CN116336938A - Incoming material inspection method and system for VCP electroplating line - Google Patents
Incoming material inspection method and system for VCP electroplating line Download PDFInfo
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- CN116336938A CN116336938A CN202111583456.1A CN202111583456A CN116336938A CN 116336938 A CN116336938 A CN 116336938A CN 202111583456 A CN202111583456 A CN 202111583456A CN 116336938 A CN116336938 A CN 116336938A
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- 239000013072 incoming material Substances 0.000 title claims abstract description 58
- 238000007689 inspection Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000009713 electroplating Methods 0.000 title abstract description 15
- 230000000007 visual effect Effects 0.000 claims abstract description 98
- 238000012545 processing Methods 0.000 claims abstract description 64
- 238000007747 plating Methods 0.000 claims description 65
- 238000011179 visual inspection Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000002950 deficient Effects 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 82
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 82
- 230000007547 defect Effects 0.000 description 8
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005571 horizontal transmission Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- 238000012937 correction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
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Abstract
The invention discloses an incoming material inspection method and an incoming material inspection system for a VCP electroplating line, belongs to the field of production of printed circuit boards, and solves the technical problem that in the prior art, the VCP electroplating line is stopped abnormally due to abnormal incoming material of the PCB. The method comprises the following steps: step 1, conveying a PCB incoming material to a designated position; step 2, the visual recognition equipment collects outline data of the incoming material of the PCB at the designated position; step 3, the visual equipment grabs outline data of the PCB and feeds the outline data back to the visual comparison equipment; step 4, the visual comparison equipment is used for calculating the difference result between the outline data of the actual PCB and the standard product size, and feeding back the difference result to the visual processing equipment; and 5, the vision processing equipment judges whether the PCB meets the requirements or not and judges whether the adjusted PCB meets the requirements or not according to the received size difference result. The invention reduces the maintenance cost of equipment damage caused by the material supply of the PCB and avoids the quality scrapping loss caused by the material supply of the PCB.
Description
Technical Field
The invention relates to the technical field of production equipment of printed circuit boards, in particular to an incoming material inspection method and an incoming material inspection system of a VCP plating line.
Background
Along with the improvement of the automation degree, in the production process of the circuit board, the operation actions of the upper board and the lower board in the electroplating process are also completed by a manipulator, but the manipulator currently applied to VCP electroplating only has the operation actions of the upper board and the lower board, and has no incoming material checking function.
For some incoming defects, such as outer plate shape defects, plate warping defects and the like, plates which are input into a production line of the VCP in an indiscriminate manner by a manipulator are extremely easy to cause serious damage to products due to collision of the plates to nozzles beside or supports in the advancing process due to the incoming defects, and even cause stop of the whole production line due to clamping plates, so that more products are abnormal in quality and lost in productivity.
Disclosure of Invention
In view of the above analysis, the present invention aims to provide an incoming material inspection system for VCP plating lines, which is used for solving the technical problem of abnormal shutdown of VCP plating lines caused by abnormal incoming material of PCB boards in the existing VCP plating.
The aim of the invention is mainly realized by the following technical scheme:
in one aspect, the present invention provides a method for inspecting incoming materials of a VCP plating line, the method for inspecting incoming materials comprising:
after the visual processing equipment judges the PCB, a control signal is sent to the grabbing unit according to the judging result, and the grabbing unit directly grabs the PCB meeting the requirements to the VCP plating line after receiving the signal; front-back and/or left-right and/or rotation adjustment is carried out on the PCB which meets the requirements after adjustment, and the PCB is grabbed to a VCP plating line after adjustment; and directly grabbing the PCB which is still not satisfactory after adjustment to a defective product placement area.
Further, in step 4, the dimensions output by the visual contrast device include the external dimensions, the angular deviation and the warpage of the PCB product.
Further, in step 4, the outline data of the actual PCB board is compared with the outline standard product size of the PCB board preset in the visual comparison device, and when the outline size deviation of the actual PCB board is less than or equal to ±0.5mm, the angle deviation is less than or equal to ±0.5° and the warp deviation is less than or equal to 0.05%, the outline, the angle and the warp of the actual PCB board are defined to meet the requirements.
Further, in step 5, for the PCB board that can meet the requirements without adjustment, the vision processing device sends a first deviation correcting result signal to the grabbing unit, and the grabbing unit directly grabs the PCB board to the VCP plating line after receiving the first deviation correcting result signal.
Further, in step 5, for the PCB board that needs to be adjusted to meet the requirement, the vision processing device sends a second deviation correcting result signal to the grabbing unit, and after receiving the second deviation correcting result signal, the grabbing unit performs front-back and/or left-right and/or rotation adjustment on the PCB board, and after adjustment, grabs the PCB board to the VCP plating line.
Further, in step 5, for the PCB board that needs to be adjusted but still does not meet the requirements after adjustment, the vision processing device sends a third deviation correcting result signal to the grabbing unit, and the grabbing unit directly grabs the PCB board to the reject placement area after receiving the third deviation correcting result signal.
On the other hand, the invention also provides an incoming material inspection system of the VCP plating line, which is used for executing the incoming material inspection method of the VCP plating line, and comprises a PCB conveying unit, a grabbing unit and a visual inspection and adjustment subsystem;
the visual inspection adjustment subsystem is used for collecting the image information of the PCB from the PCB transmission unit and outputting the image processing result of the PCB;
the grabbing unit is in signal connection with the visual inspection adjustment subsystem and is used for directly grabbing the PCB to the VCP plating line according to the image processing result; or, carrying out front-back and/or left-right and/or rotation adjustment on the PCB, and then grabbing the PCB to a VCP plating line; or directly grabbing the PCB to a defective product placement area;
the vision inspection adjustment subsystem is arranged above the PCB conveying unit.
In one possible design, the visual inspection adjustment subsystem includes a visual identification device, a visual comparison device, and a visual processing device;
the visual recognition equipment is in signal connection with the visual comparison equipment, and is used for capturing outline data of the PCB and feeding back the outline information of the PCB to the visual comparison equipment;
the visual comparison equipment is used for comparing the outline information data of the PCB captured by the visual recognition equipment with the product outline standard preset in the visual recognition equipment to obtain the dimension difference result of the actual PCB and the standard product, and feeding back the dimension difference result to the visual processing equipment;
the vision processing equipment judges whether the PCB meets the requirements or not and whether the PCB meets the requirements or not after adjustment according to the size difference result fed back by the vision comparison equipment, and sends out corresponding control signals to the grabbing unit after judgment.
In one possible design, the incoming material inspection system further comprises an alarm unit, which is in signal connection with the vision processing device; when the PCB is still not satisfactory after being adjusted by the visual processing equipment, the visual processing equipment sends an alarm signal to the alarm unit, and simultaneously the grabbing unit is controlled to grab the PCB to the unqualified product placement area.
In one possible design, the PCB board conveying unit includes a horizontal conveying belt, a conveying wheel and a control assembly, the conveying wheel is used for driving the horizontal conveying belt to move so as to drive the PCB board to move; the control component is used for controlling the horizontal conveying belt and the conveying wheels;
the end position of the horizontal conveying belt in the moving direction is defined as an upper plate area, and the visual recognition unit is arranged above the upper plate area.
Compared with the prior art, the invention has at least one of the following beneficial effects:
(1) According to the invention, the grabbing unit, the visual identification equipment, the visual processing equipment and the visual comparison equipment are arranged, so that the incoming material defects can be found in time, and the problem that the PCB with the defects collides against a nozzle or a bracket beside the PCB in the advancing process to cause more serious damage to the PCB and even stop of the whole production line due to clamping plates, so that more products have abnormal quality and loss of productivity is avoided.
(2) The incoming material inspection method of the VCP plating line has short working flow, is easy to control, and can quickly find out bad PCB, and the working efficiency of the VCP plating line is improved by the incoming material inspection method.
(3) The invention solves the technical problem of abnormal shutdown of the VCP plating line caused by abnormal feeding of the PCB, and the failure rate of the VCP plating line is improved from 4-6 to 0.
(4) The invention reduces the maintenance cost of equipment damage caused by the supply of the PCB, reduces the previous 8000-12000 yuan/month to 0 yuan/month,
(5) The invention avoids the quality scrapping loss caused by the material supply of the PCB, and the quality risk is reduced to 0 because the quality scrapping loss is improved to 0 yuan/month from 7.5 ten thousand/month before.
In the invention, the technical schemes can be mutually combined to realize more preferable combination schemes. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the embodiments of the invention particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, like reference numerals being used to refer to like parts throughout the several views.
FIG. 1 is a schematic workflow diagram of an incoming material inspection method of a VCP plating line;
FIG. 2 is a schematic diagram of the components of the incoming material inspection system of the VCP plating line;
FIG. 3 is a schematic diagram of an adjustment of a PCB;
fig. 4 is a partial enlarged view of a portion a in fig. 3.
Reference numerals:
1-a PCB board; 2-a PCB board conveying unit; 3-upper plate area; 4-a visual recognition camera; 5-visual contrast device; 6-a vision processing device; 7-a first deviation correcting result signal; 8-an alarm signal; 9-a manipulator; 10-VCP plating lines; 11-a reject placement area; 12-an audible and visual alarm; 13-actual form of the PCB; 14-the form of the rotated PCB; 15-standard form of PCB board.
Detailed Description
The following detailed description of preferred embodiments of the invention is made in connection with the accompanying drawings, which form a part hereof, and together with the description of the embodiments of the invention, are used to explain the principles of the invention and are not intended to limit the scope of the invention.
The invention provides a feeding inspection method of a VCP electroplating line 10, as shown in FIG. 1, the feeding inspection method comprises the following steps:
In step 4, the dimensions output by the visual comparison device 5 include the external dimensions, the angular deviation and the warpage of the PCB product.
In step 4, the outline data of the actual PCB 1 is compared with the outline standard product size of the PCB 1 preset in the visual comparison device 5, and when the outline size deviation of the actual PCB 1 is less than or equal to ±0.5mm, the angle deviation is less than or equal to ±0.5° and the warp deviation is less than or equal to 0.05%, the outline, the angle and the warp of the actual PCB 1 are defined to meet the requirements.
In step 5, for the PCB 1 meeting the requirements without adjustment, the vision processing device 6 sends a first deviation correcting result signal 7 to the grabbing unit, and the grabbing unit directly grabs the PCB 1 to the VCP plating line 10 after receiving the first deviation correcting result signal 7.
In step 5, for the PCB 1 that needs to be adjusted to meet the requirement, the vision processing device 6 sends a second deviation correcting result signal to the grabbing unit, and the grabbing unit performs front-back and/or left-right and/or rotation adjustment on the PCB 1 after receiving the second deviation correcting result signal, and grabs the PCB 1 to the VCP plating line 10 after adjustment.
In step 5, for the PCB 1 that needs to be adjusted but still does not meet the requirements after adjustment, the vision processing device 6 sends a third deviation correcting result signal to the grabbing unit, and the grabbing unit directly grabs the PCB 1 to the reject placement area after receiving the third deviation correcting result signal.
Compared with the prior art, the incoming material inspection method of the VCP plating line 10 provided by the invention can timely remove the bad PCB 1 in the incoming material of the PCB 1, avoid the bad influence on the subsequent VCP plating process, and save the maintenance cost of equipment damage caused by the incoming material of the PCB 1, thereby improving the plating efficiency.
On the other hand, the invention also provides an incoming material inspection system of the VCP plating line 10, as shown in fig. 2, the incoming material inspection system of the VCP plating line 10 comprises a PCB board conveying unit 2, a grabbing unit and a visual inspection and adjustment subsystem; the visual inspection adjustment subsystem is used for collecting the image information of the PCB 1 from the PCB conveying unit 2 and outputting the image processing result of the PCB 1; the grabbing unit is in signal connection with the visual inspection adjustment subsystem and is used for directly grabbing the PCB 1 to the VCP plating line 10 according to the image processing result; or, the PCB 1 is adjusted in a front-back and/or left-right and/or rotation way, and then the PCB 1 is grabbed to the VCP plating line 10; or, directly grabbing the PCB 1 to a defective product placement area; the vision inspection adjustment subsystem is disposed above the PCB board transfer unit 2. Wherein the visual inspection adjustment subsystem comprises a visual identification device, a visual contrast device 5 and a visual processing device 6.
Specifically, the PCB board conveying unit 2 is disposed below the visual recognition device and the grabbing unit, and the visual recognition device is electrically connected with the visual contrast device 5; both the gripping unit and the vision comparing device 5 are electrically connected with the vision processing device 6. When the incoming material inspection system of the VCP plating line 10 works, the visual recognition device is used for capturing the outline data of the PCB board 1 and transmitting the outline data to the visual comparison device 5; the visual comparison device 5 is used for receiving the outline data of the PCB 1 and comparing the outline data with the outline standard size of the PCB 1 preset in the visual comparison device to obtain a size difference result between the outline data of the actual PCB 1 and a standard product, and feeding back the size difference result to the visual processing device 6; the vision processing device 6 judges whether the PCB 1 meets the requirements or not and whether the PCB meets the requirements or not after adjustment according to the size difference result fed back by the vision comparing device 5, and sends out corresponding control signals to the grabbing unit.
The specific working process of the vision processing device 6 is as follows: when the appearance, angle and warping degree of the PCB 1 meet the requirements, the vision processing equipment 6 sends a first deviation rectifying result signal 7 to the grabbing unit, and the grabbing unit directly grabs the PCB 1 to the VCP plating line 10 after receiving the first deviation rectifying result signal 7. When the appearance, angle and warping degree of the PCB board 1 meet the requirements after the PCB board 1 is adjusted, the vision processing apparatus 6 sends a second deviation correcting result signal to the grabbing unit, and the grabbing unit performs front and/or left and right and/or rotation adjustment on the PCB board 1 after receiving the second deviation correcting result signal, and grabs the PCB board 1 to the VCP plating line 10 after the adjustment. In addition, when the shape, angle and warp of the PCB board 1 are still not satisfactory after the PCB board 1 is adjusted, the vision processing apparatus 6 sends a third deviation correcting result signal to the grabbing unit, and the grabbing unit directly grabs the PCB board 1 to the reject placement area 11 after receiving the third deviation correcting result signal.
It should be explained that, after the vision processing device 6 of the vision processing device 6 calculates according to the size difference result output by the vision comparing device 5, when the PCB board 1 to be adjusted is adjusted by rotating the angle of the PCB board 1 and changing the shape of the PCB board 1, the purpose of the adjustment is to enable the PCB board 1 to meet the requirements, that is, when the deviation of the external dimension of the actual PCB board 1 is less than or equal to ±0.5mm, the deviation of the angle is less than or equal to ±0.5 ° and the deviation of the warpage is less than or equal to 0.05%.
Compared with the prior art, the invention can find the incoming material defects in time by arranging the grabbing unit, the visual identification equipment, the visual processing equipment 6 and the visual comparison equipment 5, and avoid the problem that the PCB 1 is seriously damaged because the PCB 1 with the defects collides with a nozzle or a bracket beside in the advancing process, and even the whole production line stops due to the clamping plate, so that more products have abnormal quality and loss of productivity.
It should be emphasized that, firstly, the present invention thoroughly improves the abnormal shutdown condition of the VCP plating line 10 caused by the abnormal feeding of the PCB board 1 in the prior art, and the failure rate of the VCP plating line 10 is improved from 4 to 6 to 0. Secondly, the maintenance cost for equipment damage caused by the material supply of the PCB 1 is reduced from 8000-12000 yuan/month to 0 yuan/month; finally, through the incoming material inspection system, the quality scrapping loss caused by the incoming material of the PCB 1 is improved from 7.5 ten thousand/month to 0 yuan/month, so that the quality risk is reduced to 0.
In order to achieve gripping of the PCB board 1, the gripping unit of the present invention comprises a robot arm 9.
It should be noted that, when it is determined that the PCB 1 is qualified, the robot 9 moves the PCB 1 from the PCB transferring unit to the plating line, and enters the plating process.
It should be noted that, the visual recognition device of the present invention includes the visual recognition camera 4, and the visual recognition camera 4 adopts the existing visual recognition camera 4, and the specific structure and working process thereof will not be described again.
In order to prompt detection of the unqualified PCB 1 in time, the incoming material detection system also comprises an alarm unit which is in signal connection with the vision processing equipment 6; when the PCB 1 is still unsatisfactory after being adjusted by the vision processing equipment 6 of the vision processing equipment 6, an alarm signal is sent to the alarm unit for alarming, and meanwhile, a third deviation correcting result signal is sent to the grabbing unit, and the grabbing unit grabs the PCB 1 to the unqualified product placement area 11.
It should be noted that the alarm unit of the present invention is an audible and visual alarm 12. When the grabbing unit grabs the PCB 1 to the defective product placement area 11 after receiving the third deviation correcting result signal, the audible and visual alarm 12 sounds to remind a worker of finding that the defective PCB 1 exists in the incoming material.
In order to realize the transmission of the PCB 1 and the more accurate capture of the outline data of the PCB 1, the PCB transmission unit 2 comprises a horizontal transmission belt, a transmission wheel and a control assembly, wherein the transmission wheel is used for driving the horizontal transmission belt to move so as to drive the PCB 1 to move; the control component is used for controlling the horizontal conveying belt and the conveying wheels; the end position of the horizontal conveyor in the direction of movement is defined as the upper plate area 3, and the visual recognition device is provided above the upper plate area 3. When the PCB board 1 moves to the upper board area 3, the visual recognition camera 4 starts to grasp its outline data and transfers the outline data to the visual contrast device 5.
Compared with the prior art, the visual recognition camera 4 is arranged right above the upper plate area 3, so that the outline data of the PCB 1 can be accurately captured.
In order to ensure that the PCB 1 accurately stops at the upper plate area 3, so that the visual recognition camera 4 can grasp the outline data of the PCB 1 and transmit the outline data to the visual comparison equipment 5, the PCB transmission unit 2 also comprises an inductor, and the inductor is arranged below the upper plate area 3 and is electrically connected with the control component; when the sensor senses that the PCB 1 reaches the position of the upper plate area 3, the sensor sends a signal to the control component, and the control component controls the transmission wheel and stops transmission.
Compared with the prior art, the invention can accurately position the pause position of the PCB 1 by arranging the sensor below the upper plate area 3 of the horizontal transmission belt, thereby collecting the outline data of the PCB.
It should be noted that the incoming material inspection system of the VCP plating line 10 of the present invention further includes an automatic board feeding machine connected to the start end of the horizontal conveyor belt, the automatic board feeding machine being used for moving the PCB board 1 onto the horizontal conveyor belt.
It should also be noted that an automatic board collecting machine is provided at the end position of the VCP plating line 10 of the present invention, and the automatic board collecting machine is used for collecting the PCB board 1 after the plating process to a designated position.
It should be noted that the visual contrast device 5 of the present invention is used for comparing the differences of the external dimension of the PCB board 1 not exceeding ±0.5mm, the angular deviation not exceeding ±0.5° and the warpage of 0.05% or less.
In summary, the overall operation of the incoming material inspection system of the VCP plating line 10 of the present invention is as follows: when the PCB 1 is conveyed to the upper plate area 3 through the horizontal conveying belt, the sensor senses the position of the PCB 1 and transmits the signal to the control component, the control component controls the conveying wheel to stop rotating, the PCB 1 stops at the upper plate area 3, at the moment, the visual recognition camera 4 is utilized to grasp outline data of the PCB 1 and output the outline data to the visual comparison equipment 5, the visual comparison equipment 5 compares the received outline data (namely data of an actual product) of the PCB 1 with a standard product to obtain a difference result of the two, and then the difference result is output to the visual processing equipment 6 for operation; if the PCB 1 can meet the tolerance of the standard product without being adjusted by the vision processing equipment 6, outputting an adjusted first deviation correcting result signal 7 to the manipulator 9, and grabbing the PCB 1 meeting the standard tolerance onto an electroplating line by the manipulator 9; if the angle of the actual product is adjusted by the vision processing equipment 6 and accords with the tolerance of the standard product, outputting an adjusted second deviation correcting result signal to the manipulator 9, and grabbing the PCB 1 which accords with the standard tolerance onto an electroplating line by the manipulator 9; if the outline data of the PCB board 1 cannot meet the tolerance of the outline of the standard product after being adjusted by the vision processing device 6, the PCB board 1 is regarded as an unqualified product, a third deviation correcting result signal (i.e. a signal of the unqualified product) is output to the manipulator 9, and the manipulator 9 grabs the unqualified product to the unqualified product placing area 11.
Compared with the prior art, the invention solves the technical problem that the VCP electroplating line 10 is abnormally stopped due to the abnormal material supply of the PCB 1. The failure rate of the VCP electroplating line 10 is improved to 0 from 4 to 6 to one month, the maintenance cost for equipment damage caused by the material supply of the PCB 1 is reduced to 0 from 8000 to 12000 yuan per month, the quality scrapping loss caused by the material supply of the PCB 1 is avoided, and the quality risk caused by the improvement to 0 from 7.5 ten thousand to one month is also reduced to 0.
Example 1
The embodiment provides a method for checking the incoming material of the VCP plating line 10, which comprises the following specific steps:
the length of the material fed by the PCB 1 is smaller by 1mm, and the PCB 1 can be adjusted front and back in the length direction and moved forwards or backwards by 0.5mm through the grabbing of the visual identification equipment, the comparison of the visual comparison equipment 5 and the operation of the visual processing equipment 6 of the material feeding inspection system, so that the requirement that the external dimension of the PCB 1 does not exceed +/-0.5 mm is met, the clamping amount of an upper clamp and a lower clamp on the VCP electroplating line 10 is respectively reduced by 0.5mm, and the PCB 1 can be normally clamped by the upper clamp and the lower clamp on the VCP electroplating line 10.
After the data processing equipment judges that the adjusted PCB 1 meets the requirement, the data processing equipment transmits the operation result to the instruction of the manipulator, namely the second deviation correcting result signal, to the manipulator for execution, so that the PCB 1 can be ensured to be correctly clamped by the clamp of the VCP plating line 10, and finally, the normal plating of the PCB 1 in the VCP plating process is ensured.
Example 2
The embodiment provides a method for inspecting the incoming material of the VCP plating line 10, which specifically comprises the following steps:
the shape of the normal PCB board 1 is rectangular, the shape of the incoming material of the PCB board 1 in this embodiment is non-rectangular (the standard shape 15 of the PCB board 1), the internal angle of the PCB board 1 is 88 ° (the actual shape 13 of the PCB board 1), if the electroplating upper board work is performed normally, the PCB board 1 cannot be clamped completely by the clamp, and the adjacent PCB boards 1 overlap, so that the clamping board, the poor copper thickness of the laminated board and the like occur in the VCP electroplating process. Through the grabbing of the visual identification equipment, the comparing of the visual comparison equipment 5 and the operation of the visual processing equipment 6 of the incoming material inspection system, as shown in fig. 3 and 4, the defective PCB 1 is rotated by 1 degree to the left or right in the plane where the board is located and by taking the central axis of the PCB as the axis (the rotation direction is determined according to the actual situation, and the form 14 of the rotated PCB 1 is obtained after adjustment), after rotation, the deviation of the PCB 1 is 0.5 degrees, and the requirement that the angular deviation of the PCB 1 does not exceed +/-0.5 degrees is satisfied, particularly, see fig. 3 and 4.
After the data processing equipment judges that the PCB 1 meets the requirements after being adjusted, the data processing equipment transmits the instruction of the operation result conversion manipulator, namely the second deviation correction result signal, to the manipulator for execution, so that the PCB 1 can be ensured to be correctly held by the clamp of the working procedure section of the VCP plating line 10, and the PCB 1 is ensured to be normally plated in VCP plating.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. An incoming material inspection method for a VCP plating line, the incoming material inspection method comprising:
step 1, conveying a PCB incoming material to a designated position;
step 2, the visual recognition equipment collects outline data of the incoming material of the PCB at the designated position;
step 3, the visual equipment grabs the outline data of the PCB and feeds the outline data back to the visual comparison equipment;
step 4, the visual comparison equipment receives the outline data of the PCB and compares the outline data with the outline standard product size of the PCB preset in the visual comparison equipment to obtain the difference result of the outline data of the actual PCB and the standard product size, and the difference result is fed back to the visual processing equipment;
step 5, the vision processing equipment judges whether the PCB meets the requirements or not and judges whether the adjusted PCB meets the requirements or not according to the size difference result output by the vision comparison equipment, and the judgment result is as follows: the PCB which can meet the requirements can be adjusted without being adjusted, the PCB which can meet the requirements can be adjusted, and the PCB which can not meet the requirements after being adjusted;
after the visual processing equipment judges the PCB, a control signal is sent to the grabbing unit according to the judging result, and the grabbing unit directly grabs the PCB meeting the requirements to a VCP plating line after receiving the signal; front-back and/or left-right and/or rotation adjustment is carried out on the PCB which meets the requirements after adjustment, and the PCB is grabbed to a VCP plating line after adjustment; and directly grabbing the PCB which is still not satisfactory after adjustment to a defective product placement area.
2. The method according to claim 1, wherein in the step 4, the dimensions outputted from the visual contrast device include the external dimensions, the angular deviation and the warpage of the PCB product.
3. The incoming material inspection method of the VCP plating line according to claim 2, wherein in the step 4, the outline data of the actual PCB board is compared with the outline standard product size of the PCB board preset in the visual comparison device, and when the outline size deviation of the actual PCB board is less than or equal to ±0.5mm, the angle deviation is less than or equal to ±0.5°, and the warp deviation is less than or equal to 0.05%, the outline, the angle and the warp of the actual PCB board are defined to meet the requirements.
4. The incoming material inspection method of the VCP plating line according to claim 3, wherein in the step 5, the vision processing device sends a first deviation-correcting result signal to the grabbing unit, and the grabbing unit directly grabs the PCB board to the VCP plating line after receiving the first deviation-correcting result signal.
5. The incoming material inspection method of the VCP plating line according to claim 3, wherein in the step 5, the vision processing device sends a second deviation correcting result signal to the grabbing unit, and the grabbing unit performs front-back and/or left-right and/or rotation adjustment on the PCB after receiving the second deviation correcting result signal, so as to grab the PCB to the VCP plating line after adjustment.
6. The incoming material inspection method of the VCP plating line according to claim 3, wherein in the step 5, the vision processing device sends a third deviation-correcting result signal to the grabbing unit for the adjusted PCB board which is still unsatisfactory, and the grabbing unit directly grabs the PCB board to the reject placement area after receiving the third deviation-correcting result signal.
7. An incoming material inspection system of a VCP plating line, characterized by being configured to perform the incoming material inspection method of the VCP plating line of claims 1-6, the incoming material inspection system comprising a PCB board transfer unit, a gripping unit, and a vision inspection adjustment subsystem;
the visual inspection adjustment subsystem is used for collecting the image information of the PCB from the PCB transmission unit and outputting the image processing result of the PCB;
the grabbing unit is in signal connection with the visual inspection adjustment subsystem and is used for directly grabbing the PCB to a VCP plating line according to an image processing result; or, carrying out front-back and/or left-right and/or rotation adjustment on the PCB, and then grabbing the PCB to a VCP plating line; or directly grabbing the PCB to a defective product placement area;
the visual inspection adjustment subsystem is arranged above the PCB conveying unit.
8. The incoming material inspection system of a VCP plating line of claim 7, wherein said vision inspection adjustment subsystem comprises a vision recognition device, a vision alignment device, and a vision processing device;
the visual recognition equipment is in signal connection with the visual comparison equipment, and is used for capturing outline data of the PCB and feeding the outline data of the PCB back to the visual comparison equipment;
the visual comparison equipment is used for comparing the outline information data of the PCB captured by the visual recognition equipment with the product outline standard preset in the visual recognition equipment to obtain the dimension difference result of the actual PCB and the standard product, and feeding back the dimension difference result to the visual processing equipment;
and the visual processing equipment judges whether the PCB meets the requirements or not and whether the PCB meets the requirements or not after adjustment according to the size difference result fed back by the visual comparison equipment, and sends out corresponding control signals to the grabbing unit after judgment.
9. The incoming material inspection system of a VCP plating line as claimed in claim 8, wherein,
the incoming material checking system further comprises an alarm unit which is in signal connection with the vision processing equipment; when the PCB is still not satisfactory after being adjusted by the visual processing equipment, the visual processing equipment sends an alarm signal to the alarm unit and simultaneously controls the grabbing unit to grab the PCB to the unqualified product placement area.
10. The incoming material inspection system of the VCP plating line according to claim 9, wherein the PCB board conveying unit includes a horizontal conveying belt, a conveying wheel and a control assembly, the conveying wheel is used for driving the horizontal conveying belt to move so as to drive the PCB board to move; the control component is used for controlling the horizontal conveying belt and the conveying wheels;
the end position of the horizontal conveying belt in the moving direction is defined as an upper plate area, and the visual identification unit is arranged above the upper plate area.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111583456.1A CN116336938A (en) | 2021-12-22 | 2021-12-22 | Incoming material inspection method and system for VCP electroplating line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116750526A (en) * | 2023-08-16 | 2023-09-15 | 武汉煜炜光学科技有限公司 | Method and system for realizing dynamic connection |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116750526A (en) * | 2023-08-16 | 2023-09-15 | 武汉煜炜光学科技有限公司 | Method and system for realizing dynamic connection |
| CN116750526B (en) * | 2023-08-16 | 2023-11-03 | 武汉煜炜光学科技有限公司 | Method and system for realizing dynamic connection |
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