CN218576427U - 一种三刀切槽机构 - Google Patents
一种三刀切槽机构 Download PDFInfo
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- CN218576427U CN218576427U CN202222328128.3U CN202222328128U CN218576427U CN 218576427 U CN218576427 U CN 218576427U CN 202222328128 U CN202222328128 U CN 202222328128U CN 218576427 U CN218576427 U CN 218576427U
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- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- 238000009434 installation Methods 0.000 claims abstract description 25
- 230000006835 compression Effects 0.000 claims abstract description 19
- 238000007906 compression Methods 0.000 claims abstract description 19
- 230000000694 effects Effects 0.000 abstract description 5
- 230000001174 ascending effect Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000001125 extrusion Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
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- Dovetailed Work, And Nailing Machines And Stapling Machines For Wood (AREA)
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CN202222328128.3U CN218576427U (zh) | 2022-09-02 | 2022-09-02 | 一种三刀切槽机构 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Three Knife Notching Mechanism Effective date of registration: 20230808 Granted publication date: 20230307 Pledgee: China Guangfa Bank Co.,Ltd. Shenyang Branch Pledgor: Liaoning Tuobang Hongji Semiconductor Materials Co.,Ltd. Registration number: Y2023210000198 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
CB03 | Change of inventor or designer information |
Inventor after: Wang Tie Inventor after: Wu Jingli Inventor before: Wang Tie Inventor before: Wu Jingli |
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CB03 | Change of inventor or designer information | ||
CP03 | Change of name, title or address |
Address after: No. 89 Shendong Fourth Road, Shenfu Demonstration Zone, Shenyang City, Liaoning Province, 110000 Patentee after: Liaoning Tuobang Hongji Semiconductor Materials Co.,Ltd. Country or region after: China Address before: No. 13, Shendong 7th Road, Shenfu New District, Fushun City, Liaoning Province, 113000 Patentee before: Liaoning Tuobang Hongji Semiconductor Materials Co.,Ltd. Country or region before: China |
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CP03 | Change of name, title or address | ||
PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20240509 Registration number: Y2023210000198 Pledgor after: Liaoning Tuobang Hongji Semiconductor Materials Co.,Ltd. Pledgor before: Liaoning Tuobang Hongji Semiconductor Materials Co.,Ltd. |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20230307 Pledgee: China Guangfa Bank Co.,Ltd. Shenyang Branch Pledgor: Liaoning Tuobang Hongji Semiconductor Materials Co.,Ltd. Registration number: Y2023210000198 |