sliding tables 4, the removal end of second linear sliding table 5 is installed mounting bracket 6, install the visual detection camera 7 that carries out visual detection to the semiconductor chip module group that carries on the conveyer belt 3 on the mounting bracket 6; the re-judgment detection work station 2 is provided with a re-judgment detection camera 8 positioned at the discharge end of the conveyer belt 3.

Be equipped with on the conveyer belt 3 with visual detection camera 7, the chip clamping mechanism 9 of judging detection camera 8 matched with again, chip clamping mechanism 9 is used for the chip module to fix a position, clamping mechanism 9 is including setting up die clamping cylinder 10 on the 3 support bodies of conveyer belt, die clamping cylinder 10's flexible end is equipped with the clamp plate 11 that carries out the pressure to the chip module side, clamp plate 11 is equipped with the rubber layer with the one side of chip module side contact. Carry the semiconductor chip module to the below of visual detection camera 7 through conveyer belt 3, then under the clamping action of die clamping cylinder 10 in chip clamping mechanism 9, press down the clamp tightly to semiconductor chip module side, thereby realize semiconductor chip module location work, then drive visual detection camera 7 through first straight line slip table 4 and second straight line slip table 5 and carry out the motion of X direction and Y direction thereby realize the scanning detection to the semiconductor chip module, the semiconductor chip module after the scanning detection of semiconductor chip module enters into in the reexamination detects work station 2 again, then detect once more at reexamination detection camera 8, be qualified product after reexamination detection camera 8 detects qualifiedly, otherwise be unqualified product.

The re-judgment detection work station 2 is provided with a light screen 12 positioned below the re-judgment detection camera 8, the light screen 12 is provided with a through hole 13 matched with the position and the size of a chip of the semiconductor chip module, and the light screen 12 plays a role in removing the background color of the semiconductor chip module, so that the detection effect is good.

Still including setting up material loading machine 14 in visual detection worker station 1 the place ahead, material loading machine 14 is used for sending into semiconductor chip module on conveyer belt 3, carries out automatic feeding, and the material loading machine is current technical product, has obtained extensive application in chip manufacturing process, consequently no longer gives details here.

Still including setting up at the terminal blanking machine 15 of the station 2 that reexamines detect, blanking machine 15 is used for carrying out the unloading to the semiconductor chip module after detecting, and wherein the blanking machine is in the same place qualified product, and the product that will disqualified is in the same place, and the blanking machine is current technical product, has obtained extensive application in chip manufacturing process, consequently no longer has been described herein.

The working principle is as follows: the semiconductor chip module is conveyed to the position below the visual detection camera 7 through the conveying belt 3, then under the clamping action of a clamping cylinder 10 in the chip clamping mechanism 9, the side edge of the semiconductor chip module is pressed and clamped, so that the semiconductor chip module is positioned, then the visual detection camera 7 is driven by the first linear sliding table 4 and the second linear sliding table 5 to move in the X direction and the Y direction, so that the semiconductor chip module is scanned and detected, the semiconductor chip module after scanning and detection of the semiconductor chip module enters the re-judgment detection work station 2, then the re-judgment detection camera 8 performs re-detection, and the semiconductor chip module is a qualified product after the re-judgment detection camera 8 detects the qualified product, otherwise the semiconductor chip module is an unqualified product.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor chip module AOI detection device which characterized in that: the visual detection device comprises a visual detection work station (1) and a re-judgment detection work station (2) which are sequentially connected in series in sequence, wherein a conveying belt (3) for conveying semiconductor chip modules is arranged in the visual detection work station (1), the conveying belt (3) extends into the re-judgment detection work station (2), two first linear sliding tables (4) which are parallel to the conveying belt (3) are arranged in the visual detection work station (1), the two first linear sliding tables (4) are respectively arranged on two sides of the conveying belt (3), a second linear sliding table (5) is arranged between moving ends of the two first linear sliding tables (4), a mounting frame (6) is mounted at a moving end of the second linear sliding table (5), and a visual detection camera (7) for carrying out visual detection on the semiconductor chip modules conveyed on the conveying belt (3) is mounted on the mounting frame (6); the re-judgment detection work station (2) is provided with a re-judgment detection camera (8) which is positioned at the discharge end of the conveyer belt (3).

2. The semiconductor chip module AOI detection device according to claim 1, wherein the conveyor belt (3) is provided with a chip clamping mechanism (9) matched with the vision detection camera (7) and the re-judgment detection camera (8), the chip clamping mechanism (9) is used for positioning the chip module, the clamping mechanism (9) comprises a clamping cylinder (10) arranged on a frame body of the conveyor belt (3), a telescopic end of the clamping cylinder (10) is provided with a pressing plate (11) for pressing the side edge of the chip module, and one surface of the pressing plate (11) contacted with the side edge of the chip module is provided with a rubber layer.

3. The AOI detection device for the semiconductor chip module according to claim 1, wherein a light shielding plate (12) is disposed on the reexamination detection station (2) and below the reexamination detection camera (8), and a through hole (13) adapted to the chip position size of the semiconductor chip module is disposed on the light shielding plate (12).

4. The semiconductor chip module AOI inspection apparatus according to claim 1, further comprising a feeder (14) disposed in front of the vision inspection station (1), wherein the feeder (14) is used for feeding the semiconductor chip module onto the conveyor belt (3).

5. The AOI detection device for the semiconductor chip modules according to claim 1, further comprising a blanking machine (15) disposed at the end of the reexamination detection station (2), wherein the blanking machine (15) is used for blanking the detected semiconductor chip modules.